EP3C10F256I7 - 10,320 LCE 256-LBGA FPGA | Intel
Référence : EP3C10F256I7 ✗ Fin de vieEP3C10F256I7 Présentation
An FPGA is a semiconductor device whose digital logic and interconnect resources are configured after manufacture. In the product hierarchy, the EP3C10F256I7 belongs to the FPGA and CPLD class, combines with programmable logic and fixed-function blocks to form a programmable digital IC, and ultimately falls within the broader semiconductor category. Cyclone III devices support parallel hardware implementation for designs that require deterministic operation, flexible pin assignment, and field-updatable configurations.
The principal verified features of this device are its 10,320 logic cells, 182 available I/O pins, 423,936 embedded memory bits, and 256-LBGA package. The industrial temperature range supports operation from -40°C through +125°C. Its 256-ball grid supports dense PCB routing while providing 182 external I/O connections. The lead-free construction and surface-mount form also align the part with modern electronics manufacturing requirements, although complete environmental and qualification declarations must be confirmed from current manufacturer documentation.
Architecturally, the part consolidates combinational and sequential programmable logic with embedded memory resources. This allows designers to implement parallel datapaths, control logic, protocol bridges, and fixed-function digital blocks without relying exclusively on a microcontroller. Compared with a soft processor implemented entirely in programmable logic, the dedicated 10,320 logic-cell and 182-I/O resource set allows the FPGA fabric to be allocated according to the target workload.
Typical applications include industrial automation controllers, communications infrastructure, sensor and motion-control systems, embedded video processing, and general-purpose digital prototyping. The 182-I/O count is particularly useful for designs requiring multiple buses, parallel data acquisition, or mixed control and communication interfaces. The -40°C to +125°C industrial grade also makes the device suitable for temperature-ruggedized equipment where appropriate system-level qualification is performed.
Design planning must include PCB layout for all 256 package balls even though the verified device specification identifies 182 I/O pins. Signal-integrity review, decoupling, power-supply sequencing, configuration-data implementation, and thermal analysis should follow the relevant Cyclone III hardware guidance. Confirm the exact power rails, supported I/O standards, configuration requirements, and absolute maximum ratings in the current Intel datasheet before schematic release.
This product record consolidates verified distributor and manufacturer-page information with package, procurement, and engineering-selection context. It also highlights where additional data is required so engineers can distinguish confirmed EP3C10F256I7 characteristics from parameters that still require validation against the applicable device documentation.
Alternatives de remplacement direct pour EP3C10F256I7 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP3C10F256I7 (même facteur de forme et même empreinte) — différant par Operating Temperature, Process Technology, Device Type, Embedded 18x18 Multipliers, Package.
EP3C10F256C7N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP3C10F256I7N
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →EP3C10F256C6
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →EP3C10U256I7
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →EP3C16F256I7N
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →EP3C10F256I7 Valeurs maximales et caractéristiques électriques
| Device Type | Cyclone III Field Programmable Gate Array (FPGA) |
| Logic Cells | 10,320 logic cells |
| Embedded Memory | 423,936 bits |
| I/O Count | 182 I/O pins |
| Total Terminals | 256 terminals |
| Package Type | 256-LBGA |
| Package Family | LBGA |
| Package Shape | Square |
| Type de montage | Surface Mount |
| Terminal Form | Ball |
| Température de fonctionnement | -40°C to +125°C |
| Temperature Grade | Industrial |
| Lead-Free Status | Lead Free |
| Manufacturer Family | Cyclone III |
| Logic Block Count | 10,320 logic blocks |
Guide de configuration des broches du EP3C10F256I7 square
Configuration des broches du EP3C10F256I7 (boîtier square). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP3C10F256I7.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP3C10F256I7 convient pour 6 applications: Industrial Automation Controller, Communications Interface Consolidation, Parallel Sensor Acquisition, Motion and Motor Control, Embedded Video Processing, Programmable Digital Prototype.
Industrial Automation Controller
The EP3C10F256I7 fits industrial automation control because it provides 10,320 programmable logic cells, 423,936 embedded memory bits, and 182 I/O pins in one 256-LBGA package. Those resources can support parallel sequencing, machine-state control, interlocks, signal conditioning, and communications logic without relying on a separate microcontroller for every deterministic function. The verified -40°C to +125°C industrial temperature range supports equipment expected to operate across wide ambient conditions. Designers should place suitable decoupling near the power balls, preserve clean routing for high-speed interfaces, and reserve configuration resources according to the Cyclone III hardware guidelines.
Recommandé
Communications Interface Consolidation
EP3C10F256I7 can consolidate several communications and control functions in a Cyclone III FPGA when a design needs substantial parallel datapath capability. Its 182 I/O pins can accommodate multiple buses, status signals, and data interfaces, while 10,320 logic cells provide room for protocol state machines, framing logic, buffers, and error handling. This implementation reduces the number of discrete interface devices without changing the external board footprint. Exact I/O standards and supported interface IP are not present in the supplied data, so the designer must verify them against the current Intel device documentation before assigning voltage standards or timing constraints.
Recommandé
Parallel Sensor Acquisition
The EP3C10F256I7 is suitable for parallel sensor-acquisition and digital preprocessing systems because its 182 I/O pins provide substantial external connection capacity and its 10,320 logic cells can implement sampling control, filtering, thresholding, and data packing. Embedded memory of 423,936 bits can support buffering between acquisition stages and downstream logic. A practical design would use separate logic regions for interface timing, acquisition pipelines, and data conditioning while verifying setup and hold constraints in the target speed grade. The supplied evidence confirms capacity and package details but does not specify performance grades, so timing closure must be confirmed with the complete datasheet.
Recommandé
Motion and Motor Control
EP3C10F256I7 can implement deterministic digital motion-control logic where multiple position, speed, limit, and interlock signals must be coordinated. The industrial -40°C to +125°C grade and 182 available I/O pins suit equipment that connects external sensors and drive-control signals, while programmable logic allows control sequencing to be updated independently of the surrounding hardware. Embedded memory can hold lookup tables, history, and intermediate calculations. Engineers should separate sensitive analog and power-conversion circuitry from the FPGA, use controlled clock distribution, and confirm that every connected interface satisfies the device's verified electrical limits before layout release.
Recommandé
Embedded Video Processing
EP3C10F256I7 can support embedded video timing, pixel transport, and pre-processing functions where a compact FPGA implementation is preferable to a discrete logic solution. Its 10,320 logic cells offer parallel processing capacity, and 423,936 embedded memory bits can accommodate line buffers or small frame-processing stages. The 256-LBGA package supports dense routing, although ball pitch and escape-routing constraints require careful PCB planning. Video interface voltage standards, supported multipliers, memory configuration, and maximum clock performance are not included in the verified data and must be obtained from the manufacturer documentation before selecting this device for a specific video format.
Recommandé
Programmable Digital Prototype
EP3C10F256I7 is useful for compact digital prototypes because 10,320 logic cells, 423,936 memory bits, and 182 I/O pins provide enough resources to exercise multiple parallel functions on one board. Engineers can partition the fabric among control logic, test sequencing, data generation, and peripheral emulation while retaining a single programmable device architecture. The surface-mount 256-LBGA package simplifies repeatable assembly but requires fine-pitch PCB design and appropriate inspection methods. Before using it as a generic prototype platform, engineers should verify configuration method, supported I/O standards, power requirements, and tool compatibility against the applicable Cyclone III documentation.
Recommandé
Données de référence d'ingénierie pour EP3C10F256I7 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP3C10F256C7N | EP3C10F256I7N | EP3C10F256C6 | EP3C10U256I7 | EP3C16F256I7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-LBGA | 256-LBGA - same package family | 256-LBGA - same package family | 256-LBGA - same package family | 256-LBGA - same package family | 256-LBGA - same package family |
| Device Family | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III |
| Total Terminals | 256 terminals | 256 terminals | 256 terminals | 256 terminals | 256 terminals | 256 terminals |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Verified Replacement Status | Original device | Explicitly described as a complete replacement with consistent terminals and package | Same-family 256-LBGA candidate | Same-family 256-LBGA candidate | Same-family 256-LBGA candidate | Higher-capacity 256-LBGA family candidate |
Principaux différenciateurs
- Complete-replacement evidence is strongest for the C7N ordering option (vs EP3C10F256C7N)
- The I7N option retains the same 256-LBGA package and 10,320-logic-cell class (vs EP3C10F256I7N)
- The EP3C16 option adds a higher-capacity resource tier (vs EP3C16F256I7N)
Notes de conception
Reserve and route the complete 256-ball land pattern even though the verified device exposes 182 I/O pins. Power, ground, configuration, clock, and dedicated-function balls occupy the remainder of the package. Place decoupling structures close to the relevant supply balls, maintain the package's recommended thermal-pad treatment, and follow the applicable Cyclone III layout guidance for high-speed signal return paths.
Assign clocks, high-speed buses, and sensitive interfaces according to verified timing and I/O limits rather than treating all 182 I/O pins as electrically interchangeable. The supplied data does not include voltage rails, supported I/O standards, or timing tables, so these values must be obtained from the manufacturer datasheet before assigning pins or constraining the design in FPGA software.
Use a thermal design based on actual FPGA utilization, core activity, I/O loading, ambient temperature, and board copper rather than logic-cell count alone. The device supports an industrial range up to +125°C, but package temperature depends on the system design. Validate the assembled PCB in the intended enclosure and include the configured logic, clocking, I/O activity, and worst-case ambient when evaluating thermal margin.
Do not substitute EP3C10F256C7N, EP3C10F256I7N, EP3C10F256C6, EP3C10U256I7, or EP3C16F256I7N solely because they use the 256-LBGA family. Check temperature suffix, embedded-memory organization, configuration behavior, supported I/O standards, core voltage, power-up requirements, and timing constraints. Only EP3C10F256C7N has an explicit complete-replacement statement in the supplied cross-reference evidence.
Plan the configuration path as a deliberate subsystem rather than treating it as an afterthought. Confirm whether the design uses active serial, passive serial, parallel, or another supported configuration method, and route the associated pins and programming source according to the device documentation. Incorrect configuration-stratification or signal-integrity assumptions can prevent reliable startup even when the logic design itself is correct.
Informations de conformité
The verified ChipDig result identifies EP3C10F256I7 as lead-free, while the Partstack result identifies an industrial temperature grade. The supplied snippets mention RoHS and REACH only as fields used in comparison pages and do not provide their actual status, so those values remain unknown. AEC-Q100 is not applicable because the verified data identifies an industrial grade rather than automotive qualification.
