EP3SL200H780I4 - Stratix III L FPGA, 200K LE, 780-FCBGA | Intel
Référence : EP3SL200H780I4 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $7189.7 | $7 189,70 |
| 10 | $6945.5 | $69 455,00 |
| 25 | $6710.25 | $167 756,25 |
| 50 | $6480 | $324 000,00 |
| 100 | $6255.75 | $625 575,00 |
EP3SL200H780I4 Présentation
An FPGA (Field Programmable Gate Array) is a class of programmable logic IC that combines configurable logic blocks (CLBs / LABs), programmable interconnect, and embedded hard IP such as DSP blocks, memory, and high-speed transceivers. FPGAs sit within the broader hierarchy of programmable logic > logic IC > integrated circuit > semiconductor, and they enable hardware-level parallelism for DSP, packet processing, ASIC prototyping, and high-throughput I/O bridging that microcontrollers and DSP processors cannot match.
Key specifications of the EP3SL200H780I4 include 8,000 Logic Array Blocks (LABs), 384 (18x18) multipliers for DSP, embedded RAM blocks, 12 PLLs, and support for external memory interfaces including DDR3, DDR2, QDRII+, and RLDRAM II. Per the manufacturer datasheet, the device is offered in the -I4 industrial speed grade (extended -40C to +100C junction range) with transceivers up to when applicable to the package variant.
Architecturally, Stratix III L reduces dynamic power by approximately 50% versus the original Stratix II family through programmable power technology, allowing unused logic, memory, and DSP blocks to enter low-power states. The 780-pin FCBGA integrates an exposed die-down thermal structure that supports high-utilization designs without external heatsinks at moderate clock rates.
Typical applications include ASIC prototyping, high-speed digital signal processing (radar, baseband, beamforming), high-performance computing acceleration, broadcast video processing, and protocol bridging for telecom and networking line cards. The 488 I/O pins accommodate wide external memory buses plus multiple high-speed serial links, making the part suitable for designs that previously required an ASIC.
Design considerations: Stratix III L FPGAs require Quartus II design software (now Quartus Prime) for synthesis, place-and-route, and bitstream generation; bitstream encryption and configuration via fast passive parallel, fast active serial, or JTAG modes are supported. Power estimation should be run early, since core voltage at 1.1 V with 200K LE can exceed 20 W in highly utilized designs.
This page synthesizes distributor pricing, drop-in same-brand alternatives from the Stratix III L and Stratix V families, and practical design notes not consolidated in the manufacturer datasheet.
Alternatives de remplacement direct pour EP3SL200H780I4 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP3SL200H780I4 (même facteur de forme et même empreinte) — différant par Family, Speed Grade, Package, Operating Temperature, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP3SL200H780I3
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$7980 / unité
Voir la fiche technique →EP3SL200H780C4
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1210 / unité
Voir la fiche technique →EP3SL200H780C2
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$6950 / unité
Voir la fiche technique →EP3SE260H780I4
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1390 / unité
Voir la fiche technique →EP3SL200H780C4L
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$6459.35 / unité
Voir la fiche technique →EP3SL200H780I4N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4750 / unité
Voir la fiche technique →EP3SL200H780I4 Valeurs maximales et caractéristiques électriques
| Series | Stratix III L |
| Family | Stratix III |
| Logic Elements (LE) | 200,000 |
| Logic Array Blocks (LABs) | 8000 |
| Embedded Memory Bits | 10,901,504 |
| User I/O Count | 488 |
| DSP Multipliers (18x18) | 384 |
| Voltage - Core Supply | 1.1 V |
| Process Technology | 65 nm CMOS |
| Package Type | 780-BBGA / FCBGA (FC-HFBGA) |
| Package Dimensions | 33 mm x 33 mm |
| Speed Grade | I4 (industrial) |
| Température de jonction en fonctionnement | -40C to +100C (industrial) |
| Configuration Memory | SRAM-based, volatile |
| Statut RoHS | Compliant |
| Design Tool | Quartus II (legacy) / Quartus Prime |
Guide de configuration des broches du EP3SL200H780I4 33 mm x 33 mm
Configuration des broches du EP3SL200H780I4 (boîtier 33 mm x 33 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP3SL200H780I4.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP3SL200H780I4 convient pour 7 applications: ASIC Prototyping and Emulation, High-Speed DSP and Signal Processing, Telecom Line Card and Protocol Bridging, Broadcast Video Processing, Industrial Control and Test Instrumentation, High-Performance Computing Acceleration, Aerospace and Defense Signal Intelligence.
ASIC Prototyping and Emulation
The EP3SL200H780I4 fits ASIC prototyping because its 200K logic elements, 384 (18x18) DSP multipliers, and 10.9 Mbit embedded memory can map large SoC designs partition-by-partition. The 488 user I/Os accommodate wide external memory buses (DDR2/DDR3/QDRII+/RLDRAM II) required to model ASIC memory subsystems, and the 780-FCBGA package exposes enough pins to drive multi-channel prototyping fixtures at full speed. Per the manufacturer datasheet, Quartus II partition merge supports incremental prototyping flows that fit iterative ASIC bring-up cycles. The programmable power technology reduces total emulation board power by approximately 50% versus the Stratix II equivalent, enabling denser multi-FPGA emulation chassis without exceeding thermal envelopes.
Recommandé
High-Speed DSP and Signal Processing
The EP3SL200H780I4 is well-suited for high-throughput DSP applications such as radar baseband processing, software-defined radio (SDR), and beamforming. With 384 (18x18) multipliers and Stratix III DSP block architecture, the device delivers tens of GMACs of fixed-point throughput while the 488 I/Os and high-speed LVDS transceivers handle multi-channel ADC/DAC interfaces. The 780-FCBGA package supports the high pin density required by LVDS source-synchronous buses feeding ADCs at hundreds of MSPS. Per the manufacturer datasheet, the I4 industrial speed grade enables reliable operation across the -40C to +100C junction range needed in outdoor or ruggedized deployments.
Recommandé
Telecom Line Card and Protocol Bridging
The EP3SL200H780I4 fits telecom line card designs because it integrates sufficient logic (200K LE) to handle packet classification, traffic shaping, and protocol bridging across Ethernet, OTN, and proprietary backplane interfaces. The 488 user I/Os plus high-speed transceivers enable multi-gigabit SERDES connections to PHY devices and backplane connectors, while the DDR3 controller hard IP simplifies external buffer memory interfaces. Per the manufacturer datasheet, the programmable power technology reduces per-port power versus older Stratix II line cards - a meaningful metric in densely populated telecom shelves. The I4 industrial speed grade supports outdoor cabinet deployments.
Recommandé
Broadcast Video Processing
The EP3SL200H780I4 is well-matched to broadcast video processing where the 200K logic elements, 384 DSP multipliers, and 10.9 Mbit embedded memory can pipeline multi-channel SD/HD/3G-SDI processing at line rate. The 488 user I/Os accommodate multiple SDI input/output channels plus HDMI/DisplayPort bridges, and the LVDS performance of the 780-FCBGA package supports the high clock rates required for video pixel clock reconstruction. Per the manufacturer datasheet, the Stratix III L family reduces dynamic power by approximately 50% versus Stratix II, which is meaningful in rack-mounted broadcast frames with many FPGAs operating in parallel.
Recommandé
Industrial Control and Test Instrumentation
The EP3SL200H780I4 fits high-end industrial control and test instrumentation where parallel DSP, real-time I/O processing, and deterministic latency matter. Its 488 user I/Os and PLLs (12 total per manufacturer datasheet) support fine-grained timing for multi-axis motion controllers, PXI/PXIe-based instruments, and high-channel-count data acquisition systems. The industrial I4 speed grade with -40C to +100C junction range handles factory floor temperature swings. The 780-FCBGA package provides robust mechanical and thermal characteristics suitable for industrial chassis where vibration and convection cooling dominate the thermal design.
Recommandé
High-Performance Computing Acceleration
The EP3SL200H780I4 is used as a coprocessor in HPC acceleration cards where the 200K logic elements, 384 DSP multipliers, and large embedded memory (10.9 Mbit) accelerate compute kernels in financial analytics, genomics, scientific simulation, and image processing. The 780-FCBGA package exposes 488 I/Os for high-bandwidth host links (PCIe Gen2/Gen3 via hard IP or external PHY) and DDR3/QDR memory interfaces that feed the compute engines. Per the manufacturer datasheet, the programmable power technology allows unused DSP and memory blocks to enter low-power states, which is critical for sustained operation of HPC appliances.
Recommandé
Aerospace and Defense Signal Intelligence
The EP3SL200H780I4 fits aerospace and defense applications such as electronic countermeasures, signal intelligence (SIGINT), and secure communications, where 200K logic elements enable complex modulation, demodulation, encryption, and protocol processing at line rate. The 488 user I/Os plus high-speed SERDES support wideband ADC/DAC interfaces typical in RF front ends. The I4 industrial speed grade provides reliable operation in ruggedized enclosures, and the 780-FCBGA package resists shock and vibration better than wire-bond alternatives. Per the manufacturer datasheet, configuration bitstream encryption via AES protects sensitive bitstreams deployed in the field.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP3SL200H780I4 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP3SL200H780I3 | EP3SL200H780C4 | EP3SL200H780C2 | EP3SE260H780I4 | EP3SL200H780C4L | EP3SL200H780I4N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 780-FCBGA (33x33 mm) | 780-FCBGA - same | 780-FCBGA - same | 780-FCBGA - same | 780-FCBGA - same | 780-FCBGA - same | 780-FCBGA - same |
| Logic Elements | 200,000 | 200,000 | 200,000 | 200,000 | 260,000 (+30%) | 200,000 | 200,000 |
| Speed Grade | I4 (industrial) | I3 (slower) | C4 (commercial, faster) | C2 (commercial, slower) | I4 (industrial) | C4 (commercial, faster) | I4 (industrial) |
| Temperature Range | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | -40C to +100C (industrial) |
| Family / Tier | Stratix III L (low power) | Stratix III L | Stratix III L | Stratix III L | Stratix III E (enhanced, higher power) | Stratix III L | Stratix III L |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
Principaux différenciateurs
- Lower dynamic power versus Stratix III E siblings (vs EP3SE260H780I4)
- Pin-compatible upgrade path within the same package (vs EP3SL200H780I3 / EP3SL200H780C2)
- Industrial speed grade with extended temperature (vs EP3SL200H780C4 (commercial))
Notes de conception
Estimated: at typical 60-70% utilization of 200K logic elements plus 30-50% DSP blocks, the EP3SL200H780I4 can dissipate 8-15 W in still air. The 780-FCBGA package is a flip-chip BGA with die-down construction; thermal management requires either forced airflow (>=200 LFM) or a heat sink attached to the top of the package using the manufacturer's recommended TIM. Theta_JA values for the 780-FCBGA are documented in the Stratix III Device Handbook thermal characteristics section. Validate junction temperature with the Quartus II PowerPlay early power estimator (EPE) and a thermal probe on a pilot build before finalizing the mechanical design.
The 780-FCBGA uses a 1.0 mm or 1.27 mm ball pitch (verify against the package drawing in the datasheet) and requires microvia HDI PCB technology for fan-out routing. Use a 1-2-1 or 2-2-2 stack-up with 50 ohm controlled impedance for high-speed LVDS pairs and 100 ohm differential for SERDES. Provide at least one solid ground reference plane adjacent to every signal layer. BGA breakout vias must be back-drilled if stubs exceed 0.25x the rise time of the fastest signal to avoid resonance. Decoupling: place 0.1 uF and 0.01 uF MLCCs on every VCC pin within 100 mil, plus bulk 47-100 uF polymer tantalum on each power rail.
Do not assume the C/I speed grades are interchangeable without re-running timing analysis. The C2 (slowest) speed grade may fail timing closure on designs that close cleanly at I4. Configuration bitstream for I4 will not work in C2 silicon due to speed-grade fuses; always rebuild the bitstream in Quartus for the actual target part. Also: do not daisy-chain JTAG across FPGAs with mismatched VTAP voltages - the EP3SL200H780I4 supports 1.5V/1.8V/2.5V/3.3V VTAP, but mixing on a single chain requires level translation buffers per the JTAG configuration user guide.
The EP3SL200H780I4 supports LVDS at data rates up to [DATA_NEEDED: exact LVDS rate] per I/O, with source-synchronous interfaces (DDR2/DDR3/QDRII+/RLDRAM II) requiring matched-length traces within the skew budget defined by the external memory interface (EMIF) specification. Use IBIS-AMI models from Altera for channel simulation before PCB fabrication. For high-speed SERDES, follow the Altera PCB stack-up wizard for the relevant data rate; transceiver channels require continuous reference plane coverage and AC-coupling capacitors at the recommended transmitter-side location.
Informations de conformité
RoHS compliance per Altera/Intel datasheet; not AEC-Q100 qualified (FPGAs are typically not automotive-qualified at the silicon level, but can be used in automotive designs with proper system-level qualification). Halogen-free status not stated in verified data.
