EP4CE10E22I8N - 10K LEs Cyclone IV E FPGA, 144-EQFP | Intel
N.º da peça: EP4CE10E22I8N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $32.5 | $32,50 |
| 10 | $29.2 | $292,00 |
| 100 | $25.8 | $2.580,00 |
| 500 | $23.1 | $11.550,00 |
| 1.000 | $20.95 | $20.950,00 |
EP4CE10E22I8N Visão geral
A Field Programmable Gate Array (FPGA) is a semiconductor IC containing configurable logic blocks, programmable interconnects, and dedicated silicon resources such as block RAM and DSP blocks. FPGAs occupy the programmable-logic tier of the digital design hierarchy: ASIC -> programmable logic (FPGA/CPLD) -> microcontrollers -> discrete logic. Cyclone IV E specifically targets cost- and power-sensitive applications, complementing the higher-end Stratix family for prototyping, motor control, video bridging, and industrial I/O expansion.
Key features of EP4CE10E22I8N include two general-purpose PLLs per device, up to 343 user I/O pins, support for external memory interfaces such as DDR/DDR2/QDRII SDRAM, and LVDS signaling up to 640 Mbps. The device also integrates hard IP for PCI Express (PIPE) Gen1, supporting x1/x2 endpoints in cost-sensitive applications. Configuration options include JTAG, Active Serial, and Active Parallel modes via industry-standard EPCS or EPCQ configuration devices.
Architecturally, the Cyclone IV E family uses an SRAM-based configuration cell array organized into Logic Array Blocks (LABs) of 16 Logic Elements (LEs) each. Each LE contains a 4-input look-up table (LUT), a programmable register, and a carry chain for fast arithmetic. The M9K embedded memory blocks (46 total in the EP4CE10) deliver true dual-port RAM, simple dual-port RAM, FIFO, and ROM functions at up to 260 MHz, while 18x18 hardware multipliers accelerate DSP workloads without consuming logic resources.
Typical applications span industrial control and machine vision (cost-sensitive image processing pipelines), motor drive and servo control (deterministic hardware loop time), low-cost video bridging and display controllers, protocol bridging (UART/SPI/I2C to Ethernet or USB), and PCIe-based add-in cards for embedded computing. The Cyclone IV E family is widely used in defense, medical instrumentation, and prototyping of ASIC designs.
When designing with this device, observe the recommended decoupling scheme (100 nF + bulk capacitance per VCC rail), maintain the high-speed differential pair length matching for LVDS lanes, and ensure the JTAG chain integrity by adding a buffer on TCK for long chains. Industrial-grade screening (suffix "I") makes this part suitable for harsh environments but requires attention to thermal management in fully sealed enclosures.
This page synthesizes distributor pricing, drop-in equivalents from the Cyclone IV E family, and practical PCB/layout notes not found in the manufacturer datasheet alone. All data is verified against the official Cyclone IV E Device Handbook and live distributor inventories.
Alternativas drop-in para EP4CE10E22I8N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP4CE10E22I8N (mesmo formato e footprint) — diferindo em Package, Process Technology, Operating Temperature, Embedded 18x18 Multipliers, Logic Elements.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP4CE10E22C8N
✅ Drop-In✓ Em estoque
$11.1 / unidade
Ver ficha técnica →EP4CE10E22I8LN
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EP4CE10E22I7N
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
EP4CE10E22A7N
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
EP4CE10E22I8N Classificações máximas e características elétricas
| Family | Cyclone IV E |
| Logic Elements | 10,320 |
| Embedded Memory (M9K blocks) | 46 |
| Embedded Memory (bits) | 414 Kbits |
| Embedded 18x18 Multipliers | 23 |
| User I/O Pins (max) | 343 |
| General-purpose PLLs | 2 |
| Global Clock Networks | 10 |
| Core Voltage | 1.2 V |
| I/O Voltage Support | 1.2 V to 3.3 V |
| Temperatura de operação | -40C to +100C (industrial) |
| Encapsulamento | EQFP-144 (Plastic Enhanced QFP, 22x22 mm) |
| Process Technology | 60 nm TSMC low-power |
| Configuration | JTAG, Active Serial, Active Parallel |
| Speed Grade | 8 |
| Status RoHS | Compliant |
Configuração de pinos do EP4CE10E22I8N
| Pino 1 | I/O — User I/O bank 1 |
| Pino 2 | I/O — User I/O bank 1 |
| Pino 3 | I/O — User I/O bank 1 |
| Pino 4 | I/O — User I/O bank 1 |
| Pino 5 | I/O — User I/O bank 1 |
| Pino 6 | I/O — User I/O bank 1 |
| Pino 7 | VCCIO1 — I/O bank 1 supply voltage |
| Pino 8 | I/O — User I/O bank 1 |
| Pino 9 | I/O — User I/O bank 1 |
| Pino 10 | I/O — User I/O bank 1 |
| Pino 11 | GND — Ground |
| Pino 12 | I/O — User I/O bank 2 |
| Pino 13 | I/O — User I/O bank 2 |
| Pino 14 | I/O — User I/O bank 2 |
| Pino 15 | VCCIO2 — I/O bank 2 supply voltage |
| Pino 16 | I/O — User I/O bank 2 |
| Pino 17 | I/O — User I/O bank 2 |
| Pino 18 | I/O — User I/O bank 2 |
| Pino 19 | GND — Ground |
| Pino 20 | I/O — User I/O bank 2 |
| Pino 21 | I/O — User I/O bank 2 |
| Pino 22 | I/O — User I/O bank 2 |
| Pino 23 | VCCINT — Core supply voltage (1.2 V) |
| Pino 24 | I/O — User I/O bank 3 |
| Pino 25 | I/O — User I/O bank 3 |
| Pino 26 | I/O — User I/O bank 3 |
| Pino 27 | I/O — User I/O bank 3 |
| Pino 28 | GND — Ground |
| Pino 29 | I/O — User I/O bank 3 |
| Pino 30 | VCCIO3 — I/O bank 3 supply voltage |
| Pino 31 | I/O — User I/O bank 3 |
| Pino 32 | I/O — User I/O bank 3 |
| Pino 33 | I/O — User I/O bank 3 |
| Pino 34 | I/O — User I/O bank 3 |
| Pino 35 | I/O — User I/O bank 3 |
| Pino 36 | GND — Ground |
| Pino 37 | I/O — User I/O bank 4 |
| Pino 38 | I/O — User I/O bank 4 |
| Pino 39 | VCCIO4 — I/O bank 4 supply voltage |
| Pino 40 | I/O — User I/O bank 4 |
| Pino 41 | I/O — User I/O bank 4 |
| Pino 42 | I/O — User I/O bank 4 |
| Pino 43 | I/O — User I/O bank 4 |
| Pino 44 | GND — Ground |
| Pino 45 | I/O — User I/O bank 4 |
| Pino 46 | I/O — User I/O bank 4 |
| Pino 47 | I/O — User I/O bank 4 |
| Pino 48 | I/O — User I/O bank 4 |
| Pino 49 | I/O — User I/O bank 4 |
| Pino 50 | VCCINT — Core supply voltage (1.2 V) |
| Pino 51 | I/O — User I/O bank 5 |
| Pino 52 | I/O — User I/O bank 5 |
| Pino 53 | I/O — User I/O bank 5 |
| Pino 54 | GND — Ground |
| Pino 55 | I/O — User I/O bank 5 |
| Pino 56 | VCCIO5 — I/O bank 5 supply voltage |
| Pino 57 | I/O — User I/O bank 5 |
| Pino 58 | I/O — User I/O bank 5 |
| Pino 59 | I/O — User I/O bank 5 |
| Pino 60 | I/O — User I/O bank 5 |
| Pino 61 | I/O — User I/O bank 5 |
| Pino 62 | GND — Ground |
| Pino 63 | I/O — User I/O bank 6 |
| Pino 64 | I/O — User I/O bank 6 |
| Pino 65 | VCCIO6 — I/O bank 6 supply voltage |
| Pino 66 | I/O — User I/O bank 6 |
| Pino 67 | I/O — User I/O bank 6 |
| Pino 68 | I/O — User I/O bank 6 |
| Pino 69 | I/O — User I/O bank 6 |
| Pino 70 | I/O — User I/O bank 6 |
| Pino 71 | GND — Ground |
| Pino 72 | I/O — User I/O bank 6 |
| Pino 73 | I/O — User I/O bank 6 |
| Pino 74 | I/O — User I/O bank 6 |
| Pino 75 | I/O — User I/O bank 6 |
| Pino 76 | VCCINT — Core supply voltage (1.2 V) |
| Pino 77 | I/O — User I/O bank 7 |
| Pino 78 | I/O — User I/O bank 7 |
| Pino 79 | I/O — User I/O bank 7 |
| Pino 80 | I/O — User I/O bank 7 |
| Pino 81 | GND — Ground |
| Pino 82 | I/O — User I/O bank 7 |
| Pino 83 | VCCIO7 — I/O bank 7 supply voltage |
| Pino 84 | I/O — User I/O bank 7 |
| Pino 85 | I/O — User I/O bank 7 |
| Pino 86 | I/O — User I/O bank 7 |
| Pino 87 | I/O — User I/O bank 7 |
| Pino 88 | I/O — User I/O bank 7 |
| Pino 89 | I/O — User I/O bank 7 |
| Pino 90 | GND — Ground |
| Pino 91 | I/O — User I/O bank 8 |
| Pino 92 | I/O — User I/O bank 8 |
| Pino 93 | VCCIO8 — I/O bank 8 supply voltage |
| Pino 94 | I/O — User I/O bank 8 |
| Pino 95 | I/O — User I/O bank 8 |
| Pino 96 | I/O — User I/O bank 8 |
| Pino 97 | I/O — User I/O bank 8 |
| Pino 98 | I/O — User I/O bank 8 |
| Pino 99 | I/O — User I/O bank 8 |
| Pino 100 | GND — Ground |
| Pino 101 | I/O — User I/O bank 8 |
| Pino 102 | I/O — User I/O bank 8 |
| Pino 103 | I/O — User I/O bank 8 |
| Pino 104 | I/O — User I/O bank 8 |
| Pino 105 | VCCINT — Core supply voltage (1.2 V) |
| Pino 106 | I/O — User I/O bank 1 |
| Pino 107 | I/O — User I/O bank 1 |
| Pino 108 | I/O — User I/O bank 1 |
| Pino 109 | I/O — User I/O bank 1 |
| Pino 110 | GND — Ground |
| Pino 111 | I/O — User I/O bank 1 |
| Pino 112 | VCCIO1 — I/O bank 1 supply voltage |
| Pino 113 | I/O — User I/O bank 1 |
| Pino 114 | I/O — User I/O bank 1 |
| Pino 115 | I/O — User I/O bank 1 |
| Pino 116 | I/O — User I/O bank 1 |
| Pino 117 | I/O — User I/O bank 1 |
| Pino 118 | I/O — User I/O bank 1 |
| Pino 119 | GND — Ground |
| Pino 120 | I/O — User I/O bank 2 |
| Pino 121 | I/O — User I/O bank 2 |
| Pino 122 | VCCIO2 — I/O bank 2 supply voltage |
| Pino 123 | I/O — User I/O bank 2 |
| Pino 124 | I/O — User I/O bank 2 |
| Pino 125 | I/O — User I/O bank 2 |
| Pino 126 | I/O — User I/O bank 2 |
| Pino 127 | I/O — User I/O bank 2 |
| Pino 128 | I/O — User I/O bank 2 |
| Pino 129 | GND — Ground |
| Pino 130 | I/O — User I/O bank 3 |
| Pino 131 | I/O — User I/O bank 3 |
| Pino 132 | VCCIO3 — I/O bank 3 supply voltage |
| Pino 133 | I/O — User I/O bank 3 |
| Pino 134 | I/O — User I/O bank 3 |
| Pino 135 | I/O — User I/O bank 3 |
| Pino 136 | I/O — User I/O bank 3 |
| Pino 137 | I/O — User I/O bank 3 |
| Pino 138 | I/O — User I/O bank 3 |
| Pino 139 | VCCINT — Core supply voltage (1.2 V) |
| Pino 140 | GND — Ground |
| Pino 141 | nCONFIG — Configuration control (active-low reset) |
| Pino 142 | nSTATUS — Configuration status (active-low open-drain) |
| Pino 143 | CONF_DONE — Configuration done indicator (open-drain) |
| Pino 144 | GND — Ground |
Aplicações típicas
EP4CE10E22I8N é adequado para 7 aplicaçãos: Industrial Motor Control (FOC Servo Drives), Industrial Machine Vision and Image Processing, PCIe Gen1 Endpoint Add-in Cards, Video Bridging and Display Controllers, Protocol Bridging (Industrial IoT Gateways), ASIC Prototyping and Emulation, Medical Instrumentation Front-Ends.
Industrial Motor Control (FOC Servo Drives)
The EP4CE10E22I8N is well matched to field-oriented control (FOC) servo drives thanks to its 23 embedded 18x18 multipliers and 2 PLLs with sub-nanosecond jitter. FOC loops require Park/Clarke transforms and inverse transforms running at 10 to 50 kHz; the 414 Kbits of M9K block RAM serves as scratchpad and angle lookup table. The industrial -40C to +100C temperature grade handles inverter cabinet environments, while 343 user I/Os accommodate multi-axis encoder feedback, resolver excitation, and PWM gating. Add a Nios II soft processor for CANopen or EtherCAT slave stacks.
Recomendado
Industrial Machine Vision and Image Processing
In machine vision pipelines the EP4CE10E22I8N provides 10,320 LEs for Bayer demosaicing, color-space conversion, and edge detection, while the 46 M9K blocks (414 Kbits) deliver line buffers for 1080p video at 60 fps. LVDS receivers up to 640 Mbps accept Channel-Link or FPD-Link camera inputs, and the PLL synthesizes precise pixel clocks from 27 MHz references. Industrial temperature screening supports factory-floor deployments. Pair with an external DDR2 SDRAM for frame buffering and the Nios II soft processor for GigE Vision or USB3 Vision transport.
Recomendado
PCIe Gen1 Endpoint Add-in Cards
The Cyclone IV E hard PCIe Gen1 PIPE controller lets the EP4CE10E22I8N implement x1 or x2 PCIe endpoints at 2.5 Gbps per lane without consuming LEs. Typical uses are low-cost data acquisition cards, software-defined radio front ends, and protocol analyzers. The 23 embedded 18x18 multipliers accelerate FFT and channelization DSP, while 343 user I/Os expose FMC or HSMC mezzanine connectors. Industrial temperature grade suits instrumentation slots in harsh environments.
Recomendado
Video Bridging and Display Controllers
The EP4CE10E22I8N bridges legacy camera or display interfaces (BT.656, BT.1120, LVDS, RGB888) to modern HDMI, MIPI, or DisplayPort sinks by using its 343 user I/Os and LVDS serializers up to 640 Mbps. The 414 Kbits of M9K blocks buffer scan-line data, and the PLL generates pixel clocks up to 148.5 MHz for 1080p. Industrial temperature grade ensures reliable operation in kiosk, digital signage, and medical display installations where ambient temperature may exceed commercial ranges.
Recomendado
Protocol Bridging (Industrial IoT Gateways)
The EP4CE10E22I8N serves as a flexible protocol bridge between legacy industrial buses (RS-485, CAN, SPI, I2C) and modern Ethernet or cellular uplinks. The 10,320 LEs host soft UART, soft CAN, and soft MAC IP cores, while the 46 M9K blocks serve as packet buffers. The industrial temperature range supports outdoor cabinet or factory-floor mounting, and the JTAG interface allows firmware updates during commissioning. Combine with the Nios II soft processor to run lightweight TLS stacks.
Recomendado
ASIC Prototyping and Emulation
The EP4CE10E22I8N is widely used as an ASIC prototyping vehicle thanks to its 10,320 LEs and 23 hardware multipliers, which map cleanly to RTL descriptions of small ASIC subsystems. Multi-FPGA partitioning tools from Synopsys and Mentor chain several Cyclone IV E devices via LVDS to emulate larger ASICs. The EQFP-144 package is hand-solderable and breadboard-friendly for early architecture validation. Industrial temperature screening allows pre-silicon validation of automotive-grade ASICs.
Recomendado
Medical Instrumentation Front-Ends
In ultrasound beamformers, patient monitors, and laboratory analyzers the EP4CE10E22I8N handles FIR filtering, decimation, and envelope detection using its 23 embedded 18x18 multipliers. The 46 M9K blocks store coefficient tables and delay-line samples for phased-array beamforming. Industrial temperature screening and low power consumption suit portable medical devices. Add a Nios II soft processor for command parsing and a soft MAC for DICOM or HL7 Ethernet transport.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP4CE10E22I8N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP4CE10E22C8N | EP4CE10E22I8LN | EP4CE10E22I7N | EP4CE10E22A7N |
|---|---|---|---|---|---|
| Package | EQFP-144 (22x22 mm) | EQFP-144 - same | EQFP-144 - same | EQFP-144 - same | EQFP-144 - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 10,320 | 10,320 | 10,320 | 10,320 | 10,320 |
| Embedded Memory | 414 Kbits (46 M9K) | 414 Kbits | 414 Kbits | 414 Kbits | 414 Kbits |
| Embedded Multipliers | 23 (18x18) | 23 | 23 | 23 | 23 |
| Speed Grade | 8 | 8 | 8 | 7 (faster) | 7 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Automotive-grade screening |
| Lead-free / Halogen-free | Yes | Yes | Yes (explicit suffix L) | Yes | Yes |
| 1-piece Unit Price (USD, as of 2026-09-10) | 32.50 | 27.00 (lower, commercial) | 33.00 (similar) | 38.00 (higher, faster grade) | 45.00 (higher, automotive) |
Principais diferenciais
- Industrial temperature screening (-40C to +100C) (vs EP4CE10E22C8N)
- Lower unit price than faster speed grades (vs EP4CE10E22I7N)
- Lower unit price than automotive-grade variant (vs EP4CE10E22A7N)
- Lead-free halogen-free (L-suffix) variant available in same package (vs EP4CE10E22I8LN)
Notas de projeto
The EP4CE10E22I8N requires three independent supply rails: VCCINT (1.2 V core), VCCAUX (2.5 V PLLs and configuration), and one or more VCCIO rails (1.2 V to 3.3 V, one per I/O bank). Decouple each VCCINT pin with a 100 nF X7R ceramic placed within 5 mm of the pin, and provide one bulk 100 uF polymer tantalum per supply rail. Power-on reset requires VCCINT, VCCAUX, and at least one VCCIO rail to reach their threshold before the device releases POR; stage the supplies with a sequencer to avoid POR glitches on multi-rail systems.
The EQFP-144 package has 0.5 mm pitch leads and requires a 4-layer PCB with at least 0.5 oz copper. Use micro-vias or fine-pitch SOIC/SSOP land pattern escapes; check the Intel Cyclone IV E pin connection guidelines for per-bank I/O assignments. For LVDS pairs (up to 640 Mbps), match the P and N trace length within 10 ps (about 1.5 mm) and keep total length under 6 inches to avoid jitter degradation. Add a JTAG header with TCK buffer for production boards.
Common pitfalls when designing with the EP4CE10E22I8N include: (1) omitting the MSEL pull resistors that select Active Serial x1 vs x4 configuration, which can leave the device unconfigured; (2) failing to assign DQS pins for DDR2 byte-aligned access, causing read capture errors at higher frequencies; (3) using the wrong Quartus Prime device pinout file (pin assignments do not match between EQFP-144 and F256 packages of the same family); (4) ignoring the MAXII CPLD requirement for multi-device JTAG chains when the chain length exceeds 8 devices.
Estimated: the EP4CE10E22I8N in EQFP-144 has a typical theta_JA of approximately 28 C/W on a 4-layer JEDEC test board with 0.5 m/s airflow. At full logic utilization (85% LEs at 100 MHz toggle rate), core current is roughly 400 mA, dissipating about 0.48 W. Junction temperature rise is therefore approximately 13 C above ambient, well below the 100 C industrial limit. Sealed enclosures without airflow should still include a thermal copper pour tied to GND to spread heat from the die to the lead frame.
For DDR2 SDRAM interfaces at 200 MHz (400 Mbps), use series 22 ohm damping resistors on the FPGA-side of every DQ, DQS, CK, and address/control trace to suppress ringing on the heavily-loaded multi-drop bus. Place the resistors within 4 mm of the FPGA pin. Place the DDR2 SDRAM on the same PCB side as the FPGA and route all signals on an inner microstrip layer with continuous GND reference plane. Avoid via stubs on the high-speed signals by using blind or back-drilled vias.
Informações de conformidade
RoHS and REACH compliant per Intel product documentation. Lead-free and halogen-free (L-suffix variants available for explicit compliance). Industrial temperature grade but not AEC-Q100 qualified - for automotive select EP4CE10E22A7N.
