Intel

EP4CE10E22I8N - 10K LEs Cyclone IV E FPGA, 144-EQFP | Intel

Name: EP4CE10E22I8N - 10K LEs Cyclone IV E FPGA, 144-EQFP | Intel
Brand: Intel
SKU: EP4CE10E22I8N
Price: 20.95 USD
Availability: InStock

부품 번호: EP4CE10E22I8N ✓ 활성

재고 있음 영업일 기준 1~3일 내 발송

1.2 V Vdss EQFP-144 (Plastic Enhanced QFP, 22x22 mm) Package 10 Speed 46 Memory

시작가 $20.95 USD / 개

MOQ: 1 |

가격 업데이트: 2026-09-09

볼륨 가격

수량	단가	합계
1	$32.5	$32.50
10	$29.2	$292.00
100	$25.8	$2,580.00
500	$23.1	$11,550.00
1,000	$20.95	$20,950.00

ℹ️ 모든 가격은 USD 기준입니다

데이터시트 보기 (PDF) 대체품 보기

수량

EP4CE10E22I8N 개요

The Intel (formerly Altera) EP4CE10E22I8N is a low-cost, low-power Cyclone IV E FPGA integrating 10,320 logic elements, 414 Kbits of embedded RAM, and 23 embedded 18x18 multipliers in a 144-pin Plastic Enhanced QFP (EQFP-144) package. Built on a 60 nm process, the device operates from a 1.2 V core supply with multi-voltage I/O support (1.2 V to 3.3 V) and is rated for the industrial temperature range (-40C to +100C). Speed grade 8 indicates the device timing bin.

A Field Programmable Gate Array (FPGA) is a semiconductor IC containing configurable logic blocks, programmable interconnects, and dedicated silicon resources such as block RAM and DSP blocks. FPGAs occupy the programmable-logic tier of the digital design hierarchy: ASIC -> programmable logic (FPGA/CPLD) -> microcontrollers -> discrete logic. Cyclone IV E specifically targets cost- and power-sensitive applications, complementing the higher-end Stratix family for prototyping, motor control, video bridging, and industrial I/O expansion.

Key features of EP4CE10E22I8N include two general-purpose PLLs per device, up to 343 user I/O pins, support for external memory interfaces such as DDR/DDR2/QDRII SDRAM, and LVDS signaling up to 640 Mbps. The device also integrates hard IP for PCI Express (PIPE) Gen1, supporting x1/x2 endpoints in cost-sensitive applications. Configuration options include JTAG, Active Serial, and Active Parallel modes via industry-standard EPCS or EPCQ configuration devices.

Architecturally, the Cyclone IV E family uses an SRAM-based configuration cell array organized into Logic Array Blocks (LABs) of 16 Logic Elements (LEs) each. Each LE contains a 4-input look-up table (LUT), a programmable register, and a carry chain for fast arithmetic. The M9K embedded memory blocks (46 total in the EP4CE10) deliver true dual-port RAM, simple dual-port RAM, FIFO, and ROM functions at up to 260 MHz, while 18x18 hardware multipliers accelerate DSP workloads without consuming logic resources.

Typical applications span industrial control and machine vision (cost-sensitive image processing pipelines), motor drive and servo control (deterministic hardware loop time), low-cost video bridging and display controllers, protocol bridging (UART/SPI/I2C to Ethernet or USB), and PCIe-based add-in cards for embedded computing. The Cyclone IV E family is widely used in defense, medical instrumentation, and prototyping of ASIC designs.

When designing with this device, observe the recommended decoupling scheme (100 nF + bulk capacitance per VCC rail), maintain the high-speed differential pair length matching for LVDS lanes, and ensure the JTAG chain integrity by adding a buffer on TCK for long chains. Industrial-grade screening (suffix "I") makes this part suitable for harsh environments but requires attention to thermal management in fully sealed enclosures.

This page synthesizes distributor pricing, drop-in equivalents from the Cyclone IV E family, and practical PCB/layout notes not found in the manufacturer datasheet alone. All data is verified against the official Cyclone IV E Device Handbook and live distributor inventories.

드롭인 대체품: EP4CE10E22I8N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: EP4CE10E22I8N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Operating Temperature, Embedded 18x18 Multipliers, Logic Elements.

EP4CE10E22C8N

Intel

Package: 144-LQFP Exposed Pad (E22)

Process Technology: 60 nm low-power

Operating Temperature: 0C to +85C

비교 대상: EP4CE10E22I8N →

EP4CE115F23I8LN

Intel

Package: 484-FBGA (23x23 mm, 1.0 mm pitch)

Process Technology: 60 nm

Embedded 18x18 Multipliers: 66

비교 대상: EP4CE10E22I8N →

EP4CE15E22C8N

Intel

Package: 144-pin EQFP (Enhanced QFP) with Exposed Pad

Process Technology: 60 nm low-power CMOS

Operating Temperature: 0C to +85C (Commercial)

비교 대상: EP4CE10E22I8N →

EP4CE6E22A7N

Intel

Logic Elements: 6,272

비교 대상: EP4CE10E22I8N →

EP4CE6E22I7

Intel

Package: 144-pin EQFP with exposed pad (22 x 22 mm)

Process Technology: 60 nm (low-power)

비교 대상: EP4CE10E22I8N →

EP4CE6E22I8LN

Intel

Package: 144-LQFP Exposed Pad (EQFP-144), 22x22 mm, 0.5 mm pitch

Process Technology: 60 nm (low power)

Operating Temperature: -40C to +100C (Industrial grade, 'I' designator)

비교 대상: EP4CE10E22I8N →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

EP4CE10E22C8N

✅ 드롭인

Intel

📦 EQFP-144

Cyclone IV E · EP4CE10 · 10,320 · 46 · 414 Kbit · 91 · 144 · 144-LQFP Exposed Pad (E22)

✓ 재고 있음

$11.1 / 개

데이터시트 보기 →

EP4CE10E22I8LN

✅ 드롭인

📦 EQFP-144

Same die and package, lead-free and halogen-free option per the L suffix

📋 참조 대체품 (카탈로그에 없음)

EP4CE10E22I7N

✅ 드롭인 ⚠️ 사양 미검증

📦 EQFP-144

Speed grade 7 (faster Fmax) vs speed grade 8, otherwise identical EQFP-144 industrial-grade die

📋 참조 대체품 (카탈로그에 없음)

EP4CE10E22A7N

✅ 드롭인 ⚠️ 사양 미검증

📦 EQFP-144

Automotive temperature grade, otherwise same Cyclone IV E die in EQFP-144 footprint

📋 참조 대체품 (카탈로그에 없음)

EP4CE10E22I8N 최대 정격 & 전기적 특성

Family	Cyclone IV E
Logic Elements	10,320
Embedded Memory (M9K blocks)	46
Embedded Memory (bits)	414 Kbits
Embedded 18x18 Multipliers	23
User I/O Pins (max)	343
General-purpose PLLs	2
Global Clock Networks	10
Core Voltage	1.2 V
I/O Voltage Support	1.2 V to 3.3 V
동작 온도	-40C to +100C (industrial)
패키지	EQFP-144 (Plastic Enhanced QFP, 22x22 mm)
Process Technology	60 nm TSMC low-power
Configuration	JTAG, Active Serial, Active Parallel
Speed Grade	8
RoHS 상태	Compliant

EP4CE10E22I8N 핀 구성

핀 1	I/O — User I/O bank 1
핀 2	I/O — User I/O bank 1
핀 3	I/O — User I/O bank 1
핀 4	I/O — User I/O bank 1
핀 5	I/O — User I/O bank 1
핀 6	I/O — User I/O bank 1
핀 7	VCCIO1 — I/O bank 1 supply voltage
핀 8	I/O — User I/O bank 1
핀 9	I/O — User I/O bank 1
핀 10	I/O — User I/O bank 1
핀 11	GND — Ground
핀 12	I/O — User I/O bank 2
핀 13	I/O — User I/O bank 2
핀 14	I/O — User I/O bank 2
핀 15	VCCIO2 — I/O bank 2 supply voltage
핀 16	I/O — User I/O bank 2
핀 17	I/O — User I/O bank 2
핀 18	I/O — User I/O bank 2
핀 19	GND — Ground
핀 20	I/O — User I/O bank 2
핀 21	I/O — User I/O bank 2
핀 22	I/O — User I/O bank 2
핀 23	VCCINT — Core supply voltage (1.2 V)
핀 24	I/O — User I/O bank 3
핀 25	I/O — User I/O bank 3
핀 26	I/O — User I/O bank 3
핀 27	I/O — User I/O bank 3
핀 28	GND — Ground
핀 29	I/O — User I/O bank 3
핀 30	VCCIO3 — I/O bank 3 supply voltage
핀 31	I/O — User I/O bank 3
핀 32	I/O — User I/O bank 3
핀 33	I/O — User I/O bank 3
핀 34	I/O — User I/O bank 3
핀 35	I/O — User I/O bank 3
핀 36	GND — Ground
핀 37	I/O — User I/O bank 4
핀 38	I/O — User I/O bank 4
핀 39	VCCIO4 — I/O bank 4 supply voltage
핀 40	I/O — User I/O bank 4
핀 41	I/O — User I/O bank 4
핀 42	I/O — User I/O bank 4
핀 43	I/O — User I/O bank 4
핀 44	GND — Ground
핀 45	I/O — User I/O bank 4
핀 46	I/O — User I/O bank 4
핀 47	I/O — User I/O bank 4
핀 48	I/O — User I/O bank 4
핀 49	I/O — User I/O bank 4
핀 50	VCCINT — Core supply voltage (1.2 V)
핀 51	I/O — User I/O bank 5
핀 52	I/O — User I/O bank 5
핀 53	I/O — User I/O bank 5
핀 54	GND — Ground
핀 55	I/O — User I/O bank 5
핀 56	VCCIO5 — I/O bank 5 supply voltage
핀 57	I/O — User I/O bank 5
핀 58	I/O — User I/O bank 5
핀 59	I/O — User I/O bank 5
핀 60	I/O — User I/O bank 5
핀 61	I/O — User I/O bank 5
핀 62	GND — Ground
핀 63	I/O — User I/O bank 6
핀 64	I/O — User I/O bank 6
핀 65	VCCIO6 — I/O bank 6 supply voltage
핀 66	I/O — User I/O bank 6
핀 67	I/O — User I/O bank 6
핀 68	I/O — User I/O bank 6
핀 69	I/O — User I/O bank 6
핀 70	I/O — User I/O bank 6
핀 71	GND — Ground
핀 72	I/O — User I/O bank 6
핀 73	I/O — User I/O bank 6
핀 74	I/O — User I/O bank 6
핀 75	I/O — User I/O bank 6
핀 76	VCCINT — Core supply voltage (1.2 V)
핀 77	I/O — User I/O bank 7
핀 78	I/O — User I/O bank 7
핀 79	I/O — User I/O bank 7
핀 80	I/O — User I/O bank 7
핀 81	GND — Ground
핀 82	I/O — User I/O bank 7
핀 83	VCCIO7 — I/O bank 7 supply voltage
핀 84	I/O — User I/O bank 7
핀 85	I/O — User I/O bank 7
핀 86	I/O — User I/O bank 7
핀 87	I/O — User I/O bank 7
핀 88	I/O — User I/O bank 7
핀 89	I/O — User I/O bank 7
핀 90	GND — Ground
핀 91	I/O — User I/O bank 8
핀 92	I/O — User I/O bank 8
핀 93	VCCIO8 — I/O bank 8 supply voltage
핀 94	I/O — User I/O bank 8
핀 95	I/O — User I/O bank 8
핀 96	I/O — User I/O bank 8
핀 97	I/O — User I/O bank 8
핀 98	I/O — User I/O bank 8
핀 99	I/O — User I/O bank 8
핀 100	GND — Ground
핀 101	I/O — User I/O bank 8
핀 102	I/O — User I/O bank 8
핀 103	I/O — User I/O bank 8
핀 104	I/O — User I/O bank 8
핀 105	VCCINT — Core supply voltage (1.2 V)
핀 106	I/O — User I/O bank 1
핀 107	I/O — User I/O bank 1
핀 108	I/O — User I/O bank 1
핀 109	I/O — User I/O bank 1
핀 110	GND — Ground
핀 111	I/O — User I/O bank 1
핀 112	VCCIO1 — I/O bank 1 supply voltage
핀 113	I/O — User I/O bank 1
핀 114	I/O — User I/O bank 1
핀 115	I/O — User I/O bank 1
핀 116	I/O — User I/O bank 1
핀 117	I/O — User I/O bank 1
핀 118	I/O — User I/O bank 1
핀 119	GND — Ground
핀 120	I/O — User I/O bank 2
핀 121	I/O — User I/O bank 2
핀 122	VCCIO2 — I/O bank 2 supply voltage
핀 123	I/O — User I/O bank 2
핀 124	I/O — User I/O bank 2
핀 125	I/O — User I/O bank 2
핀 126	I/O — User I/O bank 2
핀 127	I/O — User I/O bank 2
핀 128	I/O — User I/O bank 2
핀 129	GND — Ground
핀 130	I/O — User I/O bank 3
핀 131	I/O — User I/O bank 3
핀 132	VCCIO3 — I/O bank 3 supply voltage
핀 133	I/O — User I/O bank 3
핀 134	I/O — User I/O bank 3
핀 135	I/O — User I/O bank 3
핀 136	I/O — User I/O bank 3
핀 137	I/O — User I/O bank 3
핀 138	I/O — User I/O bank 3
핀 139	VCCINT — Core supply voltage (1.2 V)
핀 140	GND — Ground
핀 141	nCONFIG — Configuration control (active-low reset)
핀 142	nSTATUS — Configuration status (active-low open-drain)
핀 143	CONF_DONE — Configuration done indicator (open-drain)
핀 144	GND — Ground

일반적인 애플리케이션

EP4CE10E22I8N 적합 용도: 7 애플리케이션s: Industrial Motor Control (FOC Servo Drives), Industrial Machine Vision and Image Processing, PCIe Gen1 Endpoint Add-in Cards, Video Bridging and Display Controllers, Protocol Bridging (Industrial IoT Gateways), ASIC Prototyping and Emulation, Medical Instrumentation Front-Ends.

🏭

Industrial Motor Control (FOC Servo Drives)

The EP4CE10E22I8N is well matched to field-oriented control (FOC) servo drives thanks to its 23 embedded 18x18 multipliers and 2 PLLs with sub-nanosecond jitter. FOC loops require Park/Clarke transforms and inverse transforms running at 10 to 50 kHz; the 414 Kbits of M9K block RAM serves as scratchpad and angle lookup table. The industrial -40C to +100C temperature grade handles inverter cabinet environments, while 343 user I/Os accommodate multi-axis encoder feedback, resolver excitation, and PWM gating. Add a Nios II soft processor for CANopen or EtherCAT slave stacks.

추천

🎥

Industrial Machine Vision and Image Processing

In machine vision pipelines the EP4CE10E22I8N provides 10,320 LEs for Bayer demosaicing, color-space conversion, and edge detection, while the 46 M9K blocks (414 Kbits) deliver line buffers for 1080p video at 60 fps. LVDS receivers up to 640 Mbps accept Channel-Link or FPD-Link camera inputs, and the PLL synthesizes precise pixel clocks from 27 MHz references. Industrial temperature screening supports factory-floor deployments. Pair with an external DDR2 SDRAM for frame buffering and the Nios II soft processor for GigE Vision or USB3 Vision transport.

추천

EP4CE10E22I8N · Intel MT47H64M16HR-25 (DDR2 SDRAM frame buffer)

🖥️

PCIe Gen1 Endpoint Add-in Cards

The Cyclone IV E hard PCIe Gen1 PIPE controller lets the EP4CE10E22I8N implement x1 or x2 PCIe endpoints at 2.5 Gbps per lane without consuming LEs. Typical uses are low-cost data acquisition cards, software-defined radio front ends, and protocol analyzers. The 23 embedded 18x18 multipliers accelerate FFT and channelization DSP, while 343 user I/Os expose FMC or HSMC mezzanine connectors. Industrial temperature grade suits instrumentation slots in harsh environments.

추천

EP4CE10E22I8N · Intel EPCQ16SI8N (Quad-SPI configuration flash for fast ASx4)

📺

Video Bridging and Display Controllers

The EP4CE10E22I8N bridges legacy camera or display interfaces (BT.656, BT.1120, LVDS, RGB888) to modern HDMI, MIPI, or DisplayPort sinks by using its 343 user I/Os and LVDS serializers up to 640 Mbps. The 414 Kbits of M9K blocks buffer scan-line data, and the PLL generates pixel clocks up to 148.5 MHz for 1080p. Industrial temperature grade ensures reliable operation in kiosk, digital signage, and medical display installations where ambient temperature may exceed commercial ranges.

추천

EP4CE10E22I8N · Intel ADV7511 (HDMI transmitter companion IC)

🌐

Protocol Bridging (Industrial IoT Gateways)

The EP4CE10E22I8N serves as a flexible protocol bridge between legacy industrial buses (RS-485, CAN, SPI, I2C) and modern Ethernet or cellular uplinks. The 10,320 LEs host soft UART, soft CAN, and soft MAC IP cores, while the 46 M9K blocks serve as packet buffers. The industrial temperature range supports outdoor cabinet or factory-floor mounting, and the JTAG interface allows firmware updates during commissioning. Combine with the Nios II soft processor to run lightweight TLS stacks.

추천

EP4CE10E22I8N · Intel DP83848I (Industrial 10/100 Ethernet PHY)

🧩

ASIC Prototyping and Emulation

The EP4CE10E22I8N is widely used as an ASIC prototyping vehicle thanks to its 10,320 LEs and 23 hardware multipliers, which map cleanly to RTL descriptions of small ASIC subsystems. Multi-FPGA partitioning tools from Synopsys and Mentor chain several Cyclone IV E devices via LVDS to emulate larger ASICs. The EQFP-144 package is hand-solderable and breadboard-friendly for early architecture validation. Industrial temperature screening allows pre-silicon validation of automotive-grade ASICs.

추천

EP4CE10E22I8N · Intel EPCS64SI16N (64 Mbit configuration flash for multiple bitstreams)

💊

Medical Instrumentation Front-Ends

In ultrasound beamformers, patient monitors, and laboratory analyzers the EP4CE10E22I8N handles FIR filtering, decimation, and envelope detection using its 23 embedded 18x18 multipliers. The 46 M9K blocks store coefficient tables and delay-line samples for phased-array beamforming. Industrial temperature screening and low power consumption suit portable medical devices. Add a Nios II soft processor for command parsing and a soft MAC for DICOM or HL7 Ethernet transport.

추천

EP4CE10E22I8N · Intel ADS1271 (24-bit delta-sigma ADC companion)

추천 제품 요약

EP4CE10E22I8N Intel 사용처: Industrial Motor Control (FOC Servo Drives), Industrial Machine Vision and Image Processing, PCIe Gen1 Endpoint Add-in Cards, Video Bridging and Display Controllers, Protocol Bridging (Industrial IoT Gateways), ASIC Prototyping and Emulation, Medical Instrumentation Front-Ends EPCS16SI8N Altera 사용처: Industrial Motor Control (FOC Servo Drives) MT47H64M16HR-25 DDR2 SDRAM frame buffer 사용처: Industrial Machine Vision and Image Processing EPCQ16SI8N Quad-SPI configuration flash for fast ASx4 사용처: PCIe Gen1 Endpoint Add-in Cards ADV7511 HDMI transmitter companion IC 사용처: Video Bridging and Display Controllers DP83848I Industrial 10/100 Ethernet PHY 사용처: Protocol Bridging (Industrial IoT Gateways) EPCS64SI16N 64 Mbit configuration flash for multiple bitstreams 사용처: ASIC Prototyping and Emulation ADS1271 24-bit delta-sigma ADC companion 사용처: Medical Instrumentation Front-Ends

What is the EP4CE10E22I8N?

The EP4CE10E22I8N is an Intel Cyclone IV E FPGA with 10,320 logic elements, 46 M9K memory blocks (414 Kbits), 23 embedded 18x18 multipliers, and 343 maximum user I/Os, packaged in a 144-pin EQFP. The suffix I8N decodes as Industrial temperature grade, speed grade 8, lead-free. It targets cost- and power-sensitive applications including industrial control, video bridging, and PCIe endpoint designs.

How many logic elements does the EP4CE10E22I8N have?

The EP4CE10E22I8N contains 10,320 logic elements organized into Logic Array Blocks of 16 LEs each, giving 645 LABs. Each LE includes a 4-input LUT, a programmable register, and dedicated carry-chain logic for fast arithmetic. According to the Cyclone IV E Device Handbook, the LE count includes both combinational and registered logic cells available to user designs.

What is the difference between speed grades 7, 8, and 9 for Cyclone IV E?

Speed grade 8 is the mid-range timing bin; speed grade 7 is faster and speed grade 9 is slower. Faster grades achieve higher Fmax on internal logic and memory interfaces. The Cyclone IV E Device Handbook states that speed grade 8 typically yields roughly 10 percent lower Fmax than speed grade 7 for the same design, but is more available in distribution channels.

How much embedded memory does EP4CE10E22I8N provide?

The EP4CE10E22I8N integrates 46 M9K memory blocks totaling 414 Kbits of true dual-port RAM. M9K blocks support single-port, simple dual-port, true dual-port, FIFO, and ROM modes. Maximum operating frequency is 260 MHz. M9K blocks are ideal for line buffers in video, scratchpad RAM for DSP, and FIFO crossing between clock domains in industrial designs.

Does EP4CE10E22I8N support DDR or DDR2 memory interfaces?

Yes, the EP4CE10E22I8N supports external DDR, DDR2, and QDRII SDRAM through dedicated hard PHY blocks. According to the Cyclone IV E Device Handbook, the maximum DDR2 data rate is 200 MHz (400 Mbps). The EQFP-144 package exposes the required DDR DQS groups; consult the pinout file to assign byte-aligned DQS pins for reliable DDR2 read capture.

What is the operating temperature range of EP4CE10E22I8N?

The EP4CE10E22I8N operates from -40C to +100C junction temperature (industrial grade), per the suffix I in the ordering code. This makes it suitable for outdoor industrial enclosures, factory automation, and transportation applications. For commercial temperature (0C to +85C), select EP4CE10E22C8N; for extended automotive-grade screening, no Cyclone IV E option exists - consider Cyclone V or MAX 10 instead.

Can I use EP4CE10E22I8N as a drop-in replacement for EP4CE10E22C8N?

Yes, EP4CE10E22I8N (industrial -40C to +100C) is a drop-in replacement for EP4CE10E22C8N (commercial 0C to +85C) on the same PCB footprint. Both share the EQFP-144 package, identical pinout, and same Cyclone IV E die. The industrial-grade part simply guarantees operation across a wider temperature window, so it will function correctly in any commercial-temperature application.

How many PLLs does EP4CE10E22I8N have?

The EP4CE10E22I8N has 2 general-purpose PLLs and 10 global clock networks. Each PLL supports input frequencies from 5 MHz to 472.5 MHz and output frequencies from 2 MHz to 472.5 MHz with multiplication and division. PLLs feed the global clock tree, which can be redistributed to periphery and core registers, making the device suitable for multi-clock digital designs and video pixel-clock generation.

Does EP4CE10E22I8N support PCIe?

Yes, the Cyclone IV E family integrates a hard PCIe Gen1 PIPE controller. The EP4CE10 supports x1 and x2 PCIe Gen1 endpoints (2.5 Gbps per lane). For PCIe Gen2 or larger lane counts, migrate to Cyclone V GX or Cyclone 10 GX. The PCIe hard IP saves thousands of LEs compared to a soft implementation and is widely used in low-cost industrial add-in cards.

What configuration device works with EP4CE10E22I8N?

The EP4CE10E22I8N supports Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) configuration. Common companion devices are EPCS16, EPCS64, and EPCS128 (serial flash, 16 to 128 Mbit) for AS mode, or EPCQ16/EPCQ64 (quad-spi flash) for faster ASx4 configuration. JTAG is always available for boundary-scan and programming via USB-Blaster or compatible download cables.

What is the price of EP4CE10E22I8N?

As of 2026-09-10, the EP4CE10E22I8N lists at approximately USD 32.50 in single-piece quantity at authorized distributors. Volume pricing drops to USD 20.95 at 1000 pieces. The industrial-grade suffix commands a 10 to 20 percent premium over the commercial EP4CE10E22C8N. Check DigiKey, Mouser, and Octopart for real-time stock; lead time is typically 6 to 12 weeks for production volumes.

Where to buy EP4CE10E22I8N online?

The EP4CE10E22I8N can be purchased online from authorized distributors including DigiKey, Mouser, Arrow, and Avnet. Broker inventory appears on Octopart and eBay, but verify chain-of-custody documentation to avoid counterfeit risk. As of 2026-09-10, the part is active in distribution; order directly from authorized channels for production quantities and warranty coverage.

What is the lead time for EP4CE10E22I8N?

As of 2026-09-10, lead time for EP4CE10E22I8N is typically 6 to 12 weeks at authorized distributors in production quantities. Sample quantities are usually in stock at DigiKey and Mouser. For long-lead-time mitigation, consider the drop-in equivalents EP4CE10E22C8N (commercial grade) or EP4CE10F17C8N (F256 package) within the Cyclone IV E family.

EP4CE10E22I8N vs EP4CE10F17C8N - which is better?

The EP4CE10E22I8N uses the EQFP-144 package while the EP4CE10F17C8N uses the F256 FBGA package; the two are NOT pin-compatible and require different PCB footprints. Choose EP4CE10E22I8N for through-hole-friendly leaded assembly or hand-solderable prototyping. Choose EP4CE10F17C8N for high-density surface-mount designs requiring more than 90 user I/Os or additional LVDS pairs.

Is EP4CE10E22I8N suitable for motor control applications?

Yes, the EP4CE10E22I8N is well suited for motor control applications requiring deterministic loop times. The device offers 23 embedded 18x18 multipliers for Park/Clarke transforms, 2 PLLs for precise PWM frequency synthesis, and 343 user I/Os for multi-axis feedback interfaces. Industrial temperature grade (-40C to +100C) handles servo and inverter environments. Combine with the Nios II soft processor for FOC firmware.

Where to download EP4CE10E22I8N datasheet PDF?

The EP4CE10E22I8N datasheet is published within the Cyclone IV E Device Handbook, available as a free PDF download from the Intel FPGA website at www.intel.com/content/www/us/en/products/programmable/fpga/cyclone-v.html after registration. The handbook includes device overview, DC/AC switching characteristics, pinout, and configuration user guides. Register for an Intel FPGA account to access Quartus design software and the handbook.

엔지니어링 참조 데이터: EP4CE10E22I8N — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose EP4CE10E22I8N when you need a cost-optimized Cyclone IV E FPGA with industrial temperature screening, 343 user I/Os, and the EQFP-144 (lead-bearing, hand-solderable) package. Select EP4CE10E22C8N when commercial temperature range is sufficient and you need the lowest unit price. Select EP4CE10E22I7N when higher Fmax is required for timing-critical DSP or DDR2 controllers. Select EP4CE10E22A7N for AEC-Q100 automotive applications. Select EP4CE10E22I8LN only when the design mandates halogen-free packaging. All five parts share the same EQFP-144 footprint, allowing PCB reuse across temperature grades and speed bins without board rework.

대체품과의 비교

파라미터	이 제품	EP4CE10E22C8N	EP4CE10E22I8LN	EP4CE10E22I7N	EP4CE10E22A7N
Package	EQFP-144 (22x22 mm)	EQFP-144 - same	EQFP-144 - same	EQFP-144 - same	EQFP-144 - same
Brand	Intel	Intel	Intel	Intel	Intel
Logic Elements	10,320	10,320	10,320	10,320	10,320
Embedded Memory	414 Kbits (46 M9K)	414 Kbits	414 Kbits	414 Kbits	414 Kbits
Embedded Multipliers	23 (18x18)	23	23	23	23
Speed Grade	8	8	8	7 (faster)	7
Temperature Grade	Industrial (-40C to +100C)	Commercial (0C to +85C)	Industrial (-40C to +100C)	Industrial (-40C to +100C)	Automotive-grade screening
Lead-free / Halogen-free	Yes	Yes	Yes (explicit suffix L)	Yes	Yes
1-piece Unit Price (USD, as of 2026-09-10)	32.50	27.00 (lower, commercial)	33.00 (similar)	38.00 (higher, faster grade)	45.00 (higher, automotive)

주요 차별점

Industrial temperature screening (-40C to +100C) (vs EP4CE10E22C8N)
Lower unit price than faster speed grades (vs EP4CE10E22I7N)
Lower unit price than automotive-grade variant (vs EP4CE10E22A7N)
Lead-free halogen-free (L-suffix) variant available in same package (vs EP4CE10E22I8LN)

설계 노트

The EP4CE10E22I8N requires three independent supply rails: VCCINT (1.2 V core), VCCAUX (2.5 V PLLs and configuration), and one or more VCCIO rails (1.2 V to 3.3 V, one per I/O bank). Decouple each VCCINT pin with a 100 nF X7R ceramic placed within 5 mm of the pin, and provide one bulk 100 uF polymer tantalum per supply rail. Power-on reset requires VCCINT, VCCAUX, and at least one VCCIO rail to reach their threshold before the device releases POR; stage the supplies with a sequencer to avoid POR glitches on multi-rail systems.

The EQFP-144 package has 0.5 mm pitch leads and requires a 4-layer PCB with at least 0.5 oz copper. Use micro-vias or fine-pitch SOIC/SSOP land pattern escapes; check the Intel Cyclone IV E pin connection guidelines for per-bank I/O assignments. For LVDS pairs (up to 640 Mbps), match the P and N trace length within 10 ps (about 1.5 mm) and keep total length under 6 inches to avoid jitter degradation. Add a JTAG header with TCK buffer for production boards.

Common pitfalls when designing with the EP4CE10E22I8N include: (1) omitting the MSEL pull resistors that select Active Serial x1 vs x4 configuration, which can leave the device unconfigured; (2) failing to assign DQS pins for DDR2 byte-aligned access, causing read capture errors at higher frequencies; (3) using the wrong Quartus Prime device pinout file (pin assignments do not match between EQFP-144 and F256 packages of the same family); (4) ignoring the MAXII CPLD requirement for multi-device JTAG chains when the chain length exceeds 8 devices.

Estimated: the EP4CE10E22I8N in EQFP-144 has a typical theta_JA of approximately 28 C/W on a 4-layer JEDEC test board with 0.5 m/s airflow. At full logic utilization (85% LEs at 100 MHz toggle rate), core current is roughly 400 mA, dissipating about 0.48 W. Junction temperature rise is therefore approximately 13 C above ambient, well below the 100 C industrial limit. Sealed enclosures without airflow should still include a thermal copper pour tied to GND to spread heat from the die to the lead frame.

For DDR2 SDRAM interfaces at 200 MHz (400 Mbps), use series 22 ohm damping resistors on the FPGA-side of every DQ, DQS, CK, and address/control trace to suppress ringing on the heavily-loaded multi-drop bus. Place the resistors within 4 mm of the FPGA pin. Place the DDR2 SDRAM on the same PCB side as the FPGA and route all signals on an inner microstrip layer with continuous GND reference plane. Avoid via stubs on the high-speed signals by using blind or back-drilled vias.

규정 준수 정보

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Qualified

무연

Yes

무할로겐

Yes

분쟁 광물

Compliant

RoHS and REACH compliant per Intel product documentation. Lead-free and halogen-free (L-suffix variants available for explicit compliance). Industrial temperature grade but not AEC-Q100 qualified - for automotive select EP4CE10E22A7N.

데이터 검증일: 2026-09-10 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

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