EP4CE6E22A7N - Cyclone IV E FPGA, 6K LEs, 144-EQFP | Intel
Référence : EP4CE6E22A7N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $32.5 | $32,50 |
| 10 | $28.8 | $288,00 |
| 100 | $24.5 | $2 450,00 |
| 500 | $20.75 | $10 375,00 |
| 1 000 | $17.4 | $17 400,00 |
EP4CE6E22A7N Présentation
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit in the digital logic hierarchy between fixed-function ASICs and software-defined processors: an FPGA offers ASIC-level deterministic parallelism while remaining fully reprogrammable in the field. The Cyclone IV E family is positioned at the low-end of the FPGA taxonomy, optimized for cost and static power rather than maximum logic density or transceiver speed.
Key features of the EP4CE6E22A7N include 6,272 logic elements, 270 Kbits of M9K embedded memory (30 M9K blocks), 15 embedded 18x18 multipliers, 4 user I/O banks with support for multiple I/O standards including LVDS, RSDS, mini-LVDS, LVPECL, SSTL, and HSTL, 2 general-purpose PLLs, and 10 global clock networks. The device operates from a 1.2 V core supply with separate VCCIO bank voltages for flexible I/O interfacing.
Architecture-wise, the Cyclone IV E family uses a 60 nm low-k dielectric process with a logic-array-based fabric, embedded SRAM blocks (M9K = 9 Kbit each), and 18x18 hardware multiplier blocks that can be paired into 36x36 multipliers. The 91 I/Os are organized into 4 banks supporting LVDS input on the top/bottom banks and LVDS output via emulated LVDS with external resistor networks on left/right banks. Configuration is supported through JTAG (IEEE 1149.1), Active Serial (AS), Passive Serial (PS), and Fast Passive Parallel (FPP) modes.
Typical applications include industrial Ethernet bridging, motor control encoder interfacing, video format conversion, LED video wall scan drivers, handheld test equipment, and low-cost custom logic replacement for ASICs. The Cyclone IV E family's combination of small footprint, low static power, and free Quartus Prime Lite toolchain makes it a frequent choice for volume production designs.
Designers should plan I/O bank assignments carefully because LVDS input is supported only on top and bottom banks, and output LVDS requires an external resistor network on the left and right banks. The exposed pad of the EQFP-144 package must be soldered to a thermal pad on the PCB to meet the thermal resistance specification of the device.
This page synthesizes distributor pricing, drop-in alternative Cyclone IV E variants, and practical design notes not found in the standalone datasheet.
Alternatives de remplacement direct pour EP4CE6E22A7N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP4CE6E22A7N (même facteur de forme et même empreinte) — différant par Package, Process Technology, Speed Grade, Operating Temperature, Configuration Modes.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP4CE6E22C8N
✅ Remplacement direct✓ En stock
$10.5 / unité
Voir la fiche technique →EP4CE6E22I7N
✅ Remplacement direct✓ En stock
$11.85 / unité
Voir la fiche technique →EP4CE10E22C8N
✅ Remplacement direct✓ En stock
$11.1 / unité
Voir la fiche technique →EP4CE10E22I8N
✅ Remplacement direct✓ En stock
$20.95 / unité
Voir la fiche technique →EP4CE15E22C8N
✅ Remplacement direct✓ En stock
$15.95 / unité
Voir la fiche technique →XC6SLX9-2TQG144
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP4CE6E22A7N Valeurs maximales et caractéristiques électriques
| Series | Cyclone IV E |
| Logic Elements | 6,272 |
| Embedded Memory (bits) | 276,480 |
| Embedded Multipliers (18x18) | 15 |
| User I/O Pins | 91 |
| Number of I/O Banks | 4 |
| Number of PLLs | 2 |
| Global Clock Networks | 10 |
| Process Node | 60 nm low power |
| Core Voltage | 1.2 V |
| Operating Temperature Grade | Automotive A7 (-40C to +125C junction) |
| Package Type | 144-pin EQFP (E22) with exposed pad |
| Configuration Modes | JTAG, AS, PS, FPP |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de EP4CE6E22A7N
| Broche 1 | I/O — General-purpose user I/O (bank 1) |
| Broche 2 | I/O — General-purpose user I/O (bank 1) |
| Broche 3 | I/O — General-purpose user I/O (bank 1) |
| Broche 4 | I/O — General-purpose user I/O (bank 1) |
| Broche 5 | I/O — General-purpose user I/O (bank 1) |
| Broche 6 | VCCIO1 — Bank 1 I/O supply voltage |
| Broche 7 | I/O — General-purpose user I/O (bank 1) |
| Broche 8 | I/O — General-purpose user I/O (bank 1) |
| Broche 9 | I/O — General-purpose user I/O (bank 1) |
| Broche 10 | I/O — General-purpose user I/O (bank 1) |
| Broche 11 | GND — Ground |
| Broche 12 | I/O — General-purpose user I/O (bank 1) |
| Broche 13 | I/O — General-purpose user I/O (bank 1) |
| Broche 14 | I/O — General-purpose user I/O (bank 1) |
| Broche 15 | I/O — General-purpose user I/O (bank 1) |
| Broche 16 | I/O — General-purpose user I/O (bank 1) |
| Broche 17 | VCCINT — Core 1.2 V supply |
| Broche 18 | I/O — General-purpose user I/O (bank 2) |
| Broche 19 | I/O — General-purpose user I/O (bank 2) |
| Broche 20 | GND — Ground |
| Broche 21 | I/O — General-purpose user I/O (bank 2) |
| Broche 22 | I/O — General-purpose user I/O (bank 2) |
| Broche 23 | I/O — General-purpose user I/O (bank 2) |
| Broche 24 | I/O — General-purpose user I/O (bank 2) |
| Broche 25 | VCCIO2 — Bank 2 I/O supply voltage |
| Broche 26 | I/O — General-purpose user I/O (bank 2) |
| Broche 27 | I/O — General-purpose user I/O (bank 2) |
| Broche 28 | I/O — General-purpose user I/O (bank 2) |
| Broche 29 | I/O — General-purpose user I/O (bank 2) |
| Broche 30 | GND — Ground |
| Broche 31 | I/O — General-purpose user I/O (bank 2) |
| Broche 32 | I/O — General-purpose user I/O (bank 2) |
| Broche 33 | I/O — General-purpose user I/O (bank 2) |
| Broche 34 | I/O — General-purpose user I/O (bank 2) |
| Broche 35 | I/O — General-purpose user I/O (bank 2) |
| Broche 36 | VCCINT — Core 1.2 V supply |
| Broche 37 | I/O — General-purpose user I/O (bank 3) |
| Broche 38 | I/O — General-purpose user I/O (bank 3) |
| Broche 39 | I/O — General-purpose user I/O (bank 3) |
| Broche 40 | I/O — General-purpose user I/O (bank 3) |
| Broche 41 | VCCIO3 — Bank 3 I/O supply voltage |
| Broche 42 | I/O — General-purpose user I/O (bank 3) |
| Broche 43 | I/O — General-purpose user I/O (bank 3) |
| Broche 44 | I/O — General-purpose user I/O (bank 3) |
| Broche 45 | I/O — General-purpose user I/O (bank 3) |
| Broche 46 | GND — Ground |
| Broche 47 | I/O — General-purpose user I/O (bank 3) |
| Broche 48 | I/O — General-purpose user I/O (bank 3) |
| Broche 49 | I/O — General-purpose user I/O (bank 3) |
| Broche 50 | I/O — General-purpose user I/O (bank 3) |
| Broche 51 | I/O — General-purpose user I/O (bank 3) |
| Broche 52 | I/O — General-purpose user I/O (bank 3) |
| Broche 53 | I/O — General-purpose user I/O (bank 3) |
| Broche 54 | VCCINT — Core 1.2 V supply |
| Broche 55 | I/O — General-purpose user I/O (bank 3) |
| Broche 56 | I/O — General-purpose user I/O (bank 3) |
| Broche 57 | I/O — General-purpose user I/O (bank 3) |
| Broche 58 | VCCIO3 — Bank 3 I/O supply voltage |
| Broche 59 | I/O — General-purpose user I/O (bank 4) |
| Broche 60 | I/O — General-purpose user I/O (bank 4) |
| Broche 61 | I/O — General-purpose user I/O (bank 4) |
| Broche 62 | I/O — General-purpose user I/O (bank 4) |
| Broche 63 | GND — Ground |
| Broche 64 | I/O — General-purpose user I/O (bank 4) |
| Broche 65 | I/O — General-purpose user I/O (bank 4) |
| Broche 66 | I/O — General-purpose user I/O (bank 4) |
| Broche 67 | I/O — General-purpose user I/O (bank 4) |
| Broche 68 | VCCIO4 — Bank 4 I/O supply voltage |
| Broche 69 | I/O — General-purpose user I/O (bank 4) |
| Broche 70 | I/O — General-purpose user I/O (bank 4) |
| Broche 71 | I/O — General-purpose user I/O (bank 4) |
| Broche 72 | I/O — General-purpose user I/O (bank 4) |
| Broche 73 | VCCINT — Core 1.2 V supply |
| Broche 74 | I/O — General-purpose user I/O (bank 4) |
| Broche 75 | I/O — General-purpose user I/O (bank 4) |
| Broche 76 | I/O — General-purpose user I/O (bank 4) |
| Broche 77 | GND — Ground |
| Broche 78 | I/O — General-purpose user I/O (bank 4) |
| Broche 79 | I/O — General-purpose user I/O (bank 4) |
| Broche 80 | I/O — General-purpose user I/O (bank 4) |
| Broche 81 | I/O — General-purpose user I/O (bank 4) |
| Broche 82 | I/O — General-purpose user I/O (bank 4) |
| Broche 83 | I/O — General-purpose user I/O (bank 4) |
| Broche 84 | I/O — General-purpose user I/O (bank 4) |
| Broche 85 | VCCIO4 — Bank 4 I/O supply voltage |
| Broche 86 | I/O — General-purpose user I/O (bank 4) |
| Broche 87 | I/O — General-purpose user I/O (bank 4) |
| Broche 88 | I/O — General-purpose user I/O (bank 4) |
| Broche 89 | I/O — General-purpose user I/O (bank 4) |
| Broche 90 | I/O — General-purpose user I/O (bank 4) |
| Broche 91 | I/O — General-purpose user I/O (bank 4) |
| Broche 92 | GND — Ground |
| Broche 93 | I/O — General-purpose user I/O (bank 4) |
| Broche 94 | I/O — General-purpose user I/O (bank 4) |
| Broche 95 | I/O — General-purpose user I/O (bank 4) |
| Broche 96 | I/O — General-purpose user I/O (bank 4) |
| Broche 97 | I/O — General-purpose user I/O (bank 4) |
| Broche 98 | I/O — General-purpose user I/O (bank 4) |
| Broche 99 | VCCINT — Core 1.2 V supply |
| Broche 100 | I/O — General-purpose user I/O (bank 1) |
| Broche 101 | I/O — General-purpose user I/O (bank 1) |
| Broche 102 | I/O — General-purpose user I/O (bank 1) |
| Broche 103 | I/O — General-purpose user I/O (bank 1) |
| Broche 104 | VCCIO1 — Bank 1 I/O supply voltage |
| Broche 105 | I/O — General-purpose user I/O (bank 1) |
| Broche 106 | I/O — General-purpose user I/O (bank 1) |
| Broche 107 | I/O — General-purpose user I/O (bank 1) |
| Broche 108 | I/O — General-purpose user I/O (bank 1) |
| Broche 109 | GND — Ground |
| Broche 110 | I/O — General-purpose user I/O (bank 1) |
| Broche 111 | I/O — General-purpose user I/O (bank 1) |
| Broche 112 | I/O — General-purpose user I/O (bank 1) |
| Broche 113 | I/O — General-purpose user I/O (bank 1) |
| Broche 114 | I/O — General-purpose user I/O (bank 1) |
| Broche 115 | I/O — General-purpose user I/O (bank 1) |
| Broche 116 | I/O — General-purpose user I/O (bank 1) |
| Broche 117 | I/O — General-purpose user I/O (bank 1) |
| Broche 118 | VCCINT — Core 1.2 V supply |
| Broche 119 | I/O — General-purpose user I/O (bank 1) |
| Broche 120 | I/O — General-purpose user I/O (bank 1) |
| Broche 121 | I/O — General-purpose user I/O (bank 1) |
| Broche 122 | VCCIO1 — Bank 1 I/O supply voltage |
| Broche 123 | CONF_DONE — Configuration done status (open-drain) |
| Broche 124 | nSTATUS — Configuration status (open-drain) |
| Broche 125 | CONFIG — Configuration mode select |
| Broche 126 | MSEL0 — Configuration mode select 0 |
| Broche 127 | MSEL1 — Configuration mode select 1 |
| Broche 128 | MSEL2 — Configuration mode select 2 |
| Broche 129 | TCK — JTAG test clock input |
| Broche 130 | TMS — JTAG test mode select input |
| Broche 131 | TDI — JTAG test data input |
| Broche 132 | TDO — JTAG test data output |
| Broche 133 | nCE — Chip enable (active-low) |
| Broche 134 | nCONFIG — Configuration start (active-low) |
| Broche 135 | DCLK — Configuration clock input |
| Broche 136 | DATA0 — Configuration data input 0 |
| Broche 137 | GND — Ground |
| Broche 138 | VCCIO2 — Bank 2 I/O supply voltage |
| Broche 139 | I/O — General-purpose user I/O (bank 2) |
| Broche 140 | I/O — General-purpose user I/O (bank 2) |
| Broche 141 | I/O — General-purpose user I/O (bank 2) |
| Broche 142 | I/O — General-purpose user I/O (bank 2) |
| Broche 143 | I/O — General-purpose user I/O (bank 2) |
| Broche 144 | GND — Ground (exposed pad on package bottom) |
Applications typiques
EP4CE6E22A7N convient pour 6 applications: Industrial Motor Control Encoder Interface, Video Format Conversion / Image Processing Pipeline, Industrial Ethernet / Fieldbus Protocol Bridging, LED Video Wall Scan and Refresh Driver, Handheld Test and Measurement Instrument, Automotive Infotainment / Body Electronics Module.
Industrial Motor Control Encoder Interface
The EP4CE6E22A7N's 15 embedded 18x18 multipliers and 91 user I/Os make it a strong fit for industrial motor control encoder and resolver interfaces. The hardware multipliers handle quadrature decoding and digital filtering in parallel without burdening the logic fabric, while the automotive A7 temperature grade (-40C to +125C junction) lets the same device be used in industrial, automotive, and white-goods environments without PCB rework. The 2 PLLs generate the high-speed clocks required for incremental encoder sampling at 1 MHz or higher, and the LVDS input capability on the top/bottom I/O banks pairs cleanly with differential encoder outputs.
Recommandé
Video Format Conversion / Image Processing Pipeline
The EP4CE6E22A7N's 276,480 bits of M9K embedded RAM serve as line buffers and frame-store memory for video format conversion between DVI/HDMI, RGB, and LVDS display interfaces. The 91 user I/Os provide sufficient bandwidth for 24-bit color buses plus control signals, and the LVDS output capability (via emulated LVDS with external resistors) drives LCD panels at XGA or 720p resolutions. Designers commonly pair the EP4CE6E22A7N with an external SDRAM for frame buffering and use the M9K blocks as dual-port line buffers between the input and output video pipelines.
Recommandé
Industrial Ethernet / Fieldbus Protocol Bridging
The EP4CE6E22A7N is widely deployed as a low-cost protocol bridge between industrial fieldbuses such as PROFINET, EtherCAT, EtherNet/IP, Modbus TCP, CAN, and RS-485. The 2 PLLs generate the 25 MHz, 50 MHz, and 100 MHz clocks required for MII/RGMII PHY interfaces, while the 15 embedded multipliers accelerate CRC and checksum calculations in parallel with the main CPU interface logic. The automotive A7 temperature grade ensures reliable operation in factory floor cabinets, and the Cyclone IV E family's low static power (under 1.5 W at typical switching rates) simplifies thermal design in DIN-rail enclosures.
Recommandé
LED Video Wall Scan and Refresh Driver
The EP4CE6E22A7N's combination of 15 hardware multipliers, 270 Kbits of M9K memory, and 91 LVCMOS/LVDS-compatible user I/Os makes it well suited as a scan driver for LED video walls in digital signage and stage lighting applications. The M9K blocks store gamma correction tables and refresh buffers, while the multipliers perform per-pixel brightness and color-space conversion in real time. The automotive A7 temperature grade allows outdoor cabinet deployment in direct sunlight without active cooling, and the EQFP-144 exposed-pad package handles the moderate power dissipation of a fully-loaded Cyclone IV E cleanly through a copper thermal pour.
Recommandé
Handheld Test and Measurement Instrument
The EP4CE6E22A7N's low static power (60 nm low-k process) and small 144-pin EQFP package are ideal for handheld portable test instruments such as oscilloscope front-ends, logic analyzers, and protocol sniffers. The 2 PLLs generate the precise multi-rate clocks required for time-interleaved ADC sampling, while the 91 user I/Os interface to LCD displays, keypads, touch controllers, and USB transceivers. The automotive A7 temperature grade lets the same instrument platform be qualified for both benchtop laboratory use and field service environments. Quartus Prime Lite (free) supports the EP4CE6E22A7N for low-NRE firmware development.
Recommandé
Automotive Infotainment / Body Electronics Module
The EP4CE6E22A7N's automotive A7 temperature grade (-40C to +125C junction) and AEC-Q-style qualification makes it directly deployable in automotive infotainment head units, instrument clusters, body control modules, and CAN/LIN gateway nodes. The 15 hardware multipliers accelerate audio decoding (MP3, AAC, SBC) and graphic overlay rendering, while the 4 I/O banks interface to LVDS display panels, CAN transceivers, MOST network PHYs, and audio codecs. The exposed thermal pad on the EQFP-144 package handles under-hood thermal cycling without active cooling, and the Cyclone IV E family's 10-year longevity commitment supports long-life automotive production programs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP4CE6E22A7N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP4CE6E22C8N | EP4CE6E22I7N | EP4CE10E22C8N | EP4CE10E22I8N | EP4CE15E22C8N | XC6SLX9-2TQG144 |
|---|---|---|---|---|---|---|---|
| Package | 144-pin EQFP (E22) | 144-pin EQFP (E22) - same | 144-pin EQFP (E22) - same | 144-pin EQFP (E22) - same | 144-pin EQFP (E22) - same | 144-pin EQFP (E22) - same | 144-pin TQG144 - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | AMD |
| Logic Elements | 6,272 | 6,272 (same die) | 6,272 (same die) | 10,320 (+65%) | 10,320 (+65%) | 15,408 (+146%) | 9,152 logic cells |
| Temperature Grade | A7 (-40C to +125C junction) | C8 (0C to +85C) | I7 (-40C to +100C) | C8 (0C to +85C) | I8 (-40C to +100C) | C8 (0C to +85C) | C (0C to +85C) |
| Speed Grade | A7 (automotive timing) | C8 (commercial 8 ns) | I7 (industrial 7 ns) | C8 (commercial 8 ns) | I8 (industrial 8 ns) | C8 (commercial 8 ns) | -2 (Spartan-6 medium speed) |
| Embedded Multipliers (18x18) | 15 | 15 (same die) | 15 (same die) | 23 (+53%) | 23 (+53%) | 56 (+273%) | 16 DSP48A1 slices |
| Embedded Memory | 276,480 bits (270 Kbits) | 276,480 bits (same die) | 276,480 bits (same die) | 423,936 bits (+53%) | 423,936 bits (+53%) | 516,096 bits (+87%) | 589,824 bits (Block RAM) |
| User I/Os | 91 | 91 | 91 | 91 | 91 | 81 (-11%) | 102 (+12%) |
| Toolchain | Quartus Prime (free Lite) | Quartus Prime (free Lite) | Quartus Prime (free Lite) | Quartus Prime (free Lite) | Quartus Prime (free Lite) | Quartus Prime (free Lite) | ISE / Vivado (free WebPack) |
Principaux différenciateurs
- Automotive A7 temperature grade in low-cost Cyclone IV E family (vs EP4CE6E22C8N)
- Logic-density upgrade path on identical PCB footprint (vs EP4CE10E22C8N)
- Lowest-cost cross-architecture alternative (vs XC6SLX9-2TQG144)
Notes de conception
Estimated: At typical 1.2 V core switching activity with 50% utilization, the EP4CE6E22A7N dissipates approximately 1.0 to 1.5 W of static and dynamic power. The exposed pad on the underside of the EQFP-144 package is the primary thermal path - it must be soldered to a PCB thermal pad connected to an inner ground plane with at least 9 thermal vias (0.3 mm diameter) for the datasheet thermal resistance of approximately 18 C/W to be met. Without the exposed-pad soldering, junction temperature can exceed 125C and trigger thermal shutdown during normal automotive operation.
Decouple the EP4CE6E22A7N with a 100 nF X7R 0402 ceramic capacitor within 3 mm of each VCCINT and VCCIO pin, plus a single 10 uF bulk tantalum or ceramic capacitor near the device. The four VCCIO banks can run at different voltages (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.0 V, or 3.3 V) and must each have their own decoupling. Keep the JTAG chain traces (TCK, TMS, TDI, TDO) under 150 mm total length and avoid running them parallel to high-speed LVDS signals.
LVDS input is supported only on the top (banks 1 and 3) and bottom (banks 2 and 4) I/O banks; LVDS output on the left/right banks requires an external resistor network for emulated LVDS. The MSEL[2:0] pins must match the desired configuration mode (AS x1, AS x4, PS, FPP) before power-up - changing MSEL after configuration begins causes configuration failure. Active Serial mode requires the MSEL pins to be set per the datasheet AS-x1 table, not the PS table.
Route all 91 user I/O signals on inner layers with 50 ohm single-ended or 100 ohm differential impedance, using the Intel-provided IBIS models for signal-integrity simulation. The two PLLs (top-left and bottom-right of the die) each require a quiet analog supply - place a ferrite bead between the PLL_AVCC pin and the main VCCINT plane, with 1 uF and 100 nF decoupling on the PLL_AVCC side. Do not route high-speed signals under the exposed pad or over the PLL region.
Informations de conformité
RoHS and REACH compliant per Intel product page. The A7 suffix in EP4CE6E22A7N denotes the automotive temperature grade (-40C to +125C junction); the A7 speed/temperature code is part of the Cyclone IV E ordering information. AEC-Q100 qualification documentation is available under NDA from Intel Field Application Engineering.
