EP4CE40F23C8LN - Cyclone IV E FPGA, 39.6K LE, FBGA-484 | Intel
Référence : EP4CE40F23C8LN ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $78.5 | $78,50 |
| 10 | $72.4 | $724,00 |
| 100 | $64.2 | $6 420,00 |
| 500 | $56.8 | $28 400,00 |
| 1 000 | $49.95 | $49 950,00 |
EP4CE40F23C8LN Présentation
A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic fabric, routing, and I/O can be programmed in the field to implement arbitrary digital circuits, sitting architecturally between fixed-function ASICs and software-driven microcontrollers in the broader semiconductor hierarchy: FPGA → programmable logic → digital IC → semiconductor. Cyclone IV E devices specifically target cost- and power-sensitive applications where designers need ASIC-like integration without the NRE cost of custom silicon.
Key features of this device include four general-purpose PLLs per device, 20 global clock networks, support for external memory interfaces such as DDR/DDR2/QDR II SRAM, and the C8 speed grade with industrial temperature rating (suffix "I" would be explicitly industrial; this part uses the C8L designation). The "8" suffix denotes the 8 ns speed grade internal timing, while the "L" indicates lead-free / Pb-free packaging compliant with RoHS. The die operates from a 1.2 V core supply with separate 1.2 V / 2.5 V / 3.3 V I/O bank supplies, enabling mixed-voltage interfacing without external level shifters.
The EP4CE40F23C8LN is widely used in industrial automation, motor control, video processing, communications infrastructure, and ASIC prototyping where mid-range logic density (39.6K LE) is required. Its high multiplier count and ample block RAM make it particularly suitable for DSP pipelines and multi-channel data acquisition. Designers benefit from the Quartus Prime design suite support, including the free Quartus Prime Lite edition, which covers the full Cyclone IV E family.
When designing with this part, ensure the FBGA-484 PCB footprint meets the 1.0 mm ball pitch with non-solder-mask-defined (NSMD) pads per IPC-7351, and provide sufficient via-in-pad or dog-bone fanout for signal escape routing. Thermal management is generally passive at typical industrial operating points, but junction temperature must be verified against the application power profile using the Quartus PowerPlay estimator.
This page synthesizes distributor pricing, drop-in alternative OPNs within the same FBGA-484 footprint, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour EP4CE40F23C8LN — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP4CE40F23C8LN (même facteur de forme et même empreinte) — différant par Package, Embedded Memory, Speed Grade, Process Technology, Embedded 18x18 Multipliers.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP4CE40F23C8N
✅ Remplacement direct✓ En stock
$52.85 / unité
Voir la fiche technique →EP4CE40F23C8L
✅ Remplacement direct✓ En stock
$72.1 / unité
Voir la fiche technique →EP4CE40F23I8LN
✅ Remplacement direct✓ En stock
$148 / unité
Voir la fiche technique →EP4CE40F23C9L
✅ Remplacement direct✓ En stock
$48.8 / unité
Voir la fiche technique →EP4CE40F23C8LN Valeurs maximales et caractéristiques électriques
| Series | Cyclone® IV E |
| Logic Elements (LE) | 39,600 |
| Embedded Memory (Bits) | 1,161,216 |
| Embedded 18×18 Multipliers | 116 |
| Maximum User I/O | 328 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Process Technology | 60 nm |
| Core Voltage | 1.2 V |
| Speed Grade | C8 (8 ns) |
| Boîtier | 484-FBGA, 23 × 23 mm, 1.0 mm pitch |
| Type de montage | Surface Mount (BGA) |
| Statut RoHS | Lead-free / Compliant |
| Internal Frequency (max) | 472 MHz |
| Température de fonctionnement | Commercial (0 °C to +85 °C, per "C" suffix) |
Guide de configuration des broches du EP4CE40F23C8LN 484-fbga, 23 × 23 mm, 1.0 mm pitch
Configuration des broches du EP4CE40F23C8LN (boîtier 484-fbga, 23 × 23 mm, 1.0 mm pitch). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP4CE40F23C8LN.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP4CE40F23C8LN convient pour 6 applications: Industrial Motor Control, Video Processing & Image Bridging, ASIC Prototyping & Design Validation, Communications Infrastructure (Baseband DSP), Multi-Channel Data Acquisition, LED Video Wall Controllers.
Industrial Motor Control
The EP4CE40F23C8LN suits multi-axis industrial motor control and servo drive systems. Its 116 embedded 18×18 multipliers handle Field-Oriented Control (FOC) and Space Vector PWM (SVPWM) math for up to three axes in parallel, while 1.16 Mbit of block RAM provides ample storage for sine/cosine lookup tables and per-axis state. The 328 user I/Os connect directly to multi-channel ADC/DAC interfaces for current/voltage feedback without external muxing. The 4 PLLs derive precise PWM carrier frequencies (typically 10-20 kHz) and resolver-excitation clocks from a single crystal. Commercial temperature (0-85 °C) covers most cabinet-mounted drives, while the I8LN variant extends to factory-floor edge installations.
Recommandé
Video Processing & Image Bridging
For mid-resolution video processing, surveillance DVRs, and multi-format image bridging, the EP4CE40F23C8LN delivers 39,600 LE plus 116 multipliers suitable for real-time scaling, deinterlacing, and color-space conversion (YUV↔RGB) pipelines. The 1.16 Mbit block RAM supports triple line buffers for progressive scan conversion at 720p60 without external SDRAM. The device's 328 I/Os accept parallel ITU-R BT.656, BT.1120, or LVDS camera inputs while driving HDMI/DVI encoder chips via LVDS pairs. Quartus IP cores provide hardware-accelerated MJPEG compression. Designers frequently pair this FPGA with external DDR2 memory for frame buffering at higher resolutions.
Recommandé
ASIC Prototyping & Design Validation
The EP4CE40F23C8LN serves as an ASIC prototyping platform for designs in the 30-50K ASIC-gate range, giving RTL designers real-world validation of their logic before committing to mask sets. Its 39,600 LE plus 116 hardware multipliers map cleanly to mid-complexity ASICs in industrial control, automotive body electronics, and consumer appliances. JTAG and Active Serial configuration interfaces match ASIC pin-count requirements for I/O-intensive designs. Engineers use Quartus SignalTap logic analysis and SignalProbe incremental routing to debug prototypes. The FBGA-484 footprint exposes enough I/Os to mimic large ASIC pad rings while keeping PCB costs reasonable.
Recommandé
Communications Infrastructure (Baseband DSP)
In communications infrastructure such as small-cell base stations, PTP packet processors, and protocol bridges, the EP4CE40F23C8LN delivers the DSP throughput needed for symbol-rate baseband processing. The 116 hardware 18×18 multipliers implement 32-tap FIR filters and FFT butterfly operations in a single clock cycle, replacing multiple discrete DSP chips. Four PLLs generate jitter-cleaned clocks for Ethernet PHYs, SGMII interfaces, and backplane SERDES. The 1.16 Mbit block RAM acts as a packet descriptor cache, while external DDR2 holds larger frame buffers. Designers benefit from the device's proven Cyclone IV E silicon reliability in 24/7 telecom environments.
Recommandé
Multi-Channel Data Acquisition
For high-channel-count data acquisition systems (DAQ) in test & measurement, the EP4CE40F23C8LN aggregates parallel ADC samples, performs on-the-fly DSP (averaging, FFT, decimation), and streams results over Ethernet or USB. The 328 user I/Os accept LVDS or parallel CMOS ADC buses from 16+ simultaneous channels at 100 MSPS, with the FPGA's 472 MHz internal operation comfortably handling the resulting 1.6 Gbps aggregate data rate. Block RAM buffers per-channel samples, while 116 multipliers run real-time FFTs for spectrum analysis. The FBGA-484 footprint provides the high pin count required for parallel ADC interfaces.
Recommandé
LED Video Wall Controllers
Driving LED video walls with thousands of pixels per panel demands the parallel I/O bandwidth that the EP4CE40F23C8LN provides. Each panel's row/column scan and PWM dimming math fit comfortably in 39,600 LE, with 116 multipliers handling gamma correction and color-space matrix math. The 328 user I/Os directly drive 16+ HUB75 chains without external muxes, supporting 128-scan-row panels at 10-bit color depth. Cyclone IV E's deterministic fabric ensures zero visual artifacts in refresh cycles. The commercial temperature grade suits indoor video wall installations, and the FBGA-484 package enables slim controller PCB designs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP4CE40F23C8LN — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP4CE40F23C8N | EP4CE40F23C8L | EP4CE40F23I8LN | EP4CE40F23C9L |
|---|---|---|---|---|---|
| Package | 484-FBGA (23×23 mm, 1.0 mm pitch) | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 39,600 | 39,600 | 39,600 | 39,600 | 39,600 |
| Embedded Memory (bits) | 1,161,216 | 1,161,216 | 1,161,216 | 1,161,216 | 1,161,216 |
| Speed Grade | C8 (8 ns) | C8 (8 ns) | C8 (8 ns) | I8 (8 ns, industrial) | C9 (9 ns) |
| Temperature Range | Commercial (0 to +85 °C) | Commercial | Commercial | Industrial (-40 to +100 °C) | Commercial |
| Maximum User I/O | 328 | 328 | 328 | 328 | 328 |
| Lead-Free / RoHS | Yes (L suffix) | Lead-free standard | Yes | Yes (L suffix) | Yes |
Principaux différenciateurs
- Explicit lead-free (L) suffix designation (vs EP4CE40F23C8N)
- Industrial temperature option in same footprint (vs EP4CE40F23I8LN)
- Same-family speed grade flexibility (vs EP4CE40F23C9L)
Notes de conception
The 484-FBGA with 1.0 mm ball pitch requires non-solder-mask-defined (NSMD) pads per IPC-7351, with via-in-pad or dog-bone fanout. Estimate: a 23×23 mm BGA with 0.4 mm via diameter and 0.8 mm pad diameter leaves just 0.6 mm trace-routing channel between pads, demanding 4-6 mil trace/space rules. Provide a continuous ground plane on Layer 2 to control return paths and reduce crosstalk on LVDS pairs.
Estimated: at typical Cyclone IV E utilization (~70% LE, 50% toggle rate, 100 MHz), the EP4CE40F23C8LN dissipates roughly 0.8-1.2 W from a 1.2 V core. The FBGA-484 thermal resistance θJA is approximately 18 °C/W with 4-layer PCB and adequate thermal vias. Junction temperature stays below 100 °C in commercial-temp applications, but industrial-grade designs with sustained high utilization should add a small heatsink or thermal spreader copper pour.
Cyclone IV E configuration pins MSEL[3:0] must be set correctly for the desired configuration mode (AS, PS, JTAG, FPP) - leaving them floating causes configuration failures. Decouple all VCCINT pins with 0.1 µF + 10 µF bulk capacitors placed within 5 mm of the BGA, and provide a 1.8 V or 3.3 V supply for VCCPD before VCCINTRAM ramps to prevent POR (Power-On-Reset) lockup. POR time for Standard POR is 50-200 ms.
Informations de conformité
Lead-free / RoHS compliant per 'L' suffix in ordering part number per Intel/Altera product labeling. Halogen-free molding compound per JEDEC JESD97. AEC-Q100 not applicable for FPGAs.
