EP4CE40F23C8LN - Cyclone IV E FPGA, 39.6K LE, FBGA-484 | Intel
부품 번호: EP4CE40F23C8LN ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $72.4 | $724.00 |
| 100 | $64.2 | $6,420.00 |
| 500 | $56.8 | $28,400.00 |
| 1,000 | $49.95 | $49,950.00 |
EP4CE40F23C8LN 개요
A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic fabric, routing, and I/O can be programmed in the field to implement arbitrary digital circuits, sitting architecturally between fixed-function ASICs and software-driven microcontrollers in the broader semiconductor hierarchy: FPGA → programmable logic → digital IC → semiconductor. Cyclone IV E devices specifically target cost- and power-sensitive applications where designers need ASIC-like integration without the NRE cost of custom silicon.
Key features of this device include four general-purpose PLLs per device, 20 global clock networks, support for external memory interfaces such as DDR/DDR2/QDR II SRAM, and the C8 speed grade with industrial temperature rating (suffix "I" would be explicitly industrial; this part uses the C8L designation). The "8" suffix denotes the 8 ns speed grade internal timing, while the "L" indicates lead-free / Pb-free packaging compliant with RoHS. The die operates from a 1.2 V core supply with separate 1.2 V / 2.5 V / 3.3 V I/O bank supplies, enabling mixed-voltage interfacing without external level shifters.
The EP4CE40F23C8LN is widely used in industrial automation, motor control, video processing, communications infrastructure, and ASIC prototyping where mid-range logic density (39.6K LE) is required. Its high multiplier count and ample block RAM make it particularly suitable for DSP pipelines and multi-channel data acquisition. Designers benefit from the Quartus Prime design suite support, including the free Quartus Prime Lite edition, which covers the full Cyclone IV E family.
When designing with this part, ensure the FBGA-484 PCB footprint meets the 1.0 mm ball pitch with non-solder-mask-defined (NSMD) pads per IPC-7351, and provide sufficient via-in-pad or dog-bone fanout for signal escape routing. Thermal management is generally passive at typical industrial operating points, but junction temperature must be verified against the application power profile using the Quartus PowerPlay estimator.
This page synthesizes distributor pricing, drop-in alternative OPNs within the same FBGA-484 footprint, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: EP4CE40F23C8LN — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4CE40F23C8LN (동일 폼 팩터 및 풋프린트) — 차이점: Package, Embedded Memory, Speed Grade, Process Technology, Embedded 18x18 Multipliers.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4CE40F23C8N
✅ 드롭인✓ 재고 있음
$52.85 / 개
데이터시트 보기 →EP4CE40F23C8L
✅ 드롭인✓ 재고 있음
$72.1 / 개
데이터시트 보기 →EP4CE40F23I8LN
✅ 드롭인✓ 재고 있음
$148 / 개
데이터시트 보기 →EP4CE40F23C9L
✅ 드롭인✓ 재고 있음
$48.8 / 개
데이터시트 보기 →EP4CE40F23C8LN 최대 정격 & 전기적 특성
| Series | Cyclone® IV E |
| Logic Elements (LE) | 39,600 |
| Embedded Memory (Bits) | 1,161,216 |
| Embedded 18×18 Multipliers | 116 |
| Maximum User I/O | 328 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Process Technology | 60 nm |
| Core Voltage | 1.2 V |
| Speed Grade | C8 (8 ns) |
| 패키지 | 484-FBGA, 23 × 23 mm, 1.0 mm pitch |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Lead-free / Compliant |
| Internal Frequency (max) | 472 MHz |
| 동작 온도 | Commercial (0 °C to +85 °C, per "C" suffix) |
EP4CE40F23C8LN 484-fbga, 23 × 23 mm, 1.0 mm pitch 핀 구성 가이드
EP4CE40F23C8LN(484-fbga, 23 × 23 mm, 1.0 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP4CE40F23C8LN.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP4CE40F23C8LN 적합 용도: 6 애플리케이션s: Industrial Motor Control, Video Processing & Image Bridging, ASIC Prototyping & Design Validation, Communications Infrastructure (Baseband DSP), Multi-Channel Data Acquisition, LED Video Wall Controllers.
Industrial Motor Control
The EP4CE40F23C8LN suits multi-axis industrial motor control and servo drive systems. Its 116 embedded 18×18 multipliers handle Field-Oriented Control (FOC) and Space Vector PWM (SVPWM) math for up to three axes in parallel, while 1.16 Mbit of block RAM provides ample storage for sine/cosine lookup tables and per-axis state. The 328 user I/Os connect directly to multi-channel ADC/DAC interfaces for current/voltage feedback without external muxing. The 4 PLLs derive precise PWM carrier frequencies (typically 10-20 kHz) and resolver-excitation clocks from a single crystal. Commercial temperature (0-85 °C) covers most cabinet-mounted drives, while the I8LN variant extends to factory-floor edge installations.
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Video Processing & Image Bridging
For mid-resolution video processing, surveillance DVRs, and multi-format image bridging, the EP4CE40F23C8LN delivers 39,600 LE plus 116 multipliers suitable for real-time scaling, deinterlacing, and color-space conversion (YUV↔RGB) pipelines. The 1.16 Mbit block RAM supports triple line buffers for progressive scan conversion at 720p60 without external SDRAM. The device's 328 I/Os accept parallel ITU-R BT.656, BT.1120, or LVDS camera inputs while driving HDMI/DVI encoder chips via LVDS pairs. Quartus IP cores provide hardware-accelerated MJPEG compression. Designers frequently pair this FPGA with external DDR2 memory for frame buffering at higher resolutions.
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ASIC Prototyping & Design Validation
The EP4CE40F23C8LN serves as an ASIC prototyping platform for designs in the 30-50K ASIC-gate range, giving RTL designers real-world validation of their logic before committing to mask sets. Its 39,600 LE plus 116 hardware multipliers map cleanly to mid-complexity ASICs in industrial control, automotive body electronics, and consumer appliances. JTAG and Active Serial configuration interfaces match ASIC pin-count requirements for I/O-intensive designs. Engineers use Quartus SignalTap logic analysis and SignalProbe incremental routing to debug prototypes. The FBGA-484 footprint exposes enough I/Os to mimic large ASIC pad rings while keeping PCB costs reasonable.
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Communications Infrastructure (Baseband DSP)
In communications infrastructure such as small-cell base stations, PTP packet processors, and protocol bridges, the EP4CE40F23C8LN delivers the DSP throughput needed for symbol-rate baseband processing. The 116 hardware 18×18 multipliers implement 32-tap FIR filters and FFT butterfly operations in a single clock cycle, replacing multiple discrete DSP chips. Four PLLs generate jitter-cleaned clocks for Ethernet PHYs, SGMII interfaces, and backplane SERDES. The 1.16 Mbit block RAM acts as a packet descriptor cache, while external DDR2 holds larger frame buffers. Designers benefit from the device's proven Cyclone IV E silicon reliability in 24/7 telecom environments.
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Multi-Channel Data Acquisition
For high-channel-count data acquisition systems (DAQ) in test & measurement, the EP4CE40F23C8LN aggregates parallel ADC samples, performs on-the-fly DSP (averaging, FFT, decimation), and streams results over Ethernet or USB. The 328 user I/Os accept LVDS or parallel CMOS ADC buses from 16+ simultaneous channels at 100 MSPS, with the FPGA's 472 MHz internal operation comfortably handling the resulting 1.6 Gbps aggregate data rate. Block RAM buffers per-channel samples, while 116 multipliers run real-time FFTs for spectrum analysis. The FBGA-484 footprint provides the high pin count required for parallel ADC interfaces.
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LED Video Wall Controllers
Driving LED video walls with thousands of pixels per panel demands the parallel I/O bandwidth that the EP4CE40F23C8LN provides. Each panel's row/column scan and PWM dimming math fit comfortably in 39,600 LE, with 116 multipliers handling gamma correction and color-space matrix math. The 328 user I/Os directly drive 16+ HUB75 chains without external muxes, supporting 128-scan-row panels at 10-bit color depth. Cyclone IV E's deterministic fabric ensures zero visual artifacts in refresh cycles. The commercial temperature grade suits indoor video wall installations, and the FBGA-484 package enables slim controller PCB designs.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4CE40F23C8LN — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4CE40F23C8N | EP4CE40F23C8L | EP4CE40F23I8LN | EP4CE40F23C9L |
|---|---|---|---|---|---|
| Package | 484-FBGA (23×23 mm, 1.0 mm pitch) | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 39,600 | 39,600 | 39,600 | 39,600 | 39,600 |
| Embedded Memory (bits) | 1,161,216 | 1,161,216 | 1,161,216 | 1,161,216 | 1,161,216 |
| Speed Grade | C8 (8 ns) | C8 (8 ns) | C8 (8 ns) | I8 (8 ns, industrial) | C9 (9 ns) |
| Temperature Range | Commercial (0 to +85 °C) | Commercial | Commercial | Industrial (-40 to +100 °C) | Commercial |
| Maximum User I/O | 328 | 328 | 328 | 328 | 328 |
| Lead-Free / RoHS | Yes (L suffix) | Lead-free standard | Yes | Yes (L suffix) | Yes |
주요 차별점
- Explicit lead-free (L) suffix designation (vs EP4CE40F23C8N)
- Industrial temperature option in same footprint (vs EP4CE40F23I8LN)
- Same-family speed grade flexibility (vs EP4CE40F23C9L)
설계 노트
The 484-FBGA with 1.0 mm ball pitch requires non-solder-mask-defined (NSMD) pads per IPC-7351, with via-in-pad or dog-bone fanout. Estimate: a 23×23 mm BGA with 0.4 mm via diameter and 0.8 mm pad diameter leaves just 0.6 mm trace-routing channel between pads, demanding 4-6 mil trace/space rules. Provide a continuous ground plane on Layer 2 to control return paths and reduce crosstalk on LVDS pairs.
Estimated: at typical Cyclone IV E utilization (~70% LE, 50% toggle rate, 100 MHz), the EP4CE40F23C8LN dissipates roughly 0.8-1.2 W from a 1.2 V core. The FBGA-484 thermal resistance θJA is approximately 18 °C/W with 4-layer PCB and adequate thermal vias. Junction temperature stays below 100 °C in commercial-temp applications, but industrial-grade designs with sustained high utilization should add a small heatsink or thermal spreader copper pour.
Cyclone IV E configuration pins MSEL[3:0] must be set correctly for the desired configuration mode (AS, PS, JTAG, FPP) - leaving them floating causes configuration failures. Decouple all VCCINT pins with 0.1 µF + 10 µF bulk capacitors placed within 5 mm of the BGA, and provide a 1.8 V or 3.3 V supply for VCCPD before VCCINTRAM ramps to prevent POR (Power-On-Reset) lockup. POR time for Standard POR is 50-200 ms.
규정 준수 정보
Lead-free / RoHS compliant per 'L' suffix in ordering part number per Intel/Altera product labeling. Halogen-free molding compound per JEDEC JESD97. AEC-Q100 not applicable for FPGAs.
