EP4CGX30BF14I7N - Cyclone IV GX FPGA, 30K LE, 169-FBGA | Intel
Référence : EP4CGX30BF14I7N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $98.65 | $98,65 |
| 10 | $92.4 | $924,00 |
| 100 | $78.5 | $7 850,00 |
| 500 | $71.2 | $35 600,00 |
| 1 000 | $65.8 | $65 800,00 |
EP4CGX30BF14I7N Présentation
An FPGA (field-programmable gate array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware blocks such as multipliers, memory blocks, and - in GX variants - multi-gigabit transceivers. FPGAs sit between discrete logic and ASICs in the design hierarchy, offering ASIC-class performance with mask-charge-free reprogrammability, making them ideal for prototyping, low-to-medium volume production, and designs requiring post-deployment logic updates. The Cyclone IV family specifically targets cost- and power-sensitive applications such as industrial control, video bridging, and protocol conversion.
The Cyclone IV GX architecture combines a 60 nm low-power process with hardened PCI Express (x1/x2) and multi-gigabit transceivers (up to 3.125 Gbps), eliminating the need for external PHY chips in many connectivity applications. The device supports LVDS, SSTL, and HSTL I/O standards with configurable on-chip termination. Hard IP blocks for memory controllers (DDR/DDR2/QDRII) and PCIe Gen1 reduce soft-logic overhead and simplify timing closure.
Typical applications include industrial machine vision and video bridging, factory automation backplanes with Profibus or Ethernet, low-cost PCIe endpoint cards, point-to-point serial-link aggregation, motor control and encoder interfaces, and portable test/measurement equipment. With 66 hardware multipliers and 108 KByte distributed RAM plus 540 Kbits M9K block RAM, the EP4CGX30BF14I7N balances DSP throughput with general logic capacity for mixed control-and-datapath designs.
Design consideration: the FBGA-169 package requires careful PCB stack-up planning - 1.0 mm pitch BGAs demand microvia or via-in-pad technology on standard 4-layer boards. Engineers should also budget for the transceiver reference-clock jitter budget and configure the on-chip PLL modes against the Quartus II / Quartus Prime tool's transceiver toolkit before board bring-up.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour EP4CGX30BF14I7N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP4CGX30BF14I7N (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Process Technology, Speed Grade, Transceivers.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP4CGX30BF14C7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$55.78 / unité
Voir la fiche technique →EP4CGX30CF14I7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EP4CGX30BF14C8N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$43.12 / unité
Voir la fiche technique →EP4CGX30BF14I7N
✅ Remplacement direct✓ En stock
$65.8 / unité
Voir la fiche technique →EP4CGX30BF14I7N Valeurs maximales et caractéristiques électriques
| Device Family | Cyclone IV GX |
| Logic Elements | 29,440 |
| Embedded Memory (bits) | 1,105,920 |
| User I/Os | 72 |
| Boîtier | 169-LBGA (FBGA-169, 14 x 14 mm, 1.0 mm pitch) |
| Température de fonctionnement | -40C to +100C (Industrial) |
| Transceivers | Up to 3.125 Gbps multi-gigabit transceivers |
| Embedded Multipliers (18 x 18) | 66 |
| PLLs | 4 |
| Global Clock Networks | 2 |
| Process Technology | 60 nm low-power |
| PCIe Hard IP | PCIe Gen1 x1/x2 |
| Memory Controller Hard IP | DDR / DDR2 / QDRII |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Guide de configuration des broches du EP4CGX30BF14I7N 169-lbga (fbga-169, 14 x 14 mm, 1.0 mm pitch)
Configuration des broches du EP4CGX30BF14I7N (boîtier 169-lbga (fbga-169, 14 x 14 mm, 1.0 mm pitch)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP4CGX30BF14I7N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP4CGX30BF14I7N convient pour 7 applications: Industrial Machine Vision Systems, Low-Cost PCIe Endpoint Cards, Video Bridging and Format Conversion, Factory Automation Backplanes, Motor Control and Encoder Interfaces, Portable Test and Measurement Equipment, Point-to-Point Serial Link Aggregation.
Industrial Machine Vision Systems
The EP4CGX30BF14I7N is well-matched to industrial machine vision because its 66 embedded 18 x 18 multipliers deliver the parallel pixel-processing throughput needed for real-time Bayer demosaicing, edge detection, and histogram equalization on VGA to 2-Megapixel image streams. The device's LVDS and sub-LVDS I/O support enables direct interface to Camera Link cameras without external bridge chips. Industrial temperature grade (-40C to +100C) ensures reliable operation on the factory floor. The 540 Kbits of M9K block RAM serves as line buffers for image pipeline stages, while 108 Kbits of distributed RAM holds lookup tables for gamma correction and color-space conversion. Designers typically use the on-chip PLL to generate the Camera Link clock from a single reference oscillator.
Recommandé
Low-Cost PCIe Endpoint Cards
The EP4CGX30BF14I7N's hardened PCI Express Gen1 x1/x2 IP block makes it ideal for low-cost PCIe endpoint cards such as data acquisition boards, industrial I/O cards, and protocol converters. The hard IP eliminates soft-logic overhead, freeing logic elements for application-specific DMA engines or register interfaces. Multi-gigabit transceivers up to 3.125 Gbps also support non-PCIe serial protocols on the same device. The 169-ball FBGA package keeps PCB cost manageable on standard 4-layer designs with via-in-pad. Engineers typically implement the PCIe hard IP using the Quartus Prime PCIe Compiler, with the on-chip PLLs generating the 100 MHz reference clock from the PCIe slot clock.
Recommandé
Video Bridging and Format Conversion
The EP4CGX30BF14I7N bridges between video standards such as DVI/HDMI, DisplayPort, MIPI, and parallel RGB, leveraging its multi-gigabit transceivers for TMDS/DisplayPort encoding and its flexible LVCMOS/LVDS I/O for parallel interfaces. Designers typically instantiate color-space converters and frame-rate converters in soft logic, using the 66 hardware multipliers for chroma upsampling and scaling operations. The 1.1 Mbits of embedded RAM serves as line and frame buffers for deinterlacing and scaling algorithms. The industrial temperature range supports outdoor signage and broadcast equipment applications.
Recommandé
Factory Automation Backplanes
Industrial Profibus, PROFINET, and EtherCAT master/slave nodes benefit from the EP4CGX30BF14I7N's transceiver-driven serial links and deterministic on-chip logic. The device supports industrial Ethernet MACs in soft logic, with multi-gigabit transceivers handling the PHY interface for PROFINET IRT and EtherCAT. Hardware multipliers accelerate cyclic redundancy check (CRC) computation and motion-control interpolation algorithms. The wide operating temperature range and robust BGA package suit vibration-prone factory environments. Designers typically pair the FPGA with an external PHY transceiver and use the on-chip PLLs to generate PHY reference clocks with sub-100 ps jitter.
Recommandé
Motor Control and Encoder Interfaces
The EP4CGX30BF14I7N handles multi-axis motor control loops by combining incremental encoder inputs (typically RS-422 or LVDS) with PWM generation and field-oriented control (FOC) algorithms. Hardware multipliers execute the Clarke/Park transforms and PID calculations within microseconds, while on-chip PLLs synchronize current-sampling ADC converters to PWM timers. The device's industrial temperature grade ensures reliable operation in drive cabinets. The 72 user I/Os accommodate up to 6 axes of encoder feedback plus PWM and fault inputs in a single chip.
Recommandé
Portable Test and Measurement Equipment
Portable oscilloscopes, logic analyzers, and protocol analyzers use the EP4CGX30BF14I7N to capture and process high-speed signals. The multi-gigabit transceivers support serial protocol decoding for I2C, SPI, UART, USB, and PCIe, while the abundant logic elements implement real-time trigger logic and pattern matching. Hardware multipliers enable FFT computations for spectrum analysis. The low-power Cyclone IV GX process extends battery life in handheld instruments. The 169-ball FBGA package keeps the device compact enough for portable form factors.
Recommandé
Point-to-Point Serial Link Aggregation
The EP4CGX30BF14I7N aggregates multiple low-speed serial channels into a higher-speed uplink, a common pattern in telecom and industrial gateways. Designers implement multi-protocol aggregation (E1/T1, RS-232/485, USB) in soft logic with hardware-accelerated CRC and encryption. Multi-gigabit transceivers support 1G/2.5G SFP uplink modules for fiber connectivity. The on-chip PLLs generate multiple reference clocks for the diverse serial standards, eliminating external clock-generation chips.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP4CGX30BF14I7N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP4CGX30BF14C7N | EP4CGX30CF14I7N | EP4CGX30BF14C8N |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | FBGA-169 (F14, 14x14 mm) | FBGA-169 (F14, 14x14 mm) - same | FBGA-169 (F14, 14x14 mm) - same | FBGA-169 (F14, 14x14 mm) - same |
| Logic Elements | 29,440 | 29,440 | 29,440 | 29,440 |
| Embedded Memory (bits) | 1,105,920 | 1,105,920 | 1,105,920 | 1,105,920 |
| User I/Os | 72 | 72 | 72 | 72 |
| Transceiver Data Rate | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) |
| Speed Grade | B7 (internal timing) | B7 (commercial) | C7 (faster) | C8 (faster, commercial) |
| Embedded 18x18 Multipliers | 66 | 66 | 66 | 66 |
| PCIe Hard IP | PCIe Gen1 x1/x2 | PCIe Gen1 x1/x2 | PCIe Gen1 x1/x2 | PCIe Gen1 x1/x2 |
Principaux différenciateurs
- Integrated multi-gigabit transceivers up to 3.125 Gbps (vs Cyclone IV E (non-GX) devices such as EP4CE115F23C8LN)
- Hardened PCI Express Gen1 x1/x2 IP block (vs Soft PCIe implementation in lower-end FPGAs)
- 169-ball FBGA at 14 x 14 mm with 1.0 mm pitch (vs Larger Cyclone IV GX packages (e.g. F256, F484))
Notes de conception
The FBGA-169 package at 1.0 mm ball pitch requires careful PCB stack-up planning. Standard 4-layer FR-4 boards with 1 oz copper typically need microvia (laser-drilled) technology or via-in-pad construction to fan out the BGA. Estimated: with 0.2 mm laser-drilled microvias, design for a 1.6 mm finished board thickness and use high-Tg FR-4 (Tg >= 150C) for lead-free reflow compatibility. Confirm pad and anti-pad dimensions against Intel's package mechanical drawing before finalizing stack-up.
Multi-gigabit transceivers operating at 3.125 Gbps require controlled-impedance differential routing (100 ohm differential) with length matching to within 150 mils. Reference clock jitter budget should not exceed 100 ps peak-to-peak. Use the Quartus Prime Transceiver Toolkit to characterize eye margins after PCB fab. Place AC-coupling capacitors close to the receiver pins with symmetric via placement to avoid impedance discontinuities.
The Cyclone IV GX device requires multiple supply rails: VCCINT (core, typically 1.2V), VCCA (PLL analog, 2.5V), VCCD_PLL (PLL digital, 1.2V), and VCCIO (I/O banks, 1.2V to 3.3V depending on standard). Decoupling should follow Intel's power distribution network (PDN) guidelines: place 0.1 uF and 0.01 uF ceramic capacitors within 100 mils of each power pin. Use at least one bulk 47 uF tantalum or polymer capacitor per supply rail.
Do not confuse temperature grade suffixes: the 'I' in EP4CGX30BF14I7N denotes industrial (-40C to +100C), while 'C' denotes commercial (0C to +85C). Substituting industrial-grade for commercial-grade parts in commercial-temperature designs is safe, but the reverse causes timing violations at temperature extremes. Also verify that configuration mode (AS, PS, JTAG) and MSEL pin strapping match the design intent before soldering - rework on FBGA-169 is impractical.
Informations de conformité
RoHS and REACH compliance per Intel Cyclone IV product family documentation. AEC-Q100 not applicable - this is a general-purpose FPGA, not an automotive-qualified part. For automotive applications, consider Cyclone IV GX automotive-grade variants or newer Cyclone V Auto parts.
