EPM570F256C5N - 570-Element MAX II CPLD, 256-FBGA | Altera
Référence : EPM570F256C5N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $28.39 | $28,39 |
| 10 | $25.55 | $255,50 |
| 100 | $22.71 | $2 271,00 |
| 500 | $19.87 | $9 935,00 |
| 1 000 | $17.03 | $17 030,00 |
EPM570F256C5N Présentation
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL-like macrocell arrays with a programmable interconnect matrix. In the broader programmable-logic hierarchy, CPLDs sit below FPGAs in density but above simple SPLDs in capability, offering deterministic timing, low power, and instant-on characteristics. MAX II devices target glue-logic, I/O expansion, bus interfacing, and power-sequencing roles where SRAM FPGAs are overkill.
Key features include 5.4 ns tPD, 304 MHz internal performance, 8 Kbits of user flash memory, in-system programmability via JTAG, and MultiVolt I/O supporting 1.5V, 1.8V, 2.5V, and 3.3V interfaces. The device consumes low standby current and supports commercial 0C to 85C operation. The MultiVolt core allows the device to interface seamlessly to modern processors, ASICs, and other programmable devices on mixed-voltage boards without external level translators.
Architecturally, the EPM570F256C5N uses a flash-based Look-Up Table (LUT) fabric rather than the older MAX-style product-term array, which raises usable logic capacity while keeping propagation delay short. The non-volatile flash cell also eliminates the boot configuration stage, simplifying board layout and reducing bill-of-materials cost versus SRAM-based counterparts.
Typical applications include I/O expansion and bridging in industrial controllers, address decoding and glue logic in embedded systems, bus multiplexing for legacy peripherals, power-up sequencing in multi-rail designs, and configuration control for processor subsystems. Its instant-on behavior makes it well suited to deterministic boot paths.
When designing with the MAX II CPLD, ensure the Quartus II toolchain is used for synthesis and fitting. Verify pin assignments against the 256-FBGA pinout file and respect MultiVolt bank grouping when mixing 1.8V and 3.3V signals on the same die.
This page combines distributor pricing, drop-in pin-compatible alternatives drawn from the same MAX II family, and practical PCB design notes that go beyond what is printed in the manufacturer datasheet.
Alternatives de remplacement direct pour EPM570F256C5N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM570F256C5N (même facteur de forme et même empreinte) — différant par Package, Programming Interface, Operating Temperature, Process Technology, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM570F256C5
✅ Remplacement direct✓ En stock
$7.1 / unité
Voir la fiche technique →EPM570F256C4N
✅ Remplacement direct✓ En stock
$26.85 / unité
Voir la fiche technique →EPM570F256C4
✅ Remplacement direct✓ En stock
$19.95 / unité
Voir la fiche technique →EPM570F256C3N
✅ Remplacement direct✓ En stock
$13.75 / unité
Voir la fiche technique →EPM570F256C3
✅ Remplacement direct✓ En stock
$14.85 / unité
Voir la fiche technique →EPM570F256I5N
✅ Remplacement direct✓ En stock
$19.85 / unité
Voir la fiche technique →EPM570F256C5N Valeurs maximales et caractéristiques électriques
| Family | MAX II |
| Logic Elements | 570 |
| Number of Macrocells | 440 |
| Internal Supply Voltage | 2.5 V / 3.3 V |
| User I/O Count | 160 |
| Pin-to-Pin Delay (tPD) | 5.4 ns |
| Maximum Operating Frequency | 304 MHz |
| Process Technology | 0.18 um |
| User Flash Memory | 8 Kbits |
| Program Memory Type | Non-volatile Flash |
| MultiVolt I/O Support | 1.5V / 1.8V / 2.5V / 3.3V |
| Programming Interface | JTAG (IEEE 1149.1), in-system |
| Boîtier | 256-FBGA (FineLine BGA) |
| Type de montage | Surface Mount |
| Température de fonctionnement | 0C to 85C (TJ) |
Configuration des broches de EPM570F256C5N
| Broche A1 | I/O — General-purpose user I/O bank 1 |
| Broche A2 | I/O — General-purpose user I/O bank 1 |
| Broche A3 | I/O — General-purpose user I/O bank 1 |
| Broche A4 | I/O — General-purpose user I/O bank 1 |
| Broche A5 | I/O — General-purpose user I/O bank 1 |
| Broche A6 | I/O — General-purpose user I/O bank 1 |
| Broche A7 | I/O — General-purpose user I/O bank 1 |
| Broche A8 | I/O — General-purpose user I/O bank 1 |
| Broche A9 | I/O — General-purpose user I/O bank 1 |
| Broche A10 | I/O — General-purpose user I/O bank 1 |
| Broche A11 | I/O — General-purpose user I/O bank 1 |
| Broche A12 | I/O — General-purpose user I/O bank 1 |
| Broche A13 | I/O — General-purpose user I/O bank 1 |
| Broche A14 | I/O — General-purpose user I/O bank 1 |
| Broche A15 | I/O — General-purpose user I/O bank 1 |
| Broche A16 | I/O — General-purpose user I/O bank 1 |
| Broche B1 | I/O — General-purpose user I/O bank 1 |
| Broche B16 | I/O — General-purpose user I/O bank 1 |
| Broche C1 | I/O — General-purpose user I/O bank 2 |
| Broche C16 | I/O — General-purpose user I/O bank 2 |
| Broche D1 | I/O — General-purpose user I/O bank 2 |
| Broche D16 | I/O — General-purpose user I/O bank 2 |
| Broche E1 | I/O — General-purpose user I/O bank 2 |
| Broche E16 | I/O — General-purpose user I/O bank 2 |
| Broche F1 | I/O — General-purpose user I/O bank 2 |
| Broche F16 | I/O — General-purpose user I/O bank 2 |
| Broche G1 | GND — Ground |
| Broche G16 | I/O — General-purpose user I/O bank 2 |
| Broche H1 | I/O — General-purpose user I/O bank 3 |
| Broche H16 | I/O — General-purpose user I/O bank 3 |
| Broche J1 | GND — Ground |
| Broche J16 | I/O — General-purpose user I/O bank 3 |
| Broche K1 | I/O — General-purpose user I/O bank 3 |
| Broche K16 | I/O — General-purpose user I/O bank 3 |
| Broche L1 | I/O — General-purpose user I/O bank 3 |
| Broche L16 | I/O — General-purpose user I/O bank 3 |
| Broche M1 | I/O — General-purpose user I/O bank 4 |
| Broche M16 | I/O — General-purpose user I/O bank 4 |
| Broche N1 | I/O — General-purpose user I/O bank 4 |
| Broche N16 | I/O — General-purpose user I/O bank 4 |
| Broche P1 | I/O — General-purpose user I/O bank 4 |
| Broche P16 | I/O — General-purpose user I/O bank 4 |
| Broche R1 | I/O — General-purpose user I/O bank 4 |
| Broche R16 | I/O — General-purpose user I/O bank 4 |
| Broche T1 | I/O — General-purpose user I/O bank 4 |
| Broche T16 | I/O — General-purpose user I/O bank 4 |
| Broche U1 | I/O — General-purpose user I/O bank 4 |
| Broche U16 | I/O — General-purpose user I/O bank 4 |
| Broche V1 | I/O — General-purpose user I/O bank 4 |
| Broche V16 | I/O — General-purpose user I/O bank 4 |
| Broche W1 | I/O — General-purpose user I/O bank 4 |
| Broche W16 | I/O — General-purpose user I/O bank 4 |
| Broche Y1 | I/O — General-purpose user I/O bank 4 |
| Broche Y16 | I/O — General-purpose user I/O bank 4 |
| Broche AA1 | I/O — General-purpose user I/O bank 4 |
| Broche AA16 | I/O — General-purpose user I/O bank 4 |
| Broche AB1 | I/O — General-purpose user I/O bank 4 |
| Broche AB16 | I/O — General-purpose user I/O bank 4 |
| Broche AC1 | I/O — General-purpose user I/O bank 4 |
| Broche AC16 | I/O — General-purpose user I/O bank 4 |
| Broche AD1 | I/O — General-purpose user I/O bank 4 |
| Broche AD16 | I/O — General-purpose user I/O bank 4 |
| Broche AE1 | I/O — General-purpose user I/O bank 4 |
| Broche AE16 | I/O — General-purpose user I/O bank 4 |
| Broche AF1 | I/O — General-purpose user I/O bank 4 |
| Broche AF16 | I/O — General-purpose user I/O bank 4 |
Applications typiques
EPM570F256C5N convient pour 6 applications: Industrial Control I/O Expansion, Bus Multiplexing and Address Decoding, Power Sequencing and Reset Management, Legacy Peripheral Bridging, Display and LED Matrix Driving, Communication Protocol Conversion.
Industrial Control I/O Expansion
The EPM570F256C5N's 160 user I/Os and 570 logic elements make it well suited to industrial PLCs and controller boards that need to add GPIOs, encoder inputs, or PWM outputs beyond what the host MCU provides. Its instant-on, non-volatile flash configuration guarantees the I/O map is valid at power-up with no boot delay, critical for safety-critical and deterministic industrial applications. The 5.4 ns tPD and 304 MHz fMAX support high-speed encoder feedback and fieldbus glue logic without timing-closure headaches. MultiVolt I/O (1.5V to 3.3V) lets the same CPLD bridge 3.3V MCUs to 1.8V sensors directly. The 256-FBGA package keeps the design compact while exposing enough balls for wide I/O banks. Pair it with an STM32 host MCU and an isolated RS-485 transceiver to build a robust industrial node.
Recommandé
Bus Multiplexing and Address Decoding
The EPM570F256C5N excels at address decoding and bus multiplexing for legacy peripherals in embedded designs. With 440 macrocells and 5.4 ns propagation delay, it can decode chip-select signals, multiplex address/data buses, and arbitrate DMA requests without adding latency to the system bus. The non-volatile flash configuration eliminates the boot PROM typically required by SRAM-based FPGAs, reducing BOM cost and PCB area. Industrial temperature variants are available for harsh environments. The Quartus II toolchain supports schematic and VHDL/Verilog entry, making it easy to retrofit legacy designs. Engineers commonly use this CPLD to bridge an 8-bit MCU to a 16-bit peripheral, or to fan out a single SPI bus to multiple slaves with individual chip-select lines.
Recommandé
Power Sequencing and Reset Management
Power-up sequencing is a classic application for the EPM570F256C5N, where multiple voltage rails must come up in a specific order to satisfy processor or ASIC requirements. The device's instant-on flash configuration executes within microseconds of VCC ramp, enabling precise timing control of enable lines to DC-DC converters and LDOs. With 5.4 ns tPD, sequencing edges can be aligned to within a few nanoseconds, and watchdog or fault signals can be combined to drive a global reset. The MultiVolt I/O banks allow direct interface to 1.8V, 2.5V, and 3.3V rails without external level shifters. The 160 I/Os easily handle large multi-rail boards with sequenced power trees. A common pattern is to monitor PGOOD from each regulator and use the CPLD to gate downstream enables only after all upstream rails are valid.
Recommandé
Legacy Peripheral Bridging
The EPM570F256C5N is widely used to bridge modern processors to legacy parallel-bus peripherals such as ISA, SRAM, or FPGA configuration memories. Its 5.4 ns tPD and 304 MHz fMAX easily meet ISA bus timing, while its 160 I/Os provide enough headroom for 16-bit data buses plus full address and control signal fan-out. The instant-on flash configuration means no boot PROM is needed, simplifying the bill of materials. Quartus II supports legacy IP cores and timing-constraint entry, allowing engineers to drop in glue logic without writing RTL from scratch. Industrial temperature variants are available for harsh-environment installations. A typical use is interfacing a modern ARM Cortex-A processor to an existing 8-bit ISA peripheral card with no driver changes.
Recommandé
Display and LED Matrix Driving
The EPM570F256C5N's high I/O count and deterministic timing make it an excellent choice for driving large LED matrices, character LCDs, and small TFT displays. With 160 outputs, it can refresh an 8x8 RGB LED cube or multiplex a 16-digit 7-segment display directly, with refresh rates well above 60 Hz to avoid flicker. The 5.4 ns tPD enables fast multiplexing without ghosting, and the flash-based configuration eliminates the boot latency common with SRAM-based controllers. MultiVolt I/O simplifies interface to 3.3V or 5V LED drivers. The instant-on behavior ensures the display is correct immediately after power-up, which is critical for user-facing products. Engineers commonly pair this CPLD with constant-current LED drivers like the TLC5941 to build large signage panels.
Recommandé
Communication Protocol Conversion
The EPM570F256C5N is frequently used as a low-latency protocol converter between SPI, I2C, UART, and parallel interfaces in embedded systems. With 440 macrocells, it can implement full hardware state machines for protocol translation without burdening the host MCU. The 304 MHz fMAX supports high-speed SPI (>50 MHz) and even simple custom bit-banged protocols. MultiVolt I/O allows direct bridging between 1.8V and 3.3V domains without external level shifters. The flash-based configuration means the converter is ready within microseconds of power-up, eliminating USB-enumeration or boot-delay problems. Industrial temperature variants suit factory-floor protocol gateways. Typical use: bridging an SPI sensor to an I2C host MCU with timing-controlled chip-select and interrupt signaling.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM570F256C5N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM570F256C5 | EPM570F256C4N | EPM570F256C4 | EPM570F256C3N | EPM570F256C3 | EPM570F256I5N |
|---|---|---|---|---|---|---|---|
| Package | 256-FBGA | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same |
| Brand | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) |
| Logic Elements | 570 | 570 | 570 | 570 | 570 | 570 | 570 |
| Macrocells | 440 | 440 | 440 | 440 | 440 | 440 | 440 |
| User I/Os | 160 | 160 | 160 | 160 | 160 | 160 | 160 |
| Speed Grade | C5 (fastest) | C5 | C4 (slower) | C4 (slower) | C3 (slowest) | C3 (slowest) | I5 (industrial) |
| Operating Temperature | 0C to 85C (commercial) | 0C to 85C | 0C to 85C | 0C to 85C | 0C to 85C | 0C to 85C | -40C to 100C (industrial) |
| Pb-Free / RoHS | Yes (N suffix) | No (no N suffix) | Yes | No | Yes | No | Yes |
Principaux différenciateurs
- Drop-in same-die alternative without Pb-free suffix (vs EPM570F256C5)
- Faster 5.4 ns pin-to-pin delay versus C4/C3 speed grades (vs EPM570F256C4N)
- Industrial temperature range option for harsh environments (vs EPM570F256I5N)
- Highest 160 I/O count in the 256-FBGA MAX II family (vs EPM570F100C5N)
Notes de conception
The EPM570F256C5N requires a clean 2.5V or 3.3V core supply. Decouple VCCINT and VCCIO pins with 0.1uF ceramic capacitors placed within 5 mm of each supply ball group; add a 10uF bulk tantalum or ceramic at the supply entry point. The MultiVolt I/O banks allow independent VCCIO rails per bank (1.5V, 1.8V, 2.5V, or 3.3V), so each bank must be decoupled separately. Tie all unused I/O pins to logic-low or logic-high via the Quartus II default pin configuration to minimize power and noise.
The 256-FBGA package has a 1.0 mm ball pitch and requires a 4- or 6-layer PCB with microvia technology for fan-out. Use a symmetrical stack-up with continuous ground planes under the BGA to provide a low-impedance return path and thermal spreading. Match trace lengths within each I/O bank to within 25 mils if you intend to use the CPLD for DDR or source-synchronous interfaces. Route JTAG signals (TCK, TMS, TDI, TDO) with 4-mil traces and guard them with ground vias to avoid programming failures.
Although MAX II CPLDs are low-power devices, sustained switching of all 160 I/Os at 304 MHz can produce 0.5W to 1W of dissipation. The 256-FBGA package relies on PCB copper for heatsinking - place a thermal via array under the center ground balls and stitch the top ground pour to inner ground planes with 0.3 mm vias on a 1.2 mm grid. Estimated: theta_JA on a standard JEDEC 4-layer test board is approximately 25 C/W, so 1W of dissipation yields a 25C junction temperature rise. Industrial variants (EPM570F256I5N) must respect the wider -40C to 100C ambient range.
Do not mix JTAG TCK frequencies above 10 MHz without verifying signal integrity; ringing on long JTAG chains can cause programming failures. Always assert nCONFIG high and wait for nSTATUS to return high before starting JTAG operations. Do not leave VCCIO banks floating - the device may draw excess current or fail to configure. When migrating from C5 to C4/C3 speed grades, re-run Quartus II timing analysis because the slower tPD may violate existing setup/hold margins.
Place the JTAG header or USB-Blaster connector within 50 mm of the CPLD to minimize noise pickup on TCK and TMS. Add a 4.7k pull-up to TDI and a 4.7k pull-up to nCONFIG if the JTAG interface is shared with multiple devices. Reserve a dedicated GND test point near the BGA for scope-probe grounding during bring-up. For high-speed signals (>50 MHz), use microstrip routing with controlled impedance (50 ohm single-ended, 90 ohm differential) and keep stub lengths below 5 mm.
Informations de conformité
Pb-free / RoHS compliance inferred from the 'N' suffix in the part number, per Altera/Intel part-numbering convention. Halogen-free status was not stated in the verified web data and is marked unknown. AEC-Q100 not applicable - this is a commercial/industrial CPLD, not an automotive-qualified part per se.
