EP4CGX50CF23I7NAA - Cyclone IV GX FPGA, 49.9K LE, F484 | Intel
Référence : EP4CGX50CF23I7NAA ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $103.85 | $103,85 |
| 10 | $98.2 | $982,00 |
| 100 | $89.75 | $8 975,00 |
| 250 | $84.3 | $21 075,00 |
| 500 | $79.5 | $39 750,00 |
EP4CGX50CF23I7NAA Présentation
The Cyclone IV GX family is a low-power, high-functionality programmable logic device line from Intel FPGA. As a field-programmable gate array (FPGA), it belongs to the broader hierarchy of programmable logic devices (PLDs) -> programmable logic ICs -> logic semiconductors -> integrated circuits. Cyclone IV GX FPGAs specifically target cost-sensitive applications requiring integrated transceivers and DSP blocks, making them a staple in video bridging, industrial connectivity, and wireless infrastructure designs.
Key features include 49,888 logic elements (LEs) organized into 3,136 logic array blocks (LABs), 2,562,048 bits (~2.5 Mbit) of embedded SRAM configurable as RAM, ROM, or FIFO, 132 embedded 18x18 multipliers for DSP operations, and 4 phase-locked loops (PLLs). The integrated transceivers support data rates up to 3.125 Gbps, enabling protocols such as PCI Express Gen1, Gigabit Ethernet, Serial RapidIO, and CPRI. The device operates from a 1.2V core supply with separate transceiver and I/O voltages.
The F484 package is a 1.0mm pitch FineLine BGA with 484 balls, providing high-density board integration while maintaining manufacturability with standard BGA assembly processes. The I7 speed grade designates an industrial temperature range, while the 8-transceiver configuration supports multiple high-speed serial interfaces simultaneously without external PHY devices.
Typical applications include industrial video surveillance with on-camera analytics, PCIe Gen1 endpoint cards in test equipment, broadcast video bridging (SDI to HDMI), wireless backhaul baseband processing, and motor control with high-speed feedback sampling. The combination of DSP blocks and transceivers makes the Cyclone IV GX particularly attractive for systems that previously required an FPGA plus an external transceiver PHY.
When designing with this device, allocate sufficient PCB layers for power delivery - the core, PLL, transceiver, and I/O banks each require dedicated decoupling. Quartus II (or Intel Quartus Prime) software is required for synthesis, place-and-route, and bitstream generation, and the device is supported through the Cyclone IV device family in design tools.
This page synthesizes distributor pricing, drop-in same-package variants, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour EP4CGX50CF23I7NAA — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP4CGX50CF23I7NAA (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Process Technology, Speed Grade, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP4CGX50CF23I7N
✅ Remplacement direct✓ En stock
$121.4 / unité
Voir la fiche technique →EP4CGX50CF23C8N
✅ Remplacement direct✓ En stock
$56.5 / unité
Voir la fiche technique →EP4CGX50CF23C7N
✅ Remplacement direct✓ En stock
$110.5 / unité
Voir la fiche technique →EP4CGX50CF23I7
✅ Remplacement direct✓ En stock
$112 / unité
Voir la fiche technique →EP4CGX50CF23C6N
✅ Remplacement direct✓ En stock
$65.8 / unité
Voir la fiche technique →EP4CGX50CF23I7NAA Valeurs maximales et caractéristiques électriques
| Family | Cyclone IV GX |
| Logic Elements (LEs) | 49,888 |
| Logic Array Blocks (LABs) | 3,136 |
| Embedded Memory (Bits) | 2,562,048 |
| Embedded Memory (M9K Blocks) | 270 |
| Embedded 18x18 Multipliers | 132 |
| Phase-Locked Loops (PLLs) | 4 |
| Global Clock Networks | 20 |
| Transceivers | 8 channels, up to 3.125 Gbps |
| Core Voltage | 1.2 V |
| Plage de température de fonctionnement | -40C to +100C (Industrial, I7) |
| Speed Grade | 7 |
| Boîtier | 484-ball FineLine BGA (F23), 1.0mm pitch |
| Type de montage | Surface Mount (BGA) |
| Configuration Scheme | AS, PS, JTAG, FPP |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
| Niveau MSL | 3 |
Guide de configuration des broches du EP4CGX50CF23I7NAA 484-ball fineline bga (f23), 1.0mm pitch
Configuration des broches du EP4CGX50CF23I7NAA (boîtier 484-ball fineline bga (f23), 1.0mm pitch). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP4CGX50CF23I7NAA.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP4CGX50CF23I7NAA convient pour 6 applications: Industrial Video Surveillance with On-Camera Analytics, PCI Express Gen1 Endpoint Cards, Broadcast Video Bridging (SDI/HDMI), Industrial Motor Control and Servo Drives, Wireless Baseband Processing (CPRI / OBSAI), Medical Imaging Interface Boards.
Industrial Video Surveillance with On-Camera Analytics
The EP4CGX50CF23I7NAA suits IP camera and DVR designs that need mid-range DSP and 3.125 Gbps transceivers on a single chip. Its 132 18x18 multipliers handle H.264/H.265 motion estimation pipelines, while the 2,562,048 bits of embedded memory buffer full-HD frame buffers without external SRAM. Eight transceiver channels aggregate multiple sensor streams via GigE Vision or SDI, replacing an FPGA-plus-PHY two-chip design. The I7 industrial -40C to +100C range supports outdoor housings and factory floor enclosures. PCB layout benefits from a 1.0mm-pitch F484 BGA, which balances board density against standard 4-layer SMT assembly.
Recommandé
PCI Express Gen1 Endpoint Cards
The EP4CGX50CF23I7NAA integrates a hard PCIe Gen1 IP block at 2.5 Gbps, eliminating external PHY chips on PXI, DAQ, and instrument cards. The 49,888 LEs accommodate PCIe hard IP plus application logic such as DMA engines, custom register interfaces, and on-board signal conditioning. Eight transceiver channels allow simultaneous PCIe x1 plus secondary links like Serial RapidIO for chassis backplane connectivity. The I7 industrial temperature range suits test and measurement equipment that operates in uncontrolled lab and factory environments. Quartus II provides a verified PCIe Compiler IP that compiles against this device.
Recommandé
Broadcast Video Bridging (SDI/HDMI)
The EP4CGX50CF23I7NAA bridges SDI (270 Mbps to 3 Gbps SD/HD/3G-SDI) and HDMI/DVI sources in broadcast routers and converters. Its 8 transceivers handle up to eight simultaneous 3G-SDI channels while internal CDR recovers clock from the serial stream, removing external clock-cleaner PLLs. The 270 M9K memory blocks (2.5 Mbit) implement line buffers, frame stores, and genlock FIFOs. The industrial temperature grade suits OB vans and field-broadcast gear subject to ambient swings. The device's native SDI reference designs in the Cyclone IV GX handbook shorten time-to-market versus competing FPGAs.
Recommandé
Industrial Motor Control and Servo Drives
The EP4CGX50CF23I7NAA's 132 hardware multipliers execute field-oriented control (FOC), space-vector PWM, and encoder interpolation loops in industrial servo drives. Eight transceivers interface to absolute encoders (EnDat 2.2, BiSS, SSI) and to multi-axis EtherCAT slaves via off-the-shelf IP cores. The 49,888 LEs fit multi-axis loops plus safety logic compliant with IEC 61508 SIL 2 paths. Industrial -40C to +100C operation supports cabinet temperatures without derating. Decoupling strategy must segregate the 1.2V core, 2.5V analog PLL, and 3.3V I/O rails to avoid noise coupling into PWM outputs.
Recommandé
Wireless Baseband Processing (CPRI / OBSAI)
The EP4CGX50CF23I7NAA's transceivers support CPRI (up to 3.072 Gbps) and OBSAI, the standard fronthaul protocols between baseband units and remote radio heads in 3G/4G small cells. The 49,888 LEs run PHY-layer baseband such as FFT/iFFT, channel coding, and digital pre-distortion (DPD) look-up tables. The 2.5 Mbit of embedded memory holds DPD coefficient tables and channel state buffers. Industrial temperature rating supports outdoor small-cell radios and tower-mounted equipment. The same design can target picocells, femtocells, and CPRI repeater applications.
Recommandé
Medical Imaging Interface Boards
The EP4CGX50CF23I7NAA bridges medical imaging sensors (ultrasound transducers, endoscopy CCD/CMOS arrays) to processing PCs via PCIe or proprietary high-speed links. Its 8 transceivers aggregate multiple sensor data lanes into a single PCIe Gen1 x4 uplink at full throughput. The 132 multipliers accelerate beamforming for ultrasound arrays and FFT pipelines for Doppler processing. Industrial temperature rating suits portable carts and bedside monitors where ambient varies. Hardware DSP blocks consume far less power than equivalent DSP processors, extending battery life on portable carts.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP4CGX50CF23I7NAA — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP4CGX50CF23I7N | EP4CGX50CF23C8N | EP4CGX50CF23C7N | EP4CGX50CF23I7 | EP4CGX50CF23C6N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | F484 (FineLine BGA, 1.0mm pitch) | F484 - same | F484 - same | F484 - same | F484 - same | F484 - same |
| Logic Elements (LEs) | 49,888 | 49,888 | 49,888 | 49,888 | 49,888 | 49,888 |
| Embedded Memory (Bits) | 2,562,048 | 2,562,048 | 2,562,048 | 2,562,048 | 2,562,048 | 2,562,048 |
| 18x18 Multipliers | 132 | 132 | 132 | 132 | 132 | 132 |
| Transceivers / Max Gbps | 8 / 3.125 Gbps | 8 / 3.125 Gbps | 8 / 3.125 Gbps | 8 / 3.125 Gbps | 8 / 3.125 Gbps | 8 / 3.125 Gbps |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) |
| Speed Grade | 7 | 7 | 8 (faster) | 7 | 7 | 6 (slower) |
Principaux différenciateurs
- Industrial temperature grade with same die as commercial C8 variant (vs EP4CGX50CF23C8N)
- Functionally identical silicon to no-suffix I7 variant with different packing (vs EP4CGX50CF23I7)
- Mid-density 49,888 LEs vs 75K family member (vs EP4CGX75CF23C8N)
Notes de conception
Estimated: the EP4CGX50CF23I7NAA consumes approximately 1.5-2.5W typical at 1.2V core depending on utilization and transceiver activity. Design the 1.2V regulator for at least 2.5A continuous to handle inrush during configuration, and add 100uF bulk plus 0.1uF + 10uF ceramic decoupling per VCC/VCCH/GXB power pin group. Per the Cyclone IV GX handbook, the GXB (transceiver) supply must be isolated from digital supplies to prevent noise coupling.
The F484 FineLine BGA uses 1.0mm pitch and requires a 4-layer minimum stack-up with continuous GND plane beneath the device. Estimated via pad diameter 0.5mm with 0.6mm solder mask openings; follow Intel's recommended land pattern exactly. Use micro-via-in-pad technology for inner-row balls if your PCB fabricator supports it; otherwise dog-bone fanout with 0.2mm micro-vias is acceptable for outer rows.
Transceiver channel traces must be length-matched within 0.127mm and routed on the top layer over a continuous GND plane with no signal crossovers. Differential impedance target is 100 ohms +/- 10%. AC-coupling capacitors (typically 100nF) must be placed within 4mm of the receiver pins. Per Cyclone IV GX handbook, avoid routing LVDS/TTL signals adjacent to GXB traces to minimize crosstalk.
Common mistakes with this device include: (1) leaving unused transceiver channels unpowered rather than tri-stating them per the configuration handbook; (2) omitting the MSEL pull resistors for configuration mode selection; (3) failing to connect all VCC and GND balls (floating power balls cause logic errors); (4) selecting a non-supported JTAG programmer (use USB-Blaster or compatible). Always verify the .pin file in Quartus before tape-out.
Informations de conformité
RoHS and lead-free compliance confirmed per Intel product page. AEC-Q100 not applicable for FPGAs (only applicable to automotive-grade ICs with discrete automotive qualification). Halogen-free status not explicitly stated in verified data - marked unknown.
