EP4CGX50CF23I7NAA - Cyclone IV GX FPGA, 49.9K LE, F484 | Intel
부품 번호: EP4CGX50CF23I7NAA ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $103.85 | $103.85 |
| 10 | $98.2 | $982.00 |
| 100 | $89.75 | $8,975.00 |
| 250 | $84.3 | $21,075.00 |
| 500 | $79.5 | $39,750.00 |
EP4CGX50CF23I7NAA 개요
The Cyclone IV GX family is a low-power, high-functionality programmable logic device line from Intel FPGA. As a field-programmable gate array (FPGA), it belongs to the broader hierarchy of programmable logic devices (PLDs) -> programmable logic ICs -> logic semiconductors -> integrated circuits. Cyclone IV GX FPGAs specifically target cost-sensitive applications requiring integrated transceivers and DSP blocks, making them a staple in video bridging, industrial connectivity, and wireless infrastructure designs.
Key features include 49,888 logic elements (LEs) organized into 3,136 logic array blocks (LABs), 2,562,048 bits (~2.5 Mbit) of embedded SRAM configurable as RAM, ROM, or FIFO, 132 embedded 18x18 multipliers for DSP operations, and 4 phase-locked loops (PLLs). The integrated transceivers support data rates up to 3.125 Gbps, enabling protocols such as PCI Express Gen1, Gigabit Ethernet, Serial RapidIO, and CPRI. The device operates from a 1.2V core supply with separate transceiver and I/O voltages.
The F484 package is a 1.0mm pitch FineLine BGA with 484 balls, providing high-density board integration while maintaining manufacturability with standard BGA assembly processes. The I7 speed grade designates an industrial temperature range, while the 8-transceiver configuration supports multiple high-speed serial interfaces simultaneously without external PHY devices.
Typical applications include industrial video surveillance with on-camera analytics, PCIe Gen1 endpoint cards in test equipment, broadcast video bridging (SDI to HDMI), wireless backhaul baseband processing, and motor control with high-speed feedback sampling. The combination of DSP blocks and transceivers makes the Cyclone IV GX particularly attractive for systems that previously required an FPGA plus an external transceiver PHY.
When designing with this device, allocate sufficient PCB layers for power delivery - the core, PLL, transceiver, and I/O banks each require dedicated decoupling. Quartus II (or Intel Quartus Prime) software is required for synthesis, place-and-route, and bitstream generation, and the device is supported through the Cyclone IV device family in design tools.
This page synthesizes distributor pricing, drop-in same-package variants, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: EP4CGX50CF23I7NAA — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4CGX50CF23I7NAA (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Process Technology, Speed Grade, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4CGX50CF23I7N
✅ 드롭인✓ 재고 있음
$121.4 / 개
데이터시트 보기 →EP4CGX50CF23C8N
✅ 드롭인✓ 재고 있음
$56.5 / 개
데이터시트 보기 →EP4CGX50CF23C7N
✅ 드롭인✓ 재고 있음
$110.5 / 개
데이터시트 보기 →EP4CGX50CF23I7
✅ 드롭인✓ 재고 있음
$112 / 개
데이터시트 보기 →EP4CGX50CF23C6N
✅ 드롭인✓ 재고 있음
$65.8 / 개
데이터시트 보기 →EP4CGX50CF23I7NAA 최대 정격 & 전기적 특성
| Family | Cyclone IV GX |
| Logic Elements (LEs) | 49,888 |
| Logic Array Blocks (LABs) | 3,136 |
| Embedded Memory (Bits) | 2,562,048 |
| Embedded Memory (M9K Blocks) | 270 |
| Embedded 18x18 Multipliers | 132 |
| Phase-Locked Loops (PLLs) | 4 |
| Global Clock Networks | 20 |
| Transceivers | 8 channels, up to 3.125 Gbps |
| Core Voltage | 1.2 V |
| 동작 온도 범위 | -40C to +100C (Industrial, I7) |
| Speed Grade | 7 |
| 패키지 | 484-ball FineLine BGA (F23), 1.0mm pitch |
| 실장 유형 | Surface Mount (BGA) |
| Configuration Scheme | AS, PS, JTAG, FPP |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
| MSL 레벨 | 3 |
EP4CGX50CF23I7NAA 484-ball fineline bga (f23), 1.0mm pitch 핀 구성 가이드
EP4CGX50CF23I7NAA(484-ball fineline bga (f23), 1.0mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP4CGX50CF23I7NAA.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP4CGX50CF23I7NAA 적합 용도: 6 애플리케이션s: Industrial Video Surveillance with On-Camera Analytics, PCI Express Gen1 Endpoint Cards, Broadcast Video Bridging (SDI/HDMI), Industrial Motor Control and Servo Drives, Wireless Baseband Processing (CPRI / OBSAI), Medical Imaging Interface Boards.
Industrial Video Surveillance with On-Camera Analytics
The EP4CGX50CF23I7NAA suits IP camera and DVR designs that need mid-range DSP and 3.125 Gbps transceivers on a single chip. Its 132 18x18 multipliers handle H.264/H.265 motion estimation pipelines, while the 2,562,048 bits of embedded memory buffer full-HD frame buffers without external SRAM. Eight transceiver channels aggregate multiple sensor streams via GigE Vision or SDI, replacing an FPGA-plus-PHY two-chip design. The I7 industrial -40C to +100C range supports outdoor housings and factory floor enclosures. PCB layout benefits from a 1.0mm-pitch F484 BGA, which balances board density against standard 4-layer SMT assembly.
추천
PCI Express Gen1 Endpoint Cards
The EP4CGX50CF23I7NAA integrates a hard PCIe Gen1 IP block at 2.5 Gbps, eliminating external PHY chips on PXI, DAQ, and instrument cards. The 49,888 LEs accommodate PCIe hard IP plus application logic such as DMA engines, custom register interfaces, and on-board signal conditioning. Eight transceiver channels allow simultaneous PCIe x1 plus secondary links like Serial RapidIO for chassis backplane connectivity. The I7 industrial temperature range suits test and measurement equipment that operates in uncontrolled lab and factory environments. Quartus II provides a verified PCIe Compiler IP that compiles against this device.
추천
Broadcast Video Bridging (SDI/HDMI)
The EP4CGX50CF23I7NAA bridges SDI (270 Mbps to 3 Gbps SD/HD/3G-SDI) and HDMI/DVI sources in broadcast routers and converters. Its 8 transceivers handle up to eight simultaneous 3G-SDI channels while internal CDR recovers clock from the serial stream, removing external clock-cleaner PLLs. The 270 M9K memory blocks (2.5 Mbit) implement line buffers, frame stores, and genlock FIFOs. The industrial temperature grade suits OB vans and field-broadcast gear subject to ambient swings. The device's native SDI reference designs in the Cyclone IV GX handbook shorten time-to-market versus competing FPGAs.
추천
Industrial Motor Control and Servo Drives
The EP4CGX50CF23I7NAA's 132 hardware multipliers execute field-oriented control (FOC), space-vector PWM, and encoder interpolation loops in industrial servo drives. Eight transceivers interface to absolute encoders (EnDat 2.2, BiSS, SSI) and to multi-axis EtherCAT slaves via off-the-shelf IP cores. The 49,888 LEs fit multi-axis loops plus safety logic compliant with IEC 61508 SIL 2 paths. Industrial -40C to +100C operation supports cabinet temperatures without derating. Decoupling strategy must segregate the 1.2V core, 2.5V analog PLL, and 3.3V I/O rails to avoid noise coupling into PWM outputs.
추천
Wireless Baseband Processing (CPRI / OBSAI)
The EP4CGX50CF23I7NAA's transceivers support CPRI (up to 3.072 Gbps) and OBSAI, the standard fronthaul protocols between baseband units and remote radio heads in 3G/4G small cells. The 49,888 LEs run PHY-layer baseband such as FFT/iFFT, channel coding, and digital pre-distortion (DPD) look-up tables. The 2.5 Mbit of embedded memory holds DPD coefficient tables and channel state buffers. Industrial temperature rating supports outdoor small-cell radios and tower-mounted equipment. The same design can target picocells, femtocells, and CPRI repeater applications.
추천
Medical Imaging Interface Boards
The EP4CGX50CF23I7NAA bridges medical imaging sensors (ultrasound transducers, endoscopy CCD/CMOS arrays) to processing PCs via PCIe or proprietary high-speed links. Its 8 transceivers aggregate multiple sensor data lanes into a single PCIe Gen1 x4 uplink at full throughput. The 132 multipliers accelerate beamforming for ultrasound arrays and FFT pipelines for Doppler processing. Industrial temperature rating suits portable carts and bedside monitors where ambient varies. Hardware DSP blocks consume far less power than equivalent DSP processors, extending battery life on portable carts.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4CGX50CF23I7NAA — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4CGX50CF23I7N | EP4CGX50CF23C8N | EP4CGX50CF23C7N | EP4CGX50CF23I7 | EP4CGX50CF23C6N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | F484 (FineLine BGA, 1.0mm pitch) | F484 - same | F484 - same | F484 - same | F484 - same | F484 - same |
| Logic Elements (LEs) | 49,888 | 49,888 | 49,888 | 49,888 | 49,888 | 49,888 |
| Embedded Memory (Bits) | 2,562,048 | 2,562,048 | 2,562,048 | 2,562,048 | 2,562,048 | 2,562,048 |
| 18x18 Multipliers | 132 | 132 | 132 | 132 | 132 | 132 |
| Transceivers / Max Gbps | 8 / 3.125 Gbps | 8 / 3.125 Gbps | 8 / 3.125 Gbps | 8 / 3.125 Gbps | 8 / 3.125 Gbps | 8 / 3.125 Gbps |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) |
| Speed Grade | 7 | 7 | 8 (faster) | 7 | 7 | 6 (slower) |
주요 차별점
- Industrial temperature grade with same die as commercial C8 variant (vs EP4CGX50CF23C8N)
- Functionally identical silicon to no-suffix I7 variant with different packing (vs EP4CGX50CF23I7)
- Mid-density 49,888 LEs vs 75K family member (vs EP4CGX75CF23C8N)
설계 노트
Estimated: the EP4CGX50CF23I7NAA consumes approximately 1.5-2.5W typical at 1.2V core depending on utilization and transceiver activity. Design the 1.2V regulator for at least 2.5A continuous to handle inrush during configuration, and add 100uF bulk plus 0.1uF + 10uF ceramic decoupling per VCC/VCCH/GXB power pin group. Per the Cyclone IV GX handbook, the GXB (transceiver) supply must be isolated from digital supplies to prevent noise coupling.
The F484 FineLine BGA uses 1.0mm pitch and requires a 4-layer minimum stack-up with continuous GND plane beneath the device. Estimated via pad diameter 0.5mm with 0.6mm solder mask openings; follow Intel's recommended land pattern exactly. Use micro-via-in-pad technology for inner-row balls if your PCB fabricator supports it; otherwise dog-bone fanout with 0.2mm micro-vias is acceptable for outer rows.
Transceiver channel traces must be length-matched within 0.127mm and routed on the top layer over a continuous GND plane with no signal crossovers. Differential impedance target is 100 ohms +/- 10%. AC-coupling capacitors (typically 100nF) must be placed within 4mm of the receiver pins. Per Cyclone IV GX handbook, avoid routing LVDS/TTL signals adjacent to GXB traces to minimize crosstalk.
Common mistakes with this device include: (1) leaving unused transceiver channels unpowered rather than tri-stating them per the configuration handbook; (2) omitting the MSEL pull resistors for configuration mode selection; (3) failing to connect all VCC and GND balls (floating power balls cause logic errors); (4) selecting a non-supported JTAG programmer (use USB-Blaster or compatible). Always verify the .pin file in Quartus before tape-out.
규정 준수 정보
RoHS and lead-free compliance confirmed per Intel product page. AEC-Q100 not applicable for FPGAs (only applicable to automotive-grade ICs with discrete automotive qualification). Halogen-free status not explicitly stated in verified data - marked unknown.
