EP4SGX360FF35C3N - Stratix IV GX 353kLE FPGA | Intel | Altera
料号： EP4SGX360FF35C3N ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $9111.58 | $9,111.58 |
| 10 | $8832 | $88,320.00 |
| 100 | $8395 | $839,500.00 |
| 500 | $7960 | $3,980,000.00 |
| 1,000 | $7610 | $7,610,000.00 |
EP4SGX360FF35C3N 概述
A Stratix IV GX is a system-on-chip FPGA class device that combines a programmable logic fabric, dedicated DSP blocks, embedded memory, high-speed transceivers, and hard PCIe Gen1/Gen2 IP blocks. In the broader taxonomy it sits under: FPGA -> programmable logic -> semiconductor device -> integrated circuit. The GX variant specifically adds embedded transceivers that simplify serial connectivity for protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO, and CEI-6G.
Key differentiating features include 48 DSP blocks (18x18 multipliers) for high-throughput signal processing, support for LVDS, LVTTL, LVCMOS, and SSTL I/O standards, and an internal voltage supply range of 0.87V to 0.93V core plus 0.87V to 1.20V I/O supply rails. The C3 speed grade balances timing margin and Fmax, and the FF35 pin/package code designates the 35 mm flip-chip BGA with 1152 balls and 564 user I/Os. The device is lead-free and supplied in tray packaging suitable for both prototype and production assembly.
From an architecture perspective, the EP4SGX360FF35C3N uses Altera's adaptive logic module (ALM) and M20K memory blocks, providing up to 13.6 Mbits of block RAM plus 4.3 Mbits of MLAB memory. Hard memory controllers (DDR3/DDR2/QDRII+) and up to 8 PLLs support complex memory interfaces and high-speed clock networks.
Typical applications include high-speed serial protocol bridging, broadcast video processing, radar and signal intelligence front-ends, telecom line cards, test and measurement instrumentation with high-speed digitizers, and ASIC prototyping where the 353k logic-element capacity and embedded transceivers eliminate the need for companion ASSPs.
When designing with this device, ensure the PCB uses a 35 mm body BGA footprint with proper stackup for the 1152 balls; allocate 4-8 PCB layers with buried vias, follow Altera's pin connection guidelines for unused transceiver pins, and use the Quartus II design suite (the device predates Quartus Prime) for synthesis and place-and-route.
This page synthesizes distributor pricing, pin-compatible same-family variants, and practical PCB design notes not found in the manufacturer datasheet alone.
直接替换替代料： EP4SGX360FF35C3N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP4SGX360FF35C3N （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, Speed Grade, Process Technology, Mounting Type.
快速对比工具——选择替代料号进行并排对比：
EP4SGX360FF35C3
✅ 直接替换✓ 有现货
$2285 / 个
查看数据手册 →EP4SGX360FF35C2XN
✅ 直接替换✓ 有现货
$2600 / 个
查看数据手册 →EP4SGX360FF35C2X
✅ 直接替换✓ 有现货
$3450 / 个
查看数据手册 →EP4SGX360FF35C3N 最大额定值与电气特性
| Series | Stratix IV GX |
| Number of Logic Elements | 353,600 |
| Number of LABs/CLBs | 14,144 |
| Total RAM Bits | 23,105,536 |
| Number of User I/O | 564 |
| 封装 | 1152-BBGA, FCBGA (FF35, 35 mm) |
| 安装类型 | Surface Mount |
| Core Voltage Supply | 0.87 V to 0.93 V |
| Supply Voltage Range | 0.87 V to 0.93 V (core) |
| 工作温度 | 0C to +85C (commercial) |
| Speed Grade | C3 |
| Transceivers | Up to 24 channels at up to 8.5 Gbps |
| DSP Blocks | 48 (18x18 multipliers) |
| Lead-Free | Yes |
| Process Technology | 40 nm |
EP4SGX360FF35C3N 1152-bbga, fcbga (ff35, 35 mm) 引脚配置指南
EP4SGX360FF35C3N（1152-bbga, fcbga (ff35, 35 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP4SGX360FF35C3N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP4SGX360FF35C3N 适用于 6 应用s: High-Speed Serial Protocol Bridging, Broadcast Video Processing, Telecom Line Cards and Baseband Processing, Test and Measurement Instrumentation, ASIC Prototyping, Radar and Signal Intelligence Front-Ends.
High-Speed Serial Protocol Bridging
The EP4SGX360FF35C3N's 24 embedded transceivers operating up to 8.5 Gbps make it ideal for protocol-bridging applications such as PCI Express Gen1/Gen2 to Serial RapidIO, Gigabit Ethernet to XAUI, or CEI-6G to backplane interfaces. The 353,600 logic elements provide abundant capacity for custom bridging logic, flow-control FIFOs, and protocol-state machines between the two domains. With 23 Mbits of embedded RAM, large elastic buffers absorb clock-domain crossings without external memory. The FF35 package exposes 564 user I/Os for sideband signals, GPIO, and board management.
推荐
Broadcast Video Processing
Stratix IV GX FPGAs with 48 DSP blocks are widely deployed in broadcast video routers, format converters, and contribution encoders. The 48 18x18 multipliers and DSP block accumulators deliver the throughput needed for 3G-SDI, HD-SDI, and emerging 4K/UHD processing pipelines operating at sample rates exceeding 200 MHz. The 23 Mbits of embedded RAM provides line buffers and frame stores for chroma/luma interpolation and scaling filters. The 564 I/Os simplify interfacing to multiple SDI serializers/deserializers and audio embedding chips.
推荐
Telecom Line Cards and Baseband Processing
The 353,600 logic elements and 23 Mbits of block RAM support multi-channel baseband processing in telecom line cards, including OBSAI/CPRI framer implementations, channel aggregation, and forward-error-correction (FEC) encoders/decoders. The 8.5 Gbps transceivers handle CPRI line rates up to 6.144 Gbps and OBSAI RP3 at 6.144 Gbps. Hard PCIe Gen2 IP blocks simplify backplane connectivity to host processors. The 564 I/Os support SFP/SFP+ cages, clock distribution, and management interfaces.
推荐
Test and Measurement Instrumentation
High-speed logic analyzers, protocol analyzers, and oscilloscope digitizer cards leverage the EP4SGX360FF35C3N's combination of high logic density, 24 transceivers up to 8.5 Gbps, and 564 user I/Os to capture, buffer, and analyze multi-lane serial protocols. The 48 DSP blocks accelerate FFT-based spectrum analysis and modulation-domain processing. The 23 Mbits of embedded RAM provide deep acquisition memories for time-correlated captures. Industrial temperature variants exist (EP4SGX360FF35I3N/I4N) for harsh-environment deployments.
推荐
ASIC Prototyping
The 353,600 logic elements and abundant embedded memory make the EP4SGX360FF35C3N suitable for ASIC prototyping of mid-complexity SoCs. Multiple FF35-package devices can be partitioned on a multi-FPGA prototyping board to validate larger designs before tapeout. The 24 transceivers at 8.5 Gbps allow high-bandwidth chip-to-chip and chip-to-host connections that mirror the ASIC's SerDes links. Quartus II synthesis flows with co-emulation support simplify bring-up.
推荐
Radar and Signal Intelligence Front-Ends
Defense and aerospace applications use the EP4SGX360FF35C3N for radar digital receiver exciters and signal-intelligence intercept systems, where 48 DSP blocks deliver the multiply-accumulate throughput needed for channelization, beamforming, and pulse compression. The 564 I/Os accommodate multi-channel ADC/DAC interfaces (LVDS or JESD204B via external bridge). The commercial 0C to +85C temperature range fits many ground-based platforms; for harsher environments use the I3/I4 industrial variants.
推荐
推荐产品汇总
工程参考数据： EP4SGX360FF35C3N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP4SGX360FF35C3 | EP4SGX360FF35C2XN | EP4SGX360FF35C2X |
|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1152-BBGA, FCBGA (FF35) | 1152-BBGA, FCBGA (FF35) - same | 1152-BBGA, FCBGA (FF35) - same | 1152-BBGA, FCBGA (FF35) - same |
| Logic Elements | 353,600 | 353,600 | 353,600 | 353,600 |
| LABs/CLBs | 14,144 | 14,144 | 14,144 | 14,144 |
| Total RAM Bits | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 |
| User I/Os | 564 | 564 | 564 | 564 |
| Speed Grade | C3 | C3 | C2 (slower) | C2 (slower) |
| Transceivers | Up to 24 at 8.5 Gbps | Up to 24 at 8.5 Gbps | Up to 24 at 8.5 Gbps | Up to 24 at 8.5 Gbps |
关键差异点
- Pin-to-pin FF35 BGA compatibility across speed grades （对比 EP4SGX360FF35C2XN)
- Lead-free/RoHS compliance designation （对比 EP4SGX360FF35C3)
- Highest density Stratix IV GX in FF35 package （对比 EP4SGX230TF35C4N)
设计说明
The 1152-ball FCBGA FF35 package requires an 8-12 layer PCB stackup with buried and micro vias. Follow Intel/Altera's Stratix IV GX pin connection guidelines for unused transceiver and I/O pin handling. Place decoupling capacitors as close as possible to each power pin pair; a typical design uses 100nF X7R ceramics plus bulk polymer tantalum capacitors on each supply rail.
Estimated: At maximum utilization (353kLE running at ~80% toggle rate, full transceivers at 8.5 Gbps), the EP4SGX360FF35C3N can consume 20-25 W. Design the VRM with 0.87V/0.93V core rails capable of 25-30 A peak, plus 1.2V and 2.5V auxiliary rails for transceivers and PLLs. Use Altera's PowerPlay early power estimator spreadsheet to refine budget before layout.
The 'N' suffix on EP4SGX360FF35C3N typically denotes lead-free/RoHS compliance per Altera naming conventions. When substituting EP4SGX360FF35C3 (without N), verify your assembly house accepts the part for your end-product compliance requirements. Also verify the C3 vs C2 speed grade impact on critical-path timing - C2 parts run approximately 10-15% slower Fmax.
合规信息
RoHS compliance inferred from N suffix per Altera naming convention. Reach, halogen-free, and conflict minerals status not in provided data - set to unknown. Not AEC-Q100 qualified - this is a commercial-grade FPGA.
