Intel

EP4SGX360FF35C3N - Stratix IV GX 353kLE FPGA | Intel | Altera

Артикул: EP4SGX360FF35C3N ✗ Снят с производства
В наличии Отправка в течение 1–3 рабочих дней
0.87 V to 0.93 V Vdss 1152-BBGA, FCBGA (FF35, 35 mm) Package C3 Speed
От $7610 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-09-10
Оптовые цены
Кол-во Цена за ед. Итого
1 $9111.58 $9.111,58
10 $8832 $88.320,00
100 $8395 $839.500,00
500 $7960 $3.980.000,00
1.000 $7610 $7.610.000,00
ℹ️ Все цены указаны в USD

EP4SGX360FF35C3N Обзор

The Intel (formerly Altera) EP4SGX360FF35C3N is a high-density Stratix IV GX field-programmable gate array (FPGA) integrating 353,600 logic elements, 14,144 LABs/CLBs, 23,105,536 bits of embedded memory, and 564 user I/Os in a 1152-ball flip-chip BGA (FCBGA) package. The device is fabricated in a 40 nm process and combines a rich programmable logic fabric with up to 24 transceivers operating at up to 8.5 Gbps, targeting high-bandwidth serial I/O applications such as wireline backplanes, broadcast video bridging, and protocol bridging.

A Stratix IV GX is a system-on-chip FPGA class device that combines a programmable logic fabric, dedicated DSP blocks, embedded memory, high-speed transceivers, and hard PCIe Gen1/Gen2 IP blocks. In the broader taxonomy it sits under: FPGA -> programmable logic -> semiconductor device -> integrated circuit. The GX variant specifically adds embedded transceivers that simplify serial connectivity for protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO, and CEI-6G.

Key differentiating features include 48 DSP blocks (18x18 multipliers) for high-throughput signal processing, support for LVDS, LVTTL, LVCMOS, and SSTL I/O standards, and an internal voltage supply range of 0.87V to 0.93V core plus 0.87V to 1.20V I/O supply rails. The C3 speed grade balances timing margin and Fmax, and the FF35 pin/package code designates the 35 mm flip-chip BGA with 1152 balls and 564 user I/Os. The device is lead-free and supplied in tray packaging suitable for both prototype and production assembly.

From an architecture perspective, the EP4SGX360FF35C3N uses Altera's adaptive logic module (ALM) and M20K memory blocks, providing up to 13.6 Mbits of block RAM plus 4.3 Mbits of MLAB memory. Hard memory controllers (DDR3/DDR2/QDRII+) and up to 8 PLLs support complex memory interfaces and high-speed clock networks.

Typical applications include high-speed serial protocol bridging, broadcast video processing, radar and signal intelligence front-ends, telecom line cards, test and measurement instrumentation with high-speed digitizers, and ASIC prototyping where the 353k logic-element capacity and embedded transceivers eliminate the need for companion ASSPs.

When designing with this device, ensure the PCB uses a 35 mm body BGA footprint with proper stackup for the 1152 balls; allocate 4-8 PCB layers with buried vias, follow Altera's pin connection guidelines for unused transceiver pins, and use the Quartus II design suite (the device predates Quartus Prime) for synthesis and place-and-route.

This page synthesizes distributor pricing, pin-compatible same-family variants, and practical PCB design notes not found in the manufacturer datasheet alone.

Аналоги без доработки для EP4SGX360FF35C3N — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с EP4SGX360FF35C3N (тот же форм-фактор и посадочное место) — отличается по Package, Operating Temperature, Speed Grade, Process Technology, Mounting Type.

Intel
Package: 1152-ball FCBGA (FF35), 35 x 35 mm, 1.0 mm pitch
Speed Grade: C2 (fastest)
Сравнить с EP4SGX360FF35C3N →
Intel
Package: 1152-BBGA, FCBGA (Flip-Chip BGA)
Speed Grade: -2
Process Technology: 40 nm TSMC
Сравнить с EP4SGX360FF35C3N →
Intel
Package: 1152-FBGA (35x35 mm), FCBGA
Сравнить с EP4SGX360FF35C3N →
Intel
Package: 1152-BBGA, FCBGA (flip-chip)
Сравнить с EP4SGX360FF35C3N →
Intel
Package: 1152-ball FC-BGA (FF35)
Mounting Type: Surface Mount (BGA)
Сравнить с EP4SGX360FF35C3N →
Intel
Package: 1152-BBGA, FCBGA (Flip-Chip)
Operating Temperature: -40C to +100C
Speed Grade: I3
Сравнить с EP4SGX360FF35C3N →
Intel
Package: 1152-BBGA, FCBGA (35 mm body, 1 mm pitch)
Operating Temperature: -40 °C to +100 °C (Industrial)
Сравнить с EP4SGX360FF35C3N →
Intel
Operating Temperature: -40C to +100C (Industrial, I4 grade)
Process Technology: 40 nm CMOS
Сравнить с EP4SGX360FF35C3N →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

EP4SGX360FF35C3

✅ Прямая замена
Intel
📦 1152-BBGA, FCBGA (FF35)
Stratix IV GX · Stratix IV GX FPGA · 353,600 · 14,144 · 23,105,536 bits · 564 · 40 nm · 0.9 V (0.87 V to 0.93 V)

✓ В наличии

$2285 / шт.

Открыть даташит →

EP4SGX360FF35C2XN

✅ Прямая замена
Intel
📦 1152-BBGA, FCBGA (FF35)
Stratix IV GX · 353,600 · 14,144 · 23,105,536 · 353,600 · 23,105,536 · 564

✓ В наличии

$2600 / шт.

Открыть даташит →

EP4SGX360FF35C2X

✅ Прямая замена
Intel
📦 1152-BBGA, FCBGA (FF35)
Stratix IV GX · 353,600 · 14,144 · 23,105,536 bits · 564 · 24 · 8.5 Gbps · 1,288

✓ В наличии

$3450 / шт.

Открыть даташит →

EP4SGX360FF35C3N Максимальные параметры и электрические характеристики

Series Stratix IV GX
Number of Logic Elements 353,600
Number of LABs/CLBs 14,144
Total RAM Bits 23,105,536
Number of User I/O 564
Корпус 1152-BBGA, FCBGA (FF35, 35 mm)
Тип монтажа Surface Mount
Core Voltage Supply 0.87 V to 0.93 V
Supply Voltage Range 0.87 V to 0.93 V (core)
Рабочая температура 0C to +85C (commercial)
Speed Grade C3
Transceivers Up to 24 channels at up to 8.5 Gbps
DSP Blocks 48 (18x18 multipliers)
Lead-Free Yes
Process Technology 40 nm

Руководство по цоколевке EP4SGX360FF35C3N в корпусе 1152-bbga, fcbga (ff35, 35 mm)

Цоколевка для EP4SGX360FF35C3N (корпус 1152-bbga, fcbga (ff35, 35 mm)). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.

Схема цоколевки корпуса 1152-bbga, fcbga (ff35, 35 mm) для EP4SGX360FF35C3N

Нет подробных данных о распиновке для EP4SGX360FF35C3N.

Обратитесь к даташиту для полной конфигурации выводов.

Типичное применение

EP4SGX360FF35C3N подходит для 6 применениеs: High-Speed Serial Protocol Bridging, Broadcast Video Processing, Telecom Line Cards and Baseband Processing, Test and Measurement Instrumentation, ASIC Prototyping, Radar and Signal Intelligence Front-Ends.

🌐

High-Speed Serial Protocol Bridging

The EP4SGX360FF35C3N's 24 embedded transceivers operating up to 8.5 Gbps make it ideal for protocol-bridging applications such as PCI Express Gen1/Gen2 to Serial RapidIO, Gigabit Ethernet to XAUI, or CEI-6G to backplane interfaces. The 353,600 logic elements provide abundant capacity for custom bridging logic, flow-control FIFOs, and protocol-state machines between the two domains. With 23 Mbits of embedded RAM, large elastic buffers absorb clock-domain crossings without external memory. The FF35 package exposes 564 user I/Os for sideband signals, GPIO, and board management.

🎥

Broadcast Video Processing

Stratix IV GX FPGAs with 48 DSP blocks are widely deployed in broadcast video routers, format converters, and contribution encoders. The 48 18x18 multipliers and DSP block accumulators deliver the throughput needed for 3G-SDI, HD-SDI, and emerging 4K/UHD processing pipelines operating at sample rates exceeding 200 MHz. The 23 Mbits of embedded RAM provides line buffers and frame stores for chroma/luma interpolation and scaling filters. The 564 I/Os simplify interfacing to multiple SDI serializers/deserializers and audio embedding chips.

🖥️

Telecom Line Cards and Baseband Processing

The 353,600 logic elements and 23 Mbits of block RAM support multi-channel baseband processing in telecom line cards, including OBSAI/CPRI framer implementations, channel aggregation, and forward-error-correction (FEC) encoders/decoders. The 8.5 Gbps transceivers handle CPRI line rates up to 6.144 Gbps and OBSAI RP3 at 6.144 Gbps. Hard PCIe Gen2 IP blocks simplify backplane connectivity to host processors. The 564 I/Os support SFP/SFP+ cages, clock distribution, and management interfaces.

🔧

Test and Measurement Instrumentation

High-speed logic analyzers, protocol analyzers, and oscilloscope digitizer cards leverage the EP4SGX360FF35C3N's combination of high logic density, 24 transceivers up to 8.5 Gbps, and 564 user I/Os to capture, buffer, and analyze multi-lane serial protocols. The 48 DSP blocks accelerate FFT-based spectrum analysis and modulation-domain processing. The 23 Mbits of embedded RAM provide deep acquisition memories for time-correlated captures. Industrial temperature variants exist (EP4SGX360FF35I3N/I4N) for harsh-environment deployments.

🏭

ASIC Prototyping

The 353,600 logic elements and abundant embedded memory make the EP4SGX360FF35C3N suitable for ASIC prototyping of mid-complexity SoCs. Multiple FF35-package devices can be partitioned on a multi-FPGA prototyping board to validate larger designs before tapeout. The 24 transceivers at 8.5 Gbps allow high-bandwidth chip-to-chip and chip-to-host connections that mirror the ASIC's SerDes links. Quartus II synthesis flows with co-emulation support simplify bring-up.

✈️

Radar and Signal Intelligence Front-Ends

Defense and aerospace applications use the EP4SGX360FF35C3N for radar digital receiver exciters and signal-intelligence intercept systems, where 48 DSP blocks deliver the multiply-accumulate throughput needed for channelization, beamforming, and pulse compression. The 564 I/Os accommodate multi-channel ADC/DAC interfaces (LVDS or JESD204B via external bridge). The commercial 0C to +85C temperature range fits many ground-based platforms; for harsher environments use the I3/I4 industrial variants.

What is the logic element count of EP4SGX360FF35C3N?
The EP4SGX360FF35C3N contains 353,600 logic elements organized into 14,144 LABs/CLBs. This places it in the high-density tier of the Stratix IV GX family. Source: Altera Stratix IV Device Handbook, Volume 1, Chapter 1 (Family Overview).
How many user I/Os does the EP4SGX360FF35C3N provide?
The EP4SGX360FF35C3N exposes 564 user I/Os from the 1152-ball flip-chip BGA package. This count is fixed for the FF35 pin/package code and supports LVDS, LVCMOS, LVTTL, and SSTL I/O standards per the Stratix IV GX datasheet.
Is the EP4SGX360FF35C3N obsolete?
Yes, the EP4SGX360FF35C3N is listed as obsolete on multiple distributor databases. As of 2026-09-10, distributors like Heisener still report stock (5,504 pieces in one listing, 4,288 in another). New designs should evaluate Cyclone V GX or Stratix V GX equivalents from Intel.
What is the transceiver speed of the EP4SGX360FF35C3N?
The Stratix IV GX embedded transceivers operate at up to 8.5 Gbps, supporting protocols including PCI Express Gen1/Gen2, Gigabit Ethernet, Serial RapidIO, CEI-6G, and XAUI. The exact number of transceiver channels depends on package selection.
Where can I download the EP4SGX360FF35C3N datasheet?
The Stratix IV GX datasheet and device handbook are available from Intel's FPGA documentation archive. The Device Handbook Volume 1 covers family overview, Volume 2 covers DC and switching characteristics, and Volume 4 covers transceiver specifications.
What is the difference between EP4SGX360FF35C3N and EP4SGX360KF40C3N?
The two parts share the same die (353,600 logic elements, 14,144 LABs) and same speed grade C3. They differ in package: FF35 is a 35 mm flip-chip BGA with 564 I/Os, while KF40 is a 40 mm BGA with 744 I/Os. Both are obsolete per the Xecor comparison.
What is the difference between EP4SGX360FF35C3N and EP4SGX360FF35I4N?
Both parts share the FF35 flip-chip BGA package and same die. The C3 part is the commercial speed grade 3, while the I4 part is the industrial speed grade 4 (slower timing margin, -40C to +100C operating range). Choose C3 for performance, I4 for harsh environments.
Where to buy EP4SGX360FF35C3N at the best price?
As of 2026-09-10, the EP4SGX360FF35C3N is available at $9,111.58 unit price from Heisener (5,504 pieces stock). DigiKey and Mouser list it as obsolete with limited stock. Octopart compares 18 distributors - check trustedparts.com for authorized inventory.
What is the lead time for EP4SGX360FF35C3N?
Per Heisener listings as of 2026-09-10, the lead time is 'To Be Confirmed' with estimated delivery between January 17-22 or July 26-31 (depending on the listing). Obsolete parts typically have variable lead times; contact distributors directly for current quotes.
Is EP4SGX360FF35C3N in stock at major distributors?
Per the verified data of 2026-09-10, Heisener reports 5,504 pieces and another Intel-sourced listing shows 4,288 pieces. DigiKey and Mouser list the part as obsolete; consult Octopart's real-time inventory aggregator for the most current stock across 18 distributors.
What is the best drop-in replacement for EP4SGX360FF35C3N?
There is no true drop-in replacement in the same FF35 package from Intel/Altera. For new designs, the recommended migration path is the Stratix V GX (5SGXEA7) family in equivalent speed grades, which offers higher logic density and transceivers at up to 14.1 Gbps, though in a different BGA footprint.
What design software does EP4SGX360FF35C3N require?
The EP4SGX360FF35C3N requires the Quartus II design suite (version 13.1 or later). The device predates the Quartus Prime rebrand. For modern workflows, legacy Quartus II supports Stratix IV but Intel no longer actively updates this toolchain.
What are the key specifications of EP4SGX360FF35C3N that engineers should know?
Engineers should note: 353,600 logic elements, 14,144 LABs, 23,105,536 RAM bits, 564 user I/Os, 24 transceivers up to 8.5 Gbps, 48 DSP blocks, 0.87-0.93V core supply, 40 nm process, 1152-ball FCBGA FF35 package, commercial 0C to +85C temperature range, C3 speed grade. The device is obsolete as of 2026.
Can a Xilinx Virtex-6 replace EP4SGX360FF35C3N?
No, Xilinx Virtex-6 is not drop-in compatible with EP4SGX360FF35C3N due to different package, BGA ballout, and IP cores. Any cross-brand migration requires PCB redesign. Pin-compatible cross-brand drop-ins do not exist for high-density Stratix IV GX devices.
What PCB layer count is recommended for EP4SGX360FF35C3N?
For the 1152-ball FCBGA FF35 package, Intel recommends an 8-12 layer PCB stackup with buried and micro vias. Use the pin connection guidelines from the Stratix IV handbook. High-speed transceiver channels require controlled-impedance differential routing of 100 ohm differential pairs.

Справочные инженерные данные для EP4SGX360FF35C3N — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose EP4SGX360FF35C3N when you need 353,600 logic elements, 24 transceivers at 8.5 Gbps, and 564 I/Os in the FF35 flip-chip BGA package for high-density high-speed serial designs, and your end product requires lead-free/RoHS compliance. Choose EP4SGX360FF35C3 if you do not need the lead-free designation and want the same die. Choose EP4SGX360FF35C2XN or EP4SGX360FF35C2X if your design does not require the C3 speed grade and you can trade 10-15% Fmax for potentially better availability or pricing. For new designs, consider migration to Stratix V GX (5SGXEA7) or Cyclone V GX since the EP4SGX360FF35C3N is obsolete as of 2026.

Сравнение с аналогами

Параметр Этот товар EP4SGX360FF35C3 EP4SGX360FF35C2XN EP4SGX360FF35C2X
Brand Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera)
Package 1152-BBGA, FCBGA (FF35) 1152-BBGA, FCBGA (FF35) - same 1152-BBGA, FCBGA (FF35) - same 1152-BBGA, FCBGA (FF35) - same
Logic Elements 353,600 353,600 353,600 353,600
LABs/CLBs 14,144 14,144 14,144 14,144
Total RAM Bits 23,105,536 23,105,536 23,105,536 23,105,536
User I/Os 564 564 564 564
Speed Grade C3 C3 C2 (slower) C2 (slower)
Transceivers Up to 24 at 8.5 Gbps Up to 24 at 8.5 Gbps Up to 24 at 8.5 Gbps Up to 24 at 8.5 Gbps

Ключевые отличия

  • Pin-to-pin FF35 BGA compatibility across speed grades (против EP4SGX360FF35C2XN)
  • Lead-free/RoHS compliance designation (против EP4SGX360FF35C3)
  • Highest density Stratix IV GX in FF35 package (против EP4SGX230TF35C4N)

Заметки по проектированию

The 1152-ball FCBGA FF35 package requires an 8-12 layer PCB stackup with buried and micro vias. Follow Intel/Altera's Stratix IV GX pin connection guidelines for unused transceiver and I/O pin handling. Place decoupling capacitors as close as possible to each power pin pair; a typical design uses 100nF X7R ceramics plus bulk polymer tantalum capacitors on each supply rail.

Estimated: At maximum utilization (353kLE running at ~80% toggle rate, full transceivers at 8.5 Gbps), the EP4SGX360FF35C3N can consume 20-25 W. Design the VRM with 0.87V/0.93V core rails capable of 25-30 A peak, plus 1.2V and 2.5V auxiliary rails for transceivers and PLLs. Use Altera's PowerPlay early power estimator spreadsheet to refine budget before layout.

The 'N' suffix on EP4SGX360FF35C3N typically denotes lead-free/RoHS compliance per Altera naming conventions. When substituting EP4SGX360FF35C3 (without N), verify your assembly house accepts the part for your end-product compliance requirements. Also verify the C3 vs C2 speed grade impact on critical-path timing - C2 parts run approximately 10-15% slower Fmax.

Информация о соответствии

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
Без свинца
Yes
Без галогенов
Unknown
Конфликтные минералы
Unknown

RoHS compliance inferred from N suffix per Altera naming convention. Reach, halogen-free, and conflict minerals status not in provided data - set to unknown. Not AEC-Q100 qualified - this is a commercial-grade FPGA.

Данные проверены: 2026-09-10 — данные проверены и курируются командой компонентной инженерии XAIPART

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Связанные компоненты & термины

Intel Altera EP4SGX360FF35C3N EP4SGX360FF35C3 EP4SGX360FF35C2XN EP4SGX360FF35C2X Stratix IV GX FPGA Field Programmable Gate Array PLD programmable logic FCBGA BGA-1152 1152-BBGA transceiver PCI Express Serial RapidIO DSP block logic element LAB ALM M20K block RAM 8.5 Gbps 40 nm process RoHS lead-free Quartus II
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