EP4SGX360FF35C3N - Stratix IV GX 353kLE FPGA | Intel | Altera
부품 번호: EP4SGX360FF35C3N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $9111.58 | $9,111.58 |
| 10 | $8832 | $88,320.00 |
| 100 | $8395 | $839,500.00 |
| 500 | $7960 | $3,980,000.00 |
| 1,000 | $7610 | $7,610,000.00 |
EP4SGX360FF35C3N 개요
A Stratix IV GX is a system-on-chip FPGA class device that combines a programmable logic fabric, dedicated DSP blocks, embedded memory, high-speed transceivers, and hard PCIe Gen1/Gen2 IP blocks. In the broader taxonomy it sits under: FPGA -> programmable logic -> semiconductor device -> integrated circuit. The GX variant specifically adds embedded transceivers that simplify serial connectivity for protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO, and CEI-6G.
Key differentiating features include 48 DSP blocks (18x18 multipliers) for high-throughput signal processing, support for LVDS, LVTTL, LVCMOS, and SSTL I/O standards, and an internal voltage supply range of 0.87V to 0.93V core plus 0.87V to 1.20V I/O supply rails. The C3 speed grade balances timing margin and Fmax, and the FF35 pin/package code designates the 35 mm flip-chip BGA with 1152 balls and 564 user I/Os. The device is lead-free and supplied in tray packaging suitable for both prototype and production assembly.
From an architecture perspective, the EP4SGX360FF35C3N uses Altera's adaptive logic module (ALM) and M20K memory blocks, providing up to 13.6 Mbits of block RAM plus 4.3 Mbits of MLAB memory. Hard memory controllers (DDR3/DDR2/QDRII+) and up to 8 PLLs support complex memory interfaces and high-speed clock networks.
Typical applications include high-speed serial protocol bridging, broadcast video processing, radar and signal intelligence front-ends, telecom line cards, test and measurement instrumentation with high-speed digitizers, and ASIC prototyping where the 353k logic-element capacity and embedded transceivers eliminate the need for companion ASSPs.
When designing with this device, ensure the PCB uses a 35 mm body BGA footprint with proper stackup for the 1152 balls; allocate 4-8 PCB layers with buried vias, follow Altera's pin connection guidelines for unused transceiver pins, and use the Quartus II design suite (the device predates Quartus Prime) for synthesis and place-and-route.
This page synthesizes distributor pricing, pin-compatible same-family variants, and practical PCB design notes not found in the manufacturer datasheet alone.
드롭인 대체품: EP4SGX360FF35C3N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4SGX360FF35C3N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Speed Grade, Process Technology, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4SGX360FF35C3
✅ 드롭인✓ 재고 있음
$2285 / 개
데이터시트 보기 →EP4SGX360FF35C2XN
✅ 드롭인✓ 재고 있음
$2600 / 개
데이터시트 보기 →EP4SGX360FF35C2X
✅ 드롭인✓ 재고 있음
$3450 / 개
데이터시트 보기 →EP4SGX360FF35C3N 최대 정격 & 전기적 특성
| Series | Stratix IV GX |
| Number of Logic Elements | 353,600 |
| Number of LABs/CLBs | 14,144 |
| Total RAM Bits | 23,105,536 |
| Number of User I/O | 564 |
| 패키지 | 1152-BBGA, FCBGA (FF35, 35 mm) |
| 실장 유형 | Surface Mount |
| Core Voltage Supply | 0.87 V to 0.93 V |
| Supply Voltage Range | 0.87 V to 0.93 V (core) |
| 동작 온도 | 0C to +85C (commercial) |
| Speed Grade | C3 |
| Transceivers | Up to 24 channels at up to 8.5 Gbps |
| DSP Blocks | 48 (18x18 multipliers) |
| Lead-Free | Yes |
| Process Technology | 40 nm |
EP4SGX360FF35C3N 1152-bbga, fcbga (ff35, 35 mm) 핀 구성 가이드
EP4SGX360FF35C3N(1152-bbga, fcbga (ff35, 35 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP4SGX360FF35C3N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP4SGX360FF35C3N 적합 용도: 6 애플리케이션s: High-Speed Serial Protocol Bridging, Broadcast Video Processing, Telecom Line Cards and Baseband Processing, Test and Measurement Instrumentation, ASIC Prototyping, Radar and Signal Intelligence Front-Ends.
High-Speed Serial Protocol Bridging
The EP4SGX360FF35C3N's 24 embedded transceivers operating up to 8.5 Gbps make it ideal for protocol-bridging applications such as PCI Express Gen1/Gen2 to Serial RapidIO, Gigabit Ethernet to XAUI, or CEI-6G to backplane interfaces. The 353,600 logic elements provide abundant capacity for custom bridging logic, flow-control FIFOs, and protocol-state machines between the two domains. With 23 Mbits of embedded RAM, large elastic buffers absorb clock-domain crossings without external memory. The FF35 package exposes 564 user I/Os for sideband signals, GPIO, and board management.
추천
Broadcast Video Processing
Stratix IV GX FPGAs with 48 DSP blocks are widely deployed in broadcast video routers, format converters, and contribution encoders. The 48 18x18 multipliers and DSP block accumulators deliver the throughput needed for 3G-SDI, HD-SDI, and emerging 4K/UHD processing pipelines operating at sample rates exceeding 200 MHz. The 23 Mbits of embedded RAM provides line buffers and frame stores for chroma/luma interpolation and scaling filters. The 564 I/Os simplify interfacing to multiple SDI serializers/deserializers and audio embedding chips.
추천
Telecom Line Cards and Baseband Processing
The 353,600 logic elements and 23 Mbits of block RAM support multi-channel baseband processing in telecom line cards, including OBSAI/CPRI framer implementations, channel aggregation, and forward-error-correction (FEC) encoders/decoders. The 8.5 Gbps transceivers handle CPRI line rates up to 6.144 Gbps and OBSAI RP3 at 6.144 Gbps. Hard PCIe Gen2 IP blocks simplify backplane connectivity to host processors. The 564 I/Os support SFP/SFP+ cages, clock distribution, and management interfaces.
추천
Test and Measurement Instrumentation
High-speed logic analyzers, protocol analyzers, and oscilloscope digitizer cards leverage the EP4SGX360FF35C3N's combination of high logic density, 24 transceivers up to 8.5 Gbps, and 564 user I/Os to capture, buffer, and analyze multi-lane serial protocols. The 48 DSP blocks accelerate FFT-based spectrum analysis and modulation-domain processing. The 23 Mbits of embedded RAM provide deep acquisition memories for time-correlated captures. Industrial temperature variants exist (EP4SGX360FF35I3N/I4N) for harsh-environment deployments.
추천
ASIC Prototyping
The 353,600 logic elements and abundant embedded memory make the EP4SGX360FF35C3N suitable for ASIC prototyping of mid-complexity SoCs. Multiple FF35-package devices can be partitioned on a multi-FPGA prototyping board to validate larger designs before tapeout. The 24 transceivers at 8.5 Gbps allow high-bandwidth chip-to-chip and chip-to-host connections that mirror the ASIC's SerDes links. Quartus II synthesis flows with co-emulation support simplify bring-up.
추천
Radar and Signal Intelligence Front-Ends
Defense and aerospace applications use the EP4SGX360FF35C3N for radar digital receiver exciters and signal-intelligence intercept systems, where 48 DSP blocks deliver the multiply-accumulate throughput needed for channelization, beamforming, and pulse compression. The 564 I/Os accommodate multi-channel ADC/DAC interfaces (LVDS or JESD204B via external bridge). The commercial 0C to +85C temperature range fits many ground-based platforms; for harsher environments use the I3/I4 industrial variants.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4SGX360FF35C3N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4SGX360FF35C3 | EP4SGX360FF35C2XN | EP4SGX360FF35C2X |
|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1152-BBGA, FCBGA (FF35) | 1152-BBGA, FCBGA (FF35) - same | 1152-BBGA, FCBGA (FF35) - same | 1152-BBGA, FCBGA (FF35) - same |
| Logic Elements | 353,600 | 353,600 | 353,600 | 353,600 |
| LABs/CLBs | 14,144 | 14,144 | 14,144 | 14,144 |
| Total RAM Bits | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 |
| User I/Os | 564 | 564 | 564 | 564 |
| Speed Grade | C3 | C3 | C2 (slower) | C2 (slower) |
| Transceivers | Up to 24 at 8.5 Gbps | Up to 24 at 8.5 Gbps | Up to 24 at 8.5 Gbps | Up to 24 at 8.5 Gbps |
주요 차별점
- Pin-to-pin FF35 BGA compatibility across speed grades (vs EP4SGX360FF35C2XN)
- Lead-free/RoHS compliance designation (vs EP4SGX360FF35C3)
- Highest density Stratix IV GX in FF35 package (vs EP4SGX230TF35C4N)
설계 노트
The 1152-ball FCBGA FF35 package requires an 8-12 layer PCB stackup with buried and micro vias. Follow Intel/Altera's Stratix IV GX pin connection guidelines for unused transceiver and I/O pin handling. Place decoupling capacitors as close as possible to each power pin pair; a typical design uses 100nF X7R ceramics plus bulk polymer tantalum capacitors on each supply rail.
Estimated: At maximum utilization (353kLE running at ~80% toggle rate, full transceivers at 8.5 Gbps), the EP4SGX360FF35C3N can consume 20-25 W. Design the VRM with 0.87V/0.93V core rails capable of 25-30 A peak, plus 1.2V and 2.5V auxiliary rails for transceivers and PLLs. Use Altera's PowerPlay early power estimator spreadsheet to refine budget before layout.
The 'N' suffix on EP4SGX360FF35C3N typically denotes lead-free/RoHS compliance per Altera naming conventions. When substituting EP4SGX360FF35C3 (without N), verify your assembly house accepts the part for your end-product compliance requirements. Also verify the C3 vs C2 speed grade impact on critical-path timing - C2 parts run approximately 10-15% slower Fmax.
규정 준수 정보
RoHS compliance inferred from N suffix per Altera naming convention. Reach, halogen-free, and conflict minerals status not in provided data - set to unknown. Not AEC-Q100 qualified - this is a commercial-grade FPGA.
