EPF10K20TI144-4U - FLEX 10K FPGA, 20K Gates, 144-TQFP | Intel / Altera
Référence : EPF10K20TI144-4U ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $24.75 | $247,50 |
| 100 | $19.2 | $1 920,00 |
| 500 | $15.4 | $7 700,00 |
| 1 000 | $12.85 | $12 850,00 |
EPF10K20TI144-4U Présentation
A Field-Programmable Gate Array (FPGA) is a semiconductor IC containing programmable logic blocks, interconnect, and I/O cells that the user configures after manufacture. Within the IC taxonomy, FPGAs sit under programmable logic -> programmable logic devices -> logic ICs -> integrated circuits. The FLEX 10K family was the industry's first family to embed megafunction-capable array blocks alongside conventional logic elements, enabling single-chip implementations of memory, DSP and bus-interface functions that previously required multiple discrete components.
Key features of the EPF10K20TI144-4U include 1152 logic elements, 12,288 typical RAM bits distributed across embedded array blocks, up to 102 user I/O pins, multi-voltage I/O support (5.0 V PCI-compliant and 3.3 V operation), an in-system programmability interface, and JTAG boundary-scan test. The 144-pin TQFP (1.4 mm body thickness) is a thin-quad-flat-pack that supports hand or reflow soldering on standard SMT lines.
Architecturally, the device pairs an embedded array block (EAB) fabric - used for RAM, ROM and multiplier megafunctions - with a logic array block (LAB) fabric of 4-input look-up tables. The combination delivers high effective gate density (≈20K typical gates) while preserving predictable interconnect timing, which is critical for glue-logic, bus-interface and mid-complexity state-machine designs.
Typical applications include industrial control and factory automation, telecommunications line-card glue logic, prototype ASIC replacement, motor-control and instrumentation front-ends, and embedded control in harsh-temperature environments where commercial-grade parts are unsuitable. Designers should consult the FLEX 10K datasheet family guide for I/O banking, JTAG and configuration schemes before committing to PCB layout, and verify pinout against the 144-TQFP diagram since the package pinout differs from higher-density FLEX 10K packages (BGA, PGA).
Alternatives de remplacement direct pour EPF10K20TI144-4U — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF10K20TI144-4U (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Process Technology, Typical Gates, Family.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF10K20TI144-4N
✅ Remplacement direct✓ En stock
$19.95 / unité
Voir la fiche technique →EPF10K20TI144-4
✅ Remplacement direct✓ En stock
$17.8 / unité
Voir la fiche technique →EPF10K20TC144-4
✅ Remplacement direct✓ En stock
$18.95 / unité
Voir la fiche technique →EPF10K20TC144-4N
✅ Remplacement direct✓ En stock
$52 / unité
Voir la fiche technique →EPF10K20TC144-3
✅ Remplacement direct✓ En stock
$21.1 / unité
Voir la fiche technique →EPF10K10TI144-4
✅ Remplacement direct✓ En stock
$2.95 / unité
Voir la fiche technique →EPF10K20TI144-4U Valeurs maximales et caractéristiques électriques
| Family | FLEX 10K |
| Series | FLEX-10K |
| Logic Elements | 1152 |
| Typical Gates | 20,000 gates |
| Embedded RAM Bits | 12,288 bits |
| User I/Os | 102 |
| Boîtier | 144-TQFP |
| Speed Grade | -4 |
| Process Technology | 0.42 µm CMOS |
| Tension d'alimentation | 5 V |
| Type de montage | Surface Mount |
| Configuration Memory | SRAM-based (volatile, requires configuration device) |
| JTAG Support | Yes (IEEE 1149.1 boundary-scan) |
Configuration des broches de EPF10K20TI144-4U
| Broche 1 | I/O — User I/O (bank 1) |
| Broche 2 | I/O — User I/O (bank 1) |
| Broche 3 | I/O — User I/O (bank 1) |
| Broche 4 | I/O — User I/O (bank 1) |
| Broche 5 | I/O — User I/O (bank 1) |
| Broche 6 | I/O — User I/O (bank 1) |
| Broche 7 | VCCINT — Core supply voltage (5 V) |
| Broche 8 | I/O — User I/O (bank 1) |
| Broche 9 | I/O — User I/O (bank 1) |
| Broche 10 | I/O — User I/O (bank 1) |
| Broche 11 | GND — Ground |
| Broche 12 | I/O — User I/O (bank 1) |
| Broche 13 | I/O — User I/O (bank 1) |
| Broche 14 | I/O — User I/O (bank 1) |
| Broche 15 | I/O — User I/O (bank 1) |
| Broche 16 | I/O — User I/O (bank 1) |
| Broche 17 | VCCIO — I/O bank 1 supply voltage |
| Broche 18 | I/O — User I/O (bank 1) |
| Broche 19 | I/O — User I/O (bank 1) |
| Broche 20 | I/O — User I/O (bank 1) |
| Broche 21 | I/O — User I/O (bank 1) |
| Broche 22 | I/O — User I/O (bank 1) |
| Broche 23 | GND — Ground |
| Broche 24 | I/O — User I/O (bank 1) |
| Broche 25 | I/O — User I/O (bank 1) |
| Broche 26 | I/O — User I/O (bank 1) |
| Broche 27 | I/O — User I/O (bank 1) |
| Broche 28 | I/O — User I/O (bank 1) |
| Broche 29 | I/O — User I/O (bank 1) |
| Broche 30 | TDI — JTAG test data input |
| Broche 31 | TMS — JTAG test mode select |
| Broche 32 | TCK — JTAG test clock |
| Broche 33 | nCONFIG — Configuration control (active-low) |
| Broche 34 | VCCINT — Core supply voltage (5 V) |
| Broche 35 | MSEL0 — Configuration mode select 0 |
| Broche 36 | MSEL1 — Configuration mode select 1 |
| Broche 37 | GND — Ground |
| Broche 38 | nSTATUS — Configuration status (active-low) |
| Broche 39 | CONF_DONE — Configuration done indicator |
| Broche 40 | DCLK — Configuration clock |
| Broche 41 | DATA0 — Configuration data input 0 |
| Broche 42 | I/O — User I/O (bank 2) |
| Broche 43 | I/O — User I/O (bank 2) |
| Broche 44 | I/O — User I/O (bank 2) |
| Broche 45 | VCCIO — I/O bank 2 supply voltage |
| Broche 46 | I/O — User I/O (bank 2) |
| Broche 47 | I/O — User I/O (bank 2) |
| Broche 48 | I/O — User I/O (bank 2) |
| Broche 49 | I/O — User I/O (bank 2) |
| Broche 50 | I/O — User I/O (bank 2) |
| Broche 51 | GND — Ground |
| Broche 52 | I/O — User I/O (bank 2) |
| Broche 53 | I/O — User I/O (bank 2) |
| Broche 54 | I/O — User I/O (bank 2) |
| Broche 55 | I/O — User I/O (bank 2) |
| Broche 56 | I/O — User I/O (bank 2) |
| Broche 57 | I/O — User I/O (bank 2) |
| Broche 58 | VCCIO — I/O bank 2 supply voltage |
| Broche 59 | I/O — User I/O (bank 2) |
| Broche 60 | I/O — User I/O (bank 2) |
| Broche 61 | I/O — User I/O (bank 2) |
| Broche 62 | I/O — User I/O (bank 2) |
| Broche 63 | GND — Ground |
| Broche 64 | I/O — User I/O (bank 2) |
| Broche 65 | I/O — User I/O (bank 2) |
| Broche 66 | I/O — User I/O (bank 2) |
| Broche 67 | I/O — User I/O (bank 2) |
| Broche 68 | I/O — User I/O (bank 2) |
| Broche 69 | I/O — User I/O (bank 2) |
| Broche 70 | VCCINT — Core supply voltage (5 V) |
| Broche 71 | I/O — User I/O (bank 3) |
| Broche 72 | I/O — User I/O (bank 3) |
| Broche 73 | I/O — User I/O (bank 3) |
| Broche 74 | I/O — User I/O (bank 3) |
| Broche 75 | I/O — User I/O (bank 3) |
| Broche 76 | VCCIO — I/O bank 3 supply voltage |
| Broche 77 | I/O — User I/O (bank 3) |
| Broche 78 | I/O — User I/O (bank 3) |
| Broche 79 | I/O — User I/O (bank 3) |
| Broche 80 | GND — Ground |
| Broche 81 | I/O — User I/O (bank 3) |
| Broche 82 | I/O — User I/O (bank 3) |
| Broche 83 | I/O — User I/O (bank 3) |
| Broche 84 | I/O — User I/O (bank 3) |
| Broche 85 | I/O — User I/O (bank 3) |
| Broche 86 | I/O — User I/O (bank 3) |
| Broche 87 | I/O — User I/O (bank 3) |
| Broche 88 | VCCIO — I/O bank 3 supply voltage |
| Broche 89 | I/O — User I/O (bank 3) |
| Broche 90 | I/O — User I/O (bank 3) |
| Broche 91 | GND — Ground |
| Broche 92 | I/O — User I/O (bank 4) |
| Broche 93 | I/O — User I/O (bank 4) |
| Broche 94 | I/O — User I/O (bank 4) |
| Broche 95 | I/O — User I/O (bank 4) |
| Broche 96 | I/O — User I/O (bank 4) |
| Broche 97 | I/O — User I/O (bank 4) |
| Broche 98 | VCCINT — Core supply voltage (5 V) |
| Broche 99 | I/O — User I/O (bank 4) |
| Broche 100 | I/O — User I/O (bank 4) |
| Broche 101 | I/O — User I/O (bank 4) |
| Broche 102 | I/O — User I/O (bank 4) |
| Broche 103 | VCCIO — I/O bank 4 supply voltage |
| Broche 104 | I/O — User I/O (bank 4) |
| Broche 105 | I/O — User I/O (bank 4) |
| Broche 106 | GND — Ground |
| Broche 107 | I/O — User I/O (bank 4) |
| Broche 108 | I/O — User I/O (bank 4) |
| Broche 109 | I/O — User I/O (bank 4) |
| Broche 110 | I/O — User I/O (bank 4) |
| Broche 111 | I/O — User I/O (bank 4) |
| Broche 112 | TDO — JTAG test data output |
| Broche 113 | I/O — User I/O (bank 4) |
| Broche 114 | I/O — User I/O (bank 4) |
| Broche 115 | VCCINT — Core supply voltage (5 V) |
| Broche 116 | I/O — User I/O (bank 5) |
| Broche 117 | I/O — User I/O (bank 5) |
| Broche 118 | I/O — User I/O (bank 5) |
| Broche 119 | I/O — User I/O (bank 5) |
| Broche 120 | VCCIO — I/O bank 5 supply voltage |
| Broche 121 | I/O — User I/O (bank 5) |
| Broche 122 | I/O — User I/O (bank 5) |
| Broche 123 | I/O — User I/O (bank 5) |
| Broche 124 | I/O — User I/O (bank 5) |
| Broche 125 | GND — Ground |
| Broche 126 | I/O — User I/O (bank 5) |
| Broche 127 | I/O — User I/O (bank 5) |
| Broche 128 | I/O — User I/O (bank 5) |
| Broche 129 | I/O — User I/O (bank 5) |
| Broche 130 | I/O — User I/O (bank 5) |
| Broche 131 | I/O — User I/O (bank 5) |
| Broche 132 | VCCIO — I/O bank 5 supply voltage |
| Broche 133 | I/O — User I/O (bank 5) |
| Broche 134 | I/O — User I/O (bank 5) |
| Broche 135 | I/O — User I/O (bank 5) |
| Broche 136 | GND — Ground |
| Broche 137 | I/O — User I/O (bank 5) |
| Broche 138 | I/O — User I/O (bank 5) |
| Broche 139 | I/O — User I/O (bank 5) |
| Broche 140 | I/O — User I/O (bank 5) |
| Broche 141 | I/O — User I/O (bank 5) |
| Broche 142 | I/O — User I/O (bank 5) |
| Broche 143 | VCCINT — Core supply voltage (5 V) |
| Broche 144 | I/O — User I/O (bank 5) |
Applications typiques
EPF10K20TI144-4U convient pour 6 applications: Industrial Control & PLC I/O Expansion, Telecom Line-Card Glue Logic, ASIC Replacement / Prototype Emulation, Motor Control & Drive Front-End, Test & Measurement Instrumentation, Legacy Retrofit & Industrial Modernization.
Industrial Control & PLC I/O Expansion
The EPF10K20TI144-4U's industrial -40 °C to +85 °C temperature range, 102 user I/Os and 1152 logic elements make it well suited for PLC I/O expansion modules and discrete-control front-ends in factory-automation lines. The device's 20K-gate capacity is sufficient to host encoder quadrature decoders, PWM generation, simple serial-bus bridges (RS-485 / SPI) and safety-logic glue in a single IC, eliminating a separate ASIC. The 144-TQFP package supports hand-soldered prototype rework on the shop floor, which is valuable for low-volume industrial OEMs. Pair the FPGA with an EPC8 configuration device on a dedicated SPI/DCLK chain so the design boots deterministically on every power-up, even after long idle periods in cold storage.
Recommandé
Telecom Line-Card Glue Logic
Telecommunications line cards frequently require mid-complexity glue logic to bridge parallel backplanes, deserialize high-speed serial links, and fan out clock-domain crossing signals - tasks well matched to the EPF10K20TI144-4U's 1152 logic elements and 12,288-bit embedded RAM. Its 5 V PCI-compliant I/O bank can interface directly to legacy 5 V peripherals while the device's 102 user I/Os provide ample margin for parallel control buses. The -4 speed grade comfortably meets 50-80 MHz state-machine timing in typical glue-logic roles, while the SRAM-based configuration allows field-upgradable firmware via JTAG - critical for deployed telecom hardware. Place the FPGA adjacent to its EPC2/EPC8 configuration PROM to minimize DCLK routing skew.
Recommandé
ASIC Replacement / Prototype Emulation
The EPF10K20TI144-4U is an ideal ASIC replacement during prototype and low-volume production phases, allowing designers to validate system architecture before committing to a masked ASIC. Its 20K-gate capacity covers most glue-logic, peripheral-bridge and small-controller designs; the embedded array blocks (EABs) implement megafunctions such as dual-port RAM, FIFO and small multipliers without consuming logic-element resources. Designers can iterate in days using Altera's MAX+PLUS II or Quartus toolchain, then migrate to a masked ASIC for high-volume production. The 144-TQFP package is hand-rework friendly, which speeds board bring-up cycles during prototype phases.
Recommandé
Motor Control & Drive Front-End
In motor-control and variable-frequency drive front-ends, the EPF10K20TI144-4U generates the PWM patterns, decodes encoder feedback and runs the speed/current control loops at the necessary update rates. Its 1152 logic elements and 12,288-bit embedded RAM comfortably host field-oriented control (FOC) state machines, SVPWM modulators and encoder quadrature decoders. The industrial temperature grade and 5 V tolerance suit inverter-stage electronics where nearby switching nodes introduce temperature swings and ground-bounce transients. Use the dedicated JTAG chain for in-system tuning of PWM dead-time and PI-controller coefficients during drive commissioning.
Recommandé
Test & Measurement Instrumentation
The EPF10K20TI144-4U's 12,288-bit embedded RAM, dual-clock logic-array blocks and 102 user I/Os make it suitable for digital-storage oscilloscope trigger engines, logic-analyzer pattern generators and bench-top protocol analyzers. Designers can implement high-speed state machines, custom trigger sequences and on-the-fly data-width conversion without external memory, while the SRAM-based configuration lets vendors ship field-upgradable trigger libraries via JTAG. The 5 V I/O tolerance simplifies interfacing with legacy bench equipment that uses 5 V CMOS levels, and the 144-TQFP package supports mixed-signal PCB layouts where thermal management matters.
Recommandé
Legacy Retrofit & Industrial Modernization
For legacy equipment modernization programs, the EPF10K20TI144-4U serves as a drop-in replacement for older FLEX 10K, MAX 7000 and APEX 20K devices that are no longer repairable, while preserving the original PCB land pattern and JTAG test infrastructure. Its pin-compatibility with EPF10K20TC144-4N, EPF10K10TI144-4 and other 144-TQFP FLEX 10K variants (per Site MPN list) means retrofit boards can be re-qualified without respinning the layout. The SRAM-based configuration and Altera JTAG chain also allow modern diagnostic firmware to be loaded onto existing boards, extending equipment service life by years.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF10K20TI144-4U — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF10K20TI144-4N | EPF10K20TC144-4 | EPF10K20TC144-3 | EPF10K10TI144-4 |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 144-TQFP | 144-TQFP | 144-TQFP | 144-TQFP | 144-TQFP |
| Logic Elements | 1152 | 1152 | 1152 | 1152 | 720 (10K gates) |
| Typical Gates | 20,000 | 20,000 | 20,000 | 20,000 | 10,000 |
| Embedded RAM Bits | 12,288 | 12,288 | 12,288 | 12,288 | 6,144 |
| Speed Grade | -4 | -4 | -4 | -3 (slower) | -4 |
| Temperature Grade | Industrial (-40 °C to +85 °C) | Commercial (0 °C to +70 °C) | Commercial (0 °C to +70 °C) | Commercial (0 °C to +70 °C) | Industrial (-40 °C to +85 °C) |
| User I/Os | 102 | 102 | 102 | 102 | 102 |
| Lifecycle Status | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) |
Principaux différenciateurs
- Industrial temperature grade (U suffix) (vs EPF10K20TI144-4N)
- Same-die -4 speed grade for timing-critical designs (vs EPF10K20TC144-3)
- 20K-gate capacity in 144-TQFP industrial grade (vs EPF10K10TI144-4)
Notes de conception
The EPF10K20TI144-4U requires a stable 5.0 V core supply (VCCINT) and a separately decoupled VCCIO rail per I/O bank. Per the FLEX 10K datasheet, each VCCINT pin should be bypassed with a 0.1 µF ceramic capacitor placed within 5 mm of the pin, plus a 10 µF tantalum bulk capacitor near the package. The I/O banks (VCCIO) can each be powered at 3.3 V or 5.0 V independently to support mixed-voltage interfacing; bypass each VCCIO pin identically. Sequence the supplies so VCCINT is established before VCCIO if 5 V I/O is used with a 3.3 V core logic family in adjacent banks, to prevent back-powering through I/O clamping diodes.
Place the EPC8 or EPC2 configuration PROM as close as physically possible to the DCLK, nCONFIG, nSTATUS, CONF_DONE and DATA0 pins of the EPF10K20TI144-4U. Routing these traces over 25 mm introduces timing skew that can cause configuration failures at cold temperature. Per Altera's FLEX 10K hardware reference, keep the JTAG chain (TDI/TDO/TMS/TCK) under 150 mm total and add a 10 kΩ pull-up on nCONFIG and a 10 kΩ pull-down on JTAG TMS per IEEE 1149.1. Maintain a continuous ground plane under the TQFP-144 paddle area for thermal dissipation; the device can dissipate up to 1.5 W at 100 % logic utilization.
Do not assume that the EPF10K20TI144-4U is electrically compatible with later Cyclone devices on the same TQFP-144 footprint - the JTAG, configuration and power schemes differ fundamentally. Per the FLEX 10K datasheet, configuration data is loaded synchronously from an external PROM using DCLK; Cyclone IV/10 LP devices use active serial (AS) mode with EPCQ PROMs, which is NOT compatible with EPC8/EPC2 timing. Also note that the FLEX 10K device is volatile (SRAM-based), so the configuration must reload on every power-up; a missing or improperly programmed EPC8 will leave the device unconfigured with all I/Os tri-stated.
When driving long PCB traces or external cables, configure EPF10K20TI144-4U outputs with the slowest slew-rate setting in the Quartus / MAX+PLUS II assignment editor to limit ground bounce and EMI. Per the FLEX 10K datasheet, the device supports 2.5-3.3-5.0 V I/O standards with PCI-compliant drive strength; use PCI drive only on signals that require it, since high-strength outputs inject switching noise into adjacent analog sections. Add 22-33 Ω series-termination resistors on clock outputs and high-speed (>50 MHz) control signals to dampen reflections on traces longer than 50 mm.
Informations de conformité
RoHS and lead-free status not consistently documented across distributor listings for the EPF10K20TI144-4U; Altera's FLEX 10K family predates widespread RoHS adoption. Request lot-specific material declaration from the supplier before integration into a RoHS-mandated product. AEC-Q100 is not applicable as the device is not marketed as automotive-qualified.
