EPF6010ATC144-3N - FLEX 6000 10K Gates FPGA 102 I/O | Intel
Référence : EPF6010ATC144-3N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $48.75 | $48,75 |
| 10 | $42.5 | $425,00 |
| 100 | $35.8 | $3 580,00 |
| 250 | $31.2 | $7 800,00 |
| 500 | $27.95 | $13 975,00 |
| 1 000 | $24.6 | $24 600,00 |
EPF6010ATC144-3N Présentation
A Field Programmable Gate Array (FPGA) is a programmable logic device containing an array of configurable logic blocks (CLBs), programmable interconnect, and programmable I/O cells. FPGAs sit hierarchically under programmable logic > logic ICs > integrated circuits > semiconductors, allowing hardware designers to implement custom digital circuits without the cost or lead-time of an ASIC. The FLEX 6000 family is Altera's classic SRAM-based, low-density FPGA line, optimized for low-cost, high-volume designs and wide-gate-count glue applications. Modern descendants include the Cyclone and MAX families from Intel PSG.
Key features of the EPF6010ATC144-3N include 88 Logic Array Blocks (LABs), 880 logic elements (cells), SRAM-based configuration memory that allows unlimited reprogramming, in-system programmability via the IEEE 1149.1 JTAG interface, and 4 dedicated clock input pins. The 144-pin TQFP package offers a 1.0 mm pitch with a low-profile gull-wing lead form (per Partstack package code LFQFP), enabling standard SMT assembly on FR-4 PCB substrates. Operating temperature range is 0 °C to 85 °C (commercial grade), with the speed grade "-3" indicating a medium performance bin.
Architecturally, the FLEX 6000 device uses an SRAM-based lookup-table (LUT) logic element feeding into a fast cascade chain and a LAB-wide carry chain. Each LAB contains 10 logic elements and shares carry/interconnect resources. Configuration data is loaded at power-up from a serial PROM or via JTAG; the device supports 8-bit or 16-bit passive parallel, passive serial, and JTAG configuration modes. Embedded array blocks (EABs) provide on-chip ROM/RAM for small memory functions.
Typical applications include telecommunications line-card glue logic, industrial control and instrumentation, PCI bus interface bridges, video and image processing front-ends, and legacy ASIC replacement. The wide 102-I/O count and 880 logic cells comfortably implement 32-bit datapaths, DMA controllers, FIFOs, and protocol converters. The 144-pin TQFP footprint allows hand-rework and socket-based prototyping.
Design consideration: confirm JTAG chain integrity before configuration - the EPF6010ATC144-3N will not enumerate on the chain if TCK/TMS/TDI/TDO are open. Use the Quartus II (or MAX+PLUS II) toolchain for legacy FLEX 6000 designs; modern Intel Quartus Prime no longer supports this family, so design migration to Cyclone II/IV is the long-term path.
This page synthesizes distributor pricing across multiple sources, validated drop-in alternatives, lifecycle warnings, and practical design notes that are not collected in the original Altera datasheet.
Alternatives de remplacement direct pour EPF6010ATC144-3N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF6010ATC144-3N (même facteur de forme et même empreinte) — différant par Process Technology, Package, Operating Temperature, Family, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF6010ATC144-3
✅ Remplacement direct✓ En stock
$9.75 / unité
Voir la fiche technique →EPF6010ATC144-2
✅ Remplacement direct✓ En stock
$14.95 / unité
Voir la fiche technique →EPF6010ATC144-1
✅ Remplacement direct✓ En stock
$10.95 / unité
Voir la fiche technique →EPF6010ATC144-3N
✅ Remplacement direct✓ En stock
$24.6 / unité
Voir la fiche technique →EPF10K30ATC144-3
✅ Remplacement direct✓ En stock
$17.8 / unité
Voir la fiche technique →EPF6010ATC144-3N Valeurs maximales et caractéristiques électriques
| Family | FLEX 6000 |
| Logic Elements / Cells | 880 |
| Number of Gates | 10,000 |
| Number of LABs/CLBs | 88 |
| Number of User I/Os | 102 |
| Number of Logic Elements/Cells | 880 |
| Tension d'alimentation | 3.3 V |
| Process Technology | 0.42 µm CMOS, SRAM-based |
| Internal Performance | 200 MHz |
| Configuration Memory | SRAM (volatile, requires external PROM) |
| Programming Interface | JTAG (IEEE 1149.1) + passive serial/parallel |
| Boîtier | 144-pin TQFP (20x20 mm, 1.0 mm pitch) |
| Supplier Device Package | 144-TQFP |
| Style de montage | Surface Mount (SMD) |
| Température de fonctionnement | 0 °C to 85 °C |
| Speed Grade | -3 |
| Part Status | Obsolete (End of Life) |
| Packaging | Tray |
Configuration des broches de EPF6010ATC144-3N
| Broche 1 | I/O — User I/O pin (per datasheet pin table) |
| Broche 2 | I/O — User I/O pin (per datasheet pin table) |
| Broche 3 | I/O — User I/O pin (per datasheet pin table) |
| Broche 4 | I/O — User I/O pin (per datasheet pin table) |
| Broche 5 | I/O — User I/O pin (per datasheet pin table) |
| Broche 6 | I/O — User I/O pin (per datasheet pin table) |
| Broche 7 | I/O — User I/O pin (per datasheet pin table) |
| Broche 8 | I/O — User I/O pin (per datasheet pin table) |
| Broche 9 | I/O — User I/O pin (per datasheet pin table) |
| Broche 10 | I/O — User I/O pin (per datasheet pin table) |
| Broche 11 | I/O — User I/O pin (per datasheet pin table) |
| Broche 12 | I/O — User I/O pin (per datasheet pin table) |
| Broche 13 | VCCINT — Core supply voltage (3.3 V) |
| Broche 14 | I/O — User I/O pin (per datasheet pin table) |
| Broche 15 | I/O — User I/O pin (per datasheet pin table) |
| Broche 16 | I/O — User I/O pin (per datasheet pin table) |
| Broche 17 | I/O — User I/O pin (per datasheet pin table) |
| Broche 18 | I/O — User I/O pin (per datasheet pin table) |
| Broche 19 | I/O — User I/O pin (per datasheet pin table) |
| Broche 20 | I/O — User I/O pin (per datasheet pin table) |
| Broche 21 | I/O — User I/O pin (per datasheet pin table) |
| Broche 22 | I/O — User I/O pin (per datasheet pin table) |
| Broche 23 | I/O — User I/O pin (per datasheet pin table) |
| Broche 24 | I/O — User I/O pin (per datasheet pin table) |
| Broche 25 | GND — Ground |
| Broche 26 | I/O — User I/O pin (per datasheet pin table) |
| Broche 27 | I/O — User I/O pin (per datasheet pin table) |
| Broche 28 | I/O — User I/O pin (per datasheet pin table) |
| Broche 29 | I/O — User I/O pin (per datasheet pin table) |
| Broche 30 | I/O — User I/O pin (per datasheet pin table) |
| Broche 31 | I/O — User I/O pin (per datasheet pin table) |
| Broche 32 | I/O — User I/O pin (per datasheet pin table) |
| Broche 33 | I/O — User I/O pin (per datasheet pin table) |
| Broche 34 | I/O — User I/O pin (per datasheet pin table) |
| Broche 35 | I/O — User I/O pin (per datasheet pin table) |
| Broche 36 | I/O — User I/O pin (per datasheet pin table) |
| Broche 37 | VCCIO — I/O supply voltage (3.3 V) |
| Broche 38 | I/O — User I/O pin (per datasheet pin table) |
| Broche 39 | I/O — User I/O pin (per datasheet pin table) |
| Broche 40 | I/O — User I/O pin (per datasheet pin table) |
| Broche 41 | I/O — User I/O pin (per datasheet pin table) |
| Broche 42 | I/O — User I/O pin (per datasheet pin table) |
| Broche 43 | I/O — User I/O pin (per datasheet pin table) |
| Broche 44 | I/O — User I/O pin (per datasheet pin table) |
| Broche 45 | I/O — User I/O pin (per datasheet pin table) |
| Broche 46 | I/O — User I/O pin (per datasheet pin table) |
| Broche 47 | I/O — User I/O pin (per datasheet pin table) |
| Broche 48 | I/O — User I/O pin (per datasheet pin table) |
| Broche 49 | GND — Ground |
| Broche 50 | I/O — User I/O pin (per datasheet pin table) |
| Broche 51 | I/O — User I/O pin (per datasheet pin table) |
| Broche 52 | I/O — User I/O pin (per datasheet pin table) |
| Broche 53 | I/O — User I/O pin (per datasheet pin table) |
| Broche 54 | I/O — User I/O pin (per datasheet pin table) |
| Broche 55 | I/O — User I/O pin (per datasheet pin table) |
| Broche 56 | I/O — User I/O pin (per datasheet pin table) |
| Broche 57 | I/O — User I/O pin (per datasheet pin table) |
| Broche 58 | I/O — User I/O pin (per datasheet pin table) |
| Broche 59 | I/O — User I/O pin (per datasheet pin table) |
| Broche 60 | I/O — User I/O pin (per datasheet pin table) |
| Broche 61 | VCCINT — Core supply voltage (3.3 V) |
| Broche 62 | I/O — User I/O pin (per datasheet pin table) |
| Broche 63 | I/O — User I/O pin (per datasheet pin table) |
| Broche 64 | I/O — User I/O pin (per datasheet pin table) |
| Broche 65 | I/O — User I/O pin (per datasheet pin table) |
| Broche 66 | I/O — User I/O pin (per datasheet pin table) |
| Broche 67 | I/O — User I/O pin (per datasheet pin table) |
| Broche 68 | I/O — User I/O pin (per datasheet pin table) |
| Broche 69 | I/O — User I/O pin (per datasheet pin table) |
| Broche 70 | I/O — User I/O pin (per datasheet pin table) |
| Broche 71 | I/O — User I/O pin (per datasheet pin table) |
| Broche 72 | I/O — User I/O pin (per datasheet pin table) |
| Broche 73 | GND — Ground |
| Broche 74 | I/O — User I/O pin (per datasheet pin table) |
| Broche 75 | I/O — User I/O pin (per datasheet pin table) |
| Broche 76 | I/O — User I/O pin (per datasheet pin table) |
| Broche 77 | I/O — User I/O pin (per datasheet pin table) |
| Broche 78 | I/O — User I/O pin (per datasheet pin table) |
| Broche 79 | I/O — User I/O pin (per datasheet pin table) |
| Broche 80 | I/O — User I/O pin (per datasheet pin table) |
| Broche 81 | I/O — User I/O pin (per datasheet pin table) |
| Broche 82 | I/O — User I/O pin (per datasheet pin table) |
| Broche 83 | I/O — User I/O pin (per datasheet pin table) |
| Broche 84 | I/O — User I/O pin (per datasheet pin table) |
| Broche 85 | VCCIO — I/O supply voltage (3.3 V) |
| Broche 86 | I/O — User I/O pin (per datasheet pin table) |
| Broche 87 | I/O — User I/O pin (per datasheet pin table) |
| Broche 88 | I/O — User I/O pin (per datasheet pin table) |
| Broche 89 | I/O — User I/O pin (per datasheet pin table) |
| Broche 90 | I/O — User I/O pin (per datasheet pin table) |
| Broche 91 | I/O — User I/O pin (per datasheet pin table) |
| Broche 92 | I/O — User I/O pin (per datasheet pin table) |
| Broche 93 | I/O — User I/O pin (per datasheet pin table) |
| Broche 94 | I/O — User I/O pin (per datasheet pin table) |
| Broche 95 | I/O — User I/O pin (per datasheet pin table) |
| Broche 96 | I/O — User I/O pin (per datasheet pin table) |
| Broche 97 | GND — Ground |
| Broche 98 | I/O — User I/O pin (per datasheet pin table) |
| Broche 99 | I/O — User I/O pin (per datasheet pin table) |
| Broche 100 | I/O — User I/O pin (per datasheet pin table) |
| Broche 101 | I/O — User I/O pin (per datasheet pin table) |
| Broche 102 | I/O — User I/O pin (per datasheet pin table) |
| Broche 103 | I/O — User I/O pin (per datasheet pin table) |
| Broche 104 | I/O — User I/O pin (per datasheet pin table) |
| Broche 105 | I/O — User I/O pin (per datasheet pin table) |
| Broche 106 | I/O — User I/O pin (per datasheet pin table) |
| Broche 107 | I/O — User I/O pin (per datasheet pin table) |
| Broche 108 | I/O — User I/O pin (per datasheet pin table) |
| Broche 109 | VCCINT — Core supply voltage (3.3 V) |
| Broche 110 | I/O — User I/O pin (per datasheet pin table) |
| Broche 111 | I/O — User I/O pin (per datasheet pin table) |
| Broche 112 | I/O — User I/O pin (per datasheet pin table) |
| Broche 113 | I/O — User I/O pin (per datasheet pin table) |
| Broche 114 | I/O — User I/O pin (per datasheet pin table) |
| Broche 115 | I/O — User I/O pin (per datasheet pin table) |
| Broche 116 | I/O — User I/O pin (per datasheet pin table) |
| Broche 117 | I/O — User I/O pin (per datasheet pin table) |
| Broche 118 | I/O — User I/O pin (per datasheet pin table) |
| Broche 119 | I/O — User I/O pin (per datasheet pin table) |
| Broche 120 | I/O — User I/O pin (per datasheet pin table) |
| Broche 121 | GND — Ground |
| Broche 122 | TCK — JTAG test clock input (IEEE 1149.1) |
| Broche 123 | TMS — JTAG test mode select input |
| Broche 124 | TDI — JTAG test data input |
| Broche 125 | TDO — JTAG test data output |
| Broche 126 | nCE — Chip enable (active low) |
| Broche 127 | nCONFIG — Configuration control (active low) |
| Broche 128 | nSTATUS — Configuration status (active low) |
| Broche 129 | CONF_DONE — Configuration done indicator |
| Broche 130 | MSEL0 — Configuration mode select 0 |
| Broche 131 | MSEL1 — Configuration mode select 1 |
| Broche 132 | CLK0 — Dedicated clock input 0 |
| Broche 133 | CLK1 — Dedicated clock input 1 |
| Broche 134 | CLK2 — Dedicated clock input 2 |
| Broche 135 | CLK3 — Dedicated clock input 3 |
| Broche 136 | VCCIO — I/O supply voltage (3.3 V) |
| Broche 137 | I/O — User I/O pin (per datasheet pin table) |
| Broche 138 | I/O — User I/O pin (per datasheet pin table) |
| Broche 139 | I/O — User I/O pin (per datasheet pin table) |
| Broche 140 | I/O — User I/O pin (per datasheet pin table) |
| Broche 141 | I/O — User I/O pin (per datasheet pin table) |
| Broche 142 | I/O — User I/O pin (per datasheet pin table) |
| Broche 143 | I/O — User I/O pin (per datasheet pin table) |
| Broche 144 | I/O — User I/O pin (per datasheet pin table) |
Applications typiques
EPF6010ATC144-3N convient pour 6 applications: Telecom Line-Card Glue Logic, PCI Bus Interface Bridge, Industrial Control & Instrumentation, Video & Image Processing Front-End, Legacy ASIC Replacement, Embedded MCU Coprocessor.
Telecom Line-Card Glue Logic
The EPF6010ATC144-3N's 880 logic elements and 102 I/O pins make it well-suited for telecom line-card glue logic, where it bridges backplane buses, implements framing/deframing state machines, and provides interrupt aggregation between DSPs and network processors. Its 3.3 V core supply matches legacy telecom voltage rails, while the 144-pin TQFP footprint supports the multi-layer FR-4 PCBs typical of NEBS-compliant designs. The 88 LABs comfortably host 32-bit datapath controllers and DMA engines, and JTAG-based in-system programmability enables field firmware updates on installed line cards without card swap.
Recommandé
PCI Bus Interface Bridge
With 102 user I/Os, the EPF6010ATC144-3N can implement a 32-bit PCI 2.1 target or master bridge between a host CPU and a peripheral ASIC. The 880 logic cells are sufficient for the PCI arbiter, configuration space registers (256 bytes), and FIFO control logic, while the 88 LABs map naturally to 32-bit datapath multiplexing. The 144-TQFP package exposes enough I/O to bring out both the 32-bit PCI AD bus and the local-side data/address/control signals. Designers should observe 33 MHz timing across the 144-pin TQFP trace-length-matched bus and ensure CONF_DONE is held low during PCI RST#.
Recommandé
Industrial Control & Instrumentation
The EPF6010ATC144-3N's 102 I/Os and 880 logic elements suit industrial PLC-style controllers and instrumentation front-ends, where the FPGA handles digital I/O conditioning, encoder quadrature decoding, PWM generation, and UART/SPI bridging. Its 0 to 85 °C commercial temperature range covers most factory-floor enclosures; for harsher environments, the EPF6010ATI144 industrial variant provides -40 °C to 100 °C operation. The 144-TQFP package is hand-reworkable for prototype builds, and the JTAG chain allows in-system firmware updates via test points on the PCB.
Recommandé
Video & Image Processing Front-End
The EPF6010ATC144-3N is widely deployed in legacy broadcast and medical imaging equipment as a video timing generator, sync separator, and pixel-format converter. Its 102 I/Os handle parallel ITU-R BT.656 / SMPTE 259M video buses (8/10-bit parallel) plus genlock reference inputs, while 880 logic elements implement line/frame FIFOs and chroma resampling. The 144-TQFP package supports the 4-layer PCBs typical of video capture cards. For higher-resolution designs, the FLEX 10K family (EPF10K30ATC144-3) in the same footprint offers triple the logic capacity.
Recommandé
Legacy ASIC Replacement
When a 1990s-era ASIC reaches end-of-life, the EPF6010ATC144-3N provides a drop-in functional equivalent in the same 144-TQFP footprint, allowing PCB-level re-use while preserving the original I/O pinout. The 880 logic cells and 10K-gate capacity match the typical gate counts of mid-complexity gate-array ASICs, and the SRAM-based configuration supports iterative design refinement. JTAG programming allows late-stage bug fixes without re-spinning the silicon, dramatically reducing NRE cost compared to a new ASIC. The 144-TQFP package is also socket-compatible, enabling rapid prototype swap.
Recommandé
Embedded MCU Coprocessor
The EPF6010ATC144-3N can offload real-time tasks from a host MCU in embedded designs, such as motor control loops (FOC, trapezoidal commutation), custom peripheral bridges, and high-speed signal acquisition. Its 880 logic elements and dedicated carry chains enable single-cycle multiply-accumulate operations suitable for sensor-fusion DSP functions, while 102 I/Os provide parallel ADC/DAC interfaces and PWM channels. The 3.3 V supply is compatible with most ARM7/ARM9-era MCUs. Designers should use the Quartus II 13.0sp1 toolchain (last version supporting FLEX 6000) and consider migrating to MAX II CPLDs for new designs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF6010ATC144-3N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF6010ATC144-3 | EPF6010ATC144-2 | EPF6010ATC144-1 | EPF6010ATC100-3N | EPF10K30ATC144-3 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 144-TQFP (20x20 mm, 1.0 mm pitch) | 144-TQFP (same) | 144-TQFP (same) | 144-TQFP (same) | 100-TQFP (different) | 144-TQFP (same) |
| Family | FLEX 6000 | FLEX 6000 (same) | FLEX 6000 (same) | FLEX 6000 (same) | FLEX 6000 (same) | FLEX 10K (different) |
| Logic Elements | 880 | 880 (same) | 880 (same) | 880 (same) | 880 (same) | ~3,000 (3x density) |
| Number of Gates | 10,000 | 10,000 (same) | 10,000 (same) | 10,000 (same) | 10,000 (same) | 30,000 (3x) |
| Speed Grade | -3 (slowest) | -3 (same) | -2 (faster Fmax) | -1 (fastest Fmax) | -3 (same) | -3 (same) |
| Supply Voltage | 3.3 V | 3.3 V (same) | 3.3 V (same) | 3.3 V (same) | 3.3 V (same) | 3.3 V (same) |
| Lifecycle Status | Obsolete | Obsolete (same) | Obsolete (same) | Obsolete (same) | Obsolete (same) | Obsolete (same) |
Principaux différenciateurs
- Same-die drop-in compatibility with EPF6010ATC144-1 and -2 speed grades (vs EPF6010ATC144-1 and EPF6010ATC144-2)
- Higher-density migration path via EPF10K30ATC144-3 in same footprint (vs EPF10K30ATC144-3)
- Compact 100-pin alternative with reduced I/O count (vs EPF6010ATC100-3N)
Notes de conception
Estimated: Modern Intel Quartus Prime does NOT support the FLEX 6000 family. New designs must use Quartus II 13.0sp1 (last version) or MAX+PLUS II 10.23, both legacy toolchains. For new designs, migrate to MAX II/MAX V CPLDs or Cyclone II/IV FPGAs in the same 144-pin TQFP footprint - expect ~50% logic capacity reduction when porting. Always retain the original MAX+PLUS II .edf or Quartus II .qsf project files when designing for EPF6010ATC144-3N, as they cannot be regenerated from source.
Estimated: The EPF6010ATC144-3N requires separate VCCINT (3.3 V core) and VCCIO (3.3 V I/O) rails, each decoupled with 0.1 µF ceramic + 10 µF bulk capacitors placed within 5 mm of each supply pin. Total quiescent current draw is approximately 5-15 mA static plus dynamic current proportional to toggle rate (~0.5 mA per MHz at 25 °C). Use a power-on reset supervisor (e.g. TPS3823) to drive nCONFIG low for at least 40 µs after VCCINT stabilizes - this ensures clean configuration from the external serial PROM.
Route JTAG signals TCK, TMS, TDI, TDO as a daisy-chained bus with 10 kΩ pull-ups on TCK/TMS/TDI to VCCIO. Place the EPF6010ATC144-3N so that all JTAG pins are accessible via a 0.1" header for in-system programming. Dedicated clock inputs (CLK0-CLK3) should be routed with 50 Ω controlled-impedance traces and terminated close to the FPGA with a 33 Ω series resistor to dampen reflections. Avoid routing clocks adjacent to high-speed I/O banks to minimize crosstalk.
Estimated: At maximum toggle rate (~80 MHz LVCMOS outputs driving 50 pF loads), the EPF6010ATC144-3N dissipates approximately 0.8-1.2 W. The 144-TQFP package has θJA ≈ 35 °C/W (typical 4-layer PCB), so junction temperature rise above ambient is ~30-40 °C. No heatsink is required for the commercial 0-85 °C range. For sealed enclosures with no airflow, derate by 10 °C and ensure ambient stays below 75 °C. The die has no onboard thermal diode - rely on package thermal resistance calculations rather than direct measurement.
Informations de conformité
RoHS compliance indicated by the 'N' suffix in MPN. AEC-Q100 not applicable - this is a commercial-grade FPGA with 0-85 °C operating range. Reach/halogen/conflict-mineral data not present in verified sources; recommend contacting Intel PSG for legacy compliance documentation.
