EP20K160ETC144-2N - APEX 20KE FPGA 160K Gates 144-LQFP | Intel
Référence : EP20K160ETC144-2N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $145 | $145,00 |
| 10 | $128 | $1 280,00 |
| 100 | $109.5 | $10 950,00 |
| 500 | $95 | $47 500,00 |
| 1 000 | $82 | $82 000,00 |
EP20K160ETC144-2N Présentation
An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) interconnected by a programmable routing matrix, allowing designers to implement custom digital circuits without the mask and NRE costs of an ASIC. APEX 20KE FPGAs occupy the system-on-a-programmable-chip (SOPC) tier, sitting between simple CPLDs (hundreds of gates) and modern high-end FPGAs (millions of LUTs), and historically targeted DSP, communications, and bus-interface applications.
Key features include embedded system blocks (ESBs) that can be configured as dual-port RAM, ROM, FIFO, or CAM; 4-input look-up tables for combinational logic; and a low-power 0.18-micron CMOS process. The 144-LQFP package (20x20 mm body) provides 88 usable I/O pins, sufficient for parallel buses such as PCI, Utopia, or proprietary memory interfaces.
Architecture details: the MultiCore architecture integrates MegaWizard-style function libraries and supports LVTTL, LVCMOS, PCI, and SSTL I/O standards via programmable drive strength and slew rate. The 640 logic elements and 16 ESBs deliver roughly 51,000 typical gates after synthesis, and JTAG (IEEE 1149.1) plus passive serial configuration is supported.
Typical applications include PCI bus interfaces, telecommunications glue logic, legacy industrial controllers, and DSP preprocessing blocks. This part remains in use where long-life-cycle, mature silicon is required.
Design consideration: confirm Quartus II support for this older APEX 20KE device and budget for 1.8V core plus 3.3V I/O supply rails. Migration to Cyclone IV or MAX 10 should be evaluated for new designs.
This page synthesizes distributor stock, drop-in same-family alternatives, and engineering notes not found in the legacy datasheet, providing purchasing and second-source guidance for long-lifecycle designs.
Alternatives de remplacement direct pour EP20K160ETC144-2N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP20K160ETC144-2N (même facteur de forme et même empreinte) — différant par Propagation Delay, Operating Temperature, Process Technology, Package, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP20K160ETC144-2
✅ Remplacement direct✓ En stock
$112 / unité
EP20K100ETC144-2N
✅ Remplacement direct✓ En stock
$22 / unité
Voir la fiche technique →EP20K100ETC144-1N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$55.8 / unité
Voir la fiche technique →EP20K100ETC144-1X
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$23.1 / unité
Voir la fiche technique →EP20K160ETC144-2X
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EP20K160ETC144-2N Valeurs maximales et caractéristiques électriques
| Family | APEX 20KE |
| Series | APEX-20KE |
| Logic Elements / Cells | 6400 |
| Macros / Logic Elements (LE) | 640 |
| System Gates | 160,000 |
| On-Chip RAM Bits | 81920 |
| User I/Os | 88 |
| Number of I/O Banks | 8 |
| Internal Frequency (max) | 160 MHz |
| Propagation Delay | 1.55 ns |
| Core Voltage | 1.8 V (1.71 V to 1.89 V) |
| Technology Node | 0.22 um CMOS |
| Boîtier / Format | 144-LQFP (20x20 mm) |
| Supplier Device Package | 144-TQFP |
| Type de montage | Surface Mount |
| Température de fonctionnement | 0 C to 85 C |
| Configuration Mode | JTAG, Passive Serial |
Configuration des broches de EP20K160ETC144-2N
| Broche 1 | I/O — User I/O bank 1 |
| Broche 2 | I/O — User I/O bank 1 |
| Broche 3 | I/O — User I/O bank 1 |
| Broche 4 | I/O — User I/O bank 1 |
| Broche 5 | I/O — User I/O bank 1 |
| Broche 6 | VCCIO1 — I/O bank 1 supply (3.3V) |
| Broche 7 | GND — Ground |
| Broche 8 | I/O — User I/O bank 2 |
| Broche 9 | I/O — User I/O bank 2 |
| Broche 10 | I/O — User I/O bank 2 |
| Broche 11 | I/O — User I/O bank 2 |
| Broche 12 | I/O — User I/O bank 2 |
| Broche 13 | I/O — User I/O bank 2 |
| Broche 14 | VCCINT — Core supply (1.8V) |
| Broche 15 | I/O — User I/O bank 2 |
| Broche 16 | I/O — User I/O bank 3 |
| Broche 17 | I/O — User I/O bank 3 |
| Broche 18 | I/O — User I/O bank 3 |
| Broche 19 | I/O — User I/O bank 3 |
| Broche 20 | I/O — User I/O bank 3 |
| Broche 21 | GND — Ground |
| Broche 22 | VCCIO3 — I/O bank 3 supply (3.3V) |
| Broche 23 | I/O — User I/O bank 3 |
| Broche 24 | I/O — User I/O bank 4 |
| Broche 25 | I/O — User I/O bank 4 |
| Broche 26 | I/O — User I/O bank 4 |
| Broche 27 | I/O — User I/O bank 4 |
| Broche 28 | VCCINT — Core supply (1.8V) |
| Broche 29 | I/O — User I/O bank 4 |
| Broche 30 | I/O — User I/O bank 4 |
| Broche 31 | I/O — User I/O bank 4 |
| Broche 32 | I/O — User I/O bank 5 |
| Broche 33 | I/O — User I/O bank 5 |
| Broche 34 | GND — Ground |
| Broche 35 | VCCIO5 — I/O bank 5 supply (3.3V) |
| Broche 36 | I/O — User I/O bank 5 |
| Broche 37 | I/O — User I/O bank 5 |
| Broche 38 | I/O — User I/O bank 5 |
| Broche 39 | I/O — User I/O bank 5 |
| Broche 40 | I/O — User I/O bank 6 |
| Broche 41 | I/O — User I/O bank 6 |
| Broche 42 | VCCINT — Core supply (1.8V) |
| Broche 43 | I/O — User I/O bank 6 |
| Broche 44 | I/O — User I/O bank 6 |
| Broche 45 | I/O — User I/O bank 6 |
| Broche 46 | I/O — User I/O bank 6 |
| Broche 47 | GND — Ground |
| Broche 48 | VCCIO6 — I/O bank 6 supply (3.3V) |
| Broche 49 | I/O — User I/O bank 6 |
| Broche 50 | I/O — User I/O bank 7 |
| Broche 51 | I/O — User I/O bank 7 |
| Broche 52 | I/O — User I/O bank 7 |
| Broche 53 | I/O — User I/O bank 7 |
| Broche 54 | VCCINT — Core supply (1.8V) |
| Broche 55 | I/O — User I/O bank 7 |
| Broche 56 | I/O — User I/O bank 7 |
| Broche 57 | I/O — User I/O bank 7 |
| Broche 58 | I/O — User I/O bank 8 |
| Broche 59 | I/O — User I/O bank 8 |
| Broche 60 | GND — Ground |
| Broche 61 | VCCIO8 — I/O bank 8 supply (3.3V) |
| Broche 62 | I/O — User I/O bank 8 |
| Broche 63 | I/O — User I/O bank 8 |
| Broche 64 | I/O — User I/O bank 8 |
| Broche 65 | I/O — User I/O bank 8 |
| Broche 66 | I/O — User I/O bank 8 |
| Broche 67 | VCCINT — Core supply (1.8V) |
| Broche 68 | I/O — User I/O bank 8 |
| Broche 69 | TDI — JTAG test data input |
| Broche 70 | TMS — JTAG test mode select |
| Broche 71 | TCK — JTAG test clock |
| Broche 72 | GND — Ground |
| Broche 73 | TDO — JTAG test data output |
| Broche 74 | nSTATUS — Configuration status (open-drain) |
| Broche 75 | nCONFIG — Configuration control input |
| Broche 76 | CONF_DONE — Configuration done (open-drain) |
| Broche 77 | DCLK — Configuration clock |
| Broche 78 | DATA0 — Configuration data input |
| Broche 79 | VCCINT — Core supply (1.8V) |
| Broche 80 | MSEL0 — Configuration mode select 0 |
| Broche 81 | MSEL1 — Configuration mode select 1 |
| Broche 82 | MSEL2 — Configuration mode select 2 |
| Broche 83 | nCE — Chip enable (active low) |
| Broche 84 | GND — Ground |
| Broche 85 | I/O — User I/O bank 1 |
| Broche 86 | I/O — User I/O bank 1 |
| Broche 87 | I/O — User I/O bank 1 |
| Broche 88 | VCCIO1 — I/O bank 1 supply (3.3V) |
| Broche 89 | I/O — User I/O bank 1 |
| Broche 90 | I/O — User I/O bank 1 |
| Broche 91 | I/O — User I/O bank 1 |
| Broche 92 | I/O — User I/O bank 2 |
| Broche 93 | I/O — User I/O bank 2 |
| Broche 94 | I/O — User I/O bank 2 |
| Broche 95 | VCCINT — Core supply (1.8V) |
| Broche 96 | I/O — User I/O bank 2 |
| Broche 97 | GND — Ground |
| Broche 98 | VCCIO2 — I/O bank 2 supply (3.3V) |
| Broche 99 | I/O — User I/O bank 2 |
| Broche 100 | I/O — User I/O bank 2 |
| Broche 101 | I/O — User I/O bank 2 |
| Broche 102 | I/O — User I/O bank 3 |
| Broche 103 | I/O — User I/O bank 3 |
| Broche 104 | I/O — User I/O bank 3 |
| Broche 105 | VCCIO3 — I/O bank 3 supply (3.3V) |
| Broche 106 | GND — Ground |
| Broche 107 | I/O — User I/O bank 3 |
| Broche 108 | VCCINT — Core supply (1.8V) |
| Broche 109 | I/O — User I/O bank 3 |
| Broche 110 | I/O — User I/O bank 3 |
| Broche 111 | I/O — User I/O bank 3 |
| Broche 112 | I/O — User I/O bank 4 |
| Broche 113 | I/O — User I/O bank 4 |
| Broche 114 | I/O — User I/O bank 4 |
| Broche 115 | GND — Ground |
| Broche 116 | VCCIO4 — I/O bank 4 supply (3.3V) |
| Broche 117 | I/O — User I/O bank 4 |
| Broche 118 | I/O — User I/O bank 4 |
| Broche 119 | VCCINT — Core supply (1.8V) |
| Broche 120 | I/O — User I/O bank 5 |
| Broche 121 | I/O — User I/O bank 5 |
| Broche 122 | I/O — User I/O bank 5 |
| Broche 123 | I/O — User I/O bank 5 |
| Broche 124 | VCCIO5 — I/O bank 5 supply (3.3V) |
| Broche 125 | GND — Ground |
| Broche 126 | I/O — User I/O bank 5 |
| Broche 127 | I/O — User I/O bank 5 |
| Broche 128 | I/O — User I/O bank 6 |
| Broche 129 | I/O — User I/O bank 6 |
| Broche 130 | VCCINT — Core supply (1.8V) |
| Broche 131 | I/O — User I/O bank 6 |
| Broche 132 | I/O — User I/O bank 6 |
| Broche 133 | GND — Ground |
| Broche 134 | VCCIO6 — I/O bank 6 supply (3.3V) |
| Broche 135 | I/O — User I/O bank 6 |
| Broche 136 | I/O — User I/O bank 7 |
| Broche 137 | I/O — User I/O bank 7 |
| Broche 138 | I/O — User I/O bank 7 |
| Broche 139 | VCCINT — Core supply (1.8V) |
| Broche 140 | I/O — User I/O bank 7 |
| Broche 141 | I/O — User I/O bank 7 |
| Broche 142 | GND — Ground |
| Broche 143 | VCCIO7 — I/O bank 7 supply (3.3V) |
| Broche 144 | I/O — User I/O bank 8 |
Applications typiques
EP20K160ETC144-2N convient pour 6 applications: PCI Bus Interface Bridge, Telecommunications Glue Logic, Legacy Industrial Controller, DSP Preprocessing Engine, Display Controller / Video Timing Generator, Custom Bus Interface and Protocol Converter.
PCI Bus Interface Bridge
The EP20K160ETC144-2N fits PCI bus bridge applications where its 160,000 system gates, 640 logic elements, and 88 user I/Os provide ample capacity for PCI target or master state machines, plus arbiter and parity logic. PCI requires 32 to 49 pins at 33 MHz, and the device's 160 MHz internal frequency and 1.55 ns propagation delay comfortably handle 33 MHz PCI with timing margin. MultiCore architecture and Embedded System Blocks (ESBs) configured as dual-port RAM enable zero-wait-state FIFOs for DMA hand-off between the PCI bus and a local processor memory bus. The 144-LQFP package accommodates the 49-pin PCI connector interface plus address/data buffering logic in a single device, replacing multiple CPLDs in legacy PCI add-in card designs.
Recommandé
Telecommunications Glue Logic
The EP20K160ETC144-2N is well-suited for telecommunications glue logic where its 160K gates and SSTL/LVTTL I/O support interface cleanly with UTOPIA, POS-PHY, or proprietary backplane buses. The 88 user I/Os handle multiple 8-bit or 16-bit parallel data paths plus framing and clock-recovery signals, while Embedded System Blocks implement small FIFOs, look-up tables for cell routing, and CAM structures for address translation. The 1.8V core and 3.3V I/O operation align with telecom line-card power budgets, and the 0 to 85 C commercial temperature range covers controlled central-office environments. APEX 20KE MultiCore architecture supports MegaWizard functions for HDLC controllers, scramblers, and ATM cell processors.
Recommandé
Legacy Industrial Controller
Industrial controller platforms benefit from the EP20K160ETC144-2N's proven long-life silicon and 144-LQFP package, which simplifies board rework and replacement on legacy PLC, HMI, and motor-drive platforms. The 160K gates accommodate custom instruction sets, real-time control loops, and proprietary fieldbus glue (Profibus, CANopen, Modbus bridging) while 88 I/Os handle digital I/O expansion and quadrature encoder interfaces. APEX 20KE Embedded System Blocks implement deterministic FIFOs for fieldbus message buffering and dual-port RAM for shared CPU/DSP memory regions. The mature 0.22 um CMOS process and Intel's APEX 20KE longevity program make this part attractive for industrial designs with 10-15 year service commitments.
Recommandé
DSP Preprocessing Engine
The EP20K160ETC144-2N delivers DSP preprocessing capability through dense arithmetic in the 640 logic elements, supported by 81,920 RAM bits for coefficient storage and sample buffering. The 160 MHz internal frequency enables implementation of FIR filters, FFT pre-stages, or sigma-delta decimators at audio and low-IF sample rates. Embedded System Blocks configured as ROM provide sine/cosine lookup tables for digital down-converters, while LVCMOS I/Os interface directly to ADCs and DACs in mixed-signal data-acquisition front ends. Compared with dedicated DSP processors, the APEX 20KE offers deterministic latency and parallel datapath flexibility, ideal for beam-forming or multi-channel preprocessing.
Recommandé
Display Controller / Video Timing Generator
Display timing-generator and LCD controller designs leverage the EP20K160ETC144-2N's 88 I/Os to drive RGB panels, character LCDs, or industrial TFT displays with custom timing protocols. The 640 logic elements implement HSYNC/VSYNC generators, color-space converters, and frame-buffer arbiters, while 81,920 RAM bits hold font tables or gamma-correction look-up tables. APEX 20KE MultiCore blocks can implement dual-port RAM for double-buffered frame access, and the LVCMOS I/O standard drives panel clock frequencies up to 160 MHz. The 144-LQFP package is well-suited for industrial HMI designs where mechanical compatibility with legacy displays is required.
Recommandé
Custom Bus Interface and Protocol Converter
The EP20K160ETC144-2N serves as a flexible protocol-conversion engine, bridging legacy VME, ISA, or proprietary backplane buses to modern PCIe or local processor interfaces. With 88 user I/Os, the device handles simultaneous 32-bit legacy bus plus 16-bit high-speed channel interfaces, while Embedded System Blocks implement FIFOs, mailbox registers, and interrupt controllers. The 1.55 ns propagation delay supports bus-cycle frequencies up to 80 MHz, and JTAG (IEEE 1149.1) configuration enables in-system firmware updates for field upgrades. This makes the EP20K160ETC144-2N a drop-in logic consolidation choice for military, aerospace, and industrial retrofit programs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP20K160ETC144-2N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP20K160ETC144-2 | EP20K100ETC144-2N | EP20K100ETC144-1N | EP20K100ETC144-1X | EP20K160ETC144-2X |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 144-LQFP (20x20 mm) | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same |
| System Gates | 160,000 | 160,000 | 100,000 | 100,000 | 100,000 | 160,000 |
| Logic Elements | 640 (6400 cells) | 640 (6400 cells) | 400 (4000 cells) | 400 (4000 cells) | 400 (4000 cells) | 640 (6400 cells) |
| User I/Os | 88 | 88 | 88 | 88 | 88 | 88 |
| On-Chip RAM Bits | 81920 | 81920 | 53248 | 53248 | 53248 | 81920 |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Speed Grade | -2 (commercial) | -2 (commercial) | -2 (commercial) | -1 (commercial, slower) | -1 (industrial) | -2 (industrial) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Principaux différenciateurs
- Higher logic density than smaller APEX 20KE package variants (vs EP20K100ETC144-2N)
- Faster speed grade than -1 variants (vs EP20K100ETC144-1N)
- Commercial temperature grade with optimized timing (vs EP20K160ETC144-2X)
Notes de conception
Estimated: at 100% toggle rate on all 88 I/Os with 50 pF output capacitance, core current reaches approximately 200 mA plus 50 mA I/O. Provide at least 0.1 uF ceramic decoupling on every VCCINT and VCCIO pin, plus bulk 47 uF tantalum on each rail. Sequence 1.8V core before 3.3V I/O to prevent I/O driving into unpowered inputs and latch-up risk.
The 144-LQFP package has a theta_JA of approximately 32 C/W in still air. Estimated at full-load core current 200 mA at 1.8V, dissipation is 0.36 W, yielding a 12 C rise above ambient. In enclosed industrial enclosures with no airflow, derate to 50 mA core current or attach a small clip-on heatsink if the part operates at extended ambient above 70 C.
Do not exceed VCCINT absolute maximum of 2.0V or VCCIO absolute maximum of 4.6V. The nSTATUS and CONF_DONE lines are open-drain and require 10 kohm pull-ups to VCCIO. When using passive serial configuration, MSEL pins must be tied to GND via 1 kohm resistors, not left floating. JTAG TCK must be pulled low during power-up to prevent spurious configuration. Older Quartus II versions (13.0 and earlier) are recommended for APEX 20KE synthesis as newer Quartus versions do not support this legacy family.
Informations de conformité
RoHS compliant per Altera legacy datasheet. Not AEC-Q100 qualified; not recommended for new automotive designs. Halogen-free status not explicitly stated in legacy documentation.