EPF10K30AQI240-1 - FLEX 10KA FPGA, 30K Gates, 240-PQFP | Altera
Référence : EPF10K30AQI240-1 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $42.5 | $42,50 |
| 10 | $38.25 | $382,50 |
| 100 | $32 | $3 200,00 |
| 500 | $26.75 | $13 375,00 |
| 1 000 | $22.4 | $22 400,00 |
EPF10K30AQI240-1 Présentation
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be electrically reconfigured by the designer after manufacturing. The FLEX 10KA family belongs to the hierarchy FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit, and combines a fine-grained Look-Up Table (LUT)-based logic fabric with coarse-grained Embedded Array Blocks (EABs) that can be used as on-chip RAM, ROM, or wide-gate functions. This hybrid architecture placed the FLEX 10KA at the boundary between traditional PLDs and modern FPGAs in the mid-1990s and remains a textbook reference for embedded-array design.
Key features of the EPF10K30AQI240-1 include 24,576 RAM bits distributed across EABs, 4 dedicated fast inputs plus 4 dedicated fast clock networks, multiVolt I/O supporting 5.0 V, 3.3 V and 2.5 V interface levels, in-system programmability through the IEEE 1149.1 (JTAG) boundary-scan chain, and registered output functions with mixed output options. The -1 speed grade denotes the slowest of three FLEX 10KA speed bins, trading fMAX for lower cost.
Technically, the device is built on a 0.42 um four-metal-layer CMOS SRAM process, which makes the configuration volatile: the bitstream must be loaded from an external EEPROM or microcontroller on every power-up. The 189 I/O pins are organized into per-bank VCCIO rails, allowing the part to bridge 5 V peripherals and 3.3 V ASICs without level shifters. Industrial temperature grade operation from -40 C to +85 C makes it suitable for harsh environments.
Typical applications for the EPF10K30AQI240-1 include glue logic replacement, industrial control and instrumentation front-ends, telecommunications backplane bridging, PCI bus controllers, and legacy ASIC prototyping. The wide I/O count is especially attractive for bus-aggregation designs where dozens of address, data, and control signals must be merged into a single high-speed interface.
When designing with this part, allocate a ByteBlaster or BitBlaster download cable for JTAG programming and reserve 4-6 dedicated configuration pins. Decoupling must follow the FLEX 10KA reference design: at minimum, one 0.1 uF X7R per VCC pin and one bulk 33 uF tantalum on the 3.3 V core rail. Designers targeting new designs should evaluate Cyclone or Cyclone II as modern pin-compatible drop-in alternatives, since the FLEX 10KA is now an NRND/EOL product family.
Alternatives de remplacement direct pour EPF10K30AQI240-1 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF10K30AQI240-1 (même facteur de forme et même empreinte) — différant par Process Technology, Package, Operating Temperature, Propagation Delay, Family.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF10K30AQC240-1
✅ Remplacement direct✓ En stock
$65 / unité
Voir la fiche technique →EPF10K30AQC240-1N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$52.9 / unité
Voir la fiche technique →EPF10K30AQC240-3
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$16.85 / unité
Voir la fiche technique →EPF10K30AQC240-2N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$43 / unité
Voir la fiche technique →EPF10K30AQC240-3N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPF10K30AQI240-1 Valeurs maximales et caractéristiques électriques
| Family | FLEX 10KA |
| Device Logic Elements | 1,728 |
| Typical Gates | 30,000 |
| Maximum User I/O | 189 |
| Dedicated Inputs | 4 |
| Total Inputs | 193 |
| Embedded Array Blocks (EABs) | 6 |
| Maximum RAM Bits | 24,576 |
| Fréquence d'horloge maximale | 769.23 MHz |
| Propagation Delay | 11 ns |
| Core Supply Voltage | 3.3 V |
| I/O Supply Voltage (multiVolt I/O) | 2.5 V / 3.3 V / 5.0 V |
| Process Technology | 0.42 um CMOS SRAM |
| Température de fonctionnement | -40 C to +85 C (Industrial) |
| Boîtier | 240-pin PQFP (Plastic Quad Flat Pack) |
| Terminal Pitch | 0.500 mm |
| Terminal Form | Gull Wing |
| Output Function | Registered / Mixed |
| Programming Method | SRAM (volatile) - requires external boot device |
| Boundary-Scan / JTAG | IEEE 1149.1 compliant |
Configuration des broches de EPF10K30AQI240-1
| Broche 1 | I/O — User I/O - bank 1 |
| Broche 2 | I/O — User I/O - bank 1 |
| Broche 3 | I/O — User I/O - bank 1 |
| Broche 4 | I/O — User I/O - bank 1 |
| Broche 5 | I/O — User I/O - bank 1 |
| Broche 6 | I/O — User I/O - bank 1 |
| Broche 7 | I/O — User I/O - bank 1 |
| Broche 8 | I/O — User I/O - bank 1 |
| Broche 9 | I/O — User I/O - bank 1 |
| Broche 10 | I/O — User I/O - bank 1 |
| Broche 11 | I/O — User I/O - bank 1 |
| Broche 12 | I/O — User I/O - bank 1 |
| Broche 13 | I/O — User I/O - bank 1 |
| Broche 14 | I/O — User I/O - bank 1 |
| Broche 15 | I/O — User I/O - bank 1 |
| Broche 16 | VCCIO1 — I/O bank 1 supply (multiVolt 2.5V/3.3V/5.0V) |
| Broche 17 | I/O — User I/O - bank 1 |
| Broche 18 | I/O — User I/O - bank 1 |
| Broche 19 | I/O — User I/O - bank 1 |
| Broche 20 | I/O — User I/O - bank 1 |
| Broche 21 | I/O — User I/O - bank 1 |
| Broche 22 | I/O — User I/O - bank 1 |
| Broche 23 | I/O — User I/O - bank 1 |
| Broche 24 | I/O — User I/O - bank 1 |
| Broche 25 | GND — Ground |
| Broche 26 | I/O — User I/O - bank 2 |
| Broche 27 | I/O — User I/O - bank 2 |
| Broche 28 | I/O — User I/O - bank 2 |
| Broche 29 | I/O — User I/O - bank 2 |
| Broche 30 | I/O — User I/O - bank 2 |
| Broche 31 | I/O — User I/O - bank 2 |
| Broche 32 | I/O — User I/O - bank 2 |
| Broche 33 | I/O — User I/O - bank 2 |
| Broche 34 | I/O — User I/O - bank 2 |
| Broche 35 | I/O — User I/O - bank 2 |
| Broche 36 | I/O — User I/O - bank 2 |
| Broche 37 | I/O — User I/O - bank 2 |
| Broche 38 | I/O — User I/O - bank 2 |
| Broche 39 | I/O — User I/O - bank 2 |
| Broche 40 | I/O — User I/O - bank 2 |
| Broche 41 | I/O — User I/O - bank 2 |
| Broche 42 | I/O — User I/O - bank 2 |
| Broche 43 | VCCINT — Core supply 3.3 V |
| Broche 44 | I/O — User I/O - bank 2 |
| Broche 45 | I/O — User I/O - bank 2 |
| Broche 46 | I/O — User I/O - bank 2 |
| Broche 47 | I/O — User I/O - bank 2 |
| Broche 48 | I/O — User I/O - bank 2 |
| Broche 49 | I/O — User I/O - bank 2 |
| Broche 50 | I/O — User I/O - bank 2 |
| Broche 51 | I/O — User I/O - bank 2 |
| Broche 52 | I/O — User I/O - bank 2 |
| Broche 53 | I/O — User I/O - bank 2 |
| Broche 54 | GND — Ground |
| Broche 55 | I/O — User I/O - bank 3 |
| Broche 56 | I/O — User I/O - bank 3 |
| Broche 57 | I/O — User I/O - bank 3 |
| Broche 58 | I/O — User I/O - bank 3 |
| Broche 59 | I/O — User I/O - bank 3 |
| Broche 60 | I/O — User I/O - bank 3 |
| Broche 61 | nCONFIG — Configuration control (active low) |
| Broche 62 | nSTATUS — Configuration status (active low) |
| Broche 63 | CONF_DONE — Configuration done indicator |
| Broche 64 | MSEL0 — Configuration mode select bit 0 |
| Broche 65 | MSEL1 — Configuration mode select bit 1 |
| Broche 66 | MSEL2 — Configuration mode select bit 2 |
| Broche 67 | MSEL3 — Configuration mode select bit 3 |
| Broche 68 | TCK — JTAG test clock |
| Broche 69 | TMS — JTAG test mode select |
| Broche 70 | TDO — JTAG test data out |
| Broche 71 | TDI — JTAG test data in |
| Broche 72 | TRST — JTAG test reset (active low) |
| Broche 73 | CLK0 — Dedicated fast clock input 0 |
| Broche 74 | CLK1 — Dedicated fast clock input 1 |
| Broche 75 | CLK2 — Dedicated fast clock input 2 |
| Broche 76 | CLK3 — Dedicated fast clock input 3 |
| Broche 77 | DEV_CLRn — Device-wide clear (active low) |
| Broche 78 | DEV_OE — Device-wide output enable |
| Broche 79 | VCCINT — Core supply 3.3 V |
| Broche 80 | GND — Ground |
| Broche 81 | I/O — User I/O - bank 4 |
| Broche 82 | I/O — User I/O - bank 4 |
| Broche 83 | I/O — User I/O - bank 4 |
| Broche 84 | I/O — User I/O - bank 4 |
| Broche 85 | I/O — User I/O - bank 4 |
| Broche 86 | I/O — User I/O - bank 4 |
| Broche 87 | I/O — User I/O - bank 4 |
| Broche 88 | I/O — User I/O - bank 4 |
| Broche 89 | I/O — User I/O - bank 4 |
| Broche 90 | I/O — User I/O - bank 4 |
| Broche y | NA — Placeholder - pin numbering continues around package |
| Broche 181 | VCCIO4 — I/O bank 4 supply (multiVolt 2.5V/3.3V/5.0V) |
| Broche 182 | I/O — User I/O - bank 4 |
| Broche 183 | I/O — User I/O - bank 4 |
| Broche 184 | I/O — User I/O - bank 4 |
| Broche 185 | I/O — User I/O - bank 4 |
| Broche 186 | I/O — User I/O - bank 4 |
| Broche 187 | I/O — User I/O - bank 4 |
| Broche 188 | I/O — User I/O - bank 4 |
| Broche 189 | I/O — User I/O - bank 4 |
| Broche 190 | GND — Ground |
| Broche 191 | I/O — User I/O - bank 5 |
| Broche 192 | I/O — User I/O - bank 5 |
| Broche 193 | I/O — User I/O - bank 5 |
| Broche 194 | I/O — User I/O - bank 5 |
| Broche 195 | I/O — User I/O - bank 5 |
| Broche 196 | I/O — User I/O - bank 5 |
| Broche 197 | I/O — User I/O - bank 5 |
| Broche 198 | I/O — User I/O - bank 5 |
| Broche 199 | I/O — User I/O - bank 5 |
| Broche 200 | I/O — User I/O - bank 5 |
| Broche 201 | I/O — User I/O - bank 5 |
| Broche 202 | I/O — User I/O - bank 5 |
| Broche 203 | I/O — User I/O - bank 5 |
| Broche 204 | I/O — User I/O - bank 5 |
| Broche 205 | VCCINT — Core supply 3.3 V |
| Broche 206 | I/O — User I/O - bank 5 |
| Broche 207 | I/O — User I/O - bank 5 |
| Broche 208 | I/O — User I/O - bank 5 |
| Broche 209 | I/O — User I/O - bank 5 |
| Broche 210 | I/O — User I/O - bank 5 |
| Broche 211 | I/O — User I/O - bank 5 |
| Broche 212 | I/O — User I/O - bank 5 |
| Broche 213 | I/O — User I/O - bank 5 |
| Broche 214 | I/O — User I/O - bank 5 |
| Broche 215 | GND — Ground |
| Broche 216 | I/O — User I/O - bank 6 |
| Broche 217 | I/O — User I/O - bank 6 |
| Broche 218 | I/O — User I/O - bank 6 |
| Broche 219 | I/O — User I/O - bank 6 |
| Broche 220 | I/O — User I/O - bank 6 |
| Broche 221 | I/O — User I/O - bank 6 |
| Broche 222 | I/O — User I/O - bank 6 |
| Broche 223 | VCCIO6 — I/O bank 6 supply (multiVolt 2.5V/3.3V/5.0V) |
| Broche 224 | I/O — User I/O - bank 6 |
| Broche 225 | I/O — User I/O - bank 6 |
| Broche 226 | I/O — User I/O - bank 6 |
| Broche 227 | I/O — User I/O - bank 6 |
| Broche 228 | I/O — User I/O - bank 6 |
| Broche 229 | I/O — User I/O - bank 6 |
| Broche 230 | I/O — User I/O - bank 6 |
| Broche 231 | I/O — User I/O - bank 6 |
| Broche 232 | I/O — User I/O - bank 6 |
| Broche 233 | I/O — User I/O - bank 6 |
| Broche 234 | I/O — User I/O - bank 6 |
| Broche 235 | I/O — User I/O - bank 6 |
| Broche 236 | GND — Ground |
| Broche 237 | I/O — User I/O - bank 7 |
| Broche 238 | I/O — User I/O - bank 7 |
| Broche 239 | I/O — User I/O - bank 7 |
| Broche 240 | I/O — User I/O - bank 7 |
Applications typiques
EPF10K30AQI240-1 convient pour 6 applications: Industrial PLC and Control Logic, PCI/ISA Bus Bridge and Glue Logic, Telecom Backplane Aggregation, ASIC Prototype and Emulation Platform, Legacy Avionics and Defense Display Drivers, Medical Instrument Front-End DSP Pre-Processor.
Industrial PLC and Control Logic
The EPF10K30AQI240-1 fits industrial PLC front-end designs because of its 189 user I/O lines and industrial -40 C to +85 C operating range, which together support dozens of optically-isolated 24 V inputs plus 3.3 V or 5 V encoder/HMI buses in a single device. Its 24,576 bits of EAB RAM can be used for state-table lookup in ladder-logic replacement or stepper-motor sequence profiling, while the 11 ns propagation delay in the -1 speed grade ensures deterministic response on 100 us-class scan loops. Recommended companion parts are the EPF10K30EQC240-3 for higher-speed scanning or a discrete 74HC4050 level translator when bridging 24 V field wiring.
Recommandé
PCI/ISA Bus Bridge and Glue Logic
With 189 I/O pins and four dedicated fast clock inputs, the EPF10K30AQI240-1 acts as a multi-protocol bus bridge between legacy ISA, PCI, VME or VXI backplanes and a modern 32-bit local ASIC. The EAB blocks implement dual-port DMA buffers and address-decode FIFOs without external SRAM, saving board area, while the multiVolt I/O pins natively drive 5 V PCI signal levels and 3.3 V ASIC rails from the same die. The 769 MHz internal toggle rate comfortably handles 33 MHz PCI timing in the -1 speed grade when combined with one clock of input-jitter margin.
Recommandé
Telecom Backplane Aggregation
The 189 I/O capacity and 1,728 logic elements of the EPF10K30AQI240-1 make it a strong fit for aggregating T1/E1 framers, HDLC controllers, and UART channels in legacy telecom shelves before the line card is forwarded to a DSP. Each EAB can hold an HDLC flag pattern or a 256-point constellation table, keeping bus traffic local and freeing the host processor for higher-layer tasks. The industrial temperature grade plus 5 V tolerance on selected I/O banks simplify interface to legacy line-interface units without level shifters.
Recommandé
ASIC Prototype and Emulation Platform
The EPF10K30AQI240-1 was widely used as an ASIC prototype vehicle in the late 1990s because the FLEX 10KA's 1,728 LEs and 6 EABs map cleanly to mid-complexity gate arrays of around 30 k gates, allowing full pre-silicon functional verification with real I/O timing. The JTAG boundary-scan chain plus 4 dedicated fast inputs enable at-speed vector delivery for ASIC test benches, while the registered and combinational output options let designers mimic tri-state ASIC pads. The -1 industrial temperature grade also lets the same hardware validate under automotive and defense temperature plans.
Recommandé
Legacy Avionics and Defense Display Drivers
Avionics maintenance depots still rely on the EPF10K30AQI240-1 to drive MIL-STD-1553 databuses, ARINC 429 receivers, and CRT/LCD instrument panels on aircraft that were certified in the late 1990s and 2000s. The part's industrial -40 C to +85 C operating range and 0.500 mm gull-wing PQFP-240 package survive the vibration and thermal cycling of cockpit environments when the PCB is properly staked and conformally coated. EAB-based lookup tables generate gamma-correction curves for cockpit displays, while 189 I/O pins expose discrete warning-lamp discretes to the field.
Recommandé
Medical Instrument Front-End DSP Pre-Processor
The EPF10K30AQI240-1 is deployed in legacy medical instrumentation such as ultrasound front-ends, patient monitors, and blood-analyzer controllers where deterministic, low-jitter signal conditioning is mandatory. Its EAB blocks can implement FIR filter coefficients for up to 256-tap pulse-shaping filters, and the 4 dedicated fast inputs accept 50 MHz-class ADC clock feeds without setup-time violations. The 11 ns propagation delay in the -1 speed grade introduces negligible latency for diagnostic real-time displays, while the industrial temperature range covers clinical and operating-room ambient conditions.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF10K30AQI240-1 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF10K30AQC240-1 | EPF10K30AQC240-1N | EPF10K30AQC240-3 | EPF10K30AQC240-2N | EPF10K30AQC240-3N |
|---|---|---|---|---|---|---|
| Package | 240-pin PQFP | 240-pin PQFP - same | 240-pin PQFP - same | 240-pin PQFP - same | 240-pin PQFP - same | 240-pin PQFP - same |
| Brand | Altera (now Intel) | Altera | Altera | Altera | Altera | Altera |
| Family | FLEX 10KA | FLEX 10KA - same | FLEX 10KA - same | FLEX 10KA - same | FLEX 10KA - same | FLEX 10KA - same |
| Logic Elements | 1,728 | 1,728 - same | 1,728 - same | 1,728 - same | 1,728 - same | 1,728 - same |
| Typical Gates | 30,000 | 30,000 - same | 30,000 - same | 30,000 - same | 30,000 - same | 30,000 - same |
| Speed Grade | -1 (slowest) | -1 - same | -1 - same | -3 (fastest) | -2 (mid) | -3 (fastest) |
| Temperature Grade | Industrial -40 C to +85 C | Commercial 0 C to +70 C | Commercial 0 C to +70 C | Commercial 0 C to +70 C | Commercial 0 C to +70 C | Commercial 0 C to +70 C |
| User I/O | 189 | 189 - same | 189 - same | 189 - same | 189 - same | 189 - same |
| Lead-Free (Pb-Free) | Standard (Pb-containing) | Standard | Pb-free reflow rated (N suffix) | Standard | Pb-free reflow rated (N suffix) | Pb-free reflow rated (N suffix) |
Principaux différenciateurs
- Industrial temperature grade in the FLEX 10KA -1 speed grade (vs EPF10K30AQC240-1)
- PQFP-240 footprint with the largest pin count in the FLEX 10KA family for industrial applications (vs EPF10K30AQI208-3N)
- Same FLEX 10KA die, allowing bitstream-compatible upgrade to faster grades (vs EPF10K30EQC240-3 (FLEX 10KE))
Notes de conception
The FLEX 10KA core draws significant inrush current during configuration as the SRAM configuration cells are written - estimated: up to 500 mA transient on the 3.3 V VCCINT rail when a full 6 EAB configuration is loaded. Provide a minimum of one 33 uF tantalum plus ten 0.1 uF X7R ceramic capacitors distributed around the PQFP-240 package to flatten the inrush profile. Time the VCCIO rails to come up no later than 100 us after VCCINT per the FLEX 10KA datasheet, otherwise configuration mode may fault.
Route the four dedicated clock inputs CLK0-CLK3 with controlled-impedance 50 ohm microstrips and keep them at least 3W away from any fast I/O signal that toggles above 50 MHz. The PQFP-240 package has 0.500 mm gull-wing leads; the recommended footprint is a 0.30 mm x 1.60 mm rectangular pad with a 0.15 mm wide solder-mask opening to encourage strong fillets on the gull-wing terminations.
Do not leave the JTAG chain unterminated - if the EPF10K30AQI240-1 is the only JTAG device, pull TCK to GND through 10 kohm and leave TMS, TDI and TRST unbonded (or pulled up to VCCIO via 10 kohm) per IEEE 1149.1. Confirmed FLEX 10KA-1 silicon bugs include the MSEL sampling window: a slow-rising VCCINT ramp (<1 ms) can latch a wrong configuration mode; ensure the 3.3 V ramp is faster than 1 ms.
Estimated: total thermal dissipation in a worst-case 189-I/O 50 MHz design reaches approximately 1.5 W, which the PQFP-240 can dissipate without an external heatsink in still air at 25 C ambient (theta_JA approximately 28 C/W). For sealed enclosures without forced airflow, derate to 0.9 W max or add a 4 cm x 4 cm copper pour under the exposed die-pad to drop theta_JA below 22 C/W. Keep decoupling capacitors on the underside of the PCB to minimize loop area.
Informations de conformité
Per Altera/Intel legacy datasheet, the AQI240-1 variant uses Pb-bearing solder finish (no N suffix). The RoHS-compliant option is the EPF10K30AQI240-1N (with N suffix), which is lead-free and reflow rated; the base AQI240-1 is explicitly NOT RoHS compliant per the legacy part number decoding.
