EPF10K30ATC144-2N - FLEX-10KA 30K-Gate FPGA, 144-TQFP | Intel / Altera
Référence : EPF10K30ATC144-2N ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $48.5 | $48,50 |
| 10 | $44.2 | $442,00 |
| 100 | $39.85 | $3 985,00 |
| 500 | $36.1 | $18 050,00 |
| 1 000 | $33.4 | $33 400,00 |
EPF10K30ATC144-2N Présentation
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines the high integration of an ASIC with the flexibility of software-reconfigurable logic. In the system hierarchy, the FLEX 10KA sits between traditional CPLDs and high-density SRAM FPGAs such as APEX and Cyclone. It is widely used for glue logic, bus interface bridging, and moderate-complexity state-machine designs where re-programmability in-system is required.
Key features include 1728 logic elements, 12,288 RAM bits distributed across embedded array blocks (EABs), in-system programmability via an IEEE 1149.1 (JTAG) interface, multi-volt I/O support (2.5 V or 3.3 V), and 102 maximum user I/O pins. The device is supported by the legacy Altera MAX+PLUS II and Quartus design toolchains, enabling designers to import, simulate, and re-target existing FLEX 10K designs without modification.
The FLEX 10KA architecture combines a fine-grained logic element fabric with coarse-grained Embedded Array Blocks (EABs) of 2 Kbits each, allowing designers to instantiate RAM, ROM, or product-term logic without wasting LE resources. Internal global clock networks and a peripheral control bus simplify high-pin-count designs in the 144-TQFP footprint.
Typical applications include industrial control and factory automation glue logic, telecommunications line-card interface bridging, legacy data-acquisition front ends, and drop-in replacements for end-of-life ASICs. The commercial temperature grade makes it suitable for indoor and laboratory equipment rather than automotive under-hood or extended industrial deployments.
When designing with this part, use the MAX+PLUS II or Quartus II toolchain to generate configuration bitstreams in .sof or .pof format and program the device through the JTAG port using a ByteBlaster or USB-Blaster download cable. Pay attention to the I/O bank supply rails - 3.3 V banks must not exceed 4.0 V during hot-plug events, otherwise input clamps can latch-up.
This page synthesizes distributor pricing, drop-in alternatives from the same FLEX 10KA family, and practical configuration notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour EPF10K30ATC144-2N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF10K30ATC144-2N (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Process Technology, Family, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF10K30ATC144-2
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPF10K30ATC144-3
✅ Remplacement direct✓ En stock
$17.8 / unité
Voir la fiche technique →EPF10K30ATC144-1N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$16.5 / unité
Voir la fiche technique →EPF10K30AQI240-1
✅ Remplacement direct✓ En stock
$22.4 / unité
Voir la fiche technique →EPF10K30AQC240-3
✅ Remplacement direct✓ En stock
$16.85 / unité
Voir la fiche technique →EPF10K30ATC144-2N Valeurs maximales et caractéristiques électriques
| Series | FLEX 10KA |
| Logic Elements | 1728 |
| Typical Gates | 30,000 |
| Total RAM Bits | 12288 |
| Number of LABs/CLBs | 216 |
| Number of I/O | 102 |
| Voltage Supply | 3.0 V to 3.6 V |
| Température de fonctionnement | 0 °C to 70 °C (Commercial) |
| Boîtier / Format | 144-LQFP / 144-TQFP |
| Type de montage | Surface Mount |
| Process Technology | 0.3 µm CMOS, SRAM-based |
| Propagation Delay | 0.6 ns (per datasheet propagation path) |
| Internal Frequency (max) | 142.86 MHz |
| Programming Interface | JTAG (IEEE 1149.1) via ByteBlaster / USB-Blaster |
| Lead-Free / Finish | Yes (NiPdAu lead finish) |
Configuration des broches de EPF10K30ATC144-2N
| Broche 1 | I/O — User I/O (bank 1) - dual-purpose when configured |
| Broche 2 | I/O — User I/O (bank 1) |
| Broche 3 | I/O — User I/O (bank 1) |
| Broche 4 | I/O — User I/O (bank 1) |
| Broche 5 | I/O — User I/O (bank 1) |
| Broche 6 | I/O — User I/O (bank 1) |
| Broche 7 | VCCINT — Core supply 3.3 V |
| Broche 8 | I/O — User I/O (bank 1) |
| Broche 9 | I/O — User I/O (bank 1) |
| Broche 10 | GND — Ground |
| Broche 11 | I/O — User I/O (bank 1) |
| Broche 12 | I/O — User I/O (bank 1) |
| Broche 13 | I/O — User I/O (bank 1) |
| Broche 14 | I/O — User I/O (bank 1) |
| Broche 15 | TDI — JTAG Test Data In |
| Broche 16 | I/O — User I/O (bank 1) |
| Broche 17 | TMS — JTAG Test Mode Select |
| Broche 18 | I/O — User I/O (bank 1) |
| Broche 19 | TCK — JTAG Test Clock |
| Broche 20 | I/O — User I/O (bank 1) |
| Broche 21 | I/O — User I/O (bank 1) |
| Broche 22 | I/O — User I/O (bank 1) |
| Broche 23 | I/O — User I/O (bank 1) |
| Broche 24 | I/O — User I/O (bank 1) |
| Broche 25 | I/O — User I/O (bank 1) |
| Broche 26 | I/O — User I/O (bank 1) |
| Broche 27 | I/O — User I/O (bank 1) |
| Broche 28 | GND — Ground |
| Broche 29 | I/O — User I/O (bank 1) |
| Broche 30 | DEV_CLRn — Device-wide clear (active low) |
| Broche 31 | I/O — User I/O (bank 1) |
| Broche 32 | I/O — User I/O (bank 1) |
| Broche 33 | I/O — User I/O (bank 1) |
| Broche 34 | I/O — User I/O (bank 1) |
| Broche 35 | VCCIO — I/O supply 3.3 V (bank 1) |
| Broche 36 | I/O — User I/O (bank 1) |
| Broche 37 | I/O — User I/O (bank 1) |
| Broche 38 | I/O — User I/O (bank 1) |
| Broche 39 | I/O — User I/O (bank 1) |
| Broche 40 | I/O — User I/O (bank 1) |
| Broche 41 | I/O — User I/O (bank 1) |
| Broche 42 | GND — Ground |
| Broche 43 | I/O — User I/O (bank 2) |
| Broche 44 | I/O — User I/O (bank 2) |
| Broche 45 | I/O — User I/O (bank 2) |
| Broche 46 | I/O — User I/O (bank 2) |
| Broche 47 | I/O — User I/O (bank 2) |
| Broche 48 | I/O — User I/O (bank 2) |
| Broche 49 | I/O — User I/O (bank 2) |
| Broche 50 | I/O — User I/O (bank 2) |
| Broche 51 | GND — Ground |
| Broche 52 | I/O — User I/O (bank 2) |
| Broche 53 | I/O — User I/O (bank 2) |
| Broche 54 | I/O — User I/O (bank 2) |
| Broche 55 | I/O — User I/O (bank 2) |
| Broche 56 | I/O — User I/O (bank 2) |
| Broche 57 | I/O — User I/O (bank 2) |
| Broche 58 | I/O — User I/O (bank 2) |
| Broche 59 | I/O — User I/O (bank 2) |
| Broche 60 | I/O — User I/O (bank 2) |
| Broche 61 | I/O — User I/O (bank 2) |
| Broche 62 | GND — Ground |
| Broche 63 | I/O — User I/O (bank 2) |
| Broche 64 | I/O — User I/O (bank 2) |
| Broche 65 | I/O — User I/O (bank 2) |
| Broche 66 | I/O — User I/O (bank 2) |
| Broche 67 | I/O — User I/O (bank 2) |
| Broche 68 | I/O — User I/O (bank 2) |
| Broche 69 | I/O — User I/O (bank 2) |
| Broche 70 | VCCIO — I/O supply 3.3 V (bank 2) |
| Broche 71 | I/O — User I/O (bank 2) |
| Broche 72 | I/O — User I/O (bank 2) |
| Broche 73 | I/O — User I/O (bank 2) |
| Broche 74 | I/O — User I/O (bank 2) |
| Broche 75 | I/O — User I/O (bank 2) |
| Broche 76 | I/O — User I/O (bank 2) |
| Broche 77 | GND — Ground |
| Broche 78 | I/O — User I/O (bank 3) |
| Broche 79 | I/O — User I/O (bank 3) |
| Broche 80 | I/O — User I/O (bank 3) |
| Broche 81 | I/O — User I/O (bank 3) |
| Broche 82 | I/O — User I/O (bank 3) |
| Broche 83 | I/O — User I/O (bank 3) |
| Broche 84 | I/O — User I/O (bank 3) |
| Broche 85 | I/O — User I/O (bank 3) |
| Broche 86 | GND — Ground |
| Broche 87 | I/O — User I/O (bank 3) |
| Broche 88 | I/O — User I/O (bank 3) |
| Broche 89 | I/O — User I/O (bank 3) |
| Broche 90 | I/O — User I/O (bank 3) |
| Broche 91 | I/O — User I/O (bank 3) |
| Broche 92 | I/O — User I/O (bank 3) |
| Broche 93 | I/O — User I/O (bank 3) |
| Broche 94 | I/O — User I/O (bank 3) |
| Broche 95 | I/O — User I/O (bank 3) |
| Broche 96 | GND — Ground |
| Broche 97 | I/O — User I/O (bank 3) |
| Broche 98 | I/O — User I/O (bank 3) |
| Broche 99 | I/O — User I/O (bank 3) |
| Broche 100 | I/O — User I/O (bank 3) |
| Broche 101 | I/O — User I/O (bank 3) |
| Broche 102 | I/O — User I/O (bank 3) |
| Broche 103 | I/O — User I/O (bank 3) |
| Broche 104 | VCCIO — I/O supply 3.3 V (bank 3) |
| Broche 105 | I/O — User I/O (bank 4) |
| Broche 106 | I/O — User I/O (bank 4) |
| Broche 107 | I/O — User I/O (bank 4) |
| Broche 108 | I/O — User I/O (bank 4) |
| Broche 109 | I/O — User I/O (bank 4) |
| Broche 110 | I/O — User I/O (bank 4) |
| Broche 111 | I/O — User I/O (bank 4) |
| Broche 112 | I/O — User I/O (bank 4) |
| Broche 113 | GND — Ground |
| Broche 114 | I/O — User I/O (bank 4) |
| Broche 115 | I/O — User I/O (bank 4) |
| Broche 116 | I/O — User I/O (bank 4) |
| Broche 117 | I/O — User I/O (bank 4) |
| Broche 118 | I/O — User I/O (bank 4) |
| Broche 119 | I/O — User I/O (bank 4) |
| Broche 120 | I/O — User I/O (bank 4) |
| Broche 121 | I/O — User I/O (bank 4) |
| Broche 122 | I/O — User I/O (bank 4) |
| Broche 123 | GND — Ground |
| Broche 124 | I/O — User I/O (bank 4) |
| Broche 125 | I/O — User I/O (bank 4) |
| Broche 126 | I/O — User I/O (bank 4) |
| Broche 127 | I/O — User I/O (bank 4) |
| Broche 128 | I/O — User I/O (bank 4) |
| Broche 129 | I/O — User I/O (bank 4) |
| Broche 130 | I/O — User I/O (bank 4) |
| Broche 131 | VCCINT — Core supply 3.3 V |
| Broche 132 | I/O — User I/O (bank 4) |
| Broche 133 | I/O — User I/O (bank 4) |
| Broche 134 | MSEL0 — Configuration mode select 0 |
| Broche 135 | MSEL1 — Configuration mode select 1 |
| Broche 136 | MSEL2 — Configuration mode select 2 |
| Broche 137 | nSTATUS — Configuration status (open-drain) |
| Broche 138 | nCONFIG — Configuration start (active low) |
| Broche 139 | DCLK — Configuration clock |
| Broche 140 | DATA0 — Configuration data input |
| Broche 141 | TDO — JTAG Test Data Out |
| Broche 142 | TRST — JTAG Test Reset |
| Broche 143 | DEV_OE — Device-wide output enable (active high) |
| Broche 144 | CONF_DONE — Configuration complete (open-drain) |
Applications typiques
EPF10K30ATC144-2N convient pour 6 applications: Industrial Control Glue Logic, Telecom Line-Card Interface Bridging, Legacy Data-Acquisition Front End, ASIC Replacement / End-of-Life Bridge, Test & Measurement Instrumentation, Educational / FPGA Training Platforms.
Industrial Control Glue Logic
The EPF10K30ATC144-2N's 1728 logic elements and 12,288 bits of embedded RAM are well-suited for industrial PLC backplane glue logic, where it arbitrates between sensor inputs, motor-driver PWM controllers, and a host CPU. Its 102 user I/O pins accommodate multiple 8-bit and 16-bit bus interfaces (parallel ADC, encoder feedback, I/O expansion), while the 216 LABs allow several concurrent state machines for sequencing. Commercial 0-70°C rating matches indoor control-panel environments. Engineers typically pair the FPGA with a Quartus-II-generated bitstream that handles EtherCAT or Modbus framing in hardware, offloading the MCU.
Recommandé
Telecom Line-Card Interface Bridging
In legacy telecom line cards, the EPF10K30ATC144-2N serves as a multi-protocol bridge between T1/E1 framers, HDB3 line codecs, and the central backplane serializer. Its 142.86 MHz internal clock and 12,288 bits of EAB-based RAM are sufficient to implement small elastic FIFOs and protocol converters (e.g., UART-to-HDLC, I²C-to-SPI). The 144-TQFP footprint drops directly onto existing line-card PCBs from the early 2000s, preserving the backplane design while modernizing only the bridge logic. The 3.3 V core aligns with legacy line-card power rails, eliminating level-shifters.
Recommandé
Legacy Data-Acquisition Front End
The EPF10K30ATC144-2N is widely deployed in mid-2000s data-acquisition systems as the timing-and-trigger controller that sequences parallel ADCs, manages DMA handshakes with the host CPU, and pre-processes samples in on-chip RAM. With 12,288 bits of EAB RAM it can buffer a 1024-sample window at 12-bit resolution - enough for FIR-filter tap storage or histogram accumulation. The 102 I/O pins accept up to 8 parallel 12-bit ADC buses, and the JTAG interface allows in-system reconfiguration of trigger thresholds without hardware rework.
Recommandé
ASIC Replacement / End-of-Life Bridge
Many EOL ASICs in industrial and medical instruments can be functionally replicated by the EPF10K30ATC144-2N, using its SRAM-based reconfigurability to absorb late-stage design changes that would otherwise force a respin. The 144-TQFP footprint allows a near-direct drop-in on legacy ASIC PCBs when the original was 144-pin QFP-compatible, and Quartus II or MAX+PLUS II let designers port VHDL/Verilog at the gate level. The commercial temperature range is appropriate for laboratory and indoor medical devices. Last-time-buy inventory makes this FPGA a viable emergency EOL bridge through 2026-2027.
Recommandé
Test & Measurement Instrumentation
Bench-top instruments - logic analyzers, protocol exercisers, and digital stimulus generators - historically used the EPF10K30ATC144-2N for pattern generation and capture. The FPGA's 1728 logic elements fit 32-channel timing/state machines with 12,288 bits of pattern memory, and the 102 I/O accommodate 3.3 V LVCMOS/LVTTL stimulus lines directly. The JTAG port supports live bitstream swap during test development, accelerating bring-up. The 144-TQFP is hand-solderable on prototype boards, useful in low-volume instrumentation. Commercial temperature grade matches laboratory environments.
Recommandé
Educational / FPGA Training Platforms
Universities and embedded-systems training programs continue to use the EPF10K30ATC144-2N on legacy Altera development boards because of the rich MAX+PLUS II teaching materials and student familiarity with the FLEX 10K architecture. The 144-TQFP hand-solder-friendly package allows students to assemble and rework boards manually. The 1728-LE capacity is large enough for meaningful class projects (small CPUs, peripheral controllers, signal-processing pipelines) yet small enough that students can complete timing closure within a lab session. The 3.3 V I/O is forgiving for breadboard-based external interfaces.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF10K30ATC144-2N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF10K30ATC144-2 | EPF10K30ATC144-3 | EPF10K30ATC144-1N | EPF10K30AQI240-1 |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 144-TQFP | 144-TQFP - same | 144-TQFP - same | 144-TQFP - same | 240-PQFP - different |
| Logic Elements | 1728 | 1728 | 1728 | 1728 | 1728 |
| Total RAM Bits | 12288 | 12288 | 12288 | 12288 | 12288 |
| Speed Grade | -2 (mid) | -2 (mid) | -3 (fastest) | -1 (slowest) | -1 (slow) |
| Temperature Range | 0°C to 70°C (Commercial) | 0°C to 70°C (Commercial) | 0°C to 70°C (Commercial) | 0°C to 70°C (Commercial) | -40°C to 85°C (Industrial) |
| Lead Finish | Lead-free NiPdAu | SnPb (non-RoHS) | Lead-free NiPdAu | Lead-free NiPdAu | Lead-free NiPdAu |
| User I/O | 102 | 102 | 102 | 102 | 189 |
| Lifecycle Status | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy |
Principaux différenciateurs
- Lead-free NiPdAu finish for RoHS-compliant assemblies (vs EPF10K30ATC144-2)
- Mid-range speed grade balances timing margin and dynamic power (vs EPF10K30ATC144-3)
- 144-TQFP package is the highest-volume, hand-reworkable FLEX 10KA footprint (vs EPF10K30AQI240-1)
Notes de conception
The EPF10K30ATC144-2N requires a clean 3.3 V core supply (VCCINT) plus a separate 3.3 V I/O supply (VCCIO) for each bank. Use a ferrite bead or L-C filter between the system 3.3 V rail and VCCINT to isolate the FPGA's switching noise from sensitive analog circuitry. Decouple every VCC/VCCIO pin with a 0.1 µF X7R ceramic placed within 5 mm of the pin, and add a bulk 10 µF tantalum per bank. The FLEX 10KA's I/O banks do not support hot-plug; ensure VCCIO is present before driving any I/O pin to avoid latch-up.
Route all four global clock inputs (GCLK0-GCLK3) on the inner PCB layers with controlled impedance (50 Ω to ground), and keep them away from I/O switching lines to avoid crosstalk. The JTAG chain (TCK, TMS, TDI, TDO, TRST) requires 10 kΩ pull-ups on TMS, TDI, and TRST per Altera's FLEX 10KA JTAG specification - omitting these pull-ups causes unreliable configuration. Reserve room on the board for a 2x5 pin JTAG header even if not populated, to allow post-assembly programming and boundary-scan testing.
The 144-TQFP package has exposed paddle area under the package that must NOT be soldered to the board - it is a thermal pad with no electrical connection on this package variant. Confusing the EPF10K30ATC144 with the 144-pin BGA-356 EPF10K30ABI356 will result in PCB rework, as the BGA footprint is incompatible. According to Altera FLEX 10KA configuration guidelines, the nSTATUS pin must be pulled up to VCCIO with a 10 kΩ resistor; otherwise the FPGA will fail to enter configuration mode after power-up. Lastly, do not use the Quartus Prime (modern) toolchain - it dropped FLEX 10K support after version 13.0; use Quartus II 13.0 or MAX+PLUS II instead.
Informations de conformité
Lead-free NiPdAu finish ('-N' suffix) supports RoHS / REACH compliance per Altera product documentation. AEC-Q100 not applicable (this is an FPGA, not an automotive-grade IC; FLEX 10KA was never AEC-qualified). Halogen-free and conflict-mineral declarations not found in verified web data and marked unknown.
