EPF10K30EQC208-1X - 30K-Gate FLEX 10KE FPGA, 147 I/O, PQFP-208 | Intel
Référence : EPF10K30EQC208-1X ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $32.75 | $327,50 |
| 100 | $27.2 | $2 720,00 |
| 500 | $22.1 | $11 050,00 |
| 1 000 | $18.4 | $18 400,00 |
EPF10K30EQC208-1X Présentation
A field programmable gate array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), embedded memory arrays, and programmable interconnects. The FLEX 10KE family belongs to the hierarchy of programmable logic devices (PLDs) and was among the earliest commercial architectures to merge a look-up-table (LUT) based logic fabric with embedded array blocks (EABs) for on-chip RAM and ROM. Within Intel/Altera's taxonomy, FLEX 10KE sits between the classic FLEX 10K and the subsequent APEX family, targeting high-volume glue-logic, bus-interface, and DSP pre-processing applications of the late 1990s and early 2000s.
Key features of the EPF10K30EQC208-1X include 216 logic array blocks (LABs), an internal frequency capability quoted by distributors at up to 250 MHz (fabric-dependent), a 0.22 micrometer CMOS process, embedded array blocks for distributed RAM/ROM, and JTAG-based in-system programmability via the IEEE 1149.1 boundary-scan interface. The "-1X" speed grade and "C" temperature grade designate a faster commercial-temperature variant.
Architecturally, the FLEX 10KE device combines 1,728 logic elements organized in LABs of 8 LEs each, four embedded array blocks (EABs) for memory functions, and FastTrack interconnect routing. The 208-PQFP package provides 147 usable I/O pins with multi-voltage I/O standards including 3.3 V PCI compliance, making the part suitable for mixed-voltage system designs.
Typical applications include telecommunications line cards, industrial control and factory automation controllers, PCI bridge and bus-interface logic, video processing front-ends, and legacy glue-logic replacement in mature embedded systems. The combination of SRAM-based configuration and on-chip RAM also makes it useful for prototyping ASICs and implementing custom state machines.
When designing with this part, note that it is fabricated on a 5 V-tolerant legacy process; modern system-on-chip designs typically pair FLEX 10KE with a separate 3.3 V/5 V interface transceiver. Designers should also budget for the configuration EEPROM (EPC2 or compatible) and observe the IOREF, VCCINT, and VCCIO decoupling requirements documented in the datasheet.
This page synthesizes distributor pricing from DigiKey, Mouser, Octopart and Rochester Electronics, same-brand FLEX 10KE drop-in alternatives, and practical design guidance not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour EPF10K30EQC208-1X — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF10K30EQC208-1X (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Process Technology, Propagation Delay, Family.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF10K30EQC208-1N
✅ Remplacement direct✓ En stock
$28.4 / unité
Voir la fiche technique →EPF10K30EQC208-1
✅ Remplacement direct✓ En stock
$17.95 / unité
Voir la fiche technique →EPF10K30EQC208-1X Valeurs maximales et caractéristiques électriques
| Series | FLEX 10KE |
| Family | FLEX 10KE (Altera/Intel legacy FPGA) |
| Logic Elements / Cells | 1,728 |
| Typical Gate Count | 30,000 gates |
| Total RAM Bits | 24,576 bits |
| Logic Array Blocks (LABs) | 216 |
| Number of I/O Pins | 147 |
| Core Voltage (VCCINT) | 2.375 V to 2.625 V (2.5 V nominal) |
| I/O Voltage (VCCIO) | 3.3 V (multi-standard I/O) |
| Process Technology | 0.22 um CMOS, SRAM-based |
| Internal Frequency (typical) | 250 MHz (per distributor data; fabric-dependent) |
| Propagation Delay | 0.6 ns (per DigChip) |
| Température de fonctionnement | 0 C to 70 C (commercial) |
| Boîtier | 208-pin BFQFP / PQFP (28 x 28 mm) |
| Type de montage | Surface Mount (gull-wing) |
| Programming Interface | JTAG (IEEE 1149.1) + serial/parallel configuration |
| Compliance | PCI-compatible I/O, IEEE 1149.1 boundary scan |
Configuration des broches de EPF10K30EQC208-1X
| Broche 1 | I/O — User I/O bank 1 (general-purpose) |
| Broche 2 | I/O — User I/O bank 1 |
| Broche 3 | I/O — User I/O bank 1 |
| Broche 4 | I/O — User I/O bank 1 |
| Broche 5 | I/O — User I/O bank 1 |
| Broche 6 | I/O — User I/O bank 1 |
| Broche 7 | VCCIO — I/O supply voltage (3.3 V) |
| Broche 8 | I/O — User I/O bank 1 |
| Broche 9 | GND — Ground |
| Broche 10 | I/O — User I/O bank 1 |
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| Broche 26 | I/O — User I/O bank 1 |
| Broche 27 | VCCINT — Core supply voltage (2.5 V) |
| Broche 28 | I/O — User I/O bank 1 |
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| Broche 36 | GND — Ground |
| Broche 37 | I/O — User I/O bank 1 |
| Broche 38 | I/O — User I/O bank 1 |
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| Broche 52 | I/O — User I/O bank 1 |
| Broche 53 | GND — Ground |
| Broche 54 | I/O — User I/O bank 1 |
| Broche 55 | I/O — User I/O bank 1 |
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| Broche 57 | I/O — User I/O bank 1 |
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| Broche 59 | I/O — User I/O bank 1 |
| Broche 60 | VCCIO — I/O supply voltage (3.3 V) |
| Broche 61 | I/O — User I/O bank 1 |
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| Broche 72 | I/O — User I/O bank 1 |
| Broche 73 | I/O — User I/O bank 1 |
| Broche 74 | GND — Ground |
| Broche 75 | I/O — User I/O bank 2 |
| Broche 76 | I/O — User I/O bank 2 |
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| Broche 81 | I/O — User I/O bank 2 |
| Broche 82 | VCCINT — Core supply voltage (2.5 V) |
| Broche 83 | I/O — User I/O bank 2 |
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| Broche 94 | I/O — User I/O bank 2 |
| Broche 95 | GND — Ground |
| Broche 96 | I/O — User I/O bank 2 |
| Broche 97 | I/O — User I/O bank 2 |
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| Broche 105 | I/O — User I/O bank 2 |
| Broche 106 | VCCIO — I/O supply voltage (3.3 V) |
| Broche 107 | I/O — User I/O bank 2 |
| Broche 108 | I/O — User I/O bank 2 |
| Broche 109 | I/O — User I/O bank 2 |
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| Broche 115 | I/O — User I/O bank 2 |
| Broche 116 | I/O — User I/O bank 2 |
| Broche 117 | GND — Ground |
| Broche 118 | I/O — User I/O bank 3 |
| Broche 119 | I/O — User I/O bank 3 |
| Broche 120 | I/O — User I/O bank 3 |
| Broche 121 | I/O — User I/O bank 3 |
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| Broche 123 | I/O — User I/O bank 3 |
| Broche 124 | VCCINT — Core supply voltage (2.5 V) |
| Broche 125 | I/O — User I/O bank 3 |
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| Broche 138 | GND — Ground |
| Broche 139 | I/O — User I/O bank 3 |
| Broche 140 | I/O — User I/O bank 3 |
| Broche 141 | I/O — User I/O bank 3 |
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| Broche 146 | I/O — User I/O bank 3 |
| Broche 147 | I/O — User I/O bank 3 |
| Broche 148 | VCCIO — I/O supply voltage (3.3 V) |
| Broche 149 | I/O — User I/O bank 3 |
| Broche 150 | I/O — User I/O bank 3 |
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| Broche 161 | GND — Ground |
| Broche 162 | I/O — User I/O bank 4 |
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| Broche 168 | I/O — User I/O bank 4 |
| Broche 169 | VCCINT — Core supply voltage (2.5 V) |
| Broche 170 | I/O — User I/O bank 4 |
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| Broche 182 | I/O — User I/O bank 4 |
| Broche 183 | GND — Ground |
| Broche 184 | I/O — User I/O bank 4 |
| Broche 185 | I/O — User I/O bank 4 |
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| Broche 188 | I/O — User I/O bank 4 |
| Broche 189 | I/O — User I/O bank 4 |
| Broche 190 | I/O — User I/O bank 4 |
| Broche 191 | VCCIO — I/O supply voltage (3.3 V) |
| Broche 192 | I/O — User I/O bank 4 |
| Broche 193 | I/O — User I/O bank 4 |
| Broche 194 | I/O — User I/O bank 4 |
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| Broche 201 | I/O — User I/O bank 4 |
| Broche 202 | I/O — User I/O bank 4 |
| Broche 203 | I/O — User I/O bank 4 |
| Broche 204 | GND — Ground |
| Broche 205 | I/O — User I/O bank 4 |
| Broche 206 | I/O — User I/O bank 4 |
| Broche 207 | I/O — User I/O bank 4 |
| Broche 208 | I/O — User I/O bank 4 |
Applications typiques
EPF10K30EQC208-1X convient pour 7 applications: Telecommunications Line Cards, Industrial Control and Factory Automation, PCI Bus Interface and Bridge Logic, Video Processing Front-Ends, ASIC Prototyping and Emulation, Legacy Glue Logic Replacement, Test and Measurement Instrumentation.
Telecommunications Line Cards
The EPF10K30EQC208-1X is well matched to telecom line card designs where 30K gates of LUT-based logic, 147 I/O pins, and on-chip RAM are needed for protocol glue, framer interfacing, and TDM bus aggregation. Its 2.5 V core and 3.3 V I/O directly interface legacy 3.3 V framers and SERDES framer companion chips of the late 1990s / early 2000s. The device's JTAG (IEEE 1149.1) interface simplifies in-system programming and board-level boundary-scan test on high-density backplanes. Compared to a CPLD alternative, the FLEX 10KE fabric provides roughly 4x the logic capacity at similar unit cost, while consuming modest quiescent current. Designers should pair the part with a 2.5 V LDO and bulk decoupling per the Altera reference design and budget for an EPC2/EPC8 configuration PROM.
Recommandé
Industrial Control and Factory Automation
The EPF10K30EQC208-1X provides the I/O count and embedded memory needed for industrial PLC I/O expansion, motor-control state machines, and fieldbus protocol conversion (Profibus, DeviceNet legacy bridges). Its 147 user I/O pins map naturally to multi-axis encoder inputs, opto-isolated digital I/O banks, and stepper-motor pulse generators, while the 24,576 bits of distributed RAM hold commutation tables and PID coefficient sets. The commercial 0 C to 70 C temperature grade suits indoor control cabinet environments, and the 28x28 mm PQFP package is straightforward to rework on through-hole-friendly industrial PCBs. Compared to a microcontroller, the FLEX 10KE fabric allows parallel logic execution of multiple axis controllers without firmware scheduling jitter, and its SRAM configuration supports remote firmware upgrades via JTAG in the field.
Recommandé
PCI Bus Interface and Bridge Logic
The EPF10K30EQC208-1X is qualified for 33 MHz, 32-bit PCI bus bridge applications because its I/O banks support 3.3 V PCI signaling with the required 5 V tolerance margin per the PCI Local Bus Specification. The 1,728 logic elements and 24 Kb of embedded RAM can implement a target or master bridge state machine plus FIFOs without external SRAM, and the 147 I/O pins comfortably accommodate 32-bit data + 32-bit address plus control. Designers can pair this FLEX 10KE part with a downstream microcontroller or DSP via the unused I/O, building a single-FPGA PCI mezzanine card (PMC) or CompactPCI bridge. Compared to discrete 74-series glue logic, the EPF10K30EQC208-1X consolidates roughly 20-30 logic ICs into one device, dramatically simplifying PCB layout and reducing board area.
Recommandé
Video Processing Front-Ends
The EPF10K30EQC208-1X is suitable for legacy video capture, scan-rate conversion, and overlay-graphic controllers because its embedded RAM can buffer a full line of standard-definition video, and the 147 I/O pins accommodate 16-bit video buses plus sync, blanking, and clock signals. Designers in the late 1990s used this part for broadcast equipment and digital video recorders (DVR) where ASIC NRE was unjustified. The 0.6 ns propagation delay enables pixel-rate processing at 27 MHz video clocks with margin. The PQFP-208 package is preferred over BGA for prototype and low-volume video equipment because it allows hand-rework. Compared to a modern Cyclone IV, the EPF10K30EQC208-1X has roughly 1/4 the RAM and 1/3 the LE count, but is still adequate for SD-resolution pipelines.
Recommandé
ASIC Prototyping and Emulation
Engineers use the EPF10K30EQC208-1X as a vehicle for prototyping custom ASICs because its LUT-based fabric, embedded RAM, and JTAG configuration enable rapid RTL iteration with Quartus design software. Multiple FLEX 10KE devices can be chained via JTAG to emulate larger ASICs for pre-silicon software development. The 24 Kb of RAM holds test vectors or trace buffers, and the 147 I/O pins provide plenty of stimulus/observation channels for logic analyzer hookups. Compared to simulation, FPGA prototyping runs at MHz rather than kHz and catches timing bugs that simulation misses. The PQFP-208 package, although obsolete in 2026, is still preferred in academic and defense prototyping labs because it accepts standard 0.5 mm-pitch test clips that BGA parts cannot.
Recommandé
Legacy Glue Logic Replacement
The EPF10K30EQC208-1X excels as a single-chip replacement for legacy 74-series glue logic in mature equipment, where it can absorb 20-50 SSI/MSI logic parts along with custom state machines. Its 1,728 logic elements, 4 embedded array blocks, and 147 I/O pins handle address decoding, bus arbitration, wait-state generation, and interrupt controllers in a single package. The 2.5 V core / 3.3 V I/O voltage compatibility matches 3.3 V ASICs and 5 V-tolerant peripherals of the early 2000s. Compared to designing a fresh ASIC, this approach costs a fraction of the NRE and ships in weeks instead of quarters. Maintainers of telecom, medical, and military equipment rely on this part for end-of-life repair, and Rochester Electronics stocks it specifically for that purpose.
Recommandé
Test and Measurement Instrumentation
The EPF10K30EQC208-1X is well suited to legacy bench instruments (oscilloscopes, logic analyzers, arbitrary waveform generators) where its 30K-gate fabric implements custom DSP pre-processing, channel multiplexing, and display refresh logic in a single chip. The 24 Kb of embedded RAM holds calibration coefficients and waveform lookup tables, and the 147 I/O pins can directly drive front-panel keypads, segment LCDs, or VGA display controllers. The PQFP-208 package simplifies hand rework when lab technicians service instruments; BGA parts cannot be repaired without specialized equipment. Compared to a DSP + microcontroller pair, the FLEX 10KE fabric executes sample-rate conversion and triggering algorithms with deterministic latency, which is critical for measurement accuracy.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF10K30EQC208-1X — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF10K30EQC208-1N | EPF10K30EQC208-1 | EPF10K30EFC256-3N |
|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 208-pin PQFP (BFQFP, 28x28 mm) | 208-pin PQFP (same as this product) | 208-pin PQFP (same as this product) | 256-pin FineLine BGA (different package) |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 |
| Total RAM Bits | 24,576 | 24,576 | 24,576 | 24,576 |
| Core Voltage | 2.375 V - 2.625 V (2.5 V nominal) | 2.375 V - 2.625 V | 2.375 V - 2.625 V | 2.375 V - 2.625 V |
| Speed Grade | -1X (faster than standard -1) | -1N (standard) | -1 (standard) | -3N (slower) |
| Operating Temperature | 0 C to 70 C (commercial) | 0 C to 70 C | 0 C to 70 C | 0 C to 70 C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Faster -1X speed grade provides timing margin over standard -1 (vs EPF10K30EQC208-1N)
- 208-pin PQFP package supports hand rework and legacy tooling (vs EPF10K30EFC256-3N (FineLine BGA))
- 147 user I/O pins provide broad system integration in a single device (vs EPM7256A CPLD (144 macrocells, ~68 I/O))
Notes de conception
Estimated: EPF10K30EQC208-1X requires a clean 2.5 V core (VCCINT) and a 3.3 V I/O supply (VCCIO). Multiple VCCINT and VCCIO pins are distributed around the 208-PQFP package to reduce inductance; place one 0.1 uF decoupling capacitor per VCCINT pin and one 10 uF bulk capacitor near each supply cluster. The 2.5 V rail tolerance is 5% (2.375 V to 2.625 V); use a low-dropout regulator such as an LT1585 or TPS7A45 to keep ripple under 50 mVpk during configuration bursts. Sequence VCCINT before VCCIO per the FLEX 10KE datasheet to avoid I/O latch-up during power-up.
The 208-pin BFQFP has a 0.5 mm pin pitch and a 28x28 mm body; allocate at least 4-layer PCB with a continuous ground plane beneath the device to provide a low-impedance return path for the high-edge-rate configuration and clock signals. Route JTAG signals (TCK, TMS, TDI, TDO) as a daisy chain with 10 kohm pull-ups on TCK/TMS/TDI, and add a 33 ohm series resistor on TDO near the FPGA to damp ringing. Avoid running switching signals (clock, configuration) parallel to user I/O for more than 500 mil to minimize crosstalk into the analog-sensitive I/O banks.
Do not assume the EPF10K30EQC208-1X has on-chip non-volatile memory; this part is SRAM-based and loses its configuration when power is removed. Always pair it with a configuration EEPROM (EPC2 or EPC8) or a microcontroller that streams the bitstream at power-up via passive serial mode. Avoid using the device at junction temperatures above 125 C; the commercial 0 C-70 C rating assumes the case temperature stays within that range, which requires a thermal pad or copper pour in still-air designs. Finally, when substituting EPF10K30EQC208-1N for the -1X, verify that the design's worst-case timing paths still close at the standard speed grade.
Informations de conformité
FLEX 10KE family pre-dates RoHS mandate; specific RoHS/REACH/lead-free status of this lot depends on the manufacturer (Intel/Altera) declaration at shipment - confirm with Rochester Electronics for franchised-stock compliance certificates. Part is commercial-grade (not AEC-Q100).
