EPF6024AQC208-1 - FLEX 6000 24K Gates 200MHz FPGA | Intel (Altera)
Référence : EPF6024AQC208-1 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $28.9 | $2 890,00 |
| 500 | $24.6 | $12 300,00 |
| 1 000 | $21.4 | $21 400,00 |
EPF6024AQC208-1 Présentation
A field-programmable gate array (FPGA) is a semiconductor integrated circuit that can be reconfigured by the customer after manufacture to implement arbitrary digital logic. FPGAs sit in the programmable-logic hierarchy between simple SPLDs/CPLDs and high-end structured ASICs, combining configurable logic blocks (LEs), programmable routing, and dedicated I/O cells. The FLEX 6000 family in particular pioneered low-cost, high-volume gate-array replacement for glue logic, prototyping, and design-iteration workflows in the late 1990s and early 2000s.
Key features of the EPF6024AQC208-1 include 1,960 logic elements organised into 196 LABs, an internal frequency up to 200 MHz for the -1 speed grade, 171 user I/Os, and JTAG-based in-system programmability through the Altera/Quartus tool chain. Each LE contains a 4-input look-up table, a programmable register, and dedicated carry and cascade chains for arithmetic and wide fan-in functions, while each LAB groups 16 LEs with local interconnect for high-speed logic-cluster operation.
The device is built on a 0.42 µm five-layer-metal CMOS process and uses SRAM configuration cells, allowing unlimited reconfigurations in-system. Configuration is typically loaded from a serial or parallel EPROM via the dedicated configuration interface. Built-in JTAG (IEEE 1149.1) boundary-scan test supports board-level interconnect verification without bed-of-nails fixtures, while the I/O cells support a range of 3.3 V LVTTL/LVCMOS standards with programmable drive strength and slew-rate control.
Typical applications include communication equipment glue logic, industrial control and instrumentation interfaces, legacy ASIC prototyping, high-volume gate-array replacement designs, and embedded control subsystems. The 171 available I/Os in a 208-pin PQFP also make it suitable for bridging multiple buses (e.g. microprocessor, memory and peripheral buses) inside dense backplane designs.
When designing with this device, ensure the Quartus/MAX+PLUS II fitter is configured for the EPF6024AQC208-1 device family and -1 speed grade, and that configuration storage (EPC1/EPC2 or compatible PROM) is sized for the 1,960-LE bitstream. The PQFP package requires a generous PCB pad/land pattern and careful thermal relief for production reflow.
This page synthesises distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a faster path to validation, replacement, and sourcing decisions for the EPF6024AQC208-1.
Alternatives de remplacement direct pour EPF6024AQC208-1 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF6024AQC208-1 (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Process Technology, Device Type, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF6024AQC208-3
✅ Remplacement direct✓ En stock
$18.85 / unité
Voir la fiche technique →EPF6024AQC208-1N
✅ Remplacement direct✓ En stock
$18.75 / unité
Voir la fiche technique →EPF6016AQC208-1
✅ Remplacement direct✓ En stock
$42.1 / unité
Voir la fiche technique →EPF6024AQC208-2
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$7.85 / unité
Voir la fiche technique →EPF6024AQC208
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EPF6024AQC208-1 Valeurs maximales et caractéristiques électriques
| Family | FLEX 6000 |
| Typical Gates | 24,000 |
| Logic Elements (LEs) | 1,960 |
| Logic Array Blocks (LABs) | 196 |
| User I/Os | 171 |
| Internal Frequency (max, -1 speed grade) | 200 MHz |
| Tension d'alimentation | 3.3 V |
| Process Technology | 0.42 µm CMOS |
| Configuration Memory | SRAM |
| Boîtier | 208-pin PQFP (BFQFP) |
| Type de montage | Surface Mount (Gull-Wing) |
| Température de fonctionnement | 0 °C to +85 °C (Commercial) |
| Speed Grade | -1 |
| Statut RoHS | Non-compliant (legacy PQFP, lead-bearing) |
| Programming Interface | JTAG (IEEE 1149.1) + Altera configuration port |
Guide de configuration des broches du EPF6024AQC208-1 208-pin pqfp (bfqfp)
Configuration des broches du EPF6024AQC208-1 (boîtier 208-pin pqfp (bfqfp)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EPF6024AQC208-1.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EPF6024AQC208-1 convient pour 6 applications: Communication Equipment Glue Logic, Industrial Control & Instrumentation, Legacy ASIC Prototyping & Emulation, High-Volume Gate-Array Replacement, Embedded Control Subsystems, Test & Measurement Backplanes.
Communication Equipment Glue Logic
The EPF6024AQC208-1 fits communication-equipment glue-logic applications by offering 1,960 LEs and 196 LABs of fast, deterministic combinational and registered logic on a 3.3 V rail. Its 171 user I/Os allow it to bridge a microprocessor bus (e.g. 8/16/32-bit local bus), an SDRAM interface, and a number of serial peripherals (UART, SPI, I²C) on a single device. The -1 speed grade's ~200 MHz internal fMAX is sufficient for bus-arbitration and protocol-bridging layers in legacy telecom backplanes and base-station controller cards. Compared with discrete 74-series logic, the EPF6024AQC208-1 reduces board area by collapsing 30–80 glue-logic ICs into one 208-pin PQFP while adding JTAG-driven in-system reconfiguration for late design changes.
Recommandé
Industrial Control & Instrumentation
In industrial control systems, the EPF6024AQC208-1 functions as a custom state-machine and timing-controller core, exploiting its 196 LABs to encode PID loops, motor-control sequencing, and instrumentation-timing logic. The 3.3 V LVCMOS/LVTTL I/O cells pair naturally with modern microcontrollers such as the NXP LPC or TI Tiva-C families, while 171 user I/Os accommodate parallel ADC/DAC buses and encoder inputs. JTAG boundary-scan (IEEE 1149.1) gives board-test access without bed-of-nails fixtures, a key benefit for backplane volumes. The commercial 0–85 °C operating range suits factory-floor enclosures; for harsher environments, designers should screen date codes and derate timing closure.
Recommandé
Legacy ASIC Prototyping & Emulation
The EPF6024AQC208-1 was designed precisely for the legacy ASIC prototyping role: 24,000 typical gates of fast LUT-based logic, 100% in-system reconfigurability via SRAM configuration cells, and Quartus/MAX+PLUS II design entry. Engineers prototyping gate-array or pre-ASIC designs map RTL (VHDL/Verilog) onto the 1,960 LEs and verify real-world timing against the -1 speed grade's ~200 MHz fMAX before committing to a hard-ASIC mask set. The PQFP package is hand-solderable for engineering builds, and the JTAG port enables bitstream-load cycles in seconds. This application retains the EPF6024AQC208-1 in active service at many aerospace/defence OEMs decades after its release.
Recommandé
High-Volume Gate-Array Replacement
For high-volume gate-array-replacement designs in the early 2000s, the EPF6024AQC208-1 offered the right balance of 24K typical gates, 171 I/Os, and 200 MHz performance at a price point lower than competing masked gate arrays. Modern equivalents of this use case include Cyclone IV and Cyclone 10 LP devices, but the EPF6024AQC208-1 still ships in long-lifecycle aerospace, medical-imaging, and railway-signalling designs where requalification cost exceeds migration cost. Designers benefit from the deterministic timing closure of the FLEX 6000 architecture, which avoids the variability of later synthesis-heavy architectures.
Recommandé
Embedded Control Subsystems
The EPF6024AQC208-1 pairs with embedded microprocessors as a programmable I/O-expansion and custom-peripheral engine: its 171 user I/Os handle PWM generation, quadrature-encoder input, and parallel display/Keypad scanning, while its 196 LABs implement custom instruction-set extensions or DMA engines. The 3.3 V supply aligns with NXP/Freescale ColdFire and PowerQUICC families, simplifying single-rail designs. SRAM configuration cells allow field updates over JTAG without physical access, valuable in sealed enclosures. With 0–85 °C commercial temperature range, the part covers most indoor embedded applications; for outdoor/automotive variants, designers should consider the -1N RoHS-suffix part.
Recommandé
Test & Measurement Backplanes
In test-and-measurement backplanes, the EPF6024AQC208-1 acts as a programmable timing generator, channel-multiplexer, and trigger-sequencing core. Its 196 LABs hold waveform tables and digital-state-machine encoders for arbitrary stimulus generation, while 171 user I/Os route trigger/marker signals across the backplane. The JTAG boundary-scan chain is used for board-level interconnect testing, eliminating bed-of-nails fixtures and accelerating time-to-market. With up to ~200 MHz internal fMAX in the -1 speed grade, the EPF6024AQC208-1 fits stimulus rates commonly required by ATE backplanes.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF6024AQC208-1 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF6024AQC208-3 | EPF6024AQC208-1N | EPF6016AQC208-1 | EPF6024AQC208-2 | EPF6024AQC208 |
|---|---|---|---|---|---|---|
| Brand | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) |
| Package | 208-pin PQFP (BFQFP) | 208-pin PQFP (BFQFP) - same | 208-pin PQFP (BFQFP) - same | 208-pin PQFP (BFQFP) - same | 208-pin PQFP (BFQFP) - same | 208-pin PQFP (BFQFP) - same |
| Family | FLEX 6000 | FLEX 6000 - same | FLEX 6000 - same | FLEX 6000 - same | FLEX 6000 - same | FLEX 6000 - same |
| Typical Gates | 24,000 | 24,000 | 24,000 | 16,000 (-33%) | 24,000 | 24,000 |
| Logic Elements | 1,960 | 1,960 | 1,960 | 1,320 (-33%) | 1,960 | 1,960 |
| Speed Grade | -1 (~200 MHz) | -3 (~100 MHz) -50% | -1N (~200 MHz, RoHS) | -1 (~200 MHz) | -2 (~150 MHz) -25% | default (~150 MHz) |
| User I/Os | 171 | 171 | 171 | 171 | 171 | 171 |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| RoHS | Non-compliant (legacy) | Non-compliant | Compliant (lead-free) | Non-compliant | Non-compliant | Non-compliant |
Principaux différenciateurs
- Highest FLEX 6000 speed grade available in 208-pin PQFP (vs EPF6024AQC208-3)
- RoHS lead-free finish available without changing the die (vs EPF6024AQC208-1N)
- Higher logic density than the EPF6016 in the same footprint (vs EPF6016AQC208-1)
Notes de conception
Estimated: do not drive 5 V TTL signals directly into the EPF6024AQC208-1's 3.3 V VCCIO pins. Use an external bus-switch or resistor-divider network; the device has no 5 V-tolerant I/O cells. Long-term reliability studies show that over-voltage I/O stresses accelerate latch-up risk in 0.42 µm CMOS, so level translation is mandatory when interfacing legacy 5 V logic.
The 208-pin PQFP package has 0.5 mm pitch gull-wing leads with a thermal pad underneath that bonds to internal PCB ground. Recommended PCB layout uses at least 4-layer stack-up with continuous ground plane directly under the device to provide thermal relief. Estimated: at 200 MHz internal fMAX and 0.42 µm process, typical junction-to-ambient thermal resistance θJA is ~25 °C/W, so derate maximum ambient by 25 °C above 1 W dissipation. Provide 6–8 thermal vias under the die-attach paddle.
Estimated: at -1 speed grade (≈200 MHz internal fMAX), the 3.3 V LVCMOS outputs of the EPF6024AQC208-1 require 22–33 Ω series damping resistors when driving traces longer than ~50 mm or capacitive loads above 25 pF. Use IBIS simulation in Quartus to verify signal integrity before committing to layout; bypass each VCCIO/GND pair with 0.1 µF ceramic + 10 µF tantalum decoupling placed within 5 mm of each power pin.
Informations de conformité
RoHS non-compliant due to PQFP lead-frame finish; RoHS-compliant variant available as EPF6024AQC208-1N. REACH, halogen-free, and conflict-minerals declarations are not stated in the verified web data and should be requested directly from the authorised distributor for new procurement.