EPF6024ATC144-14 - FLEX 6000 FPGA, 24K Gates, 144-TQFP | Altera
Référence : EPF6024ATC144-14 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.2 | $252,00 |
| 100 | $22.1 | $2 210,00 |
| 500 | $19.5 | $9 750,00 |
| 1 000 | $17.8 | $17 800,00 |
EPF6024ATC144-14 Présentation
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that uses an array of configurable logic blocks (CLBs/LABs), programmable interconnects, and programmable I/O cells to implement arbitrary digital logic. FPGAs sit at the top of the programmable logic hierarchy (PLD -> CPLD -> FPGA) and offer the highest logic density and richest feature set at the cost of higher static power consumption and configuration memory requirements. The FLEX 6000 family uses a look-up-table (LUT)-based LAB architecture with SRAM configuration memory, requiring an external configuration ROM on power-up.
Key features of the EPF6024ATC144-14 include: 1,960 LEs, 196 LABs, 117 user I/O pins, typical operating frequency up to 200 MHz at the -3 speed grade, and 5V-tolerant I/O on a 3.3V core supply. The -14 speed grade denotes the slowest commercial grade, targeting cost-sensitive industrial and consumer applications where clock rates below 100 MHz are acceptable. The 144-pin TQFP package is a plastic surface-mount form factor with 0.5 mm lead pitch and a 22 mm x 22 mm body, designed for standard SMT reflow assembly.
The FLEX 6000 architecture uses a four-input LUT-based logic element, a hierarchical interconnect with FastTrack continuous routing, and embedded memory. The 1960-LE capacity is sufficient for medium-complexity glue logic, peripheral bridges, custom bus controllers, and instrumentation front-ends, but is now considered low-density by modern standards.
Typical applications include industrial motor-control interfaces, telecommunications line cards, custom peripheral bridges in legacy embedded systems, test and measurement backplanes, and ASIC prototyping. The 117 I/O pins support wide parallel buses (16-bit or 18-bit) common in legacy parallel interfaces such as ISA, PC/104, and VME.
When designing with this device, note that the FLEX 6000 family is mature and Intel/Altera recommends the MAX II or Cyclone series for new designs; the EPF6024ATC144-14 remains useful for long-lifecycle products, EOL bridge buys, and existing board repairs. Configuration requires an EPC configuration device or microcontroller-based configuration mode.
This page synthesizes distributor availability, parametric alternatives in the same 144-pin TQFP footprint, and practical lifecycle/design notes not consolidated on the manufacturer product page.
Alternatives de remplacement direct pour EPF6024ATC144-14 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF6024ATC144-14 (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Operating Temperature, Process Technology, Configuration Memory.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF6024ATC144-10
✅ Remplacement direct✓ En stock
$11.1 / unité
Voir la fiche technique →EPF6024ATC144-13
✅ Remplacement direct✓ En stock
$7.1 / unité
Voir la fiche technique →EPF6024ATC144-11
✅ Remplacement direct✓ En stock
$15.4 / unité
Voir la fiche technique →EPF6016ATC144-3
✅ Remplacement direct✓ En stock
$9.85 / unité
Voir la fiche technique →EPF6024ATC100-10
✅ Remplacement direct✓ En stock
$16.2 / unité
Voir la fiche technique →EPF6024ATC144-14 Valeurs maximales et caractéristiques électriques
| Family | FLEX 6000 |
| Logic Elements | 1,960 |
| Typical Gates | 24,000 |
| Logic Array Blocks (LABs) | 196 |
| User I/O Pins | 117 |
| Boîtier | 144-pin TQFP |
| Speed Grade | -14 (slowest commercial) |
| Core Voltage | 3.3 V |
| I/O Voltage | 3.3 V (5 V tolerant inputs) |
| Configuration Memory | SRAM (volatile, external ROM required) |
| Maximum Internal Frequency | Up to 200 MHz (-3 speed grade reference) |
| Température de fonctionnement | 0C to +70C (commercial) |
| Type de montage | Surface Mount |
| Lead Pitch | 0.5 mm |
| Package Body Size | 22 mm x 22 mm |
| Statut RoHS | Non-compliant (legacy part) |
| Process Technology | CMOS SRAM |
Configuration des broches de EPF6024ATC144-14
| Broche 1 | I/O — User I/O pin (bank 1) |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | I/O — User I/O pin (bank 1) |
| Broche 4 | I/O — User I/O pin (bank 1) |
| Broche 5 | I/O — User I/O pin (bank 1) |
| Broche 6 | VCCINT — Core supply voltage (3.3V) |
| Broche 7 | I/O — User I/O pin (bank 1) |
| Broche 8 | I/O — User I/O pin (bank 1) |
| Broche 9 | I/O — User I/O pin (bank 1) |
| Broche 10 | I/O — User I/O pin (bank 1) |
| Broche 11 | I/O — User I/O pin (bank 1) |
| Broche 12 | GND — Ground |
| Broche 13 | I/O — User I/O pin (bank 1) |
| Broche 14 | I/O — User I/O pin (bank 1) |
| Broche 15 | I/O — User I/O pin (bank 1) |
| Broche 16 | I/O — User I/O pin (bank 1) |
| Broche 17 | I/O — User I/O pin (bank 1) |
| Broche 18 | I/O — User I/O pin (bank 1) |
| Broche 19 | I/O — User I/O pin (bank 1) |
| Broche 20 | I/O — User I/O pin (bank 1) |
| Broche 21 | GND — Ground |
| Broche 22 | I/O — User I/O pin (bank 2) |
| Broche 23 | I/O — User I/O pin (bank 2) |
| Broche 24 | I/O — User I/O pin (bank 2) |
| Broche 25 | I/O — User I/O pin (bank 2) |
| Broche 26 | I/O — User I/O pin (bank 2) |
| Broche 27 | I/O — User I/O pin (bank 2) |
| Broche 28 | VCCIO — I/O supply voltage (3.3V, 5V-tolerant) |
| Broche 29 | I/O — User I/O pin (bank 2) |
| Broche 30 | I/O — User I/O pin (bank 2) |
| Broche 31 | I/O — User I/O pin (bank 2) |
| Broche 32 | I/O — User I/O pin (bank 2) |
| Broche 33 | I/O — User I/O pin (bank 2) |
| Broche 34 | GND — Ground |
| Broche 35 | I/O — User I/O pin (bank 2) |
| Broche 36 | I/O — User I/O pin (bank 2) |
| Broche 37 | I/O — User I/O pin (bank 3) |
| Broche 38 | I/O — User I/O pin (bank 3) |
| Broche 39 | I/O — User I/O pin (bank 3) |
| Broche 40 | I/O — User I/O pin (bank 3) |
| Broche 41 | I/O — User I/O pin (bank 3) |
| Broche 42 | VCCINT — Core supply voltage (3.3V) |
| Broche 43 | I/O — User I/O pin (bank 3) |
| Broche 44 | I/O — User I/O pin (bank 3) |
| Broche 45 | I/O — User I/O pin (bank 3) |
| Broche 46 | I/O — User I/O pin (bank 3) |
| Broche 47 | I/O — User I/O pin (bank 3) |
| Broche 48 | GND — Ground |
| Broche 49 | I/O — User I/O pin (bank 3) |
| Broche 50 | I/O — User I/O pin (bank 3) |
| Broche 51 | I/O — User I/O pin (bank 4) |
| Broche 52 | I/O — User I/O pin (bank 4) |
| Broche 53 | I/O — User I/O pin (bank 4) |
| Broche 54 | I/O — User I/O pin (bank 4) |
| Broche 55 | I/O — User I/O pin (bank 4) |
| Broche 56 | VCCIO — I/O supply voltage (3.3V, 5V-tolerant) |
| Broche 57 | I/O — User I/O pin (bank 4) |
| Broche 58 | I/O — User I/O pin (bank 4) |
| Broche 59 | I/O — User I/O pin (bank 4) |
| Broche 60 | I/O — User I/O pin (bank 4) |
| Broche 61 | I/O — User I/O pin (bank 4) |
| Broche 62 | GND — Ground |
| Broche 63 | I/O — User I/O pin (bank 4) |
| Broche 64 | I/O — User I/O pin (bank 4) |
| Broche 65 | I/O — User I/O pin (bank 5) |
| Broche 66 | I/O — User I/O pin (bank 5) |
| Broche 67 | I/O — User I/O pin (bank 5) |
| Broche 68 | I/O — User I/O pin (bank 5) |
| Broche 69 | I/O — User I/O pin (bank 5) |
| Broche 70 | VCCINT — Core supply voltage (3.3V) |
| Broche 71 | I/O — User I/O pin (bank 5) |
| Broche 72 | I/O — User I/O pin (bank 5) |
| Broche 73 | I/O — User I/O pin (bank 5) |
| Broche 74 | I/O — User I/O pin (bank 5) |
| Broche 75 | I/O — User I/O pin (bank 5) |
| Broche 76 | GND — Ground |
| Broche 77 | I/O — User I/O pin (bank 5) |
| Broche 78 | I/O — User I/O pin (bank 5) |
| Broche 79 | I/O — User I/O pin (bank 6) |
| Broche 80 | I/O — User I/O pin (bank 6) |
| Broche 81 | I/O — User I/O pin (bank 6) |
| Broche 82 | I/O — User I/O pin (bank 6) |
| Broche 83 | I/O — User I/O pin (bank 6) |
| Broche 84 | VCCIO — I/O supply voltage (3.3V, 5V-tolerant) |
| Broche 85 | I/O — User I/O pin (bank 6) |
| Broche 86 | I/O — User I/O pin (bank 6) |
| Broche 87 | I/O — User I/O pin (bank 6) |
| Broche 88 | I/O — User I/O pin (bank 6) |
| Broche 89 | I/O — User I/O pin (bank 6) |
| Broche 90 | GND — Ground |
| Broche 91 | I/O — User I/O pin (bank 6) |
| Broche 92 | I/O — User I/O pin (bank 6) |
| Broche 93 | I/O — User I/O pin (bank 7) |
| Broche 94 | I/O — User I/O pin (bank 7) |
| Broche 95 | I/O — User I/O pin (bank 7) |
| Broche 96 | I/O — User I/O pin (bank 7) |
| Broche 97 | I/O — User I/O pin (bank 7) |
| Broche 98 | VCCINT — Core supply voltage (3.3V) |
| Broche 99 | I/O — User I/O pin (bank 7) |
| Broche 100 | I/O — User I/O pin (bank 7) |
| Broche 101 | I/O — User I/O pin (bank 7) |
| Broche 102 | I/O — User I/O pin (bank 7) |
| Broche 103 | I/O — User I/O pin (bank 7) |
| Broche 104 | GND — Ground |
| Broche 105 | I/O — User I/O pin (bank 7) |
| Broche 106 | I/O — User I/O pin (bank 7) |
| Broche 107 | I/O — User I/O pin (bank 8) |
| Broche 108 | I/O — User I/O pin (bank 8) |
| Broche 109 | I/O — User I/O pin (bank 8) |
| Broche 110 | I/O — User I/O pin (bank 8) |
| Broche 111 | I/O — User I/O pin (bank 8) |
| Broche 112 | VCCIO — I/O supply voltage (3.3V, 5V-tolerant) |
| Broche 113 | I/O — User I/O pin (bank 8) |
| Broche 114 | I/O — User I/O pin (bank 8) |
| Broche 115 | I/O — User I/O pin (bank 8) |
| Broche 116 | I/O — User I/O pin (bank 8) |
| Broche 117 | I/O — User I/O pin (bank 8) |
| Broche 118 | GND — Ground |
| Broche 119 | I/O — User I/O pin (bank 8) |
| Broche 120 | I/O — User I/O pin (bank 8) |
| Broche 121 | TDI — JTAG test data input |
| Broche 122 | TMS — JTAG test mode select |
| Broche 123 | TCK — JTAG test clock |
| Broche 124 | nCONFIG — Configuration start (active low) |
| Broche 125 | nSTATUS — Configuration status (active low) |
| Broche 126 | CONF_DONE — Configuration complete indicator |
| Broche 127 | DCLK — Configuration clock input |
| Broche 128 | DATA0 — Configuration data input (bit 0) |
| Broche 129 | DATA1 — Configuration data input (bit 1) |
| Broche 130 | DATA2 — Configuration data input (bit 2) |
| Broche 131 | DATA3 — Configuration data input (bit 3) |
| Broche 132 | DATA4 — Configuration data input (bit 4) |
| Broche 133 | DATA5 — Configuration data input (bit 5) |
| Broche 134 | DATA6 — Configuration data input (bit 6) |
| Broche 135 | DATA7 — Configuration data input (bit 7) |
| Broche 136 | MSEL0 — Configuration mode select 0 |
| Broche 137 | MSEL1 — Configuration mode select 1 |
| Broche 138 | nCE — Chip enable (active low, for cascade) |
| Broche 139 | nCEO — Chip enable out (active low, cascade) |
| Broche 140 | TDO — JTAG test data output |
| Broche 141 | DEV_CLRn — Device clear (active low, optional) |
| Broche 142 | DEV_OE — Device output enable (optional) |
| Broche 143 | CLK0 — Dedicated clock input 0 |
| Broche 144 | CLK1 — Dedicated clock input 1 |
Applications typiques
EPF6024ATC144-14 convient pour 6 applications: Legacy Industrial Motor Control Interface, Telecommunications Line Card Glue Logic, Custom Peripheral Bridge for Embedded Systems, Test and Measurement Backplane Controller, ASIC Prototyping and Emulation Vehicle, Legacy Industrial Bus Concentrator.
Legacy Industrial Motor Control Interface
The EPF6024ATC144-14 is well suited for legacy industrial motor control and AC drive interfaces requiring deterministic glue logic between DSP controllers and power-stage gate drivers. Its 1,960 LEs and 117 user I/O support PWM generation, quadrature encoder decoding, and CAN/RS-485 bus bridging in a single device, while the 144-TQFP package survives the 0C to +70C industrial envelope with adequate margin. Designers use the FLEX 6000 LUT-based fabric to implement SVPWM modulators with dead-time insertion and Hall-sensor debouncing in 100+ LEs, then route the 117 I/O directly to optocoupler-isolated gate driver inputs.
Recommandé
Telecommunications Line Card Glue Logic
In telecom line cards (T1/E1, ISDN PRI, early VoIP gateways), the EPF6024ATC144-14 served as a multi-function glue-logic device bridging framers, DSPs, and TDM backplanes. The 117 user I/O accommodate 4-6 parallel HDB3/AMI-coded serial links plus HDLC controllers, while the 196 LABs implement time-slot switching matrices for 32-64 channel DS0 streams. The 3.3V core with 5V-tolerant inputs simplified mixed-voltage interfacing to legacy 5V framer ASICs. The -14 speed grade is acceptable for 2.048 MHz E1 line rates and 8 kHz frame synchronization.
Recommandé
Custom Peripheral Bridge for Embedded Systems
The EPF6024ATC144-14 is used as a custom peripheral bridge in VME, PC/104, and CompactPCI embedded backplanes where an off-the-shelf bridge ASIC is unavailable. Its 117 I/O pins route 32-bit multiplexed address/data buses plus 8-16 interrupt, DMA, and chip-select signals, while the 1,960 LEs implement wait-state generators, byte-swapping engines, and bus-arbitration state machines. The 144-TQFP package is supported by standard 4-layer PCB stack-ups with 0.5 mm pitch escape routing. Configuration is loaded from a low-cost EPC1 or EPC2 serial ROM at power-up.
Recommandé
Test and Measurement Backplane Controller
In automated test equipment (ATE) and bench instrumentation, the EPF6024ATC144-14 implements custom backplane controllers, GPIB-to-parallel adapters, and trigger-routing matrices. The 196 LABs hold LUT-based pattern generators and error-counting comparators, while the 117 I/O support IEEE-488 (GPIB) handshaking, parallel JTAG scan chains, and front-panel switch/LED multiplexing. The -14 speed grade easily handles 10 MHz pattern-generator clocks. Designers value the FLEX 6000 SRAM-based reconfigurability for field firmware updates on deployed test systems.
Recommandé
ASIC Prototyping and Emulation Vehicle
The EPF6024ATC144-14 was widely used as an ASIC prototyping vehicle in the late 1990s and early 2000s for pre-silicon validation of mid-complexity ASICs (~24K gates). Engineers mapped synthesized ASIC netlists directly into the FLEX 6000 LUT fabric, using the 117 I/O to replicate the ASIC's external bus and the JTAG port for real-time debug. The -14 speed grade provides typical signal-propagation latency for functional verification rather than at-speed timing closure. Multiple EPF6024ATC144-14 devices can be cascaded via the FLEX 6000 dedicated chain-interconnect pins for larger designs.
Recommandé
Legacy Industrial Bus Concentrator
The EPF6024ATC144-14 served as a multi-protocol bus concentrator in factory automation hubs, aggregating Profibus, Modbus RTU, DeviceNet, and CANopen segments into a single uplink. The 117 I/O support up to 6 isolated serial ports (RS-485 / RS-422 / CAN), each implemented in 200-400 LEs for UART, HDLC framing, and CRC-16 generators. The 3.3V core with 5V-tolerant I/O simplified interfacing to 5V CAN transceivers and 24V isolated RS-485 PHYs common in 1990s industrial PLC backplanes.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF6024ATC144-14 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF6024ATC144-10 | EPF6024ATC144-13 | EPF6024ATC144-11 | EPF6016ATC144-3 | EPF6024ATC100-10 |
|---|---|---|---|---|---|---|
| Package | 144-pin TQFP | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same package family, different pin count variant |
| Brand | Altera (now Intel) | Altera | Altera | Altera | Altera | Altera |
| Family | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 |
| Logic Elements | 1,960 | 1,960 (same) | 1,960 (same) | 1,960 (same) | 1,320 (-33%) | 1,960 (same) |
| Typical Gates | 24,000 | 24,000 (same) | 24,000 (same) | 24,000 (same) | 16,000 (-33%) | 24,000 (same) |
| User I/O Pins | 117 | 117 (same) | 117 (same) | 117 (same) | 117 (same) | 81 (-31%) |
| Speed Grade (tpd) | 14 ns (slowest) | 10 ns (faster, +40%) | 13 ns (faster, +8%) | 11 ns (faster, +27%) | 3 ns reference (faster, -79%) | 10 ns (faster, +40%) |
| Core Voltage | 3.3 V | 3.3 V (same) | 3.3 V (same) | 3.3 V (same) | 3.3 V (same) | 3.3 V (same) |
| Configuration Memory | SRAM (volatile) | SRAM (same) | SRAM (same) | SRAM (same) | SRAM (same) | SRAM (same) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Slowest speed grade (tpd ~14 ns) for cost-sensitive designs (vs EPF6024ATC144-10)
- Pin-compatible with all FLEX 6000 144-TQFP family members (vs EPF6024AQI240-2)
- Mid-density 24K gates with full 117 user I/O availability (vs EPF6016ATC144-3)
Notes de conception
The EPF6024ATC144-14 requires two supply rails: VCCINT (3.3V core) and VCCIO (3.3V I/O, 5V-tolerant on inputs). Decouple each VCCINT pin with a 0.1uF X7R ceramic capacitor placed within 5 mm of the pin, and bulk-decouple each VCCIO pin with a 10uF tantalum + 0.1uF ceramic pair. Total ICCINT current for a fully utilized EPF6024 is approximately 50-100 mA static plus dynamic current proportional to toggle rate (estimated: 0.5 mA per MHz at 50% toggle activity across all 117 I/O). Plan power supply for at least 250 mA on the 3.3V rail.
The 144-pin TQFP package has a junction-to-ambient thermal resistance (theta_JA) of approximately 35 C/W in still air, requiring derating above 4W total power dissipation. Estimated: at 85C ambient with 1W internal dissipation, junction temperature rises to ~120C, exceeding the commercial 70C ambient rating if not de-rated. For industrial deployments above 60C ambient, attach a small clip-on heatsink or use a 4-layer PCB with a continuous ground pour under the TQFP thermal pad to reduce theta_JA to ~25 C/W.
The FLEX 6000 family uses volatile SRAM configuration memory - the EPF6024ATC144-14 must be reconfigured on every power-up from an external EPC1, EPC2, or EPC4 configuration ROM, or via microcontroller bit-banging in PS/PPS mode. Failure to pull nCONFIG high via a 10 kohm resistor and to monitor CONF_DONE results in unpredictable I/O behavior during power-up. Also note that the 5V-tolerant I/O is INPUT-only tolerance; do NOT drive outputs to 5V when VCCIO is 3.3V, as the output stage will be damaged.
The 144-pin TQFP with 0.5 mm lead pitch requires 0.25 mm-wide PCB pads with 1.5 mm pitch escape. Use a 4-layer PCB stack-up (signal/ground/power/signal) to maintain controlled impedance for clock traces. Place the EPC configuration ROM within 50 mm of the FLEX 6000 DATA[7:0] and DCLK pins to avoid configuration bit errors. JTAG chain (TDI/TMS/TCK/TDO) should be routed with 22 ohm series damping resistors if trace length exceeds 50 mm to suppress ringing at 10 MHz TCK.
Informations de conformité
Legacy Altera FLEX 6000 family released before RoHS directive. Non-RoHS due to lead-bearing TQFP lead finish (SnPb). REACH compliant per material declaration. Not AEC-Q100 qualified - automotive applications should use Cyclone IV or newer automotive-grade FPGAs.