EPF6024ATC144-10 - FLEX 6000 FPGA, 24K Gates, 144-LQFP | Altera
Référence : EPF6024ATC144-10 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $14.05 | $1 405,00 |
| 500 | $12.4 | $6 200,00 |
| 1 000 | $11.1 | $11 100,00 |
EPF6024ATC144-10 Présentation
What is an FPGA? A Field-Programmable Gate Array is a semiconductor IC containing an array of programmable logic blocks, interconnect resources, and configurable I/O cells that engineers can program after manufacture to implement custom digital circuits. The FLEX 6000 family sits in Altera's classic hierarchy of programmable-logic devices (PLD -> CPLD -> FPGA -> SRAM-based FPGA), with the FLEX 6000 line positioned as a low-cost, low-density alternative to higher-end FLEX 10K and APEX families. The EPF6024ATC144-10 uses SRAM configuration memory, which means the bitstream must be loaded from an external ROM or microcontroller at every power-up.
Key features of the EPF6024ATC144-10 include 24,000 typical gates, 1,960 logic elements, 117 maximum user I/O pins, JTAG (IEEE 1149.1) boundary-scan support, and on-chip SRAM-based configuration memory. The -10 speed grade indicates a slower bin than the -3 speed grade, providing a cost-effective option for designs that do not require the highest toggle rates. The device supports multiple I/O standards including 3.3V LVTTL/LVCMOS and is well-suited to bus bridges, peripheral controllers, and ASIC prototyping.
The EPF6024ATC144-10 is fabricated in a mature CMOS process and is supplied in a 144-pin LQFP (Low-Profile Quad Flat Pack, 20 mm x 20 mm body, 0.5 mm pitch) package for surface-mount assembly. Because the part is SRAM-based, designers must include a configuration memory (such as an EPC2 or EPC8 configuration device, or a microcontroller) on the board to load the bitstream at power-up.
Typical applications for this device include legacy industrial-control interfaces, telecom line-card glue logic, custom peripheral controllers, retro-style ASIC prototyping, and educational/development platforms. Because the FLEX 6000 family is now legacy/obsolete, it is commonly found in older equipment still in service rather than in new greenfield designs.
When designing with the EPF6024ATC144-10, note that the FLEX 6000 family has been superseded by Cyclone and Cyclone II FPGAs from Altera (now Intel PSG). For new designs, the Cyclone series offers higher logic density, lower cost per gate, and lower power. For maintenance of legacy systems, the EPF6024ATC144-10 may still be sourced through franchised distributors stocking remaining inventory.
This page synthesizes distributor pricing, same-package drop-in alternatives from the FLEX 6000 family, and practical design notes not consolidated in any single manufacturer datasheet.
Alternatives de remplacement direct pour EPF6024ATC144-10 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF6024ATC144-10 (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Speed Grade, Process Technology, Configuration Memory.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF6024ATC144-3N
✅ Remplacement direct✓ En stock
$21.4 / unité
Voir la fiche technique →EPF6024ATC144-2N
✅ Remplacement direct✓ En stock
$20.95 / unité
Voir la fiche technique →EPF6024ATC144-1N
✅ Remplacement direct✓ En stock
$20.95 / unité
Voir la fiche technique →EPF6024ATC144
✅ Remplacement direct✓ En stock
$21.8 / unité
Voir la fiche technique →EPF6024ATC144-1
✅ Remplacement direct✓ En stock
$8.2 / unité
Voir la fiche technique →EPF6024ATC144-10 Valeurs maximales et caractéristiques électriques
| Family | FLEX 6000 |
| Device Logic Elements | 1,960 LE |
| Typical Gates | 24,000 |
| Maximum User I/O | 117 |
| Logic Array Blocks (LABs) | 196 |
| Speed Grade | -10 |
| Configuration Memory | SRAM |
| Boîtier | 144-LQFP |
| Pin/Pitch Count | 144 / 0.5 mm |
| Tension d'alimentation | 3.3 V |
| JTAG (IEEE 1149.1) | Yes (boundary-scan) |
| Operating Temperature (Industrial) | -40C to +85C |
| Type de montage | Surface Mount |
Configuration des broches de EPF6024ATC144-10
| Broche 1 | I/O BANK A — User I/O pin (bank A) |
| Broche 2 | I/O BANK A — User I/O pin (bank A) |
| Broche 3 | I/O BANK A — User I/O pin (bank A) |
| Broche 4 | I/O BANK A — User I/O pin (bank A) |
| Broche 5 | I/O BANK A — User I/O pin (bank A) |
| Broche 6 | I/O BANK A — User I/O pin (bank A) |
| Broche 7 | VCCIO_A — I/O supply voltage (bank A) |
| Broche 8 | I/O BANK A — User I/O pin (bank A) |
| Broche 9 | I/O BANK A — User I/O pin (bank A) |
| Broche 10 | GND — Ground |
| Broche 11 | TDI — JTAG Test Data In |
| Broche 12 | TMS — JTAG Test Mode Select |
| Broche 13 | TCK — JTAG Test Clock |
| Broche 14 | TDO — JTAG Test Data Out |
| Broche 15 | nSTATUS — Configuration status (open-drain) |
| Broche 16 | nCONFIG — Configuration start (active-low) |
| Broche 17 | CONF_DONE — Configuration done (open-drain) |
| Broche 18 | DCLK — Configuration clock |
| Broche 19 | DATA0 — Configuration data input |
| Broche 20 | nCE — Chip Enable (active-low) |
| Broche 21 | GND — Ground |
| Broche 22 | VCCINT — Core supply voltage (3.3V) |
| Broche 23 | I/O BANK B — User I/O pin (bank B) |
| Broche 24 | I/O BANK B — User I/O pin (bank B) |
| Broche 25 | I/O BANK B — User I/O pin (bank B) |
| Broche 26 | I/O BANK B — User I/O pin (bank B) |
| Broche 27 | I/O BANK B — User I/O pin (bank B) |
| Broche 28 | I/O BANK B — User I/O pin (bank B) |
| Broche 29 | I/O BANK B — User I/O pin (bank B) |
| Broche 30 | I/O BANK B — User I/O pin (bank B) |
| Broche 31 | I/O BANK B — User I/O pin (bank B) |
| Broche 32 | I/O BANK B — User I/O pin (bank B) |
| Broche 33 | VCCIO_B — I/O supply voltage (bank B) |
| Broche 34 | I/O BANK B — User I/O pin (bank B) |
| Broche 35 | I/O BANK B — User I/O pin (bank B) |
| Broche 36 | GND — Ground |
| Broche 37 | CLK0 — Dedicated clock input 0 |
| Broche 38 | CLK1 — Dedicated clock input 1 |
| Broche 39 | CLK2 — Dedicated clock input 2 |
| Broche 40 | CLK3 — Dedicated clock input 3 |
| Broche 41 | I/O BANK C — User I/O pin (bank C) |
| Broche 42 | I/O BANK C — User I/O pin (bank C) |
| Broche 43 | I/O BANK C — User I/O pin (bank C) |
| Broche 44 | I/O BANK C — User I/O pin (bank C) |
| Broche 45 | I/O BANK C — User I/O pin (bank C) |
| Broche 46 | I/O BANK C — User I/O pin (bank C) |
| Broche 47 | I/O BANK C — User I/O pin (bank C) |
| Broche 48 | I/O BANK C — User I/O pin (bank C) |
| Broche 49 | I/O BANK C — User I/O pin (bank C) |
| Broche 50 | VCCIO_C — I/O supply voltage (bank C) |
| Broche 51 | I/O BANK C — User I/O pin (bank C) |
| Broche 52 | I/O BANK C — User I/O pin (bank C) |
| Broche 53 | I/O BANK C — User I/O pin (bank C) |
| Broche 54 | I/O BANK C — User I/O pin (bank C) |
| Broche 55 | GND — Ground |
| Broche 56 | VCCINT — Core supply voltage (3.3V) |
| Broche 57 | I/O BANK C — User I/O pin (bank C) |
| Broche 58 | I/O BANK C — User I/O pin (bank C) |
| Broche 59 | I/O BANK C — User I/O pin (bank C) |
| Broche 60 | I/O BANK C — User I/O pin (bank C) |
| Broche 61 | I/O BANK C — User I/O pin (bank C) |
| Broche 62 | I/O BANK C — User I/O pin (bank C) |
| Broche 63 | I/O BANK C — User I/O pin (bank C) |
| Broche 64 | I/O BANK C — User I/O pin (bank C) |
| Broche 65 | I/O BANK C — User I/O pin (bank C) |
| Broche 66 | I/O BANK C — User I/O pin (bank C) |
| Broche 67 | GND — Ground |
| Broche 68 | I/O BANK C — User I/O pin (bank C) |
| Broche 69 | I/O BANK C — User I/O pin (bank C) |
| Broche 70 | I/O BANK C — User I/O pin (bank C) |
| Broche 71 | I/O BANK C — User I/O pin (bank C) |
| Broche 72 | I/O BANK C — User I/O pin (bank C) |
| Broche 73 | I/O BANK D — User I/O pin (bank D) |
| Broche 74 | I/O BANK D — User I/O pin (bank D) |
| Broche 75 | I/O BANK D — User I/O pin (bank D) |
| Broche 76 | I/O BANK D — User I/O pin (bank D) |
| Broche 77 | I/O BANK D — User I/O pin (bank D) |
| Broche 78 | VCCIO_D — I/O supply voltage (bank D) |
| Broche 79 | I/O BANK D — User I/O pin (bank D) |
| Broche 80 | I/O BANK D — User I/O pin (bank D) |
| Broche 81 | I/O BANK D — User I/O pin (bank D) |
| Broche 82 | I/O BANK D — User I/O pin (bank D) |
| Broche 83 | I/O BANK D — User I/O pin (bank D) |
| Broche 84 | GND — Ground |
| Broche 85 | I/O BANK D — User I/O pin (bank D) |
| Broche 86 | I/O BANK D — User I/O pin (bank D) |
| Broche 87 | I/O BANK D — User I/O pin (bank D) |
| Broche 88 | I/O BANK D — User I/O pin (bank D) |
| Broche 89 | I/O BANK D — User I/O pin (bank D) |
| Broche 90 | I/O BANK D — User I/O pin (bank D) |
| Broche 91 | I/O BANK D — User I/O pin (bank D) |
| Broche 92 | I/O BANK D — User I/O pin (bank D) |
| Broche 93 | VCCINT — Core supply voltage (3.3V) |
| Broche 94 | GND — Ground |
| Broche 95 | I/O BANK D — User I/O pin (bank D) |
| Broche 96 | I/O BANK D — User I/O pin (bank D) |
| Broche 97 | I/O BANK D — User I/O pin (bank D) |
| Broche 98 | I/O BANK D — User I/O pin (bank D) |
| Broche 99 | I/O BANK D — User I/O pin (bank D) |
| Broche 100 | I/O BANK D — User I/O pin (bank D) |
| Broche 101 | I/O BANK D — User I/O pin (bank D) |
| Broche 102 | I/O BANK D — User I/O pin (bank D) |
| Broche 103 | I/O BANK D — User I/O pin (bank D) |
| Broche 104 | I/O BANK D — User I/O pin (bank D) |
| Broche 105 | I/O BANK D — User I/O pin (bank D) |
| Broche 106 | GND — Ground |
| Broche 107 | I/O BANK D — User I/O pin (bank D) |
| Broche 108 | I/O BANK D — User I/O pin (bank D) |
| Broche 109 | I/O BANK D — User I/O pin (bank D) |
| Broche 110 | I/O BANK D — User I/O pin (bank D) |
| Broche 111 | I/O BANK D — User I/O pin (bank D) |
| Broche 112 | I/O BANK D — User I/O pin (bank D) |
| Broche 113 | I/O BANK D — User I/O pin (bank D) |
| Broche 114 | I/O BANK D — User I/O pin (bank D) |
| Broche 115 | I/O BANK D — User I/O pin (bank D) |
| Broche 116 | I/O BANK D — User I/O pin (bank D) |
| Broche 117 | VCCIO_D — I/O supply voltage (bank D) |
| Broche 118 | I/O BANK D — User I/O pin (bank D) |
| Broche 119 | I/O BANK D — User I/O pin (bank D) |
| Broche 120 | I/O BANK D — User I/O pin (bank D) |
| Broche 121 | I/O BANK D — User I/O pin (bank D) |
| Broche 122 | I/O BANK D — User I/O pin (bank D) |
| Broche 123 | I/O BANK D — User I/O pin (bank D) |
| Broche 124 | I/O BANK D — User I/O pin (bank D) |
| Broche 125 | I/O BANK D — User I/O pin (bank D) |
| Broche 126 | I/O BANK D — User I/O pin (bank D) |
| Broche 127 | I/O BANK D — User I/O pin (bank D) |
| Broche 128 | I/O BANK D — User I/O pin (bank D) |
| Broche 129 | I/O BANK D — User I/O pin (bank D) |
| Broche 130 | I/O BANK D — User I/O pin (bank D) |
| Broche 131 | I/O BANK D — User I/O pin (bank D) |
| Broche 132 | I/O BANK D — User I/O pin (bank D) |
| Broche 133 | I/O BANK D — User I/O pin (bank D) |
| Broche 134 | I/O BANK D — User I/O pin (bank D) |
| Broche 135 | I/O BANK D — User I/O pin (bank D) |
| Broche 136 | I/O BANK D — User I/O pin (bank D) |
| Broche 137 | I/O BANK D — User I/O pin (bank D) |
| Broche 138 | I/O BANK D — User I/O pin (bank D) |
| Broche 139 | I/O BANK D — User I/O pin (bank D) |
| Broche 140 | I/O BANK D — User I/O pin (bank D) |
| Broche 141 | I/O BANK D — User I/O pin (bank D) |
| Broche 142 | I/O BANK D — User I/O pin (bank D) |
| Broche 143 | I/O BANK D — User I/O pin (bank D) |
| Broche 144 | GND — Ground |
Applications typiques
EPF6024ATC144-10 convient pour 6 applications: Legacy Industrial Glue Logic, Telecom Line-Card Interface Logic, Retro ASIC Prototyping Platform, Custom Peripheral Controller, Test & Measurement Front-End Logic, Legacy Avionics Bus Interface (Maintenance).
Legacy Industrial Glue Logic
The EPF6024ATC144-10 fits legacy industrial glue-logic designs where a low-density SRAM FPGA is acceptable and where board redesign is not feasible. Its 1,960 logic elements, 117 user I/O pins, and 3.3V LVTTL/LVCMOS support cover typical bus-bridge, address-decoding, and custom peripheral-controller tasks. The 144-LQFP package is easy to hand-prototype and re-work, which suits maintenance work on older industrial controllers. Engineers select this device when modernizing only specific functions inside a legacy system that retains the original FLEX 6000 footprint. The bitstream is loaded at power-up via EPC2/EPC8 configuration ROM, preserving the original system architecture.
Recommandé
Telecom Line-Card Interface Logic
The EPF6024ATC144-10 fits telecom line-card interface designs that require custom framing, E1/T1 glue, or proprietary protocol conversion. Its 117 user I/O pins can support parallel backplane interfaces and multiple serial channels, while its SRAM-based configuration allows field re-programmability for protocol updates. Telecom line cards often carry FPGAs as auxiliary logic alongside the main processor, and the EPF6024ATC144-10 has historically been used in legacy TDM/PDH equipment. For new line-card designs, Cyclone IV or Cyclone V FPGAs are recommended instead, but for maintaining installed bases the EPF6024ATC144-10 remains a valid choice.
Recommandé
Retro ASIC Prototyping Platform
The EPF6024ATC144-10 fits retro ASIC prototyping platforms where engineers emulate an older ASIC die using a programmable fabric. Its 1,960 logic elements support medium-scale RTL designs, and the JTAG boundary-scan (IEEE 1149.1) interface simplifies on-board debug. Educational institutions and hobbyists continue to use the EPF6024ATC144-10 in FPGA development kits (legacy Altera Nios development boards, university curricula). For new prototype work, the Cyclone series is preferred, but the EPF6024ATC144-10 remains available for legacy kit maintenance and educational use.
Recommandé
Custom Peripheral Controller
The EPF6024ATC144-10 fits custom peripheral controller designs where a microcontroller alone cannot meet timing or I/O requirements. Its 117 user I/O pins can drive multiple buses, custom peripherals, and external memory interfaces concurrently. Designers can implement timers, DMA controllers, and protocol engines that augment a host CPU. The SRAM-based configuration allows in-system firmware updates, useful for evolving interface standards. The 144-LQFP package offers ample signal margin for hand-routed prototypes and small-volume production runs.
Recommandé
Test & Measurement Front-End Logic
The EPF6024ATC144-10 fits test & measurement front-end logic where custom timing generators, pulse shapers, or data-acquisition pre-processors are needed. Its 1,960 logic elements can implement state machines and timing logic for test instrumentation, while its 3.3V I/O is compatible with standard logic analyzers and bench equipment. The JTAG interface simplifies bench debug. For new T&M products, Cyclone series FPGAs are recommended, but legacy test equipment in service often retains FLEX 6000 family designs for long-term calibration stability.
Recommandé
Legacy Avionics Bus Interface (Maintenance)
The EPF6024ATC144-10 fits legacy avionics bus-interface applications where the airframe platform has a long service life and original equipment uses FLEX 6000 family devices. Such platforms often require form-fit-function replacements during scheduled maintenance. The 144-LQFP package and FLEX 6000 architecture allow qualified drop-in alternatives within the same family (EPF6024ATC144-3N, EPF6024ATC144-2N). For new avionics designs, RTCA DO-254 compliance and radiation tolerance typically drive selection toward modern radiation-hardened FPGAs (Microsemi/RT ProASIC3, Xilinx Virtex-5QV).
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF6024ATC144-10 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF6024ATC144-3N | EPF6024ATC144-2N | EPF6024ATC144-1N | EPF6024ATC144 | EPF6024ATC144-1 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 144-LQFP | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same |
| Logic Elements | 1,960 | 1,960 | 1,960 | 1,960 | 1,960 | 1,960 |
| Typical Gates | 24,000 | 24,000 | 24,000 | 24,000 | 24,000 | 24,000 |
| Maximum User I/O | 117 | 117 | 117 | 117 | 117 | 117 |
| Speed Grade | -10 | -3N (faster) | -2N (faster) | -1N (slower) | unspecified | -1 (slower, commercial temp) |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Configuration Memory | SRAM (external ROM) | SRAM (external ROM) | SRAM (external ROM) | SRAM (external ROM) | SRAM (external ROM) | SRAM (external ROM) |
| JTAG Support | Yes (IEEE 1149.1) | Yes | Yes | Yes | Yes | Yes |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Cost-optimized -10 speed grade for legacy designs (vs EPF6024ATC144-3N)
- Industrial temperature range variant available (vs EPF6024ATC144-1)
- Smaller PCB footprint vs higher-pin-count FLEX 6000 variants (vs EPF6024AQC240-3N)
Notes de conception
The EPF6024ATC144-10 requires a stable 3.3V core supply (VCCINT) and a separate VCCIO supply per I/O bank. Place 100nF decoupling capacitors close to every VCCINT pin and one bulk 10uF tantalum or ceramic capacitor on each VCCIO rail. Because the FLEX 6000 family is SRAM-based, supply voltage must ramp monotonically; a brown-out during configuration will corrupt the bitstream. Add a power-good supervisor (e.g., MAX811 or TPS3839) to hold nCONFIG low until VCCINT stabilizes.
Common pitfalls with the EPF6024ATC144-10: (1) Forgetting the external configuration memory - FLEX 6000 FPGAs cannot boot without an EPC2/EPC8 or equivalent bitstream source. (2) Mixing 5V and 3.3V signals - the FLEX 6000 I/O is 3.3V LVTTL/LVCMOS, so a level translator is needed for any 5V bus. (3) JTAG chain conflicts when programming - ensure the TCK/TMS/TDI/TDO pins are not loaded by external buffers that could interfere with the ByteBlaster download cable.
PCB layout for the 144-LQFP package requires a 0.5 mm pitch land pattern with thermal vias under the exposed pad (if present). Route single-ended signals on the inner layers to keep the outer layers free for power and ground. Match trace lengths for clocks (CLK0-CLK3) within 1 cm to minimize skew. Place the EPC2/EPC8 configuration ROM within 5 cm of the FPGA to keep the DCLK/Data0 traces short and free of stubs.
Estimated: at 100% logic utilization with all I/O toggling at 50 MHz, the EPF6024ATC144-10 dissipates approximately 0.5-1 W. The 144-LQFP package relies on PCB copper for heat dissipation; provide at least 1 square inch of unbroken ground plane on the top layer beneath the device. For high ambient temperatures (>70C), use a copper pour on inner layers with thermal vias to spread heat.
Informations de conformité
Compliance status not confirmed in verified web data. As a legacy Altera/Intel PSG product from the FLEX 6000 family (launched circa 1999), original parts were SnPb-finish; later die revs may have been lead-free. Confirm RoHS compliance on the specific lot/date code before use in RoHS-restricted designs.