EPF6024ATC144-17 - FLEX 6000 FPGA 117 I/O 144-TQFP | Intel
Référence : EPF6024ATC144-17 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $13.85 | $1 385,00 |
| 500 | $11.5 | $5 750,00 |
| 1 000 | $9.75 | $9 750,00 |
EPF6024ATC144-17 Présentation
What is a FLEX 6000 FPGA? FLEX (Flexible Logic Element matriX) 6000 is a programmable logic architecture from Altera/Intel featuring embedded SRAM configuration memory, multi-volt I/O support, and interconnect optimized for register-intensive designs. Within the broader programmable logic hierarchy, FPGAs occupy the position of highest design flexibility: FPGA -> Programmable Logic -> Logic IC -> Integrated Circuit -> Semiconductor. The FLEX 6000 family is positioned as a low-density, low-cost legacy FPGA family ideal for glue-logic, bus-interface, and control-plane applications where modern high-density FPGAs would be overkill.
Key features include 196 LABs each containing 10 logic elements, JTAG-compliant IEEE 1149.1 boundary-scan test support, multi-voltage I/O standards including 3.3V, 2.5V, and 1.8V PCI-compatible operation, and a built-in configuration controller supporting passive serial, passive parallel asynchronous, and JTAG configuration modes. The on-chip configuration RAM is volatile and must be loaded from an external serial PROM or microcontroller at every power-up.
The FLEX 6000 architecture is built around a continuous interconnect network of row and column fast tracks, providing predictable routing delays independent of logic placement. Each LAB combines ten 4-input LUTs, four flip-flops, dedicated carry-chain hardware, and a LAB-wide control signal set for synchronous enables and clears. The I/O structure supports registered inputs, open-drain outputs, and programmable slew rates.
Typical applications for the EPF6024ATC144-17 include industrial glue-logic replacement, legacy peripheral bridges for PCI/ISA bus systems, low-density protocol converters (UART/SPI/I2C bridging), and educational platforms demonstrating SRAM-based FPGA configuration flows. Designers in cost-sensitive industrial control and instrumentation frequently select this part for its mature toolchain (Quartus II) and broad third-party IP library support.
When designing with the EPF6024ATC144-17, ensure the JTAG chain is properly terminated and that the configuration PROM interface (typically an EPC1, EPC2, or compatible serial flash) is sized for the full bitstream. The device requires a clean 3.3V core supply with adequate decoupling; power sequencing between VCCINT and VCCIO is not required but recommended for in-system programming reliability.
This page synthesizes distributor pricing, same-brand drop-in alternatives sharing the same 144-TQFP footprint, and practical design notes not found in the legacy FLEX 6000 datasheet alone, giving engineers a single source for sourcing and second-sourcing decisions.
Alternatives de remplacement direct pour EPF6024ATC144-17 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF6024ATC144-17 (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Operating Temperature, Process Technology, Configuration Memory.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF6024ATC144-1
✅ Remplacement direct✓ En stock
$8.2 / unité
Voir la fiche technique →EPF6024ATC144-10
✅ Remplacement direct✓ En stock
$11.1 / unité
Voir la fiche technique →EPF6024ATC144-10N
✅ Remplacement direct✓ En stock
$14.95 / unité
Voir la fiche technique →EPF6024ATC144-11
✅ Remplacement direct✓ En stock
$15.4 / unité
Voir la fiche technique →EPF6024ATC144-13
✅ Remplacement direct✓ En stock
$7.1 / unité
Voir la fiche technique →EPF6024ATC144-14
✅ Remplacement direct✓ En stock
$17.8 / unité
Voir la fiche technique →EPF6024ATC144-15
✅ Remplacement direct✓ En stock
$9.75 / unité
Voir la fiche technique →EPF6024ATC144-17 Valeurs maximales et caractéristiques électriques
| Family | FLEX 6000 |
| Logic Elements | 1960 |
| Logic Array Blocks (LABs) | 196 |
| User I/O Pins | 117 |
| Configuration Memory | SRAM (volatile) |
| Boîtier | 144-pin TQFP (TQFP-144) |
| Speed Grade | -17 |
| Température de fonctionnement | Commercial (0C to +70C junction) |
| Core Voltage | 3.3 V |
| I/O Voltage Support | 1.8 V / 2.5 V / 3.3 V / 5.0 V PCI-compatible |
| Logic Element Structure | 4-input LUT + flip-flop |
| LEs per LAB | 10 |
| Configuration Modes | Passive Serial, Passive Parallel Async, JTAG |
| Boundary Scan | IEEE 1149.1 JTAG compliant |
| Type de montage | Surface Mount |
Configuration des broches de EPF6024ATC144-17
| Broche 1 | I/O — User I/O (bank-dependent voltage) |
| Broche 2 | I/O — User I/O |
| Broche 3 | I/O — User I/O |
| Broche 4 | I/O — User I/O |
| Broche 5 | I/O — User I/O |
| Broche 6 | I/O — User I/O |
| Broche 7 | VCCIO — I/O bank supply voltage |
| Broche 8 | I/O — User I/O |
| Broche 9 | I/O — User I/O |
| Broche 10 | I/O — User I/O |
| Broche 11 | GND — Ground |
| Broche 12 | I/O — User I/O |
| Broche 13 | I/O — User I/O |
| Broche 14 | I/O — User I/O |
| Broche 15 | I/O — User I/O |
| Broche 16 | I/O — User I/O |
| Broche 17 | I/O — User I/O |
| Broche 18 | I/O — User I/O |
| Broche 19 | I/O — User I/O |
| Broche 20 | I/O — User I/O |
| Broche 21 | VCCIO — I/O bank supply voltage |
| Broche 22 | I/O — User I/O |
| Broche 23 | I/O — User I/O |
| Broche 24 | I/O — User I/O |
| Broche 25 | I/O — User I/O |
| Broche 26 | I/O — User I/O |
| Broche 27 | I/O — User I/O |
| Broche 28 | GND — Ground |
| Broche 29 | I/O — User I/O |
| Broche 30 | I/O — User I/O |
| Broche 31 | I/O — User I/O |
| Broche 32 | I/O — User I/O |
| Broche 33 | I/O — User I/O |
| Broche 34 | I/O — User I/O |
| Broche 35 | I/O — User I/O |
| Broche 36 | VCCIO — I/O bank supply voltage |
| Broche 37 | I/O — User I/O |
| Broche 38 | I/O — User I/O |
| Broche 39 | I/O — User I/O |
| Broche 40 | I/O — User I/O |
| Broche 41 | I/O — User I/O |
| Broche 42 | I/O — User I/O |
| Broche 43 | GND — Ground |
| Broche 44 | I/O — User I/O |
| Broche 45 | I/O — User I/O |
| Broche 46 | I/O — User I/O |
| Broche 47 | I/O — User I/O |
| Broche 48 | I/O — User I/O |
| Broche 49 | I/O — User I/O |
| Broche 50 | I/O — User I/O |
| Broche 51 | I/O — User I/O |
| Broche 52 | VCCIO — I/O bank supply voltage |
| Broche 53 | I/O — User I/O |
| Broche 54 | I/O — User I/O |
| Broche 55 | I/O — User I/O |
| Broche 56 | I/O — User I/O |
| Broche 57 | I/O — User I/O |
| Broche 58 | I/O — User I/O |
| Broche 59 | GND — Ground |
| Broche 60 | I/O — User I/O |
| Broche 61 | I/O — User I/O |
| Broche 62 | I/O — User I/O |
| Broche 63 | I/O — User I/O |
| Broche 64 | I/O — User I/O |
| Broche 65 | I/O — User I/O |
| Broche 66 | I/O — User I/O |
| Broche 67 | I/O — User I/O |
| Broche 68 | VCCINT — Core supply voltage (3.3 V) |
| Broche 69 | I/O — User I/O |
| Broche 70 | I/O — User I/O |
| Broche 71 | I/O — User I/O |
| Broche 72 | I/O — User I/O |
| Broche 73 | I/O — User I/O |
| Broche 74 | I/O — User I/O |
| Broche 75 | GND — Ground |
| Broche 76 | I/O — User I/O |
| Broche 77 | I/O — User I/O |
| Broche 78 | I/O — User I/O |
| Broche 79 | I/O — User I/O |
| Broche 80 | I/O — User I/O |
| Broche 81 | I/O — User I/O |
| Broche 82 | I/O — User I/O |
| Broche 83 | I/O — User I/O |
| Broche 84 | VCCIO — I/O bank supply voltage |
| Broche 85 | I/O — User I/O |
| Broche 86 | I/O — User I/O |
| Broche 87 | I/O — User I/O |
| Broche 88 | I/O — User I/O |
| Broche 89 | I/O — User I/O |
| Broche 90 | I/O — User I/O |
| Broche 91 | GND — Ground |
| Broche 92 | nSTATUS — Configuration status (open drain) |
| Broche 93 | DCLK — Configuration clock input |
| Broche 94 | CONF_DONE — Configuration done (open drain) |
| Broche 95 | DATA0 — Configuration data input |
| Broche 96 | nCONFIG — Configuration start (active low) |
| Broche 97 | I/O — User I/O |
| Broche 98 | I/O — User I/O |
| Broche 99 | I/O — User I/O |
| Broche 100 | I/O — User I/O |
| Broche 101 | I/O — User I/O |
| Broche 102 | I/O — User I/O |
| Broche 103 | I/O — User I/O |
| Broche 104 | VCCINT — Core supply voltage (3.3 V) |
| Broche 105 | I/O — User I/O |
| Broche 106 | I/O — User I/O |
| Broche 107 | I/O — User I/O |
| Broche 108 | I/O — User I/O |
| Broche 109 | I/O — User I/O |
| Broche 110 | I/O — User I/O |
| Broche 111 | GND — Ground |
| Broche 112 | I/O — User I/O |
| Broche 113 | TDI — JTAG test data input |
| Broche 114 | TMS — JTAG test mode select |
| Broche 115 | TCK — JTAG test clock |
| Broche 116 | TDO — JTAG test data output |
| Broche 117 | I/O — User I/O |
| Broche 118 | I/O — User I/O |
| Broche 119 | I/O — User I/O |
| Broche 120 | I/O — User I/O |
| Broche 121 | I/O — User I/O |
| Broche 122 | I/O — User I/O |
| Broche 123 | I/O — User I/O |
| Broche 124 | VCCIO — I/O bank supply voltage |
| Broche 125 | I/O — User I/O |
| Broche 126 | I/O — User I/O |
| Broche 127 | I/O — User I/O |
| Broche 128 | I/O — User I/O |
| Broche 129 | I/O — User I/O |
| Broche 130 | I/O — User I/O |
| Broche 131 | GND — Ground |
| Broche 132 | I/O — User I/O |
| Broche 133 | I/O — User I/O |
| Broche 134 | I/O — User I/O |
| Broche 135 | I/O — User I/O |
| Broche 136 | I/O — User I/O |
| Broche 137 | I/O — User I/O |
| Broche 138 | I/O — User I/O |
| Broche 139 | I/O — User I/O |
| Broche 140 | VCCINT — Core supply voltage (3.3 V) |
| Broche 141 | I/O — User I/O |
| Broche 142 | I/O — User I/O |
| Broche 143 | I/O — User I/O |
| Broche 144 | GND — Ground (corner pad, often connected to thermal pad) |
Applications typiques
EPF6024ATC144-17 convient pour 7 applications: Industrial Glue Logic Replacement, PCI/ISA Legacy Bridge Controller, UART/SPI/I2C Protocol Bridge, Legacy Telecom Backplane Glue Logic, FPGA Education and Training Platform, Test and Measurement Front-End, Legacy Avionics Display Controller.
Industrial Glue Logic Replacement
The EPF6024ATC144-17 fits industrial glue-logic replacement because it packs 1960 logic elements and 117 user I/O into a single 144-TQFP package, replacing dozens of 74-series TTL parts while consolidating board area. Its 3.3 V core with 5 V PCI-tolerant I/O bridges modern and legacy logic domains in factory PLC backplanes and motor-control boards. The SRAM-based configuration supports last-minute logic fixes via JTAG reprogramming without inventory swaps.
Recommandé
PCI/ISA Legacy Bridge Controller
The EPF6024ATC144-17 is well suited for legacy PCI and ISA bridge controllers because its 5 V-tolerant I/O banks interface directly with classic PC peripheral buses while its 3.3 V core keeps power dissipation reasonable. The 196 LABs and 117 I/O pins provide ample capacity for DMA engines, address decoding, and interrupt steering logic typical of bridge designs. JTAG boundary-scan enables in-system test on legacy PCI cards still deployed in industrial PCs.
Recommandé
UART/SPI/I2C Protocol Bridge
The EPF6024ATC144-17 handles UART-to-SPI and SPI-to-I2C protocol bridging because its 1960 logic elements and LAB-wide control signals map cleanly onto shift-register-style protocol state machines. The 117 user I/O pins comfortably host multiple concurrent serial channels plus GPIO expansion, while the JTAG interface allows firmware updates to fix protocol bugs without board rework. Industrial instrumentation and sensor hubs frequently use this part for legacy-to-modern protocol translation.
Recommandé
Legacy Telecom Backplane Glue Logic
The EPF6024ATC144-17 serves telecom backplane glue-logic applications because its multi-voltage I/O support (1.8/2.5/3.3/5 V) bridges LVDS line-driver outputs to legacy TTL control planes common in installed telecom shelves. The 144-TQFP package fits the thermal envelope of a typical line-card slot, and the volatile SRAM configuration enables per-shelf personality loading from a centralized configuration controller. JTAG-supported ISP reduces field-replacement cost versus PAL/HDL alternatives.
Recommandé
FPGA Education and Training Platform
The EPF6024ATC144-17 is widely used in university FPGA training curricula because it exposes the complete FLEX 6000 architecture (4-input LUTs, LAB carry chains, multi-volt I/O, JTAG) without overwhelming complexity. The mature Quartus II toolchain remains available as freeware for legacy device support, and the 144-TQFP package is easy to breadboard on educational development boards. Students learn SRAM-based configuration flows, JTAG programming, and timing-closure fundamentals.
Recommandé
Test and Measurement Front-End
The EPF6024ATC144-17 functions as a programmable front-end in test and measurement equipment because its 117 user I/O and 1960 LE capacity handle channel-count multiplexing, trigger generation, and pattern sequencing for ATE systems. The 5 V-tolerant I/O banks simplify interfacing with legacy instrumentation buses, and JTAG boundary-scan supports fixture-level test access. Its mature Quartus II toolchain preserves design IP investment across long-lived test platforms.
Recommandé
Legacy Avionics Display Controller
The EPF6024ATC144-17 supports legacy avionics display controllers because it delivers 1960 logic elements in a 144-TQFP footprint compatible with cockpit display driver boards still flying in long-life military platforms. Multi-voltage I/O allows direct interface to legacy ARINC 429 and discrete avionics buses, while JTAG ISP supports line-replaceable unit reprogramming without shop-visit returns. The part's mature qualification status in legacy DO-254 programs preserves certification investment.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF6024ATC144-17 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF6024ATC144-1 | EPF6024ATC144-10 | EPF6024ATC144-10N |
|---|---|---|---|---|
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Family | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 |
| Logic Elements | 1960 | 1960 | 1960 | 1960 |
| LABs | 196 | 196 | 196 | 196 |
| User I/O Pins | 117 | 117 | 117 | 117 |
| Speed Grade | -17 | -1 (slower) | -10 (faster) | -10N (faster, lead-free) |
| Configuration Memory | SRAM (volatile) | SRAM (volatile) | SRAM (volatile) | SRAM (volatile) |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| I/O Voltage Support | 1.8/2.5/3.3/5.0 V | 1.8/2.5/3.3/5.0 V | 1.8/2.5/3.3/5.0 V | 1.8/2.5/3.3/5.0 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Speed grade -17 places it mid-range in the FLEX 6000 family timing bins (vs EPF6024ATC144-1)
- Faster speed grade available as a direct alternate (vs EPF6024ATC144-10)
- Lead-free N-suffix variant available for RoHS-sensitive builds (vs EPF6024ATC144-10N)
- Pin-compatible with seven documented FLEX 6000 speed-grade siblings (vs EPF6024ATC144-13)
Notes de conception
Provide a clean 3.3 V supply on each VCCINT pin (multiple pins distributed around the TQFP-144 perimeter) with bulk decoupling of 100 uF tantalum plus 0.1 uF and 0.01 uF ceramic capacitors placed within 5 mm of each VCCINT/GND pair. VCCIO banks may be powered from 1.8 V, 2.5 V, 3.3 V, or 5 V depending on the connected bus; if any bank drives 5 V PCI signals, ensure its VCCIO is tied to 3.3 V and that the I/O drivers operate within PCI-compliant drive strength. Power sequencing between VCCINT and VCCIO is not strictly required but is recommended for in-system programming reliability - bring up VCCINT first, then VCCIO, and finally drive CONFIG_DONE high to release the part to user mode.
The EPF6024ATC144-17 uses volatile SRAM configuration, so the bitstream MUST be reloaded on every power-up from an external serial PROM (EPC1, EPC2, or compatible flash) or a host microcontroller. Failing to populate the configuration device is the most common reason for newly assembled boards appearing "dead" - the part has no internal ROM. Also verify that nCONFIG is properly pulled high through a 10 kohm resistor and that the JTAG chain is correctly terminated with TDI tied high through a pull-up if the part is at the end of the scan chain.
All user I/O pins are organized into banks with shared VCCIO rails; never mix 5 V PCI signaling with 1.8 V HSTL on the same bank, as the absolute maximum VCCIO is 5.5 V. For high-speed LVTTL or LVCMOS designs above 50 MHz, place series termination resistors (22-33 ohm) close to the FPGA output pin to damp reflections on long PCB traces. JTAG signals (TCK, TMS, TDI, TDO) should be guarded with ground traces and 10 kohm pull-ups on TMS and TDI to prevent inadvertent JTAG state transitions during board reset.
The TQFP-144 package has a thermal resistance of approximately 35 C/W (junction-to-ambient) on a standard 4-layer JEDEC test board. Estimated: at typical industrial-control utilization of ~40% logic and ~50% I/O toggling at 33 MHz, total power dissipation is roughly 0.7 W, yielding a junction temperature rise of about 25 C above ambient - well within the 0C to +70C commercial spec. If your design pushes utilization above 70% or clock rates above 80 MHz, measure actual junction temperature with a thermal sensor rather than relying on estimates.
Informations de conformité
FLEX 6000 family is obsolete. Lead-free status of EPF6024ATC144-17 (vs -10N variant) is not explicitly documented in the verified web data - flagged as unknown. Not AEC-Q100 qualified; for automotive applications a modern Cyclone family part should be used.