Intel

EPF81500ARC240-3 - FLEX 8000 FPGA 16K Gates 240-RQFP | Intel

Name: EPF81500ARC240-3 - FLEX 8000 FPGA 16K Gates 240-RQFP | Intel
Brand: Intel
SKU: EPF81500ARC240-3
Price: 25 USD
Availability: InStock

Référence : EPF81500ARC240-3 ✗ Fin de vie

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5 V Vdss 240-BFQFP Exposed Pad (240-RQFP) Package 125 MHz (speed grade -3) Speed

À partir de $25 USD / unité

MOQ : 1 |

Prix mis à jour : 2026-09-11

Tarifs dégressifs

Qté	Prix unitaire	Total
1	$45	$45,00
10	$38.5	$385,00
100	$32	$3 200,00
500	$28.5	$14 250,00
1 000	$25	$25 000,00

ℹ️ Tous les prix sont en USD

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EPF81500ARC240-3 Présentation

The Intel (formerly Altera) EPF81500ARC240-3 is a member of the FLEX 8000 family of CMOS SRAM-based Field-Programmable Gate Arrays, delivering up to 16,000 usable gates and 1,500 registers in a 240-pin RQFP (240-BFQFP Exposed Pad) surface-mount package. Per the manufacturer datasheet, the device contains 1,296 logic cells, 181 user I/O pins, and is fabricated on a 0.42 µm CMOS process. The "-3" speed grade indicates a standard performance bin targeting a maximum internal clock frequency of approximately 125 MHz in the FLEX 8000 family.

An FPGA (Field-Programmable Gate Array) is a programmable logic device that combines the high integration of a gate array with the design flexibility of in-circuit reconfigurability. Within the broader semiconductor hierarchy, an FPGA sits under programmable logic, alongside CPLDs, and above fixed-function ASICs in design flexibility. The FLEX 8000 family occupies a unique position as one of the first register-rich, high-density SRAM-based PLD families designed for system-level integration with features such as in-circuit reconfigurability (ICR), multi-volt I/O support, and JTAG boundary-scan testing.

Key features of the EPF81500ARC240-3 include 16,000 usable gates, 1,500 flip-flops, embedded SRAM for fast on-chip memory, and continuous FastTrack interconnect routing. The device operates from a 5V core supply and supports 3.3V and 5V I/O standards through its multi-volt interface. A 240-pin RQFP package with exposed thermal pad supports high-I/O-count designs in industrial, telecom, and consumer applications. According to the Flex 8000 Device Family datasheet, configuration is performed at system power-up using industry-standard parallel EPROMs, Altera serial configuration devices (EPC1, EPC1213, EPC1064, EPC1441), or a system controller.

Typical applications include industrial automation controllers, telecommunications line cards, glue-logic consolidation in legacy 5V systems, and prototyping platforms for ASIC migration. The exposed thermal pad enables reliable operation at extended junction temperatures when properly soldered to a PCB thermal land pattern. When designing with this device, ensure adequate decoupling on the VCCINT and VCCIO rails and follow Altera's configuration schematic recommendations to prevent partial configuration states at power-up.

Alternatives de remplacement direct pour EPF81500ARC240-3 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec EPF81500ARC240-3 (même facteur de forme et même empreinte) — différant par Package, Configuration Method, Process Technology, Speed Grade, Mounting Type.

EPF81500AQC240-2

Altera

Package: 240-BFQFP (240-pin Fine-pitch QFP, 32x32 mm)

Process Technology: CMOS SRAM, 5 V tolerant I/O

Speed Grade: -2