Intel

EPF81500ARC240-3 - FLEX 8000 FPGA 16K Gates 240-RQFP | Intel

料号: EPF81500ARC240-3 ✗ 停产
有现货 1-3 个工作日内发货
5 V Vdss 240-BFQFP Exposed Pad (240-RQFP) Package 125 MHz (speed grade -3) Speed
低至 $25 USD / 件
最小起订量: 1 |
价格更新于: 2026-09-11
批量定价
数量 单价 小计
1 $45 $45.00
10 $38.5 $385.00
100 $32 $3,200.00
500 $28.5 $14,250.00
1,000 $25 $25,000.00
ℹ️ 所有价格均以 USD 计价

EPF81500ARC240-3 概述

The Intel (formerly Altera) EPF81500ARC240-3 is a member of the FLEX 8000 family of CMOS SRAM-based Field-Programmable Gate Arrays, delivering up to 16,000 usable gates and 1,500 registers in a 240-pin RQFP (240-BFQFP Exposed Pad) surface-mount package. Per the manufacturer datasheet, the device contains 1,296 logic cells, 181 user I/O pins, and is fabricated on a 0.42 µm CMOS process. The "-3" speed grade indicates a standard performance bin targeting a maximum internal clock frequency of approximately 125 MHz in the FLEX 8000 family.

An FPGA (Field-Programmable Gate Array) is a programmable logic device that combines the high integration of a gate array with the design flexibility of in-circuit reconfigurability. Within the broader semiconductor hierarchy, an FPGA sits under programmable logic, alongside CPLDs, and above fixed-function ASICs in design flexibility. The FLEX 8000 family occupies a unique position as one of the first register-rich, high-density SRAM-based PLD families designed for system-level integration with features such as in-circuit reconfigurability (ICR), multi-volt I/O support, and JTAG boundary-scan testing.

Key features of the EPF81500ARC240-3 include 16,000 usable gates, 1,500 flip-flops, embedded SRAM for fast on-chip memory, and continuous FastTrack interconnect routing. The device operates from a 5V core supply and supports 3.3V and 5V I/O standards through its multi-volt interface. A 240-pin RQFP package with exposed thermal pad supports high-I/O-count designs in industrial, telecom, and consumer applications. According to the Flex 8000 Device Family datasheet, configuration is performed at system power-up using industry-standard parallel EPROMs, Altera serial configuration devices (EPC1, EPC1213, EPC1064, EPC1441), or a system controller.

Typical applications include industrial automation controllers, telecommunications line cards, glue-logic consolidation in legacy 5V systems, and prototyping platforms for ASIC migration. The exposed thermal pad enables reliable operation at extended junction temperatures when properly soldered to a PCB thermal land pattern. When designing with this device, ensure adequate decoupling on the VCCINT and VCCIO rails and follow Altera's configuration schematic recommendations to prevent partial configuration states at power-up.

直接替换替代料: EPF81500ARC240-3 ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。

本系列中的变体

可与以下型号直接替换的同系列型号: EPF81500ARC240-3 (相同外形与封装尺寸) ——差异在于 Package, Configuration Method, Process Technology, Speed Grade, Mounting Type.

Altera
Package: 240-BFQFP (240-pin Fine-pitch QFP, 32x32 mm)
Process Technology: CMOS SRAM, 5 V tolerant I/O
Speed Grade: -2
对比 EPF81500ARC240-3 →
Altera
Configuration Method: Serial EPROM / JTAG (IEEE 1149.1)
Process Technology: 0.42 micrometer CMOS
对比 EPF81500ARC240-3 →
Altera
Package: 240-BFQFP (240-PQFP, 32x32 mm)
Configuration Method: SRAM, loaded at power-up via EPC1/EPC1064/EPC1213/EPC1441 or parallel EPROM
Process Technology: 0.42 um CMOS
对比 EPF81500ARC240-3 →
Altera
Package: 240-BFQFP (Plastic Quad Flat Pack)
Configuration Method: SRAM, serial or parallel
Process Technology: 0.42 µm CMOS SRAM
对比 EPF81500ARC240-3 →
Altera
Configuration Method: External serial / parallel configuration device
对比 EPF81500ARC240-3 →
Intel
Package: 240-BFQFP (RQFP) Exposed Pad
Configuration Method: Serial or Parallel EPROM, Altera EPC1/EPC1064/EPC1213/EPC1441
Process Technology: 0.42 um CMOS SRAM
对比 EPF81500ARC240-3 →
Intel
Package: 240-RQFP (RQFP-240)
Speed Grade: -4 (slowest)
对比 EPF81500ARC240-3 →
Altera
Package: 240-pin RQFP (S-PQFP-G240)
Configuration Method: SRAM, EPROM, or controller-loaded
Process Technology: 0.42 um CMOS SRAM
对比 EPF81500ARC240-3 →
Intel
Package: 240-pin RQFP (Power Quad Flat Pack) with exposed pad
Configuration Method: Serial or parallel EPROM / Altera EPC1, EPC1064, EPC1213, EPC1441
Process Technology: 0.42 µm CMOS SRAM
对比 EPF81500ARC240-3 →
Intel
Package: 192-pin CPGA (Ceramic Pin Grid Array)
Configuration Method: SRAM, In-Circuit Reconfigurable (ICR)
Mounting Type: Through-Hole (CPGA socket required)
对比 EPF81500ARC240-3 →
Altera
Package: RQFP-240 (240-pin)
Process Technology: 0.42 µm CMOS, 3-layer metal
Speed Grade: -3
对比 EPF81500ARC240-3 →

快速对比工具——选择替代料号进行并排对比:

EPF81500ARC240-2

✅ 直接替换
Altera
📦 240-BFQFP Exposed Pad (240-RQFP)
FLEX 8000 · 16,000 · 1,296 · 1,500 · 181 · 125 MHz · 0.42 µm CMOS · 5 V

✓ 有现货

$61.75 / 个

查看数据手册 →

EPF81500AQC240-3

✅ 直接替换
Altera
📦 240-BFQFP Exposed Pad (240-RQFP)
FLEX 8000 · 1296 logic elements, up to 16,000 usable gates · 1500 · 162 · 181 · 1.7 ns · 4.75 V to 5.25 V · CMOS SRAM

✓ 有现货

$21.75 / 个

查看数据手册 →

EPF81500AQC240-4

✅ 直接替换
Altera
📦 240-BFQFP Exposed Pad (240-RQFP)
FLEX 8000 · 16,000 · 1,296 · 181 · 240-BFQFP (Plastic Quad Flat Pack) · 5 V · 3.3 V or 5.0 V selectable · 0.42 µm CMOS SRAM

✓ 有现货

$18.25 / 个

查看数据手册 →

EPF81500AQC240-2

✅ 直接替换
Altera
📦 240-BFQFP Exposed Pad (240-RQFP)
FLEX 8000 · 1296 · 162 · 181 · 4.75 V to 5.25 V · -2 · 240-BFQFP (240-pin Fine-pitch QFP, 32x32 mm) · Surface Mount (gull-wing leads)

✓ 有现货

$61.4 / 个

查看数据手册 →

EPF81500AQC240-2N

✅ 直接替换
Altera
📦 240-BFQFP Exposed Pad (240-RQFP)
Altera (Intel) · FLEX 8000 · FPGA (Field Programmable Gate Array) · 1,296 logic elements (LEs) · 16,000 · 1,500 · 181 · 1.7 ns

✓ 有现货

$18.95 / 个

查看数据手册 →

EPF81500ARC240-2A

✅ 直接替换
Intel
📦 240-BFQFP Exposed Pad (240-RQFP)
FLEX 8000 · 16,000 · 1,296 · 1,500 · 181 · 125 MHz · 0.42 um CMOS SRAM · 5 V

✓ 有现货

$44.2 / 个

查看数据手册 →

EPF81500ARC240-3 最大额定值与电气特性

Family FLEX 8000
Logic Elements / Cells 1296
Usable Gates 16,000
Registers (Flip-Flops) 1500
User I/O Pins 181
Number of Logic Array Blocks (LABs) 162
Number of Embedded Array Blocks (EABs) 12
Process Technology 0.42 µm CMOS
Core Supply Voltage (VCCINT) 5 V
I/O Supply Voltage (VCCIO) 3.3 V / 5 V
Maximum Internal Frequency 125 MHz (speed grade -3)
封装 240-BFQFP Exposed Pad (240-RQFP)
Configuration Method SRAM, serial or parallel EPROM, JTAG
安装类型 Surface Mount

EPF81500ARC240-3 引脚配置

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
引脚 1 I/O — User I/O pin
引脚 2 I/O — User I/O pin
引脚 3 I/O — User I/O pin
引脚 4 I/O — User I/O pin
引脚 5 VCCINT — Core supply voltage (5V)
引脚 6 GND — Ground
引脚 7 I/O — User I/O pin
引脚 8 I/O — User I/O pin
引脚 9 I/O — User I/O pin
引脚 10 I/O — User I/O pin
引脚 11 I/O — User I/O pin
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引脚 179 I/O — User I/O pin
引脚 180 I/O — User I/O pin
引脚 181 I/O — User I/O pin
引脚 182 GND — Ground
引脚 183 VCCIO — I/O supply voltage (3.3V or 5V)
引脚 184 MSEL0 — Configuration mode select 0
引脚 185 MSEL1 — Configuration mode select 1
引脚 186 MSEL2 — Configuration mode select 2
引脚 187 nSTATUS — Configuration status (open drain)
引脚 188 nCONFIG — Configuration control (active low)
引脚 189 DCLK — Configuration clock input
引脚 190 DATA0 — Configuration data input
引脚 191 CONF_DONE — Configuration complete (open drain)
引脚 192 nCE — Chip enable (active low)
引脚 193 I/O — User I/O pin
引脚 194 I/O — User I/O pin
引脚 195 I/O — User I/O pin
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引脚 238 I/O — User I/O pin
引脚 239 I/O — User I/O pin
引脚 240 I/O — User I/O pin

典型应用

EPF81500ARC240-3 适用于 6 应用s: Industrial Automation Controllers, Telecommunications Line Cards, Legacy 5V System Glue Logic, ASIC Prototyping Platform, Military and Aerospace Avionics (Legacy), Medical Imaging Front-End.

🏭

Industrial Automation Controllers

The EPF81500ARC240-3 fits industrial automation controllers because its 16,000 usable gates and 181 user I/O provide ample logic for state-machine-based machine control, encoder interfacing, and multi-axis motion sequencing. The FLEX 8000 architecture's embedded array blocks (EABs) implement FIFO buffers and look-up-table-based waveform generators used in PID loops, while the 5V core with 3.3V/5V multi-volt I/O enables direct interface to legacy 5V PLC peripherals and modern 3.3V sensors without level shifters. In-circuit reconfigurability (ICR) permits field firmware updates over JTAG or EPC serial devices, which is essential for deployed machinery that cannot be easily returned for service.

🌐

Telecommunications Line Cards

Telecommunications line cards benefit from the EPF81500ARC240-3's 181 user I/O and 1,296 logic cells, which provide enough capacity for T1/E1 framers, HDLC controllers, and time-slot interchangers common in legacy telecom equipment. The 240-RQFP package exposes the full FastTrack interconnect routing, ensuring predictable timing for synchronous serial interfaces. SRAM-based configuration allows remote firmware updates via JTAG or processor-driven serial configuration, important for central-office equipment that must support feature upgrades without physical access. The device's 5V-tolerant I/O bridges 3.3V backplane logic to legacy 5V line-interface units (LIUs) without external buffers.

🔧

Legacy 5V System Glue Logic

The EPF81500ARC240-3 is well-suited as a glue-logic consolidator in 5V systems where multiple discrete 74-series TTL/CMOS parts would otherwise be needed for address decoding, bus arbitration, or custom state machines. Its 5V VCCINT and 3.3V/5V VCCIO interface directly to both legacy 5V microprocessors (e.g. 8051, 68k) and modern 3.3V peripherals. With 1,500 registers and 162 LABs, designers can replace 20-30 discrete MSI/SSI packages with a single 240-RQFP FPGA, reducing board area, improving reliability, and simplifying ECO changes during product evolution.

🖥️

ASIC Prototyping Platform

Designers prototyping ASIC designs use the EPF81500ARC240-3 to validate RTL before committing to mask fabrication. The FLEX 8000 family provides 16K usable gates and in-circuit reconfigurability, allowing fast design iterations via JTAG or EPC configuration devices. SRAM configuration eliminates the need for UV-erase cycles required by older CPLDs, dramatically shortening debug cycles. The 240-RQFP package with exposed pad supports real-world clock rates (~125 MHz) representative of ASIC target performance, and the 5V/3.3V multi-volt I/O replicates the I/O environment of many ASIC processes used in the late 1990s.

✈️

Military and Aerospace Avionics (Legacy)

Legacy avionics platforms use the EPF81500ARC240-3 in display drivers, sensor interfaces, and bus controllers where its wide operating voltage tolerance and exposed-pad thermal dissipation are valued. The 240-RQFP package is mechanically robust and qualified for many legacy MIL-spec environments. Designers must consult the original Flex 8000 datasheet for full military temperature grade information. For new aerospace designs, however, modern radiation-hardened FPGAs (e.g. Microsemi RTG4, Xilinx Virtex-5QV) should be evaluated instead, as FLEX 8000 is not radiation-hardened by design.

💊

Medical Imaging Front-End

Legacy medical imaging front-ends (ultrasound beamformers, MRI receiver arrays) use the EPF81500ARC240-3 to implement channel-selection logic, gain control, and ADC-interface glue. The 181 user I/O accommodates parallel ADC data buses (10-16 bits per channel x multiple channels), while the 1,296 logic cells perform pipelined multiplexing and digital filtering. The 5V I/O tolerance interfaces directly to legacy medical-grade analog front-ends. Designers must verify biocompatibility, sterilization, and regulatory compliance separately; this FPGA is a logic component within a larger medical system subject to FDA/CE approvals.

推荐产品汇总

EPC1 Altera serial configuration device for FLEX 8000 用于: Industrial Automation Controllers, Legacy 5V System Glue Logic, Medical Imaging Front-End EPC1441 Higher-density Altera configuration device 用于: Industrial Automation Controllers, ASIC Prototyping Platform EPF81500AQC240-3 Altera 用于: Industrial Automation Controllers, ASIC Prototyping Platform EPC1064 Serial configuration device for FLEX 8000 用于: Telecommunications Line Cards, Military and Aerospace Avionics (Legacy) EPC1213 Altera configuration EPROM (1 Mbit) 用于: Telecommunications Line Cards EPF81500AQC240-4 Altera 用于: Telecommunications Line Cards, Medical Imaging Front-End EPF81500ARC240-2 Altera 用于: Legacy 5V System Glue Logic EPF81500ARC240-3 Intel 用于: Military and Aerospace Avionics (Legacy)
What is the EPF81500ARC240-3?
The EPF81500ARC240-3 is an Intel (formerly Altera) FLEX 8000 family SRAM-based FPGA with 16,000 usable gates, 1,500 registers, 1,296 logic cells, and 181 user I/O pins in a 240-RQFP package with exposed pad. According to the Flex 8000 Device Family datasheet, it operates from a 5V core supply with 3.3V/5V multi-volt I/O support.
What is the operating voltage of EPF81500ARC240-3?
The EPF81500ARC240-3 operates from a 5V core supply (VCCINT) and supports 3.3V or 5V I/O through its multi-volt VCCIO pins. This dual-rail design, documented in the FLEX 8000 datasheet, enables bridging between legacy 5V peripherals and 3.3V logic without external level shifters.
How many logic cells and I/O pins does the EPF81500ARC240-3 have?
The EPF81500ARC240-3 contains 1,296 logic cells organized into 162 Logic Array Blocks (LABs), 12 Embedded Array Blocks (EABs), and provides 181 user I/O pins. Per the FLEX 8000 family datasheet, the device also includes 1,500 flip-flops and supports up to 16,000 usable gates.
What is the maximum clock frequency of EPF81500ARC240-3?
The EPF81500ARC240-3 in speed grade -3 supports a maximum internal operating frequency of approximately 125 MHz in the FLEX 8000 family. According to Altera's device ordering information, lower-numbered speed grades (e.g. -2) indicate slower performance and higher grades (e.g. -4) indicate faster performance.
Where can I download the EPF81500ARC240-3 datasheet?
The EPF81500ARC240-3 datasheet is available as part of the FLEX 8000 Device Family datasheet on Altera's legacy documentation archive. The Flex 8000 Device Family datasheet contains complete DC/AC specifications, pinout tables, configuration schematics, and timing characteristics.
Where to buy EPF81500ARC240-3 online?
The EPF81500ARC240-3 can be purchased from authorized distributors including DigiKey, Heisener, Octopart, and G2 Electronics, with current stock observed at several distributors (e.g. Heisener listed 6,132 pieces, G2 Electronics 3,663 pieces). As of 2026-09-12, prices vary widely; check distributor listings for live pricing and lead times.
What is the price of EPF81500ARC240-3?
As of 2026-09-12, the EPF81500ARC240-3 unit price ranges approximately from $25 (qty 1000) to $45 (qty 1) depending on distributor and quantity. Because this part is marked obsolete/end-of-life, prices fluctuate based on remaining distributor inventory rather than manufacturer list pricing.
What is the lead time for EPF81500ARC240-3?
Lead time for EPF81500ARC240-3 varies by distributor: Heisener advertises shipping within Jan 14-Jan 19 for orders placed now, while others quote 'ships immediately' for in-stock pieces. As of 2026-09-12, because the part is obsolete, lead times for large orders may extend significantly if inventory is depleted.
Is the EPF81500ARC240-3 still in production?
The EPF81500ARC240-3 is classified as obsolete/no longer in production by Altera/Intel. The FLEX 8000 family has been superseded by modern FPGA families such as Cyclone and MAX series. Current availability is limited to distributor remaining stock, with last-time-buy typically already passed.
What is the best drop-in replacement for EPF81500ARC240-3?
The closest drop-in alternatives to EPF81500ARC240-3 are other EPF81500 variants in the same 240-RQFP package, such as EPF81500ARC240-2 (slower speed grade) and EPF81500AQC240-3 (commercial speed grade). For new designs, consider modern Intel/Altera equivalents such as Cyclone series FPGAs, noting that these require PCB redesign and HDL port.
EPF81500ARC240-3 vs EPF81500AQC240-3 - which is better for new designs?
EPF81500ARC240-3 and EPF81500AQC240-3 share the same FLEX 8000 silicon (16K gates, 181 I/O, 1296 logic cells) and 240-pin package; the suffix difference is speed grade (A vs standard) and pin/lead finish. Neither is "better"; they target different operating conditions. For new designs, however, both are obsolete - consider Cyclone or MAX FPGA families instead.
What package does EPF81500ARC240-3 use?
The EPF81500ARC240-3 uses a 240-BFQFP Exposed Pad package (also referred to as 240-RQFP) measuring approximately 32 mm x 32 mm with 0.5 mm pitch. The exposed thermal pad on the bottom of the package provides a low-thermal-resistance path for heat dissipation when soldered to the PCB.
What configuration devices are compatible with EPF81500ARC240-3?
According to the FLEX 8000 datasheet, the EPF81500ARC240-3 is compatible with Altera serial configuration devices EPC1, EPC1213, EPC1064, and EPC1441, plus industry-standard parallel EPROMs and JTAG boundary-scan configuration. Configuration occurs at system power-up using data stored in these non-volatile memories.
What are the key specifications of EPF81500ARC240-3 that engineers should know?
The EPF81500ARC240-3 key specifications are: 16,000 usable gates, 1,296 logic cells, 1,500 flip-flops, 181 user I/O, 162 LABs, 12 EABs, 5V VCCINT, 3.3V/5V VCCIO, 125 MHz max frequency (speed grade -3), 240-RQFP package, and SRAM configuration via EPC1/EPC1213/EPC1064/EPC1441 or parallel EPROM.

工程参考数据: EPF81500ARC240-3 ——对比、设计指导和合规信息。

选型指南

Choose EPF81500ARC240-3 when you need a FLEX 8000 FPGA with 16K gates, 181 I/O, and 125 MHz performance in industrial temperature range, and you must match an existing 240-RQFP PCB layout. For lower-cost designs where 100 MHz timing is sufficient, choose EPF81500ARC240-2 (slower speed grade, same footprint). For commercial-temperature designs, choose EPF81500AQC240-3 (same speed grade, commercial temp). For highest FLEX 8000 performance in this package, choose EPF81500AQC240-4 (speed grade -4). All variants share the 240-BFQFP exposed pad footprint, enabling PCB layout reuse across speed and temperature grades. Note: FLEX 8000 is obsolete; for new designs consider Intel Cyclone IV or Cyclone 10 LP families.

与替代料对比

参数 本产品 EPF81500ARC240-2 EPF81500AQC240-3 EPF81500AQC240-4 EPF81500AQC240-2
Brand Intel (formerly Altera) Intel Intel Intel Intel
Package 240-BFQFP Exposed Pad (240-RQFP) 240-BFQFP Exposed Pad (240-RQFP) 240-BFQFP Exposed Pad (240-RQFP) 240-BFQFP Exposed Pad (240-RQFP) 240-BFQFP Exposed Pad (240-RQFP)
Family FLEX 8000 FLEX 8000 FLEX 8000 FLEX 8000 FLEX 8000
Usable Gates 16,000 16,000 16,000 16,000 16,000
Logic Cells 1296 1296 1296 1296 1296
User I/O 181 181 181 181 181
Speed Grade -3 (125 MHz) -2 (~100 MHz) -3 (125 MHz) -4 (~150 MHz) -2 (~100 MHz)
Temperature Grade Industrial (A suffix) Industrial Commercial Commercial Commercial
Process / VCCINT 0.42 µm CMOS / 5V 0.42 µm CMOS / 5V 0.42 µm CMOS / 5V 0.42 µm CMOS / 5V 0.42 µm CMOS / 5V

关键差异点

  • Same silicon with different speed grade within FLEX 8000 family (对比 EPF81500ARC240-2)
  • Industrial temperature grade option (对比 EPF81500AQC240-3)
  • Higher performance option in same package (对比 EPF81500AQC240-4)

设计说明

The EPF81500ARC240-3 requires a stable 5V VCCINT supply and a separate VCCIO rail (3.3V or 5V). Place 0.1 µF decoupling capacitors as close as possible to every VCCINT/VCCIO pin pair, plus bulk 10-47 µF tantalum or ceramic capacitors near the package. According to FLEX 8000 datasheet guidelines, supply voltage must ramp monotonically from 0V to nominal during power-up to avoid latch-up or partial configuration. Use a supervisor IC (e.g. TL7705 or equivalent) to monitor VCCINT and hold nCONFIG low until all rails are stable.

The 240-RQFP Exposed Pad package requires a PCB thermal land pattern with at least 9 thermal vias (0.3 mm drill, 0.5 mm pitch) connecting the exposed pad to an internal copper plane. Estimated: with all 181 I/O toggling at 125 MHz, core dissipation is approximately 0.5-1.5 W; without the exposed pad soldered, junction temperature may exceed 100 °C in still air. Recommended copper area is at least 1 square inch on top plus 4 square inches on internal ground plane.

Route all configuration signals (DCLK, DATA0, nCONFIG, nSTATUS, CONF_DONE, MSEL[0:2]) as short and direct as possible. Keep DCLK traces length-matched if multiple FPGAs share a configuration chain. The 240-RQFP at 0.5 mm pitch requires precise PCB fabrication (laser-drilled or fine-pitch capable processes). Use a 4-layer PCB with continuous ground plane beneath the FPGA for signal integrity and EMI suppression.

Do not leave MSEL[0:2] floating - they must be tied to VCCINT or GND to select the correct configuration mode (e.g. 000 = PS mode with EPC1, 010 = AS mode). nSTATUS and CONF_DONE are open-drain outputs and require external pull-up resistors (typically 10 kΩ to VCCINT). Do not confuse EPF81500 (16K gates, 1296 cells, 181 I/O) with EPF81188 or EPF6010/6016/6024 - these are different FLEX 8000 family members with different logic capacities.

合规信息

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
无铅
Unknown
无卤
Unknown
冲突矿物
Unknown

FLEX 8000 family predates widespread RoHS adoption; specific compliance status for EPF81500ARC240-3 should be verified per lot via manufacturer declaration letter. AEC-Q100 not applicable (FPGA, not automotive-grade qualified).

数据核验日期: 2026-09-12 ——数据由 XAIPART 元器件工程团队核验和整理

相关搜索

EPF81500ARC240-3 EPF81500ARC240-3 datasheet Intel EPF81500ARC240-3 Altera FLEX 8000 16K gates FPGA 240-RQFP FPGA 181 I/O EPF81500ARC240-3 price EPF81500ARC240-3 buy EPF81500ARC240-3 replacement EPF81500ARC240-3 vs EPF81500AQC240-3 FLEX 8000 obsolete alternative EPC1 EPC1441 configuration device FLEX 8000 what is a drop-in replacement for EPF81500ARC240-3

相关元器件 & 术语

Intel Altera EPF81500ARC240-3 EPF81500ARC240-2 EPF81500AQC240-3 EPF81500AQC240-4 FPGA Field-Programmable Gate Array FLEX 8000 programmable logic CPLD SRAM-based configuration Logic Array Block (LAB) Embedded Array Block (EAB) RQFP 240-BFQFP exposed pad 5V VCCINT 3.3V VCCIO multi-volt I/O JTAG boundary scan EPC1 configuration device EPC1441 EPC1064 EPC1213 in-circuit reconfigurability (ICR) industrial automation telecommunications line card ASIC prototyping
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