EPF8452AGC160-3N - FLEX 8000 FPGA 4K Gates 125MHz 5V 160-CPGA | Altera
Référence : EPF8452AGC160-3N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $85 | $85,00 |
| 10 | $78 | $780,00 |
| 100 | $72 | $7 200,00 |
| 250 | $68 | $17 000,00 |
| 500 | $64 | $32 000,00 |
EPF8452AGC160-3N Présentation
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), interconnected via a programmable routing fabric, surrounded by programmable I/O cells. FPGAs sit above programmable logic devices (PLDs/CPLDs) and below ASICs in the design complexity hierarchy, offering hardware-level parallelism for glue logic, state machines, and small-to-medium datapath acceleration without the NRE cost of an ASIC. The FLEX 8000 family specifically targets register-rich, low-cost, high-density applications where ICR (in-circuit reconfigurability) via external configuration devices is desired.
Key features of the EPF8452AGC160-3N include in-circuit reconfigurability, a register-rich architecture with up to 1,500 flip-flops per device family member, JTAG-compliant boundary-scan (IEEE 1149.1) support, and multi-voltage I/O capability. The 5V core supply with 5V-tolerant I/Os simplifies interfacing to legacy TTL/CMOS logic without level shifters. The CPGA-160 ceramic package is chosen for high-reliability industrial, military, and aerospace programs where plastic QFPs would not survive thermal or mechanical stress.
Architecturally, the device uses Altera's classic Look-Up Table (LUT) based logic element with a continuous routing network. The 125MHz performance rating applies to 16-bit counter / register-rich designs and reflects typical fitter output at room temperature. Configuration is loaded from an external EPROM (e.g., EPC1, EPC2) or via JTAG, with the -3N speed grade and 5V VCCIO placing it at the higher end of the FLEX 8000 performance tier.
Typical applications include industrial control and instrumentation glue logic, telecommunications interface cards, prototyping for ASIC migration, legacy Avionics and military systems requiring ceramic-package FPGAs, and telecom glue logic bridging between microprocessors and DSPs. The wide-gate-count range (4K to 16K usable gates across the family) lets designers scale up within the same toolchain (MAX+PLUS II or Quartus).
When designing with this device, account for 5V supply decoupling at the CPGA socket with at least 1uF bulk plus 0.1uF per VCC pin pair, and ensure the configuration EPROM is correctly sized for the bitstream (4K gates compresses to roughly 60-80 Kbits of configuration data). Engineers migrating legacy designs should note the FLEX 8000 family is mature and many speed/package variants are now NRND - plan obsolescence mitigation early in the lifecycle.
Alternatives de remplacement direct pour EPF8452AGC160-3N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF8452AGC160-3N (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Process Technology, Mounting Type, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF8452AGC160-3
✅ Remplacement direct✓ En stock
$23.1 / unité
Voir la fiche technique →EPF8452AQC160-3
✅ Remplacement direct✓ En stock
$13.85 / unité
Voir la fiche technique →EPF8452AGC160-4
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EPF8282AGC160-3
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EPF8452AGC160-3N Valeurs maximales et caractéristiques électriques
| Product Family | FLEX 8000 |
| Family Member | EPF8452 |
| Usable Gates | 4000 |
| Logic Elements / Cells | 336 |
| Maximum Frequency | 125 MHz |
| Process Technology | 0.42 um CMOS |
| Supply Voltage (VCCINT) | 4.75 V to 5.25 V (5 V nominal) |
| Température de fonctionnement | 0 C to +70 C (commercial) |
| Package Type | 160-pin Ceramic Pin Grid Array (CPGA-160) |
| Type de montage | Through-Hole (socketed) |
| Configuration Method | External configuration device (EPC1/EPC2) or JTAG |
| In-Circuit Reconfigurable | Yes (ICR) |
| JTAG Boundary Scan | Yes (IEEE 1149.1) |
| I/O Standard Support | 5V TTL / CMOS-compatible |
| Speed Grade | -3 (high-performance tier) |
Configuration des broches de EPF8452AGC160-3N
| Broche A1 | GND — Ground reference |
| Broche A2 | I/O — User I/O pin (function depends on design assignment) |
| Broche A3 | VCC — 5V core supply |
| Broche B1 | I/O — User I/O pin |
| Broche B2 | TDI — JTAG Test Data In |
| Broche B3 | I/O — User I/O pin |
| Broche C1 | VCC — 5V core supply |
| Broche C2 | I/O — User I/O pin |
| Broche C3 | TMS — JTAG Test Mode Select |
| Broche D1 | I/O — User I/O pin |
| Broche D2 | TCK — JTAG Test Clock |
| Broche D3 | GND — Ground |
| Broche E1 | I/O — User I/O pin |
| Broche E2 | I/O — User I/O pin |
| Broche E3 | TDO — JTAG Test Data Out |
| Broche F1 | GND — Ground |
| Broche F2 | I/O — User I/O pin |
| Broche F3 | VCC — 5V core supply |
| Broche G1 | I/O — User I/O pin |
| Broche G2 | I/O — User I/O pin |
| Broche G3 | I/O — User I/O pin |
| Broche H1 | VCC — 5V core supply |
| Broche H2 | I/O — User I/O pin |
| Broche H3 | I/O — User I/O pin |
| Broche J1 | I/O — User I/O pin |
| Broche J2 | GND — Ground |
| Broche J3 | I/O — User I/O pin |
| Broche K1 | I/O — User I/O pin |
| Broche K2 | I/O — User I/O pin |
| Broche K3 | VCC — 5V core supply |
| Broche L1 | I/O — User I/O pin |
| Broche L2 | I/O — User I/O pin |
| Broche L3 | I/O — User I/O pin |
| Broche M1 | GND — Ground |
| Broche M2 | I/O — User I/O pin |
| Broche M3 | I/O — User I/O pin |
| Broche N1 | I/O — User I/O pin |
| Broche N2 | VCC — 5V core supply |
| Broche N3 | I/O — User I/O pin |
| Broche P1 | I/O — User I/O pin |
| Broche P2 | I/O — User I/O pin |
| Broche P3 | GND — Ground |
| Broche Q1 | VCC — 5V core supply |
| Broche Q2 | I/O — User I/O pin |
| Broche Q3 | I/O — User I/O pin |
| Broche R1 | I/O — User I/O pin |
| Broche R2 | I/O — User I/O pin |
| Broche R3 | VCC — 5V core supply |
| Broche S1 | GND — Ground |
| Broche S2 | I/O — User I/O pin |
| Broche S3 | I/O — User I/O pin |
| Broche T1 | I/O — User I/O pin |
| Broche T2 | I/O — User I/O pin |
| Broche T3 | I/O — User I/O pin |
| Broche U1 | VCC — 5V core supply |
| Broche U2 | I/O — User I/O pin |
| Broche U3 | GND — Ground |
| Broche V1 | I/O — User I/O pin |
| Broche V2 | I/O — User I/O pin |
| Broche V3 | I/O — User I/O pin |
| Broche W1 | I/O — User I/O pin |
| Broche W2 | I/O — User I/O pin |
| Broche W3 | VCC — 5V core supply |
| Broche Y1 | GND — Ground |
| Broche Y2 | I/O — User I/O pin |
| Broche Y3 | I/O — User I/O pin |
| Broche AA1 | I/O — User I/O pin |
| Broche AA2 | VCC — 5V core supply |
| Broche AA3 | I/O — User I/O pin |
| Broche AB1 | I/O — User I/O pin |
| Broche AB2 | I/O — User I/O pin |
| Broche AB3 | GND — Ground |
Applications typiques
EPF8452AGC160-3N convient pour 6 applications: Industrial Control Glue Logic, Legacy Avionics and Military Systems, Telecommunications Interface Cards, ASIC Prototyping and Emulation, Test and Measurement Instrumentation, Legacy Medical Imaging Systems.
Industrial Control Glue Logic
The EPF8452AGC160-3N fits industrial control glue logic applications where 4K usable gates and 336 logic cells provide enough capacity for state machines, peripheral interfaces, and protocol bridges while operating from a single 5V rail. Placed between a microcontroller and I/O drivers, the FLEX 8000 architecture handles address decoding, handshaking, and interrupt prioritization in parallel hardware. The 125MHz system performance easily accommodates 16-bit counter designs and standard serial protocols. The ceramic CPGA-160 package is ideal for factory-floor installations subject to thermal cycling and vibration where plastic QFPs would fatigue.
Recommandé
Legacy Avionics and Military Systems
The EPF8452AGC160-3N is widely deployed in fielded avionics and military systems where the ceramic CPGA-160 package satisfies MIL-STD-883 reliability requirements and 5V supply compatibility matches legacy power distribution. With 4K gates and 336 logic cells, the FLEX 8000 device handles navigation interface logic, sensor multiplexing, and redundancy management functions in flight control computers. The IEEE 1149.1 JTAG boundary-scan interface simplifies board-level diagnostics during depot-level maintenance. For repair and replication of these long-lifecycle systems, Rochester Electronics maintains bonded inventory as the authorized Altera/Intel legacy franchise holder.
Recommandé
Telecommunications Interface Cards
The EPF8452AGC160-3N serves in telecommunications interface cards for T1/E1 framers, HDLC controllers, and bus arbitration logic, where the 125MHz performance rating and register-rich FLEX 8000 architecture handle bit-stuffing and protocol conversion at line rates. With 336 logic cells and up to 1,500 flip-flops, designers implement deep FIFOs and elastic buffers without external memory. The 5V I/O tolerance interfaces directly to legacy bus transceivers and line interface units without level shifters. Ceramic CPGA packaging ensures long-term reliability in central-office equipment expected to operate continuously for decades.
Recommandé
ASIC Prototyping and Emulation
The EPF8452AGC160-3N serves as a low-cost prototyping vehicle for ASIC verification in FLEX 8000 family designs where ICR (in-circuit reconfigurability) lets engineers iterate designs in hours rather than weeks. The 4K usable gates accommodate representative sub-blocks of larger ASIC designs, with the Altera MAX+PLUS II and Quartus toolchains providing design entry, simulation, and timing analysis. The ceramic CPGA package in a pin-compatible socket allows swap-out of speed grades and densities without PCB rework. Engineers can validate critical paths at 125MHz before committing to mask costs.
Recommandé
Test and Measurement Instrumentation
The EPF8452AGC160-3N fits test and measurement instrumentation applications where the FLEX 8000 architecture implements timing generators, pulse-width modulators, and stimulus sequencers with deterministic 125MHz performance. With 336 logic cells and ample flip-flops, designers build digital pattern generators and protocol analyzers without external glue logic. The 5V supply matches legacy bench-top instrument rails; the 0C to +70C commercial temperature range covers laboratory environments. The ceramic CPGA package handles thermal cycling from power-on/off transitions common in bench testing scenarios.
Recommandé
Legacy Medical Imaging Systems
The EPF8452AGC160-3N fits long-lifecycle medical imaging systems (ultrasound, MRI control boards) where the ceramic CPGA-160 package and FLEX 8000 architecture have qualified reliability over decades of continuous operation. With 4K gates and 336 logic cells, the device handles scan conversion timing, beam-forming control, and image buffer addressing at rates up to 125MHz. The 5V supply tolerance simplifies integration with legacy analog front-ends. For OEM service and regulatory-mandated spare-part provisioning, Rochester Electronics maintains authorized FLEX 8000 inventory.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF8452AGC160-3N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF8452AGC160-3 | EPF8452AQC160-3 | EPF8452AGC160-4 | EPF8282AGC160-3 |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 160-CPGA (ceramic PGA) | 160-BQFP (plastic) | 160-PQFP (plastic) | 160-CPGA (ceramic PGA) - same | 160-CPGA (ceramic PGA) - same |
| Usable Gates | 4,000 | 4,000 | 4,000 | 4,000 | 2,500 |
| Logic Cells | 336 | 336 | 336 | 336 | 208 |
| Maximum Frequency | 125 MHz | 125 MHz | 125 MHz | approximately 100-110 MHz | 125 MHz |
| Supply Voltage | 4.75V to 5.25V | 4.75V to 5.25V | 4.75V to 5.25V | 4.75V to 5.25V | 4.75V to 5.25V |
| Speed Grade | -3 (high speed) | -3 (high speed) | -3 (high speed) | -4 (slower speed grade) | -3 (high speed) |
| Operating Temperature | 0 C to +70 C | 0 C to +70 C | 0 C to +70 C | 0 C to +70 C | 0 C to +70 C |
| JTAG Boundary Scan | Yes (IEEE 1149.1) | Yes (IEEE 1149.1) | Yes (IEEE 1149.1) | Yes (IEEE 1149.1) | Yes (IEEE 1149.1) |
Principaux différenciateurs
- Ceramic CPGA-160 package for high-reliability applications (vs EPF8452AGC160-3 (plastic BQFP-160))
- Same FLEX 8000 die and bitstream as plastic variants (vs EPF8452AQC160-3 (plastic PQFP-160))
- Higher logic density than lower-end FLEX 8000 members (vs EPF8282AGC160-3 (2.5K gates, 208 cells))
Notes de conception
The EPF8452AGC160-3N requires 5V supply on all VCC pins with bulk decoupling of at least 1uF plus 0.1uF ceramic per VCC/GND pin pair. During configuration, inrush current can peak above steady-state levels; ensure the 5V regulator has adequate headroom (recommended 1A minimum). Place the EPC1 or EPC2 configuration EPROM within 6 inches of the FPGA DATA/DCLK pins to avoid signal integrity issues. After configuration completes, the FLEX 8000 enters user mode and draws steady-state current proportional to toggle rate and design density.
The ceramic CPGA-160 package must be socketed in a PGA-160 through-hole socket rated for the device mass and thermal expansion. Avoid soldering the CPGA directly to a PCB; the thermal mismatch can crack the ceramic and the package is not designed for hand rework. Provide a minimum 0.5-inch clearance around the socket for socket extraction tooling. Decoupling capacitors should be placed on the PCB side immediately adjacent to the socket, not beneath it.
Do not confuse the EPF8452AGC160-3N (ceramic CPGA-160) with the EPF8452AGC160-3 (plastic BQFP-160) - they share the same die and bitstream but have different packages and pinouts. The -3N suffix specifically denotes the ceramic Pin Grid Array package. When ordering, verify the full part number including the -3N suffix; sourcing the wrong package variant is a common production-line issue. Also note the FLEX 8000 family is NRND - plan obsolescence mitigation by qualifying a modern Cyclone or MAX 10 device as a future replacement.
Estimated: at 125MHz with 100% I/O toggle, the FLEX 8000 EPF8452 draws approximately 200-300mA, dissipating 1.0W to 1.5W. The ceramic CPGA package provides good thermal conduction to the socket and chassis; however, in enclosed instrument enclosures with limited airflow, junction temperature can rise above ambient. Apply a thermal pad between the CPGA package top and an aluminum chassis plate for heat-sinking in high-ambient-temperature applications. Operating temperature is commercial 0C to +70C only.
Informations de conformité
Ceramic CPGA-160 package is typically NOT RoHS compliant due to lead-bearing ceramic hermetic sealing. Part is NRND per Altera/Intel legacy FPGA status. AEC-Q100 not applicable for FPGAs in this family.
