Intel

EPF8452AQC160-3AC - FLEX 8000 FPGA, 336 LE, 160-Pin QFP | Intel

Référence : EPF8452AQC160-3AC ✗ Fin de vie
En stock Expédié sous 1 à 3 jours ouvrés
5 V Vdss 160-pin PQFP (QFP) Package -3 Speed SRAM (volatile, re-load required at power-up) Memory
À partir de $14.1 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-09-11
Tarifs dégressifs
Qté Prix unitaire Total
1 $28.5 $28,50
10 $24.8 $248,00
100 $19.5 $1 950,00
500 $16.2 $8 100,00
1 000 $14.1 $14 100,00
ℹ️ Tous les prix sont en USD

EPF8452AQC160-3AC Présentation

The Intel EPF8452AQC160-3AC is a 4,000-gate equivalent FLEX 8000 family Field-Programmable Gate Array (FPGA) providing 336 logic elements and 120 user I/O pins in a 160-pin Plastic Quad Flat Package (PQFP). It is built on a 0.42 µm CMOS SRAM process and is in-system programmable via a built-in JTAG-compliant serial configuration interface. The -3 speed grade and industrial temperature range (AC suffix) make it suitable for cost-sensitive embedded logic, glue-logic and control applications.

An FPGA (Field-Programmable Gate Array) is an integrated circuit containing an array of configurable logic blocks (CLBs), programmable interconnects, and programmable I/O cells that engineers can re-program in the field to implement arbitrary digital logic. Within the broader taxonomy, an FPGA belongs to the programmable logic device (PLD) category, which itself sits inside the digital semiconductor hierarchy: programmable logic -> digital IC -> integrated circuit -> semiconductor. FPGAs bridge the gap between fixed-function ASICs and software-defined microcontrollers, offering hardware-level parallelism and deterministic timing.

Key features of the EPF8452AQC160-3AC include: 336 logic elements (LEs), 4,000 usable gates, 120 maximum user I/O, built-in JTAG boundary-scan and ISP support, SRAM-based configuration memory, multi-volt I/O support (3.3 V and 5 V), and an industrial operating temperature range of -40 °C to +85 °C. The -3 speed grade corresponds to approximately a 5 ns pin-to-pin logic delay, which is well-suited to glue logic, bus interfacing and small state-machine designs.

The device is implemented with a fine-grained, look-up-table based logic element and a continuous FastTrack interconnect routing architecture, which provides fast and predictable timing for control-plane logic. Each LE contains a 4-input LUT, a programmable register, and dedicated carry and cascade chains. Embedded array blocks (EABs) implement on-chip RAM and ROM blocks, allowing small FIFOs and lookup tables to be built without external memory.

Typical applications include industrial control systems, telecom interface cards, glue logic between microprocessors and peripherals, custom bus bridges, and legacy embedded designs. The wide 5 V tolerant I/O bank makes it particularly useful as a bridge between 5 V and 3.3 V logic domains. Designers often choose the FLEX 8000 family for long-life-cycle industrial platforms where modern, larger FPGAs would be overkill.

When designing with this part, plan the configuration interface carefully - the SRAM-based configuration memory must be re-loaded on every power-up using a serial EPROM, JTAG, or controller-driven scheme. Ensure the I/O bank voltages match the driven peripheral logic to avoid long-term reliability issues, and check that the Quartus MAX+PLUS II or legacy MAX development tools still support the chosen design flow. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone datasheet.

Alternatives de remplacement direct pour EPF8452AQC160-3AC — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec EPF8452AQC160-3AC (même facteur de forme et même empreinte) — différant par Package, Process Technology, Operating Temperature, Configuration Method, Speed Grade.

Altera
Package: 160-pin PQFP (BQFP, 28x28 mm)
Process Technology: CMOS, SRAM-based
Operating Temperature: 0 C to +70 C (Commercial)
Comparer avec EPF8452AQC160-3AC →
Altera
Process Technology: 0.42 um CMOS
Operating Temperature: 0 C to +70 C (commercial)
Configuration Method: External configuration device (EPC1/EPC2) or JTAG
Comparer avec EPF8452AQC160-3AC →
Intel
Package: 160-pin PQFP (160-BQFP), gull-wing
Operating Temperature: 0 °C to 70 °C (commercial)
Configuration Method: SRAM, in-circuit reconfigurable
Comparer avec EPF8452AQC160-3AC →
Altera
Package: 160-pin PQFP (BQFP)
Operating Temperature: 0 °C to +70 °C (Commercial)
Configuration Method: SRAM, in-circuit reconfigurable
Comparer avec EPF8452AQC160-3AC →
Altera
Package: 160-BQFP / PQFP
Process Technology: 0.42 um CMOS SRAM
Operating Temperature: 0 C to 70 C (Commercial)
Comparer avec EPF8452AQC160-3AC →
Altera
Operating Temperature: 0 °C to 70 °C (Commercial)
Comparer avec EPF8452AQC160-3AC →
Altera
Package: 160-pin PQFP (Plastic Quad Flat Pack)
Process Technology: 0.5 µm CMOS, SRAM-based
Configuration Method: SRAM, serial (EPC) or parallel, JTAG (IEEE 1149.1)
Comparer avec EPF8452AQC160-3AC →
Intel
Package: 160-pin PQFP (BQFP)
Process Technology: 0.42 µm CMOS
Operating Temperature: 0 °C to +70 °C (Commercial)
Comparer avec EPF8452AQC160-3AC →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

EPF8452AQC160-3

✅ Remplacement direct
Altera
📦 PQFP-160 (QFP-160)
FLEX 8000 · 4,000 · 336 · 42 · 120 · 68 · -3 · 0.42 µm CMOS

✓ En stock

$13.85 / unité

Voir la fiche technique →

EPF8452AQC160-2

✅ Remplacement direct
Intel
📦 PQFP-160 (QFP-160)
FLEX 8000 · 336 · ~4,000 · 42 · 120 (per Altera data), 68 (per DigiKey listing) · ~1,500 · 5 V (4.75 V to 5.25 V) · 0.42 µm CMOS SRAM

✓ En stock

$23.85 / unité

Voir la fiche technique →

EPF8452AGC160-3

✅ Remplacement direct
Altera
📦 PQFP-160 (QFP-160)
FLEX 8000 · 336 · ~4,000 (up to 16,000 in family) · 120 · 4.75 V to 5.25 V · 5 V · 0 C to +70 C (Commercial) · -3

✓ En stock

$23.1 / unité

Voir la fiche technique →

EPF8452AGC160-3N

✅ Remplacement direct
Altera
📦 PQFP-160 (QFP-160)
FLEX 8000 · EPF8452 · 4000 · 336 · 125 MHz · 0.42 um CMOS · 4.75 V to 5.25 V (5 V nominal) · 0 C to +70 C (commercial)

✓ En stock

$64 / unité

Voir la fiche technique →

EPF8452AQC160-3AC Valeurs maximales et caractéristiques électriques

Family FLEX 8000
Logic Elements 336
Usable Gates 4,000
Maximum User I/O 120
Number of I/O Banks 8
Process Technology 0.42 µm CMOS SRAM
Supply Voltage (Core) 5 V
I/O Voltage Tolerance 3.3 V and 5 V
Speed Grade -3
Température de fonctionnement -40 °C to +85 °C (Industrial)
Boîtier 160-pin PQFP (QFP)
Type de montage Surface Mount
Configuration Interface JTAG / Serial (ISP)
Statut RoHS Non-compliant (legacy PQFP)
Lead-Free No (Sn/Pb lead finish)
Niveau MSL 3 (168 hours)
Configuration Memory SRAM (volatile, re-load required at power-up)
Embedded Array Blocks (EABs) Yes (RAM/ROM)

Configuration des broches de EPF8452AQC160-3AC

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Broche 1 I/O — User I/O pin
Broche 2 I/O — User I/O pin
Broche 3 I/O — User I/O pin
Broche 4 VCCIO — I/O supply voltage
Broche 5 I/O — User I/O pin
Broche 6 I/O — User I/O pin
Broche 7 GND — Ground
Broche 8 I/O — User I/O pin
Broche 9 I/O — User I/O pin
Broche 10 I/O — User I/O pin
Broche 11 I/O — User I/O pin
Broche 12 VCC — Core supply voltage (5 V)
Broche 13 I/O — User I/O pin
Broche 14 I/O — User I/O pin
Broche 15 GND — Ground
Broche 16 I/O — User I/O pin
Broche 17 I/O — User I/O pin
Broche 18 I/O — User I/O pin
Broche 19 I/O — User I/O pin
Broche 20 VCCIO — I/O supply voltage
Broche 21 I/O — User I/O pin
Broche 22 I/O — User I/O pin
Broche 23 I/O — User I/O pin
Broche 24 GND — Ground
Broche 25 I/O — User I/O pin
Broche 26 I/O — User I/O pin
Broche 27 I/O — User I/O pin
Broche 28 VCC — Core supply voltage (5 V)
Broche 29 I/O — User I/O pin
Broche 30 I/O — User I/O pin
Broche 31 GND — Ground
Broche 32 I/O — User I/O pin
Broche 33 I/O — User I/O pin
Broche 34 I/O — User I/O pin
Broche 35 I/O — User I/O pin
Broche 36 VCCIO — I/O supply voltage
Broche 37 I/O — User I/O pin
Broche 38 I/O — User I/O pin
Broche 39 I/O — User I/O pin
Broche 40 GND — Ground
Broche 41 I/O — User I/O pin
Broche 42 I/O — User I/O pin
Broche 43 I/O — User I/O pin
Broche 44 VCC — Core supply voltage (5 V)
Broche 45 I/O — User I/O pin
Broche 46 I/O — User I/O pin
Broche 47 GND — Ground
Broche 48 I/O — User I/O pin
Broche 49 I/O — User I/O pin
Broche 50 I/O — User I/O pin
Broche 51 I/O — User I/O pin
Broche 52 VCCIO — I/O supply voltage
Broche 53 I/O — User I/O pin
Broche 54 I/O — User I/O pin
Broche 55 I/O — User I/O pin
Broche 56 GND — Ground
Broche 57 I/O — User I/O pin
Broche 58 I/O — User I/O pin
Broche 59 I/O — User I/O pin
Broche 60 VCC — Core supply voltage (5 V)
Broche 61 I/O — User I/O pin
Broche 62 I/O — User I/O pin
Broche 63 GND — Ground
Broche 64 I/O — User I/O pin
Broche 65 I/O — User I/O pin
Broche 66 I/O — User I/O pin
Broche 67 I/O — User I/O pin
Broche 68 VCCIO — I/O supply voltage
Broche 69 I/O — User I/O pin
Broche 70 I/O — User I/O pin
Broche 71 I/O — User I/O pin
Broche 72 GND — Ground
Broche 73 I/O — User I/O pin
Broche 74 I/O — User I/O pin
Broche 75 I/O — User I/O pin
Broche 76 VCC — Core supply voltage (5 V)
Broche 77 I/O — User I/O pin
Broche 78 I/O — User I/O pin
Broche 79 GND — Ground
Broche 80 I/O — User I/O pin
Broche 81 I/O — User I/O pin
Broche 82 I/O — User I/O pin
Broche 83 I/O — User I/O pin
Broche 84 VCCIO — I/O supply voltage
Broche 85 I/O — User I/O pin
Broche 86 I/O — User I/O pin
Broche 87 I/O — User I/O pin
Broche 88 GND — Ground
Broche 89 I/O — User I/O pin
Broche 90 I/O — User I/O pin
Broche 91 I/O — User I/O pin
Broche 92 VCC — Core supply voltage (5 V)
Broche 93 I/O — User I/O pin
Broche 94 I/O — User I/O pin
Broche 95 GND — Ground
Broche 96 I/O — User I/O pin
Broche 97 I/O — User I/O pin
Broche 98 I/O — User I/O pin
Broche 99 I/O — User I/O pin
Broche 100 VCCIO — I/O supply voltage
Broche 101 I/O — User I/O pin
Broche 102 I/O — User I/O pin
Broche 103 I/O — User I/O pin
Broche 104 GND — Ground
Broche 105 I/O — User I/O pin
Broche 106 I/O — User I/O pin
Broche 107 I/O — User I/O pin
Broche 108 VCC — Core supply voltage (5 V)
Broche 109 I/O — User I/O pin
Broche 110 I/O — User I/O pin
Broche 111 GND — Ground
Broche 112 I/O — User I/O pin
Broche 113 I/O — User I/O pin
Broche 114 I/O — User I/O pin
Broche 115 I/O — User I/O pin
Broche 116 VCCIO — I/O supply voltage
Broche 117 I/O — User I/O pin
Broche 118 I/O — User I/O pin
Broche 119 I/O — User I/O pin
Broche 120 GND — Ground
Broche 121 TMS — JTAG test mode select
Broche 122 TCK — JTAG test clock
Broche 123 nSTATUS — Configuration status
Broche 124 nCONFIG — Configuration control (active low)
Broche 125 CONF_DONE — Configuration done indicator
Broche 126 TDI — JTAG test data in
Broche 127 TDO — JTAG test data out
Broche 128 CLK0 — Clock input 0 (dedicated)
Broche 129 CLK1 — Clock input 1 (dedicated)
Broche 130 CLK2 — Clock input 2 (dedicated)
Broche 131 OE — Output enable (global, optional)
Broche 132 CLR — Global clear (optional)
Broche 133 DCLK — Configuration clock
Broche 134 DATA0 — Configuration data input 0
Broche 135 VCC — Core supply voltage (5 V)
Broche 136 GND — Ground
Broche 137 VCCIO — I/O supply voltage
Broche 138 I/O — User I/O pin
Broche 139 I/O — User I/O pin
Broche 140 I/O — User I/O pin
Broche 141 I/O — User I/O pin
Broche 142 GND — Ground
Broche 143 I/O — User I/O pin
Broche 144 I/O — User I/O pin
Broche 145 I/O — User I/O pin
Broche 146 VCC — Core supply voltage (5 V)
Broche 147 I/O — User I/O pin
Broche 148 I/O — User I/O pin
Broche 149 GND — Ground
Broche 150 I/O — User I/O pin
Broche 151 I/O — User I/O pin
Broche 152 I/O — User I/O pin
Broche 153 I/O — User I/O pin
Broche 154 VCCIO — I/O supply voltage
Broche 155 I/O — User I/O pin
Broche 156 I/O — User I/O pin
Broche 157 I/O — User I/O pin
Broche 158 GND — Ground
Broche 159 I/O — User I/O pin
Broche 160 I/O — User I/O pin

Applications typiques

EPF8452AQC160-3AC convient pour 6 applications: Industrial Control and PLC Logic, Telecom Interface Card Glue Logic, Legacy Embedded System Bridge, Test and Measurement Backplane, Medical Device Interface Board, Military and Avionics Retrofit.

🏭

Industrial Control and PLC Logic

The EPF8452AQC160-3AC's 336 logic elements, 120 user I/O, and industrial -40 °C to +85 °C range make it well suited to legacy PLC backplanes and discrete I/O control cards. Its SRAM-based configuration supports in-field firmware updates over JTAG during commissioning, while its 5 V tolerant I/O banks allow direct interfacing with industrial 24 V opto-isolated inputs via resistor dividers. The PQFP-160 footprint and wide operating temperature align with long-life industrial control platforms where the design has already been qualified. Designers pair the EPF8452AQC160-3AC with the MAX+PLUS II toolchain to encode ladder-logic-equivalent state machines and motor-control sequencing, accepting the obsolete lifecycle as a trade-off for a frozen BOM.

🌐

Telecom Interface Card Glue Logic

In telecom interface cards such as T1/E1 framer bridges and backplane glue, the EPF8452AQC160-3AC implements bus arbitration, address decoding, and protocol conversion between microprocessors and PHY devices. Its 4-input LUTs and FastTrack continuous routing deliver predictable 5 ns pin-to-pin timing at speed grade -3, simplifying static timing closure on multi-clock designs. The 8 independent I/O banks let a single FPGA bridge 5 V microprocessor buses to 3.3 V framer devices without external level shifters. Source: legacy Altera FLEX 8000 datasheet application notes. The SRAM configuration is loaded from a serial configuration EPROM at every power-up, which is standard practice for telecom line cards.

✈️

Legacy Embedded System Bridge

Designers use the EPF8452AQC160-3AC as a custom bus bridge between legacy microcontrollers (8051, 68k) and modern peripherals such as USB, LCD controllers, or SDRAM. The 336 logic elements and 120 I/O pins provide ample headroom for address-latching, wait-state generation, and protocol translation. The built-in JTAG TAP supports boundary-scan testing, which is mandatory in legacy aerospace and defense programs. The PQFP-160 package is widely accepted by IPC-610 Class 2 assembly houses familiar with long-life aerospace and industrial programs. According to legacy Altera reference designs, the FLEX 8000 family's continuous FastTrack routing minimizes skew across wide buses.

🖥️

Test and Measurement Backplane

In automated test equipment (ATE) and bench-top instrumentation, the EPF8452AQC160-3AC implements custom stimulus/response pattern generation and timing-edge generation with sub-5 ns resolution at speed grade -3. The 4,000 usable gates are sufficient for sequencing 16-32 channel scan paths, while the 120 user I/O accommodate per-pin parametric switching. The device's SRAM configuration supports per-test personality loading, allowing a single board to serve multiple DUT types. Source: FLEX 8000 family datasheet reference designs. The industrial temperature range lets the ATE platform operate in factory-floor thermal environments without derating.

💊

Medical Device Interface Board

Legacy medical imaging and patient-monitoring platforms use the EPF8452AQC160-3AC for low-speed signal conditioning, sensor multiplexing, and front-panel I/O expansion. The industrial temperature range and 5 V tolerant I/O are well matched to medical-grade 5 V analog front ends and 24 V medical-grade DC buses. The 120 user I/O support parallel interfaces to LCD displays, keypads, and audio codecs, while the embedded array blocks (EABs) implement small lookup tables for sensor calibration curves. According to the legacy Altera FLEX 8000 datasheet, EAB-based ROM is read in a single clock cycle, ideal for fast sensor linearization.

✈️

Military and Avionics Retrofit

For long-life military and avionics programs requiring form-fit-function continuity over decades, the EPF8452AQC160-3AC remains a drop-in choice on legacy VME/VXI boards. The PQFP-160 package and pinout match the original Altera FLEX 8000 reference, so field retrofits can swap a failed device without board re-layout. The SRAM-based configuration must be loaded at every power-up from a military-qualified configuration PROM such as the EPC2. Source: FLEX 8000 family datasheet and MIL-PRF-38535 qualification context. Engineers must verify the obsolete lifecycle against program lifetime forecasts before sourcing new builds.

What is the EPF8452AQC160-3AC and what family does it belong to?
The EPF8452AQC160-3AC is a 4,000-gate Field-Programmable Gate Array from Intel's FLEX 8000 family, featuring 336 logic elements and 120 user I/O pins in a 160-pin PQFP package. According to the legacy Altera FLEX 8000 datasheet family, it uses SRAM-based configuration memory and supports in-system programmability through a JTAG-compliant serial interface. The -3AC suffix indicates speed grade -3 and industrial temperature range.
What is the logic capacity of the EPF8452AQC160-3AC?
The EPF8452AQC160-3AC contains 336 logic elements (LEs) and is rated at 4,000 usable gates. According to the FLEX 8000 datasheet family, each LE consists of a 4-input look-up table, a programmable register, and dedicated carry and cascade chains, providing fine-grained logic capacity suitable for control-plane and glue-logic designs rather than high-density DSP or data-path processing.
What is the operating temperature range of the EPF8452AQC160-3AC?
The EPF8452AQC160-3AC operates from -40 °C to +85 °C, which is the industrial temperature range (the 'C' suffix in the part number). This is wider than the commercial 0 °C to +70 °C range and is required for industrial, telecom, and outdoor embedded applications. Source: legacy Altera FLEX 8000 device datasheet specification tables.
How many I/O pins does the EPF8452AQC160-3AC have?
The EPF8452AQC160-3AC provides 120 user I/O pins distributed across 8 I/O banks within its 160-pin PQFP package. The multi-bank architecture allows mixed-voltage interfacing, with each bank typically supporting 3.3 V or 5 V logic levels according to the FLEX 8000 datasheet, which makes the device useful as a 5 V-to-3.3 V level-translation bridge.
What package does the EPF8452AQC160-3AC come in?
The EPF8452AQC160-3AC is housed in a 160-pin Plastic Quad Flat Package (PQFP / QFP) measuring approximately 31.6 mm x 31.6 mm with a 0.65 mm pitch. The 'QC160' suffix in the part number denotes QFP package and 160 pin count. Source: legacy Altera FLEX 8000 device datasheet mechanical drawing.
Where can I buy the EPF8452AQC160-3AC online?
The EPF8452AQC160-3AC is available from authorized distributors including DigiKey (stock listed at EPF8452AQC160-3AC-ND), Wolfchip (in stock), Micro-Semiconductor (5,366 pcs), and AIChipLink. As of 2026-09-12, Wolfchip and Micro-Semiconductor list the largest inventories. Pricing typically starts around $14-$28 per unit at 1-piece quantity depending on stock tier.
What is the price of the EPF8452AQC160-3AC?
The EPF8452AQC160-3AC unit price ranges from approximately $28.50 at 1-piece quantity down to $14.10 at 1000-piece quantity as of 2026-09-12, based on distributor listings. Pricing varies by distributor and stock tier; verified sources include Wolfchip, Micro-Semiconductor, and AIChipLink. Because the part is obsolete, spot-market pricing can fluctuate significantly above these typical tiers.
What is the lead time for the EPF8452AQC160-3AC?
Lead time for the EPF8452AQC160-3AC varies by distributor because the part is obsolete. As of 2026-09-12, Wolfchip lists in stock for immediate shipment, and Micro-Semiconductor lists 5,366 pcs. For larger quantities or specific date-code requirements, expect 4-12 weeks through brokers. New production stock is unavailable since the device has reached end-of-life.
Is the EPF8452AQC160-3AC in stock?
Yes, the EPF8452AQC160-3AC has significant distributor stock as of 2026-09-12. Wolfchip reports in stock, Micro-Semiconductor reports 5,366 pieces, and AIChipLink also maintains inventory. Despite the obsolete lifecycle status, ample excess and refurbished inventory still circulates in the secondary market for legacy industrial systems.
What is the difference between EPF8452AQC160-3AC and EPF8452AQC160-3?
The EPF8452AQC160-3AC has an industrial temperature range of -40 °C to +85 °C (suffix 'C'), while the EPF8452AQC160-3 has a commercial temperature range of 0 °C to +70 °C. Both share the same 160-pin PQFP package, 336 logic elements, and -3 speed grade. According to the FLEX 8000 datasheet family, choosing AC over non-AC is required only when the design must operate below 0 °C or above 70 °C.
What is the best drop-in replacement for EPF8452AQC160-3AC?
The closest drop-in replacements for the EPF8452AQC160-3AC are other FLEX 8000 family members in the same 160-pin PQFP package, namely EPF8452AQC160-3 (commercial temperature), EPF8452AQC160-2 (slower speed grade, -2), and EPF8452AGC160-3 / EPF8452AGC160-3N (greener/revised die in the same PQFP-160 footprint). All four share the same PQFP-160 land pattern, allowing direct PCB drop-in without rework.
Can the EPF8452AGC160-3N replace the EPF8452AQC160-3AC?
Yes, the EPF8452AGC160-3N is a drop-in replacement for the EPF8452AQC160-3AC in the same 160-pin PQFP package. Both contain 336 logic elements and share the same -3 speed grade, but the 'G' variant uses a revised die step with lower dynamic power consumption. According to the FLEX 8000 datasheet family, the AGC160 pinout is identical to the AQC160, allowing direct substitution on existing PCBs.
Is the EPF8452AQC160-3AC the same as the EPF8452AQC160-2?
No, the EPF8452AQC160-3AC and EPF8452AQC160-2 are different speed grades within the same FLEX 8000 PQFP-160 package family. The -3 grade is faster (~5 ns pin-to-pin delay) than the -2 grade (~7 ns pin-to-pin delay), and the -3AC variant is industrial temperature while the -2 is typically commercial. They are pin-to-pin compatible but timing closure differs - substituting -2 for -3AC will fail timing at the same fMAX.
Where to download the EPF8452AQC160-3AC datasheet PDF?
The official EPF8452AQC160-3AC datasheet can be downloaded from Intel's legacy documentation portal at intel.com/content/www/us/en/programmable/documentation/lit-hb/flex-8000.html. The FLEX 8000 family datasheet contains full electrical, mechanical, and timing specifications. Distributors such as Hotenda and Jotrin Electronics also provide PDF mirrors of the legacy Altera datasheet for offline reference.
Where to find the EPF8452AQC160-3AC pinout?
The EPF8452AQC160-3AC pinout is published in the FLEX 8000 family datasheet and on distributor pages such as Hotenda, Jotrin Electronics, and ODG Electronics. The 160-pin PQFP pinout assigns 120 user I/O, dedicated JTAG (TCK/TMS/TDO/TDI), configuration (nCONFIG/nSTATUS/CONF_DONE), clock (CLK0..CLK2, OE), and power/ground pins. The diagram on ODG Electronics provides a labelled top-view mechanical drawing.
What is the key difference between FLEX 8000 and FLEX 10K FPGAs?
FLEX 8000 (the EPF8452AQC160-3AC family) is a pure logic FPGA with 4-input LUTs and FastTrack continuous routing, while FLEX 10K adds embedded array blocks (EABs) of 2 Kbit RAM on every device. The FLEX 10K is therefore preferred for designs needing on-chip dual-port RAM, FIFOs, or ROM, whereas the FLEX 8000 is more cost-effective for pure logic, glue, and control functions. Both families share the same JTAG ISP configuration interface and I/O architecture.
Is the EPF8452AQC160-3AC suitable for new designs?
The EPF8452AQC160-3AC is obsolete and is not recommended for new designs as of 2026-09-12. It is suitable only for legacy industrial, telecom, and military system maintenance where the existing PCB footprint, firmware, and qualification must be preserved. For new designs, modern equivalents include Lattice ispMACH 4000ZE CPLDs or Intel Cyclone 10 LP FPGAs, both of which require PCB redesign.

Données de référence d'ingénierie pour EPF8452AQC160-3AC — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the EPF8452AQC160-3AC when you need an obsolete-but-stocked FLEX 8000 FPGA for a legacy industrial, telecom, military, or medical system that was originally designed around the PQFP-160 footprint and -40 °C to +85 °C temperature range. Choose the EPF8452AGC160-3N instead if your manufacturing line is RoHS-compliant and you need a lead-free equivalent in the same footprint with lower dynamic power. Choose the EPF8452AQC160-3 only for indoor commercial-temperature applications where 0 °C to +70 °C is sufficient. Avoid the EPF8452AQC160-2 unless your design has timing margin to spare - the 7 ns delay is roughly 30% slower than the -3 grade. For new designs in 2026, choose a modern Cyclone 10 LP or Lattice ispMACH 4000ZE device instead, accepting that PCB redesign will be required.

Comparaison avec les alternatives

Paramètre Ce produit EPF8452AQC160-3 EPF8452AQC160-2 EPF8452AGC160-3 EPF8452AGC160-3N
Package PQFP-160 PQFP-160 PQFP-160 PQFP-160 PQFP-160
Brand Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera)
Logic Elements 336 336 336 336 336
Speed Grade -3 (~5 ns) -3 (~5 ns) -2 (~7 ns) -3 (~5 ns) -3 (~5 ns)
Operating Temperature -40 °C to +85 °C (Industrial) 0 °C to +70 °C (Commercial) 0 °C to +70 °C (Commercial) -40 °C to +85 °C (Industrial) -40 °C to +85 °C (Industrial)
Lead-Free / RoHS Sn/Pb (Non-compliant) Sn/Pb (Non-compliant) Sn/Pb (Non-compliant) Sn/Pb (Non-compliant) Lead-Free (RoHS)
Maximum User I/O 120 120 120 120 120
Usable Gates 4,000 4,000 4,000 4,000 4,000
Process / Die Step 0.42 µm CMOS, original die 0.42 µm CMOS, original die 0.42 µm CMOS, original die 0.42 µm CMOS, revised die step (lower power) 0.42 µm CMOS, revised die step, lead-free

Principaux différenciateurs

  • Lead-free industrial variant available in same footprint (vs EPF8452AQC160-3N)
  • Industrial temperature range vs commercial-only siblings (vs EPF8452AQC160-3)
  • Faster -3 speed grade vs slower -2 alternative (vs EPF8452AQC160-2)

Notes de conception

Estimated: at a typical 5 V core supply and a switching activity of 25%, the EPF8452AQC160-3AC draws approximately 250 mA to 400 mA from VCC and 100 mA to 200 mA from VCCIO. Decouple each VCC pin with a 0.1 µF ceramic capacitor placed within 5 mm of the pin, and add a single 33 µF tantalum bulk capacitor near the center of the package. The I/O banks (VCCIO) may be supplied at 3.3 V or 5 V independently; ensure VCCIO never exceeds VCC during power-up, otherwise the I/O cells will latch-up. The SRAM-based configuration memory draws a small inrush current during configuration that must be considered when sizing the supply.

The 160-pin PQFP has a 0.65 mm pitch and gull-wing leads; route all signals on inner layers with a continuous ground plane beneath the device. Use a 4-layer stackup with power and ground on the inner layers directly under the PQFP-160 to minimize lead inductance. Place the configuration EPROM (such as EPC2LC20) within 50 mm of the DCLK/DATA0/nCONFIG/nSTATUS pins, and route DCLK and DATA0 with matched trace lengths (within 25 mm) to avoid setup/hold violations. Reserve a 4-pin JTAG header (TCK, TMS, TDI, TDO) accessible from the board edge for boundary-scan testing during manufacturing.

Do not assume the FLEX 8000 SRAM-based configuration persists through power cycles - the bitstream must be re-loaded every time the device powers up, either from a serial configuration EPROM (EPC2), a microcontroller, or via JTAG. Forgetting this is the #1 reason 'dead-on-arrival' FLEX 8000 designs fail to come up. Do not apply VCCIO before VCC at power-up, and do not exceed the maximum I/O current per bank (typically 25 mA per pin, 100 mA per bank). When migrating the design to a Cyclone or Lattice ispMACH device, account for the new toolchain - MAX+PLUS II is end-of-life and Quartus no longer supports FLEX 8000 as of the latest releases.

Estimated: with theta_JA around 35 °C/W on a 4-layer JEDEC test board and 300 mA core current at 5 V, the junction temperature rises about 53 °C above ambient at full activity. Industrial-temperature operation (-40 °C to +85 °C) is achievable without a heatsink as long as ambient stays below 32 °C at full activity; for higher ambient, add a small copper heatsink or top-side airflow. The PQFP-160 plastic package is rated for a maximum junction temperature of 135 °C, providing roughly 50 °C of thermal margin above the worst-case industrial ambient.

Informations de conformité

RoHS
Non Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Sans plomb
No
Sans halogène
Unknown
Minerais de conflit
Compliant

Sn/Pb lead finish on legacy PQFP-160 package; non-RoHS but REACH-compliant. AEC-Q100 not qualified (FPGA, not automotive qualified). For RoHS requirement, choose EPF8452AGC160-3N drop-in alternative.

Données vérifiées le : 2026-09-12 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

EPF8452AQC160-3AC datasheet EPF8452AQC160-3AC price FLEX 8000 FPGA 336 logic elements Intel FLEX 8000 PQFP-160 EPF8452AQC160-3AC drop-in replacement Altera FLEX 8000 160-pin QFP EPF8452AQC160-3AC buy online EPF8452 vs EPM7128 glue logic FPGA EPF8452AQC160-3AC in stock FLEX 8000 industrial FPGA -40 to 85C EPF8452AQC160-3AC obsolete lifecycle what is the pin count of EPF8452AQC160-3AC

Composants & termes associés

Intel Altera EPF8452AQC160-3AC EPF8452AQC160-3 EPF8452AQC160-2 EPF8452AGC160-3 EPF8452AGC160-3N FPGA Field-Programmable Gate Array FLEX 8000 PQFP-160 Plastic Quad Flat Package QFP logic element LE LUT FastTrack interconnect embedded array block EAB JTAG boundary scan in-system programmability ISP SRAM configuration MAX+PLUS II Quartus RoHS REACH industrial temperature range IPC-610 MIL-PRF-38535
RFQ de devis rapide
Renseignez tous les détails — notre équipe commerciale vous répondra sous 24 heures
Référence Fabricant Boîtier QTY Prix cible Total
Total : 0,00 USD
✓
Devis envoyé !

Nous répondrons à votre e-mail sous 24 heures

1
RFQ envoyée
2
Devis reçu
3
Commande passée
4
Paiement
5
Expédié
6
Livré
Voir les détails de la RFQ