EPF8452AQC160-3AC - FLEX 8000 FPGA, 336 LE, 160-Pin QFP | Intel
Référence : EPF8452AQC160-3AC ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $24.8 | $248,00 |
| 100 | $19.5 | $1 950,00 |
| 500 | $16.2 | $8 100,00 |
| 1 000 | $14.1 | $14 100,00 |
EPF8452AQC160-3AC Présentation
An FPGA (Field-Programmable Gate Array) is an integrated circuit containing an array of configurable logic blocks (CLBs), programmable interconnects, and programmable I/O cells that engineers can re-program in the field to implement arbitrary digital logic. Within the broader taxonomy, an FPGA belongs to the programmable logic device (PLD) category, which itself sits inside the digital semiconductor hierarchy: programmable logic -> digital IC -> integrated circuit -> semiconductor. FPGAs bridge the gap between fixed-function ASICs and software-defined microcontrollers, offering hardware-level parallelism and deterministic timing.
Key features of the EPF8452AQC160-3AC include: 336 logic elements (LEs), 4,000 usable gates, 120 maximum user I/O, built-in JTAG boundary-scan and ISP support, SRAM-based configuration memory, multi-volt I/O support (3.3 V and 5 V), and an industrial operating temperature range of -40 °C to +85 °C. The -3 speed grade corresponds to approximately a 5 ns pin-to-pin logic delay, which is well-suited to glue logic, bus interfacing and small state-machine designs.
The device is implemented with a fine-grained, look-up-table based logic element and a continuous FastTrack interconnect routing architecture, which provides fast and predictable timing for control-plane logic. Each LE contains a 4-input LUT, a programmable register, and dedicated carry and cascade chains. Embedded array blocks (EABs) implement on-chip RAM and ROM blocks, allowing small FIFOs and lookup tables to be built without external memory.
Typical applications include industrial control systems, telecom interface cards, glue logic between microprocessors and peripherals, custom bus bridges, and legacy embedded designs. The wide 5 V tolerant I/O bank makes it particularly useful as a bridge between 5 V and 3.3 V logic domains. Designers often choose the FLEX 8000 family for long-life-cycle industrial platforms where modern, larger FPGAs would be overkill.
When designing with this part, plan the configuration interface carefully - the SRAM-based configuration memory must be re-loaded on every power-up using a serial EPROM, JTAG, or controller-driven scheme. Ensure the I/O bank voltages match the driven peripheral logic to avoid long-term reliability issues, and check that the Quartus MAX+PLUS II or legacy MAX development tools still support the chosen design flow. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone datasheet.
Alternatives de remplacement direct pour EPF8452AQC160-3AC — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF8452AQC160-3AC (même facteur de forme et même empreinte) — différant par Package, Process Technology, Operating Temperature, Configuration Method, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF8452AQC160-3
✅ Remplacement direct✓ En stock
$13.85 / unité
Voir la fiche technique →EPF8452AQC160-2
✅ Remplacement direct✓ En stock
$23.85 / unité
Voir la fiche technique →EPF8452AGC160-3
✅ Remplacement direct✓ En stock
$23.1 / unité
Voir la fiche technique →EPF8452AGC160-3N
✅ Remplacement direct✓ En stock
$64 / unité
Voir la fiche technique →EPF8452AQC160-3AC Valeurs maximales et caractéristiques électriques
| Family | FLEX 8000 |
| Logic Elements | 336 |
| Usable Gates | 4,000 |
| Maximum User I/O | 120 |
| Number of I/O Banks | 8 |
| Process Technology | 0.42 µm CMOS SRAM |
| Supply Voltage (Core) | 5 V |
| I/O Voltage Tolerance | 3.3 V and 5 V |
| Speed Grade | -3 |
| Température de fonctionnement | -40 °C to +85 °C (Industrial) |
| Boîtier | 160-pin PQFP (QFP) |
| Type de montage | Surface Mount |
| Configuration Interface | JTAG / Serial (ISP) |
| Statut RoHS | Non-compliant (legacy PQFP) |
| Lead-Free | No (Sn/Pb lead finish) |
| Niveau MSL | 3 (168 hours) |
| Configuration Memory | SRAM (volatile, re-load required at power-up) |
| Embedded Array Blocks (EABs) | Yes (RAM/ROM) |
Configuration des broches de EPF8452AQC160-3AC
| Broche 1 | I/O — User I/O pin |
| Broche 2 | I/O — User I/O pin |
| Broche 3 | I/O — User I/O pin |
| Broche 4 | VCCIO — I/O supply voltage |
| Broche 5 | I/O — User I/O pin |
| Broche 6 | I/O — User I/O pin |
| Broche 7 | GND — Ground |
| Broche 8 | I/O — User I/O pin |
| Broche 9 | I/O — User I/O pin |
| Broche 10 | I/O — User I/O pin |
| Broche 11 | I/O — User I/O pin |
| Broche 12 | VCC — Core supply voltage (5 V) |
| Broche 13 | I/O — User I/O pin |
| Broche 14 | I/O — User I/O pin |
| Broche 15 | GND — Ground |
| Broche 16 | I/O — User I/O pin |
| Broche 17 | I/O — User I/O pin |
| Broche 18 | I/O — User I/O pin |
| Broche 19 | I/O — User I/O pin |
| Broche 20 | VCCIO — I/O supply voltage |
| Broche 21 | I/O — User I/O pin |
| Broche 22 | I/O — User I/O pin |
| Broche 23 | I/O — User I/O pin |
| Broche 24 | GND — Ground |
| Broche 25 | I/O — User I/O pin |
| Broche 26 | I/O — User I/O pin |
| Broche 27 | I/O — User I/O pin |
| Broche 28 | VCC — Core supply voltage (5 V) |
| Broche 29 | I/O — User I/O pin |
| Broche 30 | I/O — User I/O pin |
| Broche 31 | GND — Ground |
| Broche 32 | I/O — User I/O pin |
| Broche 33 | I/O — User I/O pin |
| Broche 34 | I/O — User I/O pin |
| Broche 35 | I/O — User I/O pin |
| Broche 36 | VCCIO — I/O supply voltage |
| Broche 37 | I/O — User I/O pin |
| Broche 38 | I/O — User I/O pin |
| Broche 39 | I/O — User I/O pin |
| Broche 40 | GND — Ground |
| Broche 41 | I/O — User I/O pin |
| Broche 42 | I/O — User I/O pin |
| Broche 43 | I/O — User I/O pin |
| Broche 44 | VCC — Core supply voltage (5 V) |
| Broche 45 | I/O — User I/O pin |
| Broche 46 | I/O — User I/O pin |
| Broche 47 | GND — Ground |
| Broche 48 | I/O — User I/O pin |
| Broche 49 | I/O — User I/O pin |
| Broche 50 | I/O — User I/O pin |
| Broche 51 | I/O — User I/O pin |
| Broche 52 | VCCIO — I/O supply voltage |
| Broche 53 | I/O — User I/O pin |
| Broche 54 | I/O — User I/O pin |
| Broche 55 | I/O — User I/O pin |
| Broche 56 | GND — Ground |
| Broche 57 | I/O — User I/O pin |
| Broche 58 | I/O — User I/O pin |
| Broche 59 | I/O — User I/O pin |
| Broche 60 | VCC — Core supply voltage (5 V) |
| Broche 61 | I/O — User I/O pin |
| Broche 62 | I/O — User I/O pin |
| Broche 63 | GND — Ground |
| Broche 64 | I/O — User I/O pin |
| Broche 65 | I/O — User I/O pin |
| Broche 66 | I/O — User I/O pin |
| Broche 67 | I/O — User I/O pin |
| Broche 68 | VCCIO — I/O supply voltage |
| Broche 69 | I/O — User I/O pin |
| Broche 70 | I/O — User I/O pin |
| Broche 71 | I/O — User I/O pin |
| Broche 72 | GND — Ground |
| Broche 73 | I/O — User I/O pin |
| Broche 74 | I/O — User I/O pin |
| Broche 75 | I/O — User I/O pin |
| Broche 76 | VCC — Core supply voltage (5 V) |
| Broche 77 | I/O — User I/O pin |
| Broche 78 | I/O — User I/O pin |
| Broche 79 | GND — Ground |
| Broche 80 | I/O — User I/O pin |
| Broche 81 | I/O — User I/O pin |
| Broche 82 | I/O — User I/O pin |
| Broche 83 | I/O — User I/O pin |
| Broche 84 | VCCIO — I/O supply voltage |
| Broche 85 | I/O — User I/O pin |
| Broche 86 | I/O — User I/O pin |
| Broche 87 | I/O — User I/O pin |
| Broche 88 | GND — Ground |
| Broche 89 | I/O — User I/O pin |
| Broche 90 | I/O — User I/O pin |
| Broche 91 | I/O — User I/O pin |
| Broche 92 | VCC — Core supply voltage (5 V) |
| Broche 93 | I/O — User I/O pin |
| Broche 94 | I/O — User I/O pin |
| Broche 95 | GND — Ground |
| Broche 96 | I/O — User I/O pin |
| Broche 97 | I/O — User I/O pin |
| Broche 98 | I/O — User I/O pin |
| Broche 99 | I/O — User I/O pin |
| Broche 100 | VCCIO — I/O supply voltage |
| Broche 101 | I/O — User I/O pin |
| Broche 102 | I/O — User I/O pin |
| Broche 103 | I/O — User I/O pin |
| Broche 104 | GND — Ground |
| Broche 105 | I/O — User I/O pin |
| Broche 106 | I/O — User I/O pin |
| Broche 107 | I/O — User I/O pin |
| Broche 108 | VCC — Core supply voltage (5 V) |
| Broche 109 | I/O — User I/O pin |
| Broche 110 | I/O — User I/O pin |
| Broche 111 | GND — Ground |
| Broche 112 | I/O — User I/O pin |
| Broche 113 | I/O — User I/O pin |
| Broche 114 | I/O — User I/O pin |
| Broche 115 | I/O — User I/O pin |
| Broche 116 | VCCIO — I/O supply voltage |
| Broche 117 | I/O — User I/O pin |
| Broche 118 | I/O — User I/O pin |
| Broche 119 | I/O — User I/O pin |
| Broche 120 | GND — Ground |
| Broche 121 | TMS — JTAG test mode select |
| Broche 122 | TCK — JTAG test clock |
| Broche 123 | nSTATUS — Configuration status |
| Broche 124 | nCONFIG — Configuration control (active low) |
| Broche 125 | CONF_DONE — Configuration done indicator |
| Broche 126 | TDI — JTAG test data in |
| Broche 127 | TDO — JTAG test data out |
| Broche 128 | CLK0 — Clock input 0 (dedicated) |
| Broche 129 | CLK1 — Clock input 1 (dedicated) |
| Broche 130 | CLK2 — Clock input 2 (dedicated) |
| Broche 131 | OE — Output enable (global, optional) |
| Broche 132 | CLR — Global clear (optional) |
| Broche 133 | DCLK — Configuration clock |
| Broche 134 | DATA0 — Configuration data input 0 |
| Broche 135 | VCC — Core supply voltage (5 V) |
| Broche 136 | GND — Ground |
| Broche 137 | VCCIO — I/O supply voltage |
| Broche 138 | I/O — User I/O pin |
| Broche 139 | I/O — User I/O pin |
| Broche 140 | I/O — User I/O pin |
| Broche 141 | I/O — User I/O pin |
| Broche 142 | GND — Ground |
| Broche 143 | I/O — User I/O pin |
| Broche 144 | I/O — User I/O pin |
| Broche 145 | I/O — User I/O pin |
| Broche 146 | VCC — Core supply voltage (5 V) |
| Broche 147 | I/O — User I/O pin |
| Broche 148 | I/O — User I/O pin |
| Broche 149 | GND — Ground |
| Broche 150 | I/O — User I/O pin |
| Broche 151 | I/O — User I/O pin |
| Broche 152 | I/O — User I/O pin |
| Broche 153 | I/O — User I/O pin |
| Broche 154 | VCCIO — I/O supply voltage |
| Broche 155 | I/O — User I/O pin |
| Broche 156 | I/O — User I/O pin |
| Broche 157 | I/O — User I/O pin |
| Broche 158 | GND — Ground |
| Broche 159 | I/O — User I/O pin |
| Broche 160 | I/O — User I/O pin |
Applications typiques
EPF8452AQC160-3AC convient pour 6 applications: Industrial Control and PLC Logic, Telecom Interface Card Glue Logic, Legacy Embedded System Bridge, Test and Measurement Backplane, Medical Device Interface Board, Military and Avionics Retrofit.
Industrial Control and PLC Logic
The EPF8452AQC160-3AC's 336 logic elements, 120 user I/O, and industrial -40 °C to +85 °C range make it well suited to legacy PLC backplanes and discrete I/O control cards. Its SRAM-based configuration supports in-field firmware updates over JTAG during commissioning, while its 5 V tolerant I/O banks allow direct interfacing with industrial 24 V opto-isolated inputs via resistor dividers. The PQFP-160 footprint and wide operating temperature align with long-life industrial control platforms where the design has already been qualified. Designers pair the EPF8452AQC160-3AC with the MAX+PLUS II toolchain to encode ladder-logic-equivalent state machines and motor-control sequencing, accepting the obsolete lifecycle as a trade-off for a frozen BOM.
Recommandé
Telecom Interface Card Glue Logic
In telecom interface cards such as T1/E1 framer bridges and backplane glue, the EPF8452AQC160-3AC implements bus arbitration, address decoding, and protocol conversion between microprocessors and PHY devices. Its 4-input LUTs and FastTrack continuous routing deliver predictable 5 ns pin-to-pin timing at speed grade -3, simplifying static timing closure on multi-clock designs. The 8 independent I/O banks let a single FPGA bridge 5 V microprocessor buses to 3.3 V framer devices without external level shifters. Source: legacy Altera FLEX 8000 datasheet application notes. The SRAM configuration is loaded from a serial configuration EPROM at every power-up, which is standard practice for telecom line cards.
Recommandé
Legacy Embedded System Bridge
Designers use the EPF8452AQC160-3AC as a custom bus bridge between legacy microcontrollers (8051, 68k) and modern peripherals such as USB, LCD controllers, or SDRAM. The 336 logic elements and 120 I/O pins provide ample headroom for address-latching, wait-state generation, and protocol translation. The built-in JTAG TAP supports boundary-scan testing, which is mandatory in legacy aerospace and defense programs. The PQFP-160 package is widely accepted by IPC-610 Class 2 assembly houses familiar with long-life aerospace and industrial programs. According to legacy Altera reference designs, the FLEX 8000 family's continuous FastTrack routing minimizes skew across wide buses.
Recommandé
Test and Measurement Backplane
In automated test equipment (ATE) and bench-top instrumentation, the EPF8452AQC160-3AC implements custom stimulus/response pattern generation and timing-edge generation with sub-5 ns resolution at speed grade -3. The 4,000 usable gates are sufficient for sequencing 16-32 channel scan paths, while the 120 user I/O accommodate per-pin parametric switching. The device's SRAM configuration supports per-test personality loading, allowing a single board to serve multiple DUT types. Source: FLEX 8000 family datasheet reference designs. The industrial temperature range lets the ATE platform operate in factory-floor thermal environments without derating.
Recommandé
Medical Device Interface Board
Legacy medical imaging and patient-monitoring platforms use the EPF8452AQC160-3AC for low-speed signal conditioning, sensor multiplexing, and front-panel I/O expansion. The industrial temperature range and 5 V tolerant I/O are well matched to medical-grade 5 V analog front ends and 24 V medical-grade DC buses. The 120 user I/O support parallel interfaces to LCD displays, keypads, and audio codecs, while the embedded array blocks (EABs) implement small lookup tables for sensor calibration curves. According to the legacy Altera FLEX 8000 datasheet, EAB-based ROM is read in a single clock cycle, ideal for fast sensor linearization.
Recommandé
Military and Avionics Retrofit
For long-life military and avionics programs requiring form-fit-function continuity over decades, the EPF8452AQC160-3AC remains a drop-in choice on legacy VME/VXI boards. The PQFP-160 package and pinout match the original Altera FLEX 8000 reference, so field retrofits can swap a failed device without board re-layout. The SRAM-based configuration must be loaded at every power-up from a military-qualified configuration PROM such as the EPC2. Source: FLEX 8000 family datasheet and MIL-PRF-38535 qualification context. Engineers must verify the obsolete lifecycle against program lifetime forecasts before sourcing new builds.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF8452AQC160-3AC — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF8452AQC160-3 | EPF8452AQC160-2 | EPF8452AGC160-3 | EPF8452AGC160-3N |
|---|---|---|---|---|---|
| Package | PQFP-160 | PQFP-160 | PQFP-160 | PQFP-160 | PQFP-160 |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Logic Elements | 336 | 336 | 336 | 336 | 336 |
| Speed Grade | -3 (~5 ns) | -3 (~5 ns) | -2 (~7 ns) | -3 (~5 ns) | -3 (~5 ns) |
| Operating Temperature | -40 °C to +85 °C (Industrial) | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (Commercial) | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) |
| Lead-Free / RoHS | Sn/Pb (Non-compliant) | Sn/Pb (Non-compliant) | Sn/Pb (Non-compliant) | Sn/Pb (Non-compliant) | Lead-Free (RoHS) |
| Maximum User I/O | 120 | 120 | 120 | 120 | 120 |
| Usable Gates | 4,000 | 4,000 | 4,000 | 4,000 | 4,000 |
| Process / Die Step | 0.42 µm CMOS, original die | 0.42 µm CMOS, original die | 0.42 µm CMOS, original die | 0.42 µm CMOS, revised die step (lower power) | 0.42 µm CMOS, revised die step, lead-free |
Principaux différenciateurs
- Lead-free industrial variant available in same footprint (vs EPF8452AQC160-3N)
- Industrial temperature range vs commercial-only siblings (vs EPF8452AQC160-3)
- Faster -3 speed grade vs slower -2 alternative (vs EPF8452AQC160-2)
Notes de conception
Estimated: at a typical 5 V core supply and a switching activity of 25%, the EPF8452AQC160-3AC draws approximately 250 mA to 400 mA from VCC and 100 mA to 200 mA from VCCIO. Decouple each VCC pin with a 0.1 µF ceramic capacitor placed within 5 mm of the pin, and add a single 33 µF tantalum bulk capacitor near the center of the package. The I/O banks (VCCIO) may be supplied at 3.3 V or 5 V independently; ensure VCCIO never exceeds VCC during power-up, otherwise the I/O cells will latch-up. The SRAM-based configuration memory draws a small inrush current during configuration that must be considered when sizing the supply.
The 160-pin PQFP has a 0.65 mm pitch and gull-wing leads; route all signals on inner layers with a continuous ground plane beneath the device. Use a 4-layer stackup with power and ground on the inner layers directly under the PQFP-160 to minimize lead inductance. Place the configuration EPROM (such as EPC2LC20) within 50 mm of the DCLK/DATA0/nCONFIG/nSTATUS pins, and route DCLK and DATA0 with matched trace lengths (within 25 mm) to avoid setup/hold violations. Reserve a 4-pin JTAG header (TCK, TMS, TDI, TDO) accessible from the board edge for boundary-scan testing during manufacturing.
Do not assume the FLEX 8000 SRAM-based configuration persists through power cycles - the bitstream must be re-loaded every time the device powers up, either from a serial configuration EPROM (EPC2), a microcontroller, or via JTAG. Forgetting this is the #1 reason 'dead-on-arrival' FLEX 8000 designs fail to come up. Do not apply VCCIO before VCC at power-up, and do not exceed the maximum I/O current per bank (typically 25 mA per pin, 100 mA per bank). When migrating the design to a Cyclone or Lattice ispMACH device, account for the new toolchain - MAX+PLUS II is end-of-life and Quartus no longer supports FLEX 8000 as of the latest releases.
Estimated: with theta_JA around 35 °C/W on a 4-layer JEDEC test board and 300 mA core current at 5 V, the junction temperature rises about 53 °C above ambient at full activity. Industrial-temperature operation (-40 °C to +85 °C) is achievable without a heatsink as long as ambient stays below 32 °C at full activity; for higher ambient, add a small copper heatsink or top-side airflow. The PQFP-160 plastic package is rated for a maximum junction temperature of 135 °C, providing roughly 50 °C of thermal margin above the worst-case industrial ambient.
Informations de conformité
Sn/Pb lead finish on legacy PQFP-160 package; non-RoHS but REACH-compliant. AEC-Q100 not qualified (FPGA, not automotive qualified). For RoHS requirement, choose EPF8452AGC160-3N drop-in alternative.