Altera

EPF8452AGC160-3 - FLEX 8000 FPGA, 5K Gates, 160-PQFP | Altera

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4.75 V to 5.25 V Vdss 160-pin PQFP (BQFP, 28x28 mm) Package -3 Speed

À partir de $23.1 USD / unité

MOQ : 1 |

Prix mis à jour : 2026-09-11

Tarifs dégressifs

Qté	Prix unitaire	Total
1	$38.5	$38,50
10	$34.2	$342,00
100	$29.95	$2 995,00
500	$26.4	$13 200,00
1 000	$23.1	$23 100,00

ℹ️ Tous les prix sont en USD

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EPF8452AGC160-3 Présentation

The Altera (Intel) EPF8452AGC160-3 is a member of the FLEX 8000 family of CMOS SRAM-based FPGAs, providing approximately 4,000 usable gates, 336 logic elements (LEs), and 120 I/O pins in a 160-pin Plastic Quad Flat Pack (PQFP/BQFP) package. The device operates from a 4.75 V to 5.25 V supply and is specified over the commercial 0 C to +70 C temperature range. The "-3" speed grade designates one of the faster FLEX 8000 timing options, suited for designs where toggle-rate or setup-time margin matters more than absolute minimum propagation delay cost.

A Field Programmable Gate Array (FPGA) is a programmable logic device (PLD) containing an array of configurable logic blocks (CLBs), programmable interconnect, and programmable I/O cells. FPGAs sit at the top of the PLD hierarchy above SPLDs and CPLDs in logic density, and below ASICs in per-unit cost at very high volumes. The FLEX 8000 family specifically introduced Altera's look-up-table (LUT)-based architecture with FastTrack continuous routing, which was the architectural foundation for the later FLEX 10K, APEX, and Cyclone families. Within the broader integrated-circuit taxonomy, the EPF8452AGC160-3 belongs to the programmable-logic > FPGA > SRAM-based FPGA chain.

Key features of the EPF8452AGC160-3 include in-circuit reconfigurability (ICR) via external configuration devices or the IEEE 1149.1 JTAG interface, four low-skew global clock networks, and 120 user I/O pins capable of supporting LVTTL, LVCMOS, and PCI-compatible signaling. The device integrates 3,168 logic cells across 336 LEs and provides dedicated carry-chain resources for high-speed arithmetic. Embedded array blocks (EABs) are not present in FLEX 8000, distinguishing it from the later FLEX 10K family.

Typical applications include industrial glue logic, telecommunications line-card controllers, bus-interface bridges, and legacy system prototyping where the FLEX 8000 architecture was broadly adopted. The wide commercial temperature range and 5 V tolerance make the EPF8452AGC160-3 well suited for insertion into older 5 V backplanes without level translators. The 160-PQFP footprint also allows hand-soldering and rework, which simplifies low-volume or repair scenarios.

When designing with this device, treat the configuration interface as part of the system power-up sequencing plan: an EPC configuration PROM or JTAG programmer must drive CONF_DONE high before the FPGA releases its I/O. Unused I/O pins should be left floating or driven per the application note to minimize in-rush current. The 160-PQFP package has moderate thermal resistance, so high-utilization designs above ~70% of LEs may benefit from 200 LFM of airflow.

Alternatives de remplacement direct pour EPF8452AGC160-3 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec EPF8452AGC160-3 (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Process Technology, Usable Gates, Configuration Method.

EPF8452AGC160-3N

Altera

Process Technology: 0.42 um CMOS

Usable Gates: 4000

Configuration Method: External configuration device (EPC1/EPC2) or JTAG