EPF8452AGC160-3N - FLEX 8000 FPGA 4K Gates 125MHz 5V 160-CPGA | Altera
MPN: EPF8452AGC160-3N β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $85 | $85.00 |
| 10 | $78 | $780.00 |
| 100 | $72 | $7,200.00 |
| 250 | $68 | $17,000.00 |
| 500 | $64 | $32,000.00 |
Drop-in alternatives for EPF8452AGC160-3N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EPF8452AGC160-3
β Drop-Inβ In Stock
$23.1 / Unit
View Datasheet βEPF8452AQC160-3
β Drop-Inβ In Stock
$13.85 / Unit
View Datasheet βEPF8452AGC160-4
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EPF8282AGC160-3
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EPF8452AGC160-3N Maximum Ratings & Electrical Characteristics
| Product Family | FLEX 8000 |
| Family Member | EPF8452 |
| Usable Gates | 4000 |
| Logic Elements / Cells | 336 |
| Maximum Frequency | 125 MHz |
| Process Technology | 0.42 um CMOS |
| Supply Voltage (VCCINT) | 4.75 V to 5.25 V (5 V nominal) |
| Operating Temperature | 0 C to +70 C (commercial) |
| Package Type | 160-pin Ceramic Pin Grid Array (CPGA-160) |
| Mounting Type | Through-Hole (socketed) |
| Configuration Method | External configuration device (EPC1/EPC2) or JTAG |
| In-Circuit Reconfigurable | Yes (ICR) |
| JTAG Boundary Scan | Yes (IEEE 1149.1) |
| I/O Standard Support | 5V TTL / CMOS-compatible |
| Speed Grade | -3 (high-performance tier) |
EPF8452AGC160-3N Pin Configuration
| Pin A1 | GND β Ground reference |
| Pin A2 | I/O β User I/O pin (function depends on design assignment) |
| Pin A3 | VCC β 5V core supply |
| Pin B1 | I/O β User I/O pin |
| Pin B2 | TDI β JTAG Test Data In |
| Pin B3 | I/O β User I/O pin |
| Pin C1 | VCC β 5V core supply |
| Pin C2 | I/O β User I/O pin |
| Pin C3 | TMS β JTAG Test Mode Select |
| Pin D1 | I/O β User I/O pin |
| Pin D2 | TCK β JTAG Test Clock |
| Pin D3 | GND β Ground |
| Pin E1 | I/O β User I/O pin |
| Pin E2 | I/O β User I/O pin |
| Pin E3 | TDO β JTAG Test Data Out |
| Pin F1 | GND β Ground |
| Pin F2 | I/O β User I/O pin |
| Pin F3 | VCC β 5V core supply |
| Pin G1 | I/O β User I/O pin |
| Pin G2 | I/O β User I/O pin |
| Pin G3 | I/O β User I/O pin |
| Pin H1 | VCC β 5V core supply |
| Pin H2 | I/O β User I/O pin |
| Pin H3 | I/O β User I/O pin |
| Pin J1 | I/O β User I/O pin |
| Pin J2 | GND β Ground |
| Pin J3 | I/O β User I/O pin |
| Pin K1 | I/O β User I/O pin |
| Pin K2 | I/O β User I/O pin |
| Pin K3 | VCC β 5V core supply |
| Pin L1 | I/O β User I/O pin |
| Pin L2 | I/O β User I/O pin |
| Pin L3 | I/O β User I/O pin |
| Pin M1 | GND β Ground |
| Pin M2 | I/O β User I/O pin |
| Pin M3 | I/O β User I/O pin |
| Pin N1 | I/O β User I/O pin |
| Pin N2 | VCC β 5V core supply |
| Pin N3 | I/O β User I/O pin |
| Pin P1 | I/O β User I/O pin |
| Pin P2 | I/O β User I/O pin |
| Pin P3 | GND β Ground |
| Pin Q1 | VCC β 5V core supply |
| Pin Q2 | I/O β User I/O pin |
| Pin Q3 | I/O β User I/O pin |
| Pin R1 | I/O β User I/O pin |
| Pin R2 | I/O β User I/O pin |
| Pin R3 | VCC β 5V core supply |
| Pin S1 | GND β Ground |
| Pin S2 | I/O β User I/O pin |
| Pin S3 | I/O β User I/O pin |
| Pin T1 | I/O β User I/O pin |
| Pin T2 | I/O β User I/O pin |
| Pin T3 | I/O β User I/O pin |
| Pin U1 | VCC β 5V core supply |
| Pin U2 | I/O β User I/O pin |
| Pin U3 | GND β Ground |
| Pin V1 | I/O β User I/O pin |
| Pin V2 | I/O β User I/O pin |
| Pin V3 | I/O β User I/O pin |
| Pin W1 | I/O β User I/O pin |
| Pin W2 | I/O β User I/O pin |
| Pin W3 | VCC β 5V core supply |
| Pin Y1 | GND β Ground |
| Pin Y2 | I/O β User I/O pin |
| Pin Y3 | I/O β User I/O pin |
| Pin AA1 | I/O β User I/O pin |
| Pin AA2 | VCC β 5V core supply |
| Pin AA3 | I/O β User I/O pin |
| Pin AB1 | I/O β User I/O pin |
| Pin AB2 | I/O β User I/O pin |
| Pin AB3 | GND β Ground |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPF8452AGC160-3N is suitable for 6 applications: Industrial Control Glue Logic, Legacy Avionics and Military Systems, Telecommunications Interface Cards, ASIC Prototyping and Emulation, Test and Measurement Instrumentation, Legacy Medical Imaging Systems.
Industrial Control Glue Logic
The EPF8452AGC160-3N fits industrial control glue logic applications where 4K usable gates and 336 logic cells provide enough capacity for state machines, peripheral interfaces, and protocol bridges while operating from a single 5V rail. Placed between a microcontroller and I/O drivers, the FLEX 8000 architecture handles address decoding, handshaking, and interrupt prioritization in parallel hardware. The 125MHz system performance easily accommodates 16-bit counter designs and standard serial protocols. The ceramic CPGA-160 package is ideal for factory-floor installations subject to thermal cycling and vibration where plastic QFPs would fatigue.
Recommended
Legacy Avionics and Military Systems
The EPF8452AGC160-3N is widely deployed in fielded avionics and military systems where the ceramic CPGA-160 package satisfies MIL-STD-883 reliability requirements and 5V supply compatibility matches legacy power distribution. With 4K gates and 336 logic cells, the FLEX 8000 device handles navigation interface logic, sensor multiplexing, and redundancy management functions in flight control computers. The IEEE 1149.1 JTAG boundary-scan interface simplifies board-level diagnostics during depot-level maintenance. For repair and replication of these long-lifecycle systems, Rochester Electronics maintains bonded inventory as the authorized Altera/Intel legacy franchise holder.
Recommended
Telecommunications Interface Cards
The EPF8452AGC160-3N serves in telecommunications interface cards for T1/E1 framers, HDLC controllers, and bus arbitration logic, where the 125MHz performance rating and register-rich FLEX 8000 architecture handle bit-stuffing and protocol conversion at line rates. With 336 logic cells and up to 1,500 flip-flops, designers implement deep FIFOs and elastic buffers without external memory. The 5V I/O tolerance interfaces directly to legacy bus transceivers and line interface units without level shifters. Ceramic CPGA packaging ensures long-term reliability in central-office equipment expected to operate continuously for decades.
Recommended
ASIC Prototyping and Emulation
The EPF8452AGC160-3N serves as a low-cost prototyping vehicle for ASIC verification in FLEX 8000 family designs where ICR (in-circuit reconfigurability) lets engineers iterate designs in hours rather than weeks. The 4K usable gates accommodate representative sub-blocks of larger ASIC designs, with the Altera MAX+PLUS II and Quartus toolchains providing design entry, simulation, and timing analysis. The ceramic CPGA package in a pin-compatible socket allows swap-out of speed grades and densities without PCB rework. Engineers can validate critical paths at 125MHz before committing to mask costs.
Recommended
Test and Measurement Instrumentation
The EPF8452AGC160-3N fits test and measurement instrumentation applications where the FLEX 8000 architecture implements timing generators, pulse-width modulators, and stimulus sequencers with deterministic 125MHz performance. With 336 logic cells and ample flip-flops, designers build digital pattern generators and protocol analyzers without external glue logic. The 5V supply matches legacy bench-top instrument rails; the 0C to +70C commercial temperature range covers laboratory environments. The ceramic CPGA package handles thermal cycling from power-on/off transitions common in bench testing scenarios.
Recommended
Legacy Medical Imaging Systems
The EPF8452AGC160-3N fits long-lifecycle medical imaging systems (ultrasound, MRI control boards) where the ceramic CPGA-160 package and FLEX 8000 architecture have qualified reliability over decades of continuous operation. With 4K gates and 336 logic cells, the device handles scan conversion timing, beam-forming control, and image buffer addressing at rates up to 125MHz. The 5V supply tolerance simplifies integration with legacy analog front-ends. For OEM service and regulatory-mandated spare-part provisioning, Rochester Electronics maintains authorized FLEX 8000 inventory.
Recommended
Recommended Products Summary
Engineering reference data for EPF8452AGC160-3N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF8452AGC160-3 | EPF8452AQC160-3 | EPF8452AGC160-4 | EPF8282AGC160-3 |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 160-CPGA (ceramic PGA) | 160-BQFP (plastic) | 160-PQFP (plastic) | 160-CPGA (ceramic PGA) - same | 160-CPGA (ceramic PGA) - same |
| Usable Gates | 4,000 | 4,000 | 4,000 | 4,000 | 2,500 |
| Logic Cells | 336 | 336 | 336 | 336 | 208 |
| Maximum Frequency | 125 MHz | 125 MHz | 125 MHz | approximately 100-110 MHz | 125 MHz |
| Supply Voltage | 4.75V to 5.25V | 4.75V to 5.25V | 4.75V to 5.25V | 4.75V to 5.25V | 4.75V to 5.25V |
| Speed Grade | -3 (high speed) | -3 (high speed) | -3 (high speed) | -4 (slower speed grade) | -3 (high speed) |
| Operating Temperature | 0 C to +70 C | 0 C to +70 C | 0 C to +70 C | 0 C to +70 C | 0 C to +70 C |
| JTAG Boundary Scan | Yes (IEEE 1149.1) | Yes (IEEE 1149.1) | Yes (IEEE 1149.1) | Yes (IEEE 1149.1) | Yes (IEEE 1149.1) |
Key Differentiators
- Ceramic CPGA-160 package for high-reliability applications (vs EPF8452AGC160-3 (plastic BQFP-160))
- Same FLEX 8000 die and bitstream as plastic variants (vs EPF8452AQC160-3 (plastic PQFP-160))
- Higher logic density than lower-end FLEX 8000 members (vs EPF8282AGC160-3 (2.5K gates, 208 cells))
Design Notes
The EPF8452AGC160-3N requires 5V supply on all VCC pins with bulk decoupling of at least 1uF plus 0.1uF ceramic per VCC/GND pin pair. During configuration, inrush current can peak above steady-state levels; ensure the 5V regulator has adequate headroom (recommended 1A minimum). Place the EPC1 or EPC2 configuration EPROM within 6 inches of the FPGA DATA/DCLK pins to avoid signal integrity issues. After configuration completes, the FLEX 8000 enters user mode and draws steady-state current proportional to toggle rate and design density.
The ceramic CPGA-160 package must be socketed in a PGA-160 through-hole socket rated for the device mass and thermal expansion. Avoid soldering the CPGA directly to a PCB; the thermal mismatch can crack the ceramic and the package is not designed for hand rework. Provide a minimum 0.5-inch clearance around the socket for socket extraction tooling. Decoupling capacitors should be placed on the PCB side immediately adjacent to the socket, not beneath it.
Do not confuse the EPF8452AGC160-3N (ceramic CPGA-160) with the EPF8452AGC160-3 (plastic BQFP-160) - they share the same die and bitstream but have different packages and pinouts. The -3N suffix specifically denotes the ceramic Pin Grid Array package. When ordering, verify the full part number including the -3N suffix; sourcing the wrong package variant is a common production-line issue. Also note the FLEX 8000 family is NRND - plan obsolescence mitigation by qualifying a modern Cyclone or MAX 10 device as a future replacement.
Estimated: at 125MHz with 100% I/O toggle, the FLEX 8000 EPF8452 draws approximately 200-300mA, dissipating 1.0W to 1.5W. The ceramic CPGA package provides good thermal conduction to the socket and chassis; however, in enclosed instrument enclosures with limited airflow, junction temperature can rise above ambient. Apply a thermal pad between the CPGA package top and an aluminum chassis plate for heat-sinking in high-ambient-temperature applications. Operating temperature is commercial 0C to +70C only.
Compliance Information
Ceramic CPGA-160 package is typically NOT RoHS compliant due to lead-bearing ceramic hermetic sealing. Part is NRND per Altera/Intel legacy FPGA status. AEC-Q100 not applicable for FPGAs in this family.
