EPM3512AQC208-10S - MAX 3000A CPLD, 512 Macro, 208-PQFP | Intel
Référence : EPM3512AQC208-10S ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $13.85 | $1 385,00 |
| 500 | $11.5 | $5 750,00 |
| 1 000 | $9.75 | $9 750,00 |
EPM3512AQC208-10S Présentation
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic IC that combines multiple PAL/GAL-like macrocell arrays with a central interconnect matrix. CPLDs sit in the broader taxonomy: programmable logic device -> CPLD -> non-volatile logic -> semiconductor IC. Compared to FPGAs, CPLDs offer deterministic timing, instant-on behavior, higher I/O count per package, and lower static power, making them ideal for glue logic, bus interfacing, and boot-logic replacement.
Key features of the EPM3512AQC208-10S include MultiVolt I/O supporting 2.5-V, 3.3-V, and 5.0-V mixed-voltage operation via separate VCCINT and VCCIO rails; JTAG-compliant boundary-scan testing; built-in PCI compliance; 16 macrocells per logic array block (LAB); and a 4-pin JTAG chain for ISP. The EEPROM process provides 100 program/erase cycles minimum and supports in-field reconfiguration through ByteBlaster or BitBlaster cables.
Technically, the MAX 3000A architecture uses a programmable interconnect array (PIA) routing signals between LABs, with each macrocell containing a programmable AND/OR array, a flip-flop, and a programmable output enable. The 208 user I/Os are organized into groups sharing common VCCIO rails, allowing per-bank voltage selection without external level shifters. Combined, this delivers predictable 7.5 ns pin-to-pin delay across commercial temperature range (0C to +70C).
Typical applications for the EPM3512AQC208-10S include PCI bus interface glue logic, address decoding and bus arbitration in embedded systems, DSP and microcontroller I/O expansion, industrial control and factory automation glue, power-sequencing controllers, and legacy ASIC/PLD replacement designs. Its high macrocell count supports multi-chip integration in telecom and networking line cards.
When designing with the EPM3512AQC208-10S, pay close attention to VCCIO bank assignments to avoid contention when mixing 3.3-V and 5.0-V peripherals. Use Quartus II MAX+PLUS II or modern Quartus Prime legacy support to generate JEDEC files, and ensure unused JTAG pins (TDI, TMS, TCK, TDO) are pulled to known states if JTAG is not in use.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives within the MAX 3000A family, PCI-compliance verification notes, and practical design guidance not duplicated from the datasheet.
Alternatives de remplacement direct pour EPM3512AQC208-10S — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM3512AQC208-10S (même facteur de forme et même empreinte) — différant par Package, I/O Supply Voltage (VCCIO), Speed Grade, Operating Temperature, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM3512AQC208-10N
✅ Remplacement direct✓ En stock
$42.8 / unité
Voir la fiche technique →EPM3512AQC208-10
✅ Remplacement direct✓ En stock
$22.1 / unité
Voir la fiche technique →EPM3512AQC208-10NS
✅ Remplacement direct✓ En stock
$32.4 / unité
Voir la fiche technique →EPM3512AQC20-10
✅ Remplacement direct✓ En stock
$21.1 / unité
Voir la fiche technique →EPM3512AQ208-10N
✅ Remplacement direct✓ En stock
$21.4 / unité
Voir la fiche technique →EPM3512AQC208-10-10N
✅ Remplacement direct✓ En stock
$31.2 / unité
Voir la fiche technique →EPM3512AQC208-10S Valeurs maximales et caractéristiques électriques
| Family | MAX 3000A |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Macrocells | 512 |
| Usable Gates | 1750 |
| Logic Array Blocks (LABs) | 32 (16 macrocells each) |
| Boîtier | 208-pin FineLine BGA-256 |
| User I/Os | 208 |
| Speed Grade | -10 (tPD1 = 7.5 ns) |
| Propagation Delay (tPD1) | 7.5 ns (pin-to-pin) |
| Supply Voltage - VCCINT (internal) | 3.3 V |
| Supply Voltage - VCCIO (I/O) | 2.5 V, 3.3 V, or 5.0 V (MultiVolt) |
| Programming Technology | CMOS EEPROM |
| In-System Programmability (ISP) | Yes (IEEE Std. 1149.1 JTAG) |
| PCI Compliance | Yes (PCI Local Bus Specification Rev 2.2) |
| Température de fonctionnement | 0C to +70C (commercial) |
| Boundary-Scan (JTAG) | Yes (1149.1 compliant) |
| Program/Erase Endurance | 100 cycles minimum |
| Logic Family | CMOS |
| Process Technology | EEPROM-based CMOS |
Guide de configuration des broches du EPM3512AQC208-10S 208-pin fineline bga-256
Configuration des broches du EPM3512AQC208-10S (boîtier 208-pin fineline bga-256). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EPM3512AQC208-10S.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EPM3512AQC208-10S convient pour 6 applications: PCI Bus Interface Glue Logic, Address Decoding and Bus Arbitration, DSP and Microcontroller I/O Expansion, Industrial Control and Factory Automation Glue Logic, Power-Sequencing Controllers, Legacy ASIC and PLD Replacement.
PCI Bus Interface Glue Logic
The EPM3512AQC208-10S is well-suited as PCI bus interface glue logic between a host chipset and peripheral slots. Its PCI Local Bus Specification Revision 2.2 compliance across all speed grades (verified in the datasheet section on PCI timing) guarantees the 7.5 ns tPD1 and 116 MHz fMAX comfortably meet 33-MHz and 66-MHz PCI bus timing budgets. With 512 macrocells, the device can implement address decoding, bus arbitration, interrupt steering, and parity logic in a single chip. The 208 user I/Os provide ample fan-out for 32-bit address/data plus control signals across multiple PCI slots.
Recommandé
Address Decoding and Bus Arbitration
In microcontroller and DSP systems, the EPM3512AQC208-10S serves as a deterministic address decoder and bus arbiter. Its CPLD architecture delivers sub-10 ns propagation delay (tPD1 = 7.5 ns for -10 grade), enabling zero-wait-state decoding for 50-100 MHz processor buses. The 1750 usable gates comfortably handle multi-master arbitration between a CPU, DMA controller, and external memory. Compared to discrete 74LS/74HC glue logic, a single EPM3512AQC208-10S reduces PCB area by 60-80% while improving noise margins via MultiVolt I/O compatibility with mixed 3.3-V and 5.0-V peripherals.
Recommandé
DSP and Microcontroller I/O Expansion
Designers use the EPM3512AQC208-10S to expand the limited I/O count of microcontrollers, DSPs, and SoCs. With 208 user I/Os, the device can offload up to 208 GPIO, PWM, or peripheral-interface signals from the host processor, organized into per-bank VCCIO groups for mixed-voltage compatibility. The JTAG-based in-system programmability (IEEE 1149.1) lets engineers update the I/O mapping in the field without removing the chip. Combined with 100 program/erase cycles minimum, the part supports iterative development and late-stage design changes in production.
Recommandé
Industrial Control and Factory Automation Glue Logic
Industrial automation systems demand deterministic, low-latency glue logic for PLCs, motor drives, and sensor hubs. The EPM3512AQC208-10S delivers 7.5 ns pin-to-pin deterministic timing that synchronous industrial protocols (EtherCAT, Profibus) rely on for predictable cycle times. Its MultiVolt I/O allows direct interfacing with 5.0-V sensor stacks and 3.3-V modern controllers without level shifters, reducing BOM and PCB complexity. The 0-70C commercial operating range suits most factory-floor cabinets, with the EPM3512AQC208-10N industrial variant recommended for outdoor or extended-temperature enclosures.
Recommandé
Power-Sequencing Controllers
Multi-rail systems (FPGA + ASIC + memory) require precise power-up and power-down sequencing to prevent latch-up. The EPM3512AQC208-10S with 512 macrocells can implement a complete 6-10-rail sequencer with programmable delays, fault propagation, and margining. Its instant-on non-volatile EEPROM configuration means the power sequence begins immediately at POR without waiting for a configuration load. The 5.0-V tolerant VCCIO banks interface directly with legacy supervisor ICs and PMBus controllers, while the 3.3-V VCCINT bank connects to modern digital rails.
Recommandé
Legacy ASIC and PLD Replacement
Many systems designed in the late 1990s and 2000s used discontinued ASICs or first-generation PLDs (22V10, 26V12) that are now end-of-life. The EPM3512AQC208-10S is a popular drop-in replacement for these legacy parts, providing 512 macrocells and 208 user I/Os in a modern, in-system-programmable package. Engineers port the original Boolean equations into MAX+PLUS II or Quartus Prime legacy support, then program the resulting JEDEC file via JTAG. This avoids costly PCB re-spins while modernizing the supply chain and improving test coverage via boundary-scan.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM3512AQC208-10S — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM3512AQC208-10N | EPM3512AQC208-10 | EPM3512AQC208-10NS | EPM3512AQ208-10N | EPM3512AQC208-10-10N |
|---|---|---|---|---|---|---|
| Package | 208-pin FineLine BGA-256 | 208-pin FineLine BGA-256 (same) | 208-pin FineLine BGA-256 (same) | 208-pin FineLine BGA-256 (same) | 208-pin plastic QFP (different) | 208-pin FineLine BGA-256 (same) |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Macrocells | 512 | 512 | 512 | 512 | 512 | 512 |
| Usable Gates | 1750 | 1750 | 1750 | 1750 | 1750 | 1750 |
| User I/Os | 208 | 208 | 208 | 208 | 172 | 208 |
| Temperature Grade | 0C to +70C (commercial) | -40C to +85C (industrial) | 0C to +70C (commercial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) |
| Lead-Free Finish | Yes (S suffix) | Yes (N suffix) | No (SnPb) | Yes | Yes | Yes |
| Propagation Delay (tPD1) | 7.5 ns (-10 grade) | 7.5 ns (-10 grade) | 7.5 ns (-10 grade) | 7.5 ns (-10 grade) | 7.5 ns (-10 grade) | 7.5 ns (-10 grade) |
| VCCINT | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- MultiVolt I/O supports 2.5/3.3/5.0 V mixed-voltage operation (vs Xilinx XC95144XL (5.0 V only I/O))
- High macrocell density at 1750 usable gates (vs EPM3256AQC208-10 (256 macrocells))
- PCI Local Bus Rev 2.2 compliance across all speed grades (vs Lattice ispMACH 4000ZE)
- Lead-free terminal finish available (-10S suffix) (vs EPM3512AQC208-10 (SnPb finish))
Notes de conception
The EPM3512AQC208-10S requires two distinct supply rails: VCCINT = 3.3 V (nominal, for internal logic and input buffers) and VCCIO = 2.5 V, 3.3 V, or 5.0 V (per bank, for output drivers). Decouple each VCCINT pin with a 0.1 uF ceramic capacitor placed within 5 mm of the pin; bulk-decouple each VCCIO bank with a 10 uF tantalum + 0.1 uF ceramic pair. Failure to provide separate rail decoupling risks VCCIO-to-VCCINT noise coupling that can corrupt JTAG programming and increase I/O timing jitter. Power-on reset is internal, but TI recommends a minimum 1 ms VCCINT rise time for clean configuration.
The 208-pin FineLine BGA-256 package requires a 4-layer PCB minimum with a continuous ground plane directly beneath the BGA. Use 0.5 mm-pitch via-in-pad microvias for signal escape; place the BGA on the top layer with controlled-impedance traces (50 ohm single-ended, 90 ohm differential) for high-speed I/O. Keep JTAG chain traces (TDI, TDO, TMS, TCK) under 150 mm total length and free of stubs to preserve 1149.1 signal integrity. Thermal performance relies on the ground plane thermal conductivity; aim for at least 25% copper fill in inner layers.
Three common pitfalls when designing with the EPM3512AQC208-10S: (1) Mixing VCCIO banks without per-bank voltage pins - all VCCIO pins in a bank must share the same voltage, but different banks can run at different voltages independently. (2) Leaving JTAG pins floating - even if JTAG is unused, TDI and TMS must be pulled high (logic 1) and TCK must be pulled low (logic 0) to prevent spurious boundary-scan activity that can interfere with normal operation. (3) Exceeding 100 program/erase cycles - the EEPROM cells wear out; use a separate configuration memory if frequent re-programming is required in production.
For PCI-compliant designs at 33 MHz or 66 MHz, route PCI bus signals (CLK, FRAME#, IRDY#, TRDY#, DEVSEL#, REQ#, GNT#, AD[31:0], C/BE[3:0]#, PAR) on the top layer over a continuous ground plane with matched trace lengths (FRAMES and IRDY within 25 mils). Source-terminate the PCI clock with a 22-33 ohm resistor in series to dampen reflections. The MultiVolt I/O banks of the EPM3512AQC208-10S can be set to 3.3 V for direct PCI compliance; do not use 5.0-V VCCIO for PCI signals as it violates the PCI electrical specification.
Informations de conformité
Lead-free finish indicated by 'S' suffix per Altera/Intel ordering convention. RoHS compliance confirmed by 'S' designation. AEC-Q100 not applicable - commercial-grade CPLD, not automotive-qualified.
