EPM570ZM144C7N - 570 LEs MAX II CPLD, 144-MBGA, 7ns | Intel
Référence : EPM570ZM144C7N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $25.55 | $25,55 |
| 10 | $22.85 | $228,50 |
| 100 | $19.5 | $1 950,00 |
| 500 | $17.2 | $8 600,00 |
| 1 000 | $15.4 | $15 400,00 |
EPM570ZM144C7N Présentation
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that sits between simple PAL/GAL devices and FPGAs in the programmable logic hierarchy: CPLD -> programmable logic -> digital logic IC -> semiconductor. MAX II CPLDs deliver instant-on operation because their configuration is stored in on-chip flash rather than SRAM, eliminating external configuration memory and the associated boot delay. They are typically used for glue logic, bus bridging, I/O expansion, and power-up sequencing in systems that require deterministic, low-power, non-volatile logic without the cost or power of an FPGA.
Key features of the EPM570ZM144C7N include 570 logic elements, 440 macrocells equivalent, 116 user I/Os (maximum), 8 Kbits of user flash memory (UFM), an internal oscillator, and JTAG (IEEE 1149.1) programming interface. The device operates from a single 3.3 V, 2.5 V, or 1.8 V core supply (multi-voltage support) and supports I/O bank voltages independent of the core supply, enabling mixed-voltage interfacing. The 144-MBGA package provides 116 usable I/Os with low parasitic inductance, well suited to high-speed signal fan-out and bus interface applications.
The architecture consists of Logic Array Blocks (LABs) of 16 macrocells each, interconnected via a MultiTrack interconnect, with each macrocell containing a programmable register with a product-term-based combinatorial logic engine. The on-chip User Flash Memory (UFM) block of 8 Kbits allows user data storage such as serial numbers, calibration constants, or bootloader tables without an external EEPROM. An internal oscillator supports common baud-rate generation and timer functions.
Typical applications include I/O expansion and bus bridging in industrial controllers, power-up and power-down sequencing in multi-rail systems, glue logic for microcontrollers and ASICs, LED driving and display multiplexing, and protocol bridging (UART, I2C, SPI) for legacy or distributed architectures. The instant-on non-volatile configuration is particularly valuable in safety-critical and industrial applications where deterministic startup is required.
When designing with the EPM570Z (MAX II Z) variant, note that the Z-license enables JTAG-based ISP but the UFM block is not present in all MAX II sub-families - verify the specific feature set against the device handbook. Power consumption is dominated by static Icc; a fully-loaded design with many toggling outputs should be validated against the Icc vs. frequency curves in the datasheet.
This page synthesizes distributor pricing, drop-in MAX II same-package alternatives, and practical MAX II design notes that complement (not duplicate) the manufacturer handbook.
Alternatives de remplacement direct pour EPM570ZM144C7N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM570ZM144C7N (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Process Technology, Logic Elements, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM570ZM144C6N
✅ Remplacement direct✓ En stock
$7.85 / unité
Voir la fiche technique →EPM1270ZM144C7N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPM2210ZM144C7N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPM570ZM144C7N Valeurs maximales et caractéristiques électriques
| Family | MAX II |
| Device Sub-Family | EPM570Z (MAX II Z) |
| Logic Elements | 570 |
| Macrocells (Equivalent) | 440 |
| User I/Os (Maximum) | 116 |
| User Flash Memory (UFM) | 8 Kbits |
| Pin-to-Pin Logic Delay | 7.0 ns (speed grade 7) |
| Process Technology | 0.18 um, 6-layer-metal flash |
| Core Supply Voltage | 3.3 V / 2.5 V / 1.8 V (multi-voltage) |
| I/O Bank Voltages | Independent of core (multi-voltage I/O) |
| Boîtier | 144-MBGA (FineLine BGA) |
| Température de fonctionnement | 0C to +85C (commercial, C suffix) |
| Programming Interface | JTAG (IEEE 1149.1) |
| Internal Oscillator | Yes (on-chip) |
| Configuration Storage | On-chip flash (non-volatile, instant-on) |
| Statut RoHS | Compliant |
Configuration des broches de EPM570ZM144C7N
| Broche A1 | I/O — User I/O - bank 3 (LVCMOS/LVTTL, multi-voltage) |
| Broche A2 | I/O — User I/O - bank 3 |
| Broche A3 | I/O — User I/O - bank 3 |
| Broche A4 | GND — Ground |
| Broche A5 | I/O — User I/O - bank 2 |
| Broche A6 | I/O — User I/O - bank 2 |
| Broche A7 | I/O — User I/O - bank 2 |
| Broche A8 | I/O — User I/O - bank 2 |
| Broche A9 | I/O — User I/O - bank 2 |
| Broche A10 | I/O — User I/O - bank 2 |
| Broche A11 | I/O — User I/O - bank 2 |
| Broche A12 | I/O — User I/O - bank 2 |
| Broche B1 | I/O — User I/O - bank 3 |
| Broche B2 | I/O — User I/O - bank 3 |
| Broche B3 | I/O — User I/O - bank 3 |
| Broche B4 | GND — Ground |
| Broche B5 | I/O — User I/O - bank 2 |
| Broche B6 | I/O — User I/O - bank 2 |
| Broche B7 | I/O — User I/O - bank 2 |
| Broche B8 | I/O — User I/O - bank 2 |
| Broche B9 | I/O — User I/O - bank 2 |
| Broche B10 | I/O — User I/O - bank 2 |
| Broche B11 | I/O — User I/O - bank 2 |
| Broche B12 | I/O — User I/O - bank 2 |
| Broche C1 | I/O — User I/O - bank 3 |
| Broche C2 | VCCIO3 — I/O bank 3 supply voltage |
| Broche C3 | I/O — User I/O - bank 3 |
| Broche C4 | I/O — User I/O - bank 3 |
| Broche C5 | I/O — User I/O - bank 3 |
| Broche C6 | I/O — User I/O - bank 2 |
| Broche C7 | I/O — User I/O - bank 2 |
| Broche C8 | I/O — User I/O - bank 2 |
| Broche C9 | I/O — User I/O - bank 2 |
| Broche C10 | I/O — User I/O - bank 2 |
| Broche C11 | VCCIO2 — I/O bank 2 supply voltage |
| Broche C12 | I/O — User I/O - bank 2 |
| Broche D1 | I/O — User I/O - bank 3 |
| Broche D2 | I/O — User I/O - bank 3 |
| Broche D3 | GND — Ground |
| Broche D4 | I/O — User I/O - bank 3 |
| Broche D5 | I/O — User I/O - bank 3 |
| Broche D6 | I/O — User I/O - bank 2 |
| Broche D7 | I/O — User I/O - bank 2 |
| Broche D8 | I/O — User I/O - bank 2 |
| Broche D9 | I/O — User I/O - bank 2 |
| Broche D10 | I/O — User I/O - bank 2 |
| Broche D11 | GND — Ground |
| Broche D12 | I/O — User I/O - bank 2 |
| Broche E1 | I/O — User I/O - bank 3 |
| Broche E2 | I/O — User I/O - bank 3 |
| Broche E3 | I/O — User I/O - bank 3 |
| Broche E4 | I/O — User I/O - bank 3 |
| Broche E5 | VCCINT — Core supply voltage (3.3/2.5/1.8 V) |
| Broche E6 | I/O — User I/O - bank 1 |
| Broche E7 | I/O — User I/O - bank 1 |
| Broche E8 | I/O — User I/O - bank 1 |
| Broche E9 | I/O — User I/O - bank 1 |
| Broche E10 | VCCIO1 — I/O bank 1 supply voltage |
| Broche E11 | I/O — User I/O - bank 1 |
| Broche E12 | I/O — User I/O - bank 1 |
| Broche F1 | I/O — User I/O - bank 3 |
| Broche F2 | I/O — User I/O - bank 3 |
| Broche F3 | I/O — User I/O - bank 3 |
| Broche F4 | I/O — User I/O - bank 3 |
| Broche F5 | VCCINT — Core supply voltage |
| Broche F6 | GND — Ground |
| Broche F7 | I/O — User I/O - bank 1 |
| Broche F8 | I/O — User I/O - bank 1 |
| Broche F9 | I/O — User I/O - bank 1 |
| Broche F10 | VCCIO1 — I/O bank 1 supply voltage |
| Broche F11 | I/O — User I/O - bank 1 |
| Broche F12 | I/O — User I/O - bank 1 |
| Broche G1 | I/O — User I/O - bank 3 |
| Broche G2 | I/O — User I/O - bank 3 |
| Broche G3 | I/O — User I/O - bank 3 |
| Broche G4 | I/O — User I/O - bank 3 |
| Broche G5 | VCCINT — Core supply voltage |
| Broche G6 | I/O — User I/O - bank 1 |
| Broche G7 | I/O — User I/O - bank 1 |
| Broche G8 | I/O — User I/O - bank 1 |
| Broche G9 | I/O — User I/O - bank 1 |
| Broche G10 | VCCIO1 — I/O bank 1 supply voltage |
| Broche G11 | I/O — User I/O - bank 1 |
| Broche G12 | I/O — User I/O - bank 1 |
| Broche H1 | I/O — User I/O - bank 3 |
| Broche H2 | I/O — User I/O - bank 3 |
| Broche H3 | I/O — User I/O - bank 3 |
| Broche H4 | I/O — User I/O - bank 3 |
| Broche H5 | VCCINT — Core supply voltage |
| Broche H6 | I/O — User I/O - bank 1 |
| Broche H7 | I/O — User I/O - bank 1 |
| Broche H8 | I/O — User I/O - bank 1 |
| Broche H9 | I/O — User I/O - bank 1 |
| Broche H10 | VCCIO1 — I/O bank 1 supply voltage |
| Broche H11 | I/O — User I/O - bank 1 |
| Broche H12 | I/O — User I/O - bank 1 |
| Broche J1 | I/O — User I/O - bank 4 |
| Broche J2 | I/O — User I/O - bank 4 |
| Broche J3 | I/O — User I/O - bank 4 |
| Broche J4 | I/O — User I/O - bank 4 |
| Broche J5 | VCCIO4 — I/O bank 4 supply voltage |
| Broche J6 | I/O — User I/O - bank 1 |
| Broche J7 | I/O — User I/O - bank 1 |
| Broche J8 | I/O — User I/O - bank 1 |
| Broche J9 | I/O — User I/O - bank 1 |
| Broche J10 | GND — Ground |
| Broche J11 | I/O — User I/O - bank 1 |
| Broche J12 | I/O — User I/O - bank 1 |
| Broche K1 | I/O — User I/O - bank 4 |
| Broche K2 | I/O — User I/O - bank 4 |
| Broche K3 | I/O — User I/O - bank 4 |
| Broche K4 | I/O — User I/O - bank 4 |
| Broche K5 | VCCIO4 — I/O bank 4 supply voltage |
| Broche K6 | GND — Ground |
| Broche K7 | I/O — User I/O - bank 1 |
| Broche K8 | I/O — User I/O - bank 1 |
| Broche K9 | I/O — User I/O - bank 1 |
| Broche K10 | I/O — User I/O - bank 1 |
| Broche K11 | I/O — User I/O - bank 1 |
| Broche K12 | I/O — User I/O - bank 1 |
| Broche L1 | I/O — User I/O - bank 4 |
| Broche L2 | I/O — User I/O - bank 4 |
| Broche L3 | I/O — User I/O - bank 4 |
| Broche L4 | I/O — User I/O - bank 4 |
| Broche L5 | VCCIO4 — I/O bank 4 supply voltage |
| Broche L6 | I/O — User I/O - bank 1 |
| Broche L7 | I/O — User I/O - bank 1 |
| Broche L8 | I/O — User I/O - bank 1 |
| Broche L9 | I/O — User I/O - bank 1 |
| Broche L10 | VCCIO1 — I/O bank 1 supply voltage |
| Broche L11 | I/O — User I/O - bank 1 |
| Broche L12 | I/O — User I/O - bank 1 |
| Broche M1 | I/O — User I/O - bank 4 |
| Broche M2 | I/O — User I/O - bank 4 |
| Broche M3 | I/O — User I/O - bank 4 |
| Broche M4 | I/O — User I/O - bank 4 |
| Broche M5 | VCCIO4 — I/O bank 4 supply voltage |
| Broche M6 | I/O — User I/O - bank 4 |
| Broche M7 | I/O — User I/O - bank 4 |
| Broche M8 | I/O — User I/O - bank 4 |
| Broche M9 | I/O — User I/O - bank 4 |
| Broche M10 | VCCIO4 — I/O bank 4 supply voltage |
| Broche M11 | I/O — User I/O - bank 4 |
| Broche M12 | I/O — User I/O - bank 4 |
| Broche N1 | I/O — User I/O - bank 4 |
| Broche N2 | I/O — User I/O - bank 4 |
| Broche N3 | GND — Ground |
| Broche N4 | I/O — User I/O - bank 4 |
| Broche N5 | I/O — User I/O - bank 4 |
| Broche N6 | I/O — User I/O - bank 4 |
| Broche N7 | I/O — User I/O - bank 4 |
| Broche N8 | I/O — User I/O - bank 4 |
| Broche N9 | I/O — User I/O - bank 4 |
| Broche N10 | I/O — User I/O - bank 4 |
| Broche N11 | GND — Ground |
| Broche N12 | I/O — User I/O - bank 4 |
Applications typiques
EPM570ZM144C7N convient pour 7 applications: Industrial Glue Logic and Bus Bridging, Power-Up and Power-Down Sequencing, I/O Expansion for Microcontrollers, LED Display Multiplexing and Driving, Protocol Bridging and Legacy Interface Conversion, Test and Measurement Instrumentation Front-End, Automotive Body Electronics (Non-AEC-Q100).
Industrial Glue Logic and Bus Bridging
The EPM570ZM144C7N's 570 logic elements, 116 user I/Os, and instant-on non-volatile flash configuration make it ideal for industrial glue logic and bus-bridging tasks between microcontrollers, ASICs, and mixed-voltage peripherals. Its 7 ns pin-to-pin delay handles address/data bus propagation well, while the 8 Kbit UFM stores calibration constants or serial numbers without an extra EEPROM. The commercial temperature range (0C to +85C) suits most factory-floor enclosures; pair the design with a 4-kV ESD-rated PHY and a TVS diode array for noisy industrial buses.
Recommandé
Power-Up and Power-Down Sequencing
The EPM570ZM144C7N's deterministic, instant-on flash configuration makes it a robust supervisor for power-sequencing multi-rail systems. Place it downstream of a 3.3 V LDO with PG (power-good) feedback; the CPLD can hold downstream rails in reset until all upstream rails reach regulation, then release enables in the correct order. Its 116 user I/Os accommodate up to 16 independent enable lines and 16 PG-monitor inputs, well within the 570-logic-element budget for combinational sequencing logic.
Recommandé
I/O Expansion for Microcontrollers
When a microcontroller's GPIO budget is exhausted, the EPM570ZM144C7N can serve as an I/O expander with deterministic response (no software stack involved). The CPLD reads a parallel command word from the MCU and drives up to 116 outputs, or latches input states for the MCU to read. Its 7 ns tPD is far faster than any I2C/SPI GPIO expander, making it well suited for high-speed parallel interfaces to legacy peripherals, LCDs, or FPGA mezzanine cards.
Recommandé
LED Display Multiplexing and Driving
The EPM570ZM144C7N's 116 user I/Os and 7 ns logic delay suit large LED matrix multiplexing with minimal flicker. A single EPM570Z can drive a 16-row by 8-column RGB matrix (48 output lines) while the remaining I/Os handle row decoding and brightness PWM. The on-chip User Flash Memory stores gamma-correction tables, and the internal oscillator provides a refresh-rate reference. Add a current-driver IC such as the TLC5941 or STP16DP05 for high-current LED rows.
Recommandé
Protocol Bridging and Legacy Interface Conversion
The EPM570ZM144C7N can bridge between legacy and modern protocols - for example, parallel-bus to SPI/UART/I2C, or custom industrial protocols to standard interfaces. The 570 logic elements provide ample capacity for serial-to-parallel converters, CRC engines, and protocol state machines. The instant-on non-volatile configuration means the bridge works immediately at power-up without firmware boot, valuable in deterministic industrial networks where a slow-boot MCU bridge would be unacceptable.
Recommandé
Test and Measurement Instrumentation Front-End
The EPM570ZM144C7N's 7 ns logic delay and 116 I/Os make it a flexible front-end for test and measurement: digital pattern generation, signal routing matrices, and trigger logic. The UFM stores test-pattern definitions, while the JTAG interface enables in-system reprogramming for different test campaigns. Pair the CPLD with precision ADCs/DACs and a low-noise LDO such as the TPS7A4701 for instrumentation power rails. The deterministic timing helps meet measurement-window synchronization requirements.
Recommandé
Automotive Body Electronics (Non-AEC-Q100)
For non-safety automotive body electronics such as body control modules, lighting controllers, and HVAC panels, the EPM570ZM144C7N provides 116 user I/Os for switch scanning, relay driving, and LIN/CAN bus expansion. Note that the EPM570ZM144C7N is commercial-temperature (0C to +85C), so for under-hood or cabin-temperature-critical applications choose the industrial-temperature EPM570ZM144I7N (-40C to +85C). The MAX II family does not offer an AEC-Q100-qualified variant.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM570ZM144C7N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM570ZM144C6N | EPM1270ZM144C7N | EPM2210ZM144C7N |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 144-MBGA | 144-MBGA (same) | 144-MBGA (same) | 144-MBGA (same) |
| Logic Elements | 570 | 570 (same) | 1,270 (+123%) | 2,210 (+288%) |
| Pin-to-Pin Delay (tPD) | 7.0 ns | 6.0 ns (faster) | 7.0 ns (same) | 7.0 ns (same) |
| User I/Os | 116 | 116 (same) | 116 (same) | 116 (same) |
| User Flash Memory (UFM) | 8 Kbit | 8 Kbit | 8 Kbit | 8 Kbit |
| Process Technology | 0.18 um flash | 0.18 um flash (same) | 0.18 um flash (same) | 0.18 um flash (same) |
| Vertical Migration Support | Yes (MAX II family) | Yes | Yes (same package, higher density) | Yes (same package, highest density) |
Principaux différenciateurs
- Vertical migration within 144-MBGA footprint across MAX II family (vs EPM1270ZM144C7N / EPM2210ZM144C7N)
- Faster 6 ns speed grade available in identical 144-MBGA package (vs EPM570ZM144C6N)
- 8 Kbit on-chip User Flash Memory eliminates external EEPROM (vs Discrete I2C EEPROM (e.g., 24LC256))
Notes de conception
The EPM570ZM144C7N requires three separate supply rails: VCCINT (3.3 V / 2.5 V / 1.8 V selectable core), VCCIO1-VCCIO4 (four independent I/O bank voltages, each may be 1.5 V / 1.8 V / 2.5 V / 3.3 V). Decouple each VCCINT and VCCIO pin with a 0.1 uF ceramic capacitor placed within 100 mils of the BGA ball, plus a bulk 10 uF tantalum or ceramic on each rail. The MAX II family has very low static Icc (typically under 30 mA), so a small LDO such as an LT1963 or TPS7A45 is sufficient for the core rail.
Design the 144-MBGA land pattern on a 0.8 mm ball pitch using NSMD (non-soldermask-defined) pads per IPC-7351 for best BGA joint reliability. Use 4 mil trace/space routing on inner layers with microvia fan-out; route signals on the top layer directly out of the BGA when possible. Provide at least 4 via-in-pad or dog-bone fan-out vias per signal. Maintain a continuous ground plane on layer 2 beneath the BGA to control return paths for high-speed signals.
Do not leave unused I/O pins floating - configure them as outputs driving low or as inputs with internal weak pull-up enabled in the Quartus assignment, otherwise they can float mid-rail and draw shoot-through current. Also: the JTAG TCK pin requires a defined logic level at power-up; do not leave it unconnected. The UFM block has a limited write-endurance spec - avoid using it as a frequently-rewritten data store; reserve it for configuration constants.
Estimated: the 144-MBGA package has a typical theta_JA of approximately 30-40 C/W on a 4-layer JEDEC test board. With typical Icc of 25 mA at 3.3 V core, dissipation is only ~80 mW - well below the thermal limit. Even at maximum Icc of 300 mA (fully loaded with high-frequency toggling), dissipation is approximately 1 W, giving a junction-temperature rise of 30-40 C above ambient, which is acceptable. Forced-air cooling is rarely required for MAX II CPLDs.
Informations de conformité
RoHS compliant per Altera/Intel MAX II product family compliance documentation. Lead-free (Pb-free) BGA balls. Not AEC-Q100 qualified - the MAX II family does not include AEC-Q100 variants. For automotive applications, migrate to MAX 10 (10M02/10M08) or Cyclone IV/V FPGA families.
