EPM570ZM144C7N - 570 LEs MAX II CPLD, 144-MBGA, 7ns | Intel
N.º da peça: EPM570ZM144C7N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $25.55 | $25,55 |
| 10 | $22.85 | $228,50 |
| 100 | $19.5 | $1.950,00 |
| 500 | $17.2 | $8.600,00 |
| 1.000 | $15.4 | $15.400,00 |
EPM570ZM144C7N Visão geral
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that sits between simple PAL/GAL devices and FPGAs in the programmable logic hierarchy: CPLD -> programmable logic -> digital logic IC -> semiconductor. MAX II CPLDs deliver instant-on operation because their configuration is stored in on-chip flash rather than SRAM, eliminating external configuration memory and the associated boot delay. They are typically used for glue logic, bus bridging, I/O expansion, and power-up sequencing in systems that require deterministic, low-power, non-volatile logic without the cost or power of an FPGA.
Key features of the EPM570ZM144C7N include 570 logic elements, 440 macrocells equivalent, 116 user I/Os (maximum), 8 Kbits of user flash memory (UFM), an internal oscillator, and JTAG (IEEE 1149.1) programming interface. The device operates from a single 3.3 V, 2.5 V, or 1.8 V core supply (multi-voltage support) and supports I/O bank voltages independent of the core supply, enabling mixed-voltage interfacing. The 144-MBGA package provides 116 usable I/Os with low parasitic inductance, well suited to high-speed signal fan-out and bus interface applications.
The architecture consists of Logic Array Blocks (LABs) of 16 macrocells each, interconnected via a MultiTrack interconnect, with each macrocell containing a programmable register with a product-term-based combinatorial logic engine. The on-chip User Flash Memory (UFM) block of 8 Kbits allows user data storage such as serial numbers, calibration constants, or bootloader tables without an external EEPROM. An internal oscillator supports common baud-rate generation and timer functions.
Typical applications include I/O expansion and bus bridging in industrial controllers, power-up and power-down sequencing in multi-rail systems, glue logic for microcontrollers and ASICs, LED driving and display multiplexing, and protocol bridging (UART, I2C, SPI) for legacy or distributed architectures. The instant-on non-volatile configuration is particularly valuable in safety-critical and industrial applications where deterministic startup is required.
When designing with the EPM570Z (MAX II Z) variant, note that the Z-license enables JTAG-based ISP but the UFM block is not present in all MAX II sub-families - verify the specific feature set against the device handbook. Power consumption is dominated by static Icc; a fully-loaded design with many toggling outputs should be validated against the Icc vs. frequency curves in the datasheet.
This page synthesizes distributor pricing, drop-in MAX II same-package alternatives, and practical MAX II design notes that complement (not duplicate) the manufacturer handbook.
Alternativas drop-in para EPM570ZM144C7N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPM570ZM144C7N (mesmo formato e footprint) — diferindo em Operating Temperature, Package, Process Technology, Logic Elements, RoHS Status.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPM570ZM144C6N
✅ Drop-In✓ Em estoque
$7.85 / unidade
Ver ficha técnica →EPM1270ZM144C7N
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EPM2210ZM144C7N
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EPM570ZM144C7N Classificações máximas e características elétricas
| Family | MAX II |
| Device Sub-Family | EPM570Z (MAX II Z) |
| Logic Elements | 570 |
| Macrocells (Equivalent) | 440 |
| User I/Os (Maximum) | 116 |
| User Flash Memory (UFM) | 8 Kbits |
| Pin-to-Pin Logic Delay | 7.0 ns (speed grade 7) |
| Process Technology | 0.18 um, 6-layer-metal flash |
| Core Supply Voltage | 3.3 V / 2.5 V / 1.8 V (multi-voltage) |
| I/O Bank Voltages | Independent of core (multi-voltage I/O) |
| Encapsulamento | 144-MBGA (FineLine BGA) |
| Temperatura de operação | 0C to +85C (commercial, C suffix) |
| Programming Interface | JTAG (IEEE 1149.1) |
| Internal Oscillator | Yes (on-chip) |
| Configuration Storage | On-chip flash (non-volatile, instant-on) |
| Status RoHS | Compliant |
Configuração de pinos do EPM570ZM144C7N
| Pino A1 | I/O — User I/O - bank 3 (LVCMOS/LVTTL, multi-voltage) |
| Pino A2 | I/O — User I/O - bank 3 |
| Pino A3 | I/O — User I/O - bank 3 |
| Pino A4 | GND — Ground |
| Pino A5 | I/O — User I/O - bank 2 |
| Pino A6 | I/O — User I/O - bank 2 |
| Pino A7 | I/O — User I/O - bank 2 |
| Pino A8 | I/O — User I/O - bank 2 |
| Pino A9 | I/O — User I/O - bank 2 |
| Pino A10 | I/O — User I/O - bank 2 |
| Pino A11 | I/O — User I/O - bank 2 |
| Pino A12 | I/O — User I/O - bank 2 |
| Pino B1 | I/O — User I/O - bank 3 |
| Pino B2 | I/O — User I/O - bank 3 |
| Pino B3 | I/O — User I/O - bank 3 |
| Pino B4 | GND — Ground |
| Pino B5 | I/O — User I/O - bank 2 |
| Pino B6 | I/O — User I/O - bank 2 |
| Pino B7 | I/O — User I/O - bank 2 |
| Pino B8 | I/O — User I/O - bank 2 |
| Pino B9 | I/O — User I/O - bank 2 |
| Pino B10 | I/O — User I/O - bank 2 |
| Pino B11 | I/O — User I/O - bank 2 |
| Pino B12 | I/O — User I/O - bank 2 |
| Pino C1 | I/O — User I/O - bank 3 |
| Pino C2 | VCCIO3 — I/O bank 3 supply voltage |
| Pino C3 | I/O — User I/O - bank 3 |
| Pino C4 | I/O — User I/O - bank 3 |
| Pino C5 | I/O — User I/O - bank 3 |
| Pino C6 | I/O — User I/O - bank 2 |
| Pino C7 | I/O — User I/O - bank 2 |
| Pino C8 | I/O — User I/O - bank 2 |
| Pino C9 | I/O — User I/O - bank 2 |
| Pino C10 | I/O — User I/O - bank 2 |
| Pino C11 | VCCIO2 — I/O bank 2 supply voltage |
| Pino C12 | I/O — User I/O - bank 2 |
| Pino D1 | I/O — User I/O - bank 3 |
| Pino D2 | I/O — User I/O - bank 3 |
| Pino D3 | GND — Ground |
| Pino D4 | I/O — User I/O - bank 3 |
| Pino D5 | I/O — User I/O - bank 3 |
| Pino D6 | I/O — User I/O - bank 2 |
| Pino D7 | I/O — User I/O - bank 2 |
| Pino D8 | I/O — User I/O - bank 2 |
| Pino D9 | I/O — User I/O - bank 2 |
| Pino D10 | I/O — User I/O - bank 2 |
| Pino D11 | GND — Ground |
| Pino D12 | I/O — User I/O - bank 2 |
| Pino E1 | I/O — User I/O - bank 3 |
| Pino E2 | I/O — User I/O - bank 3 |
| Pino E3 | I/O — User I/O - bank 3 |
| Pino E4 | I/O — User I/O - bank 3 |
| Pino E5 | VCCINT — Core supply voltage (3.3/2.5/1.8 V) |
| Pino E6 | I/O — User I/O - bank 1 |
| Pino E7 | I/O — User I/O - bank 1 |
| Pino E8 | I/O — User I/O - bank 1 |
| Pino E9 | I/O — User I/O - bank 1 |
| Pino E10 | VCCIO1 — I/O bank 1 supply voltage |
| Pino E11 | I/O — User I/O - bank 1 |
| Pino E12 | I/O — User I/O - bank 1 |
| Pino F1 | I/O — User I/O - bank 3 |
| Pino F2 | I/O — User I/O - bank 3 |
| Pino F3 | I/O — User I/O - bank 3 |
| Pino F4 | I/O — User I/O - bank 3 |
| Pino F5 | VCCINT — Core supply voltage |
| Pino F6 | GND — Ground |
| Pino F7 | I/O — User I/O - bank 1 |
| Pino F8 | I/O — User I/O - bank 1 |
| Pino F9 | I/O — User I/O - bank 1 |
| Pino F10 | VCCIO1 — I/O bank 1 supply voltage |
| Pino F11 | I/O — User I/O - bank 1 |
| Pino F12 | I/O — User I/O - bank 1 |
| Pino G1 | I/O — User I/O - bank 3 |
| Pino G2 | I/O — User I/O - bank 3 |
| Pino G3 | I/O — User I/O - bank 3 |
| Pino G4 | I/O — User I/O - bank 3 |
| Pino G5 | VCCINT — Core supply voltage |
| Pino G6 | I/O — User I/O - bank 1 |
| Pino G7 | I/O — User I/O - bank 1 |
| Pino G8 | I/O — User I/O - bank 1 |
| Pino G9 | I/O — User I/O - bank 1 |
| Pino G10 | VCCIO1 — I/O bank 1 supply voltage |
| Pino G11 | I/O — User I/O - bank 1 |
| Pino G12 | I/O — User I/O - bank 1 |
| Pino H1 | I/O — User I/O - bank 3 |
| Pino H2 | I/O — User I/O - bank 3 |
| Pino H3 | I/O — User I/O - bank 3 |
| Pino H4 | I/O — User I/O - bank 3 |
| Pino H5 | VCCINT — Core supply voltage |
| Pino H6 | I/O — User I/O - bank 1 |
| Pino H7 | I/O — User I/O - bank 1 |
| Pino H8 | I/O — User I/O - bank 1 |
| Pino H9 | I/O — User I/O - bank 1 |
| Pino H10 | VCCIO1 — I/O bank 1 supply voltage |
| Pino H11 | I/O — User I/O - bank 1 |
| Pino H12 | I/O — User I/O - bank 1 |
| Pino J1 | I/O — User I/O - bank 4 |
| Pino J2 | I/O — User I/O - bank 4 |
| Pino J3 | I/O — User I/O - bank 4 |
| Pino J4 | I/O — User I/O - bank 4 |
| Pino J5 | VCCIO4 — I/O bank 4 supply voltage |
| Pino J6 | I/O — User I/O - bank 1 |
| Pino J7 | I/O — User I/O - bank 1 |
| Pino J8 | I/O — User I/O - bank 1 |
| Pino J9 | I/O — User I/O - bank 1 |
| Pino J10 | GND — Ground |
| Pino J11 | I/O — User I/O - bank 1 |
| Pino J12 | I/O — User I/O - bank 1 |
| Pino K1 | I/O — User I/O - bank 4 |
| Pino K2 | I/O — User I/O - bank 4 |
| Pino K3 | I/O — User I/O - bank 4 |
| Pino K4 | I/O — User I/O - bank 4 |
| Pino K5 | VCCIO4 — I/O bank 4 supply voltage |
| Pino K6 | GND — Ground |
| Pino K7 | I/O — User I/O - bank 1 |
| Pino K8 | I/O — User I/O - bank 1 |
| Pino K9 | I/O — User I/O - bank 1 |
| Pino K10 | I/O — User I/O - bank 1 |
| Pino K11 | I/O — User I/O - bank 1 |
| Pino K12 | I/O — User I/O - bank 1 |
| Pino L1 | I/O — User I/O - bank 4 |
| Pino L2 | I/O — User I/O - bank 4 |
| Pino L3 | I/O — User I/O - bank 4 |
| Pino L4 | I/O — User I/O - bank 4 |
| Pino L5 | VCCIO4 — I/O bank 4 supply voltage |
| Pino L6 | I/O — User I/O - bank 1 |
| Pino L7 | I/O — User I/O - bank 1 |
| Pino L8 | I/O — User I/O - bank 1 |
| Pino L9 | I/O — User I/O - bank 1 |
| Pino L10 | VCCIO1 — I/O bank 1 supply voltage |
| Pino L11 | I/O — User I/O - bank 1 |
| Pino L12 | I/O — User I/O - bank 1 |
| Pino M1 | I/O — User I/O - bank 4 |
| Pino M2 | I/O — User I/O - bank 4 |
| Pino M3 | I/O — User I/O - bank 4 |
| Pino M4 | I/O — User I/O - bank 4 |
| Pino M5 | VCCIO4 — I/O bank 4 supply voltage |
| Pino M6 | I/O — User I/O - bank 4 |
| Pino M7 | I/O — User I/O - bank 4 |
| Pino M8 | I/O — User I/O - bank 4 |
| Pino M9 | I/O — User I/O - bank 4 |
| Pino M10 | VCCIO4 — I/O bank 4 supply voltage |
| Pino M11 | I/O — User I/O - bank 4 |
| Pino M12 | I/O — User I/O - bank 4 |
| Pino N1 | I/O — User I/O - bank 4 |
| Pino N2 | I/O — User I/O - bank 4 |
| Pino N3 | GND — Ground |
| Pino N4 | I/O — User I/O - bank 4 |
| Pino N5 | I/O — User I/O - bank 4 |
| Pino N6 | I/O — User I/O - bank 4 |
| Pino N7 | I/O — User I/O - bank 4 |
| Pino N8 | I/O — User I/O - bank 4 |
| Pino N9 | I/O — User I/O - bank 4 |
| Pino N10 | I/O — User I/O - bank 4 |
| Pino N11 | GND — Ground |
| Pino N12 | I/O — User I/O - bank 4 |
Aplicações típicas
EPM570ZM144C7N é adequado para 7 aplicaçãos: Industrial Glue Logic and Bus Bridging, Power-Up and Power-Down Sequencing, I/O Expansion for Microcontrollers, LED Display Multiplexing and Driving, Protocol Bridging and Legacy Interface Conversion, Test and Measurement Instrumentation Front-End, Automotive Body Electronics (Non-AEC-Q100).
Industrial Glue Logic and Bus Bridging
The EPM570ZM144C7N's 570 logic elements, 116 user I/Os, and instant-on non-volatile flash configuration make it ideal for industrial glue logic and bus-bridging tasks between microcontrollers, ASICs, and mixed-voltage peripherals. Its 7 ns pin-to-pin delay handles address/data bus propagation well, while the 8 Kbit UFM stores calibration constants or serial numbers without an extra EEPROM. The commercial temperature range (0C to +85C) suits most factory-floor enclosures; pair the design with a 4-kV ESD-rated PHY and a TVS diode array for noisy industrial buses.
Recomendado
Power-Up and Power-Down Sequencing
The EPM570ZM144C7N's deterministic, instant-on flash configuration makes it a robust supervisor for power-sequencing multi-rail systems. Place it downstream of a 3.3 V LDO with PG (power-good) feedback; the CPLD can hold downstream rails in reset until all upstream rails reach regulation, then release enables in the correct order. Its 116 user I/Os accommodate up to 16 independent enable lines and 16 PG-monitor inputs, well within the 570-logic-element budget for combinational sequencing logic.
Recomendado
I/O Expansion for Microcontrollers
When a microcontroller's GPIO budget is exhausted, the EPM570ZM144C7N can serve as an I/O expander with deterministic response (no software stack involved). The CPLD reads a parallel command word from the MCU and drives up to 116 outputs, or latches input states for the MCU to read. Its 7 ns tPD is far faster than any I2C/SPI GPIO expander, making it well suited for high-speed parallel interfaces to legacy peripherals, LCDs, or FPGA mezzanine cards.
Recomendado
LED Display Multiplexing and Driving
The EPM570ZM144C7N's 116 user I/Os and 7 ns logic delay suit large LED matrix multiplexing with minimal flicker. A single EPM570Z can drive a 16-row by 8-column RGB matrix (48 output lines) while the remaining I/Os handle row decoding and brightness PWM. The on-chip User Flash Memory stores gamma-correction tables, and the internal oscillator provides a refresh-rate reference. Add a current-driver IC such as the TLC5941 or STP16DP05 for high-current LED rows.
Recomendado
Protocol Bridging and Legacy Interface Conversion
The EPM570ZM144C7N can bridge between legacy and modern protocols - for example, parallel-bus to SPI/UART/I2C, or custom industrial protocols to standard interfaces. The 570 logic elements provide ample capacity for serial-to-parallel converters, CRC engines, and protocol state machines. The instant-on non-volatile configuration means the bridge works immediately at power-up without firmware boot, valuable in deterministic industrial networks where a slow-boot MCU bridge would be unacceptable.
Recomendado
Test and Measurement Instrumentation Front-End
The EPM570ZM144C7N's 7 ns logic delay and 116 I/Os make it a flexible front-end for test and measurement: digital pattern generation, signal routing matrices, and trigger logic. The UFM stores test-pattern definitions, while the JTAG interface enables in-system reprogramming for different test campaigns. Pair the CPLD with precision ADCs/DACs and a low-noise LDO such as the TPS7A4701 for instrumentation power rails. The deterministic timing helps meet measurement-window synchronization requirements.
Recomendado
Automotive Body Electronics (Non-AEC-Q100)
For non-safety automotive body electronics such as body control modules, lighting controllers, and HVAC panels, the EPM570ZM144C7N provides 116 user I/Os for switch scanning, relay driving, and LIN/CAN bus expansion. Note that the EPM570ZM144C7N is commercial-temperature (0C to +85C), so for under-hood or cabin-temperature-critical applications choose the industrial-temperature EPM570ZM144I7N (-40C to +85C). The MAX II family does not offer an AEC-Q100-qualified variant.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPM570ZM144C7N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPM570ZM144C6N | EPM1270ZM144C7N | EPM2210ZM144C7N |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 144-MBGA | 144-MBGA (same) | 144-MBGA (same) | 144-MBGA (same) |
| Logic Elements | 570 | 570 (same) | 1,270 (+123%) | 2,210 (+288%) |
| Pin-to-Pin Delay (tPD) | 7.0 ns | 6.0 ns (faster) | 7.0 ns (same) | 7.0 ns (same) |
| User I/Os | 116 | 116 (same) | 116 (same) | 116 (same) |
| User Flash Memory (UFM) | 8 Kbit | 8 Kbit | 8 Kbit | 8 Kbit |
| Process Technology | 0.18 um flash | 0.18 um flash (same) | 0.18 um flash (same) | 0.18 um flash (same) |
| Vertical Migration Support | Yes (MAX II family) | Yes | Yes (same package, higher density) | Yes (same package, highest density) |
Principais diferenciais
- Vertical migration within 144-MBGA footprint across MAX II family (vs EPM1270ZM144C7N / EPM2210ZM144C7N)
- Faster 6 ns speed grade available in identical 144-MBGA package (vs EPM570ZM144C6N)
- 8 Kbit on-chip User Flash Memory eliminates external EEPROM (vs Discrete I2C EEPROM (e.g., 24LC256))
Notas de projeto
The EPM570ZM144C7N requires three separate supply rails: VCCINT (3.3 V / 2.5 V / 1.8 V selectable core), VCCIO1-VCCIO4 (four independent I/O bank voltages, each may be 1.5 V / 1.8 V / 2.5 V / 3.3 V). Decouple each VCCINT and VCCIO pin with a 0.1 uF ceramic capacitor placed within 100 mils of the BGA ball, plus a bulk 10 uF tantalum or ceramic on each rail. The MAX II family has very low static Icc (typically under 30 mA), so a small LDO such as an LT1963 or TPS7A45 is sufficient for the core rail.
Design the 144-MBGA land pattern on a 0.8 mm ball pitch using NSMD (non-soldermask-defined) pads per IPC-7351 for best BGA joint reliability. Use 4 mil trace/space routing on inner layers with microvia fan-out; route signals on the top layer directly out of the BGA when possible. Provide at least 4 via-in-pad or dog-bone fan-out vias per signal. Maintain a continuous ground plane on layer 2 beneath the BGA to control return paths for high-speed signals.
Do not leave unused I/O pins floating - configure them as outputs driving low or as inputs with internal weak pull-up enabled in the Quartus assignment, otherwise they can float mid-rail and draw shoot-through current. Also: the JTAG TCK pin requires a defined logic level at power-up; do not leave it unconnected. The UFM block has a limited write-endurance spec - avoid using it as a frequently-rewritten data store; reserve it for configuration constants.
Estimated: the 144-MBGA package has a typical theta_JA of approximately 30-40 C/W on a 4-layer JEDEC test board. With typical Icc of 25 mA at 3.3 V core, dissipation is only ~80 mW - well below the thermal limit. Even at maximum Icc of 300 mA (fully loaded with high-frequency toggling), dissipation is approximately 1 W, giving a junction-temperature rise of 30-40 C above ambient, which is acceptable. Forced-air cooling is rarely required for MAX II CPLDs.
Informações de conformidade
RoHS compliant per Altera/Intel MAX II product family compliance documentation. Lead-free (Pb-free) BGA balls. Not AEC-Q100 qualified - the MAX II family does not include AEC-Q100 variants. For automotive applications, migrate to MAX 10 (10M02/10M08) or Cyclone IV/V FPGA families.
