EPM570ZM144C7N - 570 LEs MAX II CPLD, 144-MBGA, 7ns | Intel
料号： EPM570ZM144C7N ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $25.55 | $25.55 |
| 10 | $22.85 | $228.50 |
| 100 | $19.5 | $1,950.00 |
| 500 | $17.2 | $8,600.00 |
| 1,000 | $15.4 | $15,400.00 |
EPM570ZM144C7N 概述
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that sits between simple PAL/GAL devices and FPGAs in the programmable logic hierarchy: CPLD -> programmable logic -> digital logic IC -> semiconductor. MAX II CPLDs deliver instant-on operation because their configuration is stored in on-chip flash rather than SRAM, eliminating external configuration memory and the associated boot delay. They are typically used for glue logic, bus bridging, I/O expansion, and power-up sequencing in systems that require deterministic, low-power, non-volatile logic without the cost or power of an FPGA.
Key features of the EPM570ZM144C7N include 570 logic elements, 440 macrocells equivalent, 116 user I/Os (maximum), 8 Kbits of user flash memory (UFM), an internal oscillator, and JTAG (IEEE 1149.1) programming interface. The device operates from a single 3.3 V, 2.5 V, or 1.8 V core supply (multi-voltage support) and supports I/O bank voltages independent of the core supply, enabling mixed-voltage interfacing. The 144-MBGA package provides 116 usable I/Os with low parasitic inductance, well suited to high-speed signal fan-out and bus interface applications.
The architecture consists of Logic Array Blocks (LABs) of 16 macrocells each, interconnected via a MultiTrack interconnect, with each macrocell containing a programmable register with a product-term-based combinatorial logic engine. The on-chip User Flash Memory (UFM) block of 8 Kbits allows user data storage such as serial numbers, calibration constants, or bootloader tables without an external EEPROM. An internal oscillator supports common baud-rate generation and timer functions.
Typical applications include I/O expansion and bus bridging in industrial controllers, power-up and power-down sequencing in multi-rail systems, glue logic for microcontrollers and ASICs, LED driving and display multiplexing, and protocol bridging (UART, I2C, SPI) for legacy or distributed architectures. The instant-on non-volatile configuration is particularly valuable in safety-critical and industrial applications where deterministic startup is required.
When designing with the EPM570Z (MAX II Z) variant, note that the Z-license enables JTAG-based ISP but the UFM block is not present in all MAX II sub-families - verify the specific feature set against the device handbook. Power consumption is dominated by static Icc; a fully-loaded design with many toggling outputs should be validated against the Icc vs. frequency curves in the datasheet.
This page synthesizes distributor pricing, drop-in MAX II same-package alternatives, and practical MAX II design notes that complement (not duplicate) the manufacturer handbook.
直接替换替代料： EPM570ZM144C7N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EPM570ZM144C7N （相同外形与封装尺寸） ——差异在于 Operating Temperature, Package, Process Technology, Logic Elements, RoHS Status.
快速对比工具——选择替代料号进行并排对比：
EPM570ZM144C6N
✅ 直接替换✓ 有现货
$7.85 / 个
查看数据手册 →EPM1270ZM144C7N
✅ 直接替换📋 参考替代料（不在目录中）
EPM2210ZM144C7N
✅ 直接替换📋 参考替代料（不在目录中）
EPM570ZM144C7N 最大额定值与电气特性
| Family | MAX II |
| Device Sub-Family | EPM570Z (MAX II Z) |
| Logic Elements | 570 |
| Macrocells (Equivalent) | 440 |
| User I/Os (Maximum) | 116 |
| User Flash Memory (UFM) | 8 Kbits |
| Pin-to-Pin Logic Delay | 7.0 ns (speed grade 7) |
| Process Technology | 0.18 um, 6-layer-metal flash |
| Core Supply Voltage | 3.3 V / 2.5 V / 1.8 V (multi-voltage) |
| I/O Bank Voltages | Independent of core (multi-voltage I/O) |
| 封装 | 144-MBGA (FineLine BGA) |
| 工作温度 | 0C to +85C (commercial, C suffix) |
| Programming Interface | JTAG (IEEE 1149.1) |
| Internal Oscillator | Yes (on-chip) |
| Configuration Storage | On-chip flash (non-volatile, instant-on) |
| RoHS 状态 | Compliant |
EPM570ZM144C7N 引脚配置
| 引脚 A1 | I/O — User I/O - bank 3 (LVCMOS/LVTTL, multi-voltage) |
| 引脚 A2 | I/O — User I/O - bank 3 |
| 引脚 A3 | I/O — User I/O - bank 3 |
| 引脚 A4 | GND — Ground |
| 引脚 A5 | I/O — User I/O - bank 2 |
| 引脚 A6 | I/O — User I/O - bank 2 |
| 引脚 A7 | I/O — User I/O - bank 2 |
| 引脚 A8 | I/O — User I/O - bank 2 |
| 引脚 A9 | I/O — User I/O - bank 2 |
| 引脚 A10 | I/O — User I/O - bank 2 |
| 引脚 A11 | I/O — User I/O - bank 2 |
| 引脚 A12 | I/O — User I/O - bank 2 |
| 引脚 B1 | I/O — User I/O - bank 3 |
| 引脚 B2 | I/O — User I/O - bank 3 |
| 引脚 B3 | I/O — User I/O - bank 3 |
| 引脚 B4 | GND — Ground |
| 引脚 B5 | I/O — User I/O - bank 2 |
| 引脚 B6 | I/O — User I/O - bank 2 |
| 引脚 B7 | I/O — User I/O - bank 2 |
| 引脚 B8 | I/O — User I/O - bank 2 |
| 引脚 B9 | I/O — User I/O - bank 2 |
| 引脚 B10 | I/O — User I/O - bank 2 |
| 引脚 B11 | I/O — User I/O - bank 2 |
| 引脚 B12 | I/O — User I/O - bank 2 |
| 引脚 C1 | I/O — User I/O - bank 3 |
| 引脚 C2 | VCCIO3 — I/O bank 3 supply voltage |
| 引脚 C3 | I/O — User I/O - bank 3 |
| 引脚 C4 | I/O — User I/O - bank 3 |
| 引脚 C5 | I/O — User I/O - bank 3 |
| 引脚 C6 | I/O — User I/O - bank 2 |
| 引脚 C7 | I/O — User I/O - bank 2 |
| 引脚 C8 | I/O — User I/O - bank 2 |
| 引脚 C9 | I/O — User I/O - bank 2 |
| 引脚 C10 | I/O — User I/O - bank 2 |
| 引脚 C11 | VCCIO2 — I/O bank 2 supply voltage |
| 引脚 C12 | I/O — User I/O - bank 2 |
| 引脚 D1 | I/O — User I/O - bank 3 |
| 引脚 D2 | I/O — User I/O - bank 3 |
| 引脚 D3 | GND — Ground |
| 引脚 D4 | I/O — User I/O - bank 3 |
| 引脚 D5 | I/O — User I/O - bank 3 |
| 引脚 D6 | I/O — User I/O - bank 2 |
| 引脚 D7 | I/O — User I/O - bank 2 |
| 引脚 D8 | I/O — User I/O - bank 2 |
| 引脚 D9 | I/O — User I/O - bank 2 |
| 引脚 D10 | I/O — User I/O - bank 2 |
| 引脚 D11 | GND — Ground |
| 引脚 D12 | I/O — User I/O - bank 2 |
| 引脚 E1 | I/O — User I/O - bank 3 |
| 引脚 E2 | I/O — User I/O - bank 3 |
| 引脚 E3 | I/O — User I/O - bank 3 |
| 引脚 E4 | I/O — User I/O - bank 3 |
| 引脚 E5 | VCCINT — Core supply voltage (3.3/2.5/1.8 V) |
| 引脚 E6 | I/O — User I/O - bank 1 |
| 引脚 E7 | I/O — User I/O - bank 1 |
| 引脚 E8 | I/O — User I/O - bank 1 |
| 引脚 E9 | I/O — User I/O - bank 1 |
| 引脚 E10 | VCCIO1 — I/O bank 1 supply voltage |
| 引脚 E11 | I/O — User I/O - bank 1 |
| 引脚 E12 | I/O — User I/O - bank 1 |
| 引脚 F1 | I/O — User I/O - bank 3 |
| 引脚 F2 | I/O — User I/O - bank 3 |
| 引脚 F3 | I/O — User I/O - bank 3 |
| 引脚 F4 | I/O — User I/O - bank 3 |
| 引脚 F5 | VCCINT — Core supply voltage |
| 引脚 F6 | GND — Ground |
| 引脚 F7 | I/O — User I/O - bank 1 |
| 引脚 F8 | I/O — User I/O - bank 1 |
| 引脚 F9 | I/O — User I/O - bank 1 |
| 引脚 F10 | VCCIO1 — I/O bank 1 supply voltage |
| 引脚 F11 | I/O — User I/O - bank 1 |
| 引脚 F12 | I/O — User I/O - bank 1 |
| 引脚 G1 | I/O — User I/O - bank 3 |
| 引脚 G2 | I/O — User I/O - bank 3 |
| 引脚 G3 | I/O — User I/O - bank 3 |
| 引脚 G4 | I/O — User I/O - bank 3 |
| 引脚 G5 | VCCINT — Core supply voltage |
| 引脚 G6 | I/O — User I/O - bank 1 |
| 引脚 G7 | I/O — User I/O - bank 1 |
| 引脚 G8 | I/O — User I/O - bank 1 |
| 引脚 G9 | I/O — User I/O - bank 1 |
| 引脚 G10 | VCCIO1 — I/O bank 1 supply voltage |
| 引脚 G11 | I/O — User I/O - bank 1 |
| 引脚 G12 | I/O — User I/O - bank 1 |
| 引脚 H1 | I/O — User I/O - bank 3 |
| 引脚 H2 | I/O — User I/O - bank 3 |
| 引脚 H3 | I/O — User I/O - bank 3 |
| 引脚 H4 | I/O — User I/O - bank 3 |
| 引脚 H5 | VCCINT — Core supply voltage |
| 引脚 H6 | I/O — User I/O - bank 1 |
| 引脚 H7 | I/O — User I/O - bank 1 |
| 引脚 H8 | I/O — User I/O - bank 1 |
| 引脚 H9 | I/O — User I/O - bank 1 |
| 引脚 H10 | VCCIO1 — I/O bank 1 supply voltage |
| 引脚 H11 | I/O — User I/O - bank 1 |
| 引脚 H12 | I/O — User I/O - bank 1 |
| 引脚 J1 | I/O — User I/O - bank 4 |
| 引脚 J2 | I/O — User I/O - bank 4 |
| 引脚 J3 | I/O — User I/O - bank 4 |
| 引脚 J4 | I/O — User I/O - bank 4 |
| 引脚 J5 | VCCIO4 — I/O bank 4 supply voltage |
| 引脚 J6 | I/O — User I/O - bank 1 |
| 引脚 J7 | I/O — User I/O - bank 1 |
| 引脚 J8 | I/O — User I/O - bank 1 |
| 引脚 J9 | I/O — User I/O - bank 1 |
| 引脚 J10 | GND — Ground |
| 引脚 J11 | I/O — User I/O - bank 1 |
| 引脚 J12 | I/O — User I/O - bank 1 |
| 引脚 K1 | I/O — User I/O - bank 4 |
| 引脚 K2 | I/O — User I/O - bank 4 |
| 引脚 K3 | I/O — User I/O - bank 4 |
| 引脚 K4 | I/O — User I/O - bank 4 |
| 引脚 K5 | VCCIO4 — I/O bank 4 supply voltage |
| 引脚 K6 | GND — Ground |
| 引脚 K7 | I/O — User I/O - bank 1 |
| 引脚 K8 | I/O — User I/O - bank 1 |
| 引脚 K9 | I/O — User I/O - bank 1 |
| 引脚 K10 | I/O — User I/O - bank 1 |
| 引脚 K11 | I/O — User I/O - bank 1 |
| 引脚 K12 | I/O — User I/O - bank 1 |
| 引脚 L1 | I/O — User I/O - bank 4 |
| 引脚 L2 | I/O — User I/O - bank 4 |
| 引脚 L3 | I/O — User I/O - bank 4 |
| 引脚 L4 | I/O — User I/O - bank 4 |
| 引脚 L5 | VCCIO4 — I/O bank 4 supply voltage |
| 引脚 L6 | I/O — User I/O - bank 1 |
| 引脚 L7 | I/O — User I/O - bank 1 |
| 引脚 L8 | I/O — User I/O - bank 1 |
| 引脚 L9 | I/O — User I/O - bank 1 |
| 引脚 L10 | VCCIO1 — I/O bank 1 supply voltage |
| 引脚 L11 | I/O — User I/O - bank 1 |
| 引脚 L12 | I/O — User I/O - bank 1 |
| 引脚 M1 | I/O — User I/O - bank 4 |
| 引脚 M2 | I/O — User I/O - bank 4 |
| 引脚 M3 | I/O — User I/O - bank 4 |
| 引脚 M4 | I/O — User I/O - bank 4 |
| 引脚 M5 | VCCIO4 — I/O bank 4 supply voltage |
| 引脚 M6 | I/O — User I/O - bank 4 |
| 引脚 M7 | I/O — User I/O - bank 4 |
| 引脚 M8 | I/O — User I/O - bank 4 |
| 引脚 M9 | I/O — User I/O - bank 4 |
| 引脚 M10 | VCCIO4 — I/O bank 4 supply voltage |
| 引脚 M11 | I/O — User I/O - bank 4 |
| 引脚 M12 | I/O — User I/O - bank 4 |
| 引脚 N1 | I/O — User I/O - bank 4 |
| 引脚 N2 | I/O — User I/O - bank 4 |
| 引脚 N3 | GND — Ground |
| 引脚 N4 | I/O — User I/O - bank 4 |
| 引脚 N5 | I/O — User I/O - bank 4 |
| 引脚 N6 | I/O — User I/O - bank 4 |
| 引脚 N7 | I/O — User I/O - bank 4 |
| 引脚 N8 | I/O — User I/O - bank 4 |
| 引脚 N9 | I/O — User I/O - bank 4 |
| 引脚 N10 | I/O — User I/O - bank 4 |
| 引脚 N11 | GND — Ground |
| 引脚 N12 | I/O — User I/O - bank 4 |
典型应用
EPM570ZM144C7N 适用于 7 应用s: Industrial Glue Logic and Bus Bridging, Power-Up and Power-Down Sequencing, I/O Expansion for Microcontrollers, LED Display Multiplexing and Driving, Protocol Bridging and Legacy Interface Conversion, Test and Measurement Instrumentation Front-End, Automotive Body Electronics (Non-AEC-Q100).
Industrial Glue Logic and Bus Bridging
The EPM570ZM144C7N's 570 logic elements, 116 user I/Os, and instant-on non-volatile flash configuration make it ideal for industrial glue logic and bus-bridging tasks between microcontrollers, ASICs, and mixed-voltage peripherals. Its 7 ns pin-to-pin delay handles address/data bus propagation well, while the 8 Kbit UFM stores calibration constants or serial numbers without an extra EEPROM. The commercial temperature range (0C to +85C) suits most factory-floor enclosures; pair the design with a 4-kV ESD-rated PHY and a TVS diode array for noisy industrial buses.
推荐
Power-Up and Power-Down Sequencing
The EPM570ZM144C7N's deterministic, instant-on flash configuration makes it a robust supervisor for power-sequencing multi-rail systems. Place it downstream of a 3.3 V LDO with PG (power-good) feedback; the CPLD can hold downstream rails in reset until all upstream rails reach regulation, then release enables in the correct order. Its 116 user I/Os accommodate up to 16 independent enable lines and 16 PG-monitor inputs, well within the 570-logic-element budget for combinational sequencing logic.
推荐
I/O Expansion for Microcontrollers
When a microcontroller's GPIO budget is exhausted, the EPM570ZM144C7N can serve as an I/O expander with deterministic response (no software stack involved). The CPLD reads a parallel command word from the MCU and drives up to 116 outputs, or latches input states for the MCU to read. Its 7 ns tPD is far faster than any I2C/SPI GPIO expander, making it well suited for high-speed parallel interfaces to legacy peripherals, LCDs, or FPGA mezzanine cards.
推荐
LED Display Multiplexing and Driving
The EPM570ZM144C7N's 116 user I/Os and 7 ns logic delay suit large LED matrix multiplexing with minimal flicker. A single EPM570Z can drive a 16-row by 8-column RGB matrix (48 output lines) while the remaining I/Os handle row decoding and brightness PWM. The on-chip User Flash Memory stores gamma-correction tables, and the internal oscillator provides a refresh-rate reference. Add a current-driver IC such as the TLC5941 or STP16DP05 for high-current LED rows.
推荐
Protocol Bridging and Legacy Interface Conversion
The EPM570ZM144C7N can bridge between legacy and modern protocols - for example, parallel-bus to SPI/UART/I2C, or custom industrial protocols to standard interfaces. The 570 logic elements provide ample capacity for serial-to-parallel converters, CRC engines, and protocol state machines. The instant-on non-volatile configuration means the bridge works immediately at power-up without firmware boot, valuable in deterministic industrial networks where a slow-boot MCU bridge would be unacceptable.
推荐
Test and Measurement Instrumentation Front-End
The EPM570ZM144C7N's 7 ns logic delay and 116 I/Os make it a flexible front-end for test and measurement: digital pattern generation, signal routing matrices, and trigger logic. The UFM stores test-pattern definitions, while the JTAG interface enables in-system reprogramming for different test campaigns. Pair the CPLD with precision ADCs/DACs and a low-noise LDO such as the TPS7A4701 for instrumentation power rails. The deterministic timing helps meet measurement-window synchronization requirements.
推荐
Automotive Body Electronics (Non-AEC-Q100)
For non-safety automotive body electronics such as body control modules, lighting controllers, and HVAC panels, the EPM570ZM144C7N provides 116 user I/Os for switch scanning, relay driving, and LIN/CAN bus expansion. Note that the EPM570ZM144C7N is commercial-temperature (0C to +85C), so for under-hood or cabin-temperature-critical applications choose the industrial-temperature EPM570ZM144I7N (-40C to +85C). The MAX II family does not offer an AEC-Q100-qualified variant.
推荐
推荐产品汇总
工程参考数据： EPM570ZM144C7N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EPM570ZM144C6N | EPM1270ZM144C7N | EPM2210ZM144C7N |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 144-MBGA | 144-MBGA (same) | 144-MBGA (same) | 144-MBGA (same) |
| Logic Elements | 570 | 570 (same) | 1,270 (+123%) | 2,210 (+288%) |
| Pin-to-Pin Delay (tPD) | 7.0 ns | 6.0 ns (faster) | 7.0 ns (same) | 7.0 ns (same) |
| User I/Os | 116 | 116 (same) | 116 (same) | 116 (same) |
| User Flash Memory (UFM) | 8 Kbit | 8 Kbit | 8 Kbit | 8 Kbit |
| Process Technology | 0.18 um flash | 0.18 um flash (same) | 0.18 um flash (same) | 0.18 um flash (same) |
| Vertical Migration Support | Yes (MAX II family) | Yes | Yes (same package, higher density) | Yes (same package, highest density) |
关键差异点
- Vertical migration within 144-MBGA footprint across MAX II family （对比 EPM1270ZM144C7N / EPM2210ZM144C7N)
- Faster 6 ns speed grade available in identical 144-MBGA package （对比 EPM570ZM144C6N)
- 8 Kbit on-chip User Flash Memory eliminates external EEPROM （对比 Discrete I2C EEPROM (e.g., 24LC256))
设计说明
The EPM570ZM144C7N requires three separate supply rails: VCCINT (3.3 V / 2.5 V / 1.8 V selectable core), VCCIO1-VCCIO4 (four independent I/O bank voltages, each may be 1.5 V / 1.8 V / 2.5 V / 3.3 V). Decouple each VCCINT and VCCIO pin with a 0.1 uF ceramic capacitor placed within 100 mils of the BGA ball, plus a bulk 10 uF tantalum or ceramic on each rail. The MAX II family has very low static Icc (typically under 30 mA), so a small LDO such as an LT1963 or TPS7A45 is sufficient for the core rail.
Design the 144-MBGA land pattern on a 0.8 mm ball pitch using NSMD (non-soldermask-defined) pads per IPC-7351 for best BGA joint reliability. Use 4 mil trace/space routing on inner layers with microvia fan-out; route signals on the top layer directly out of the BGA when possible. Provide at least 4 via-in-pad or dog-bone fan-out vias per signal. Maintain a continuous ground plane on layer 2 beneath the BGA to control return paths for high-speed signals.
Do not leave unused I/O pins floating - configure them as outputs driving low or as inputs with internal weak pull-up enabled in the Quartus assignment, otherwise they can float mid-rail and draw shoot-through current. Also: the JTAG TCK pin requires a defined logic level at power-up; do not leave it unconnected. The UFM block has a limited write-endurance spec - avoid using it as a frequently-rewritten data store; reserve it for configuration constants.
Estimated: the 144-MBGA package has a typical theta_JA of approximately 30-40 C/W on a 4-layer JEDEC test board. With typical Icc of 25 mA at 3.3 V core, dissipation is only ~80 mW - well below the thermal limit. Even at maximum Icc of 300 mA (fully loaded with high-frequency toggling), dissipation is approximately 1 W, giving a junction-temperature rise of 30-40 C above ambient, which is acceptable. Forced-air cooling is rarely required for MAX II CPLDs.
合规信息
RoHS compliant per Altera/Intel MAX II product family compliance documentation. Lead-free (Pb-free) BGA balls. Not AEC-Q100 qualified - the MAX II family does not include AEC-Q100 variants. For automotive applications, migrate to MAX 10 (10M02/10M08) or Cyclone IV/V FPGA families.
