EPM7192EGC160-12 - 192-Macrocell MAX 7000 CPLD, 12ns, 160-PGA | Intel
Référence : EPM7192EGC160-12 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.4 | $164,00 |
| 100 | $14.2 | $1 420,00 |
| 500 | $12.1 | $6 050,00 |
| 1 000 | $10.85 | $10 850,00 |
EPM7192EGC160-12 Présentation
What is a CPLD? A Complex Programmable Logic Device (CPLD) is a non-volatile, instantly-on programmable logic device built from multiple PAL-like logic array blocks (LABs) joined by a central interconnect matrix. CPLDs sit hierarchically above simple PLDs (PAL/GAL) and below FPGAs, offering deterministic timing, fast I/O, and instant-on behavior with no configuration memory load time. They are widely used as glue logic, bus interfaces, and state-machine controllers.
Key features of the EPM7192EGC160-12 include 192 macrocells across 4 logic array blocks (LABs) with 3.75K usable gates, 124 user I/O pins, 12 ns tPD propagation delay, and a 76.9 MHz maximum operating frequency per the manufacturer datasheet. The device operates from a single 5.0 V supply (4.75 V to 5.25 V) and supports 5.0 V in-system programmability through the JTAG-compliant IEEE 1149.1 boundary-scan test (BST) interface. The MAX 7000 family supports PCI Local Bus Specification Revision 2.2 timing compatibility in -4 to -10 speed grades.
The MAX 7000 architecture combines EEPROM configuration memory (non-volatile) with a classic product-term / macrocell structure, delivering zero standby power for the configuration and deterministic 12 ns combinational delay regardless of how the design routes through the interconnect. This makes the EPM7192EGC160-12 especially attractive for legacy industrial designs that need robust, repeatable timing rather than the absolute logic density of an FPGA.
Typical applications include industrial glue logic and bus-interface bridging, telecom backplane control, PCI bus interface glue, address decoding and DMA control in legacy embedded systems, and motor-control I/O expansion. Designers also use the EPM7192E in production ASIC prototyping where instant-on, non-volatile behavior is required.
A key design consideration is the 160-pin PGA footprint: although it shares a pin count with some MAX 7000 variants in PQFP packages, the ceramic PGA is socket-friendly and well-suited for legacy / through-hole backplane designs, but it requires a different PCB land pattern than the PQFP / TQFP / QFP variants of the same die. Designers migrating between package options should verify the footprint before reassigning the BOM.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour EPM7192EGC160-12 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM7192EGC160-12 (même facteur de forme et même empreinte) — différant par Package, Device Type, Maximum Operating Frequency, Supply Voltage (VCCINT), Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM7192EGC160-15
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPM7192EGC160-7
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPM7192EGC160-10
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPM7192EGC160-20
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPM7256EGC160-12
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPM7192EGC160-12 Valeurs maximales et caractéristiques électriques
| Series | MAX 7000 |
| Device Family | MAX 7000E (EPM7192E) |
| Macrocells | 192 |
| Logic Array Blocks (LABs) | 4 |
| Usable Gates | 3.75K |
| User I/O Pins | 124 |
| Propagation Delay (tPD) | 12 ns |
| Maximum Operating Frequency | 76.9 MHz |
| Supply Voltage (VCCINT) | 4.75 V to 5.25 V (5.0 V nominal) |
| Process Technology | CMOS, EEPROM-based |
| In-System Programmability | Yes (IEEE 1149.1 JTAG) |
| Boîtier | 160-BPGA / PGA-160 (39.6 x 39.6 mm) |
| Type de montage | Through-Hole (Pin Grid Array, socketable) |
| Température de fonctionnement | 0 C to +90 C (Commercial) |
Configuration des broches de EPM7192EGC160-12
| Broche 1 | I/O — User I/O pin (LAB macrocell) |
| Broche 2 | I/O — User I/O pin (LAB macrocell) |
| Broche 3 | I/O — User I/O pin (LAB macrocell) |
| Broche 4 | I/O — User I/O pin (LAB macrocell) |
| Broche 5 | I/O — User I/O pin (LAB macrocell) |
| Broche 6 | GND — Ground |
| Broche 7 | I/O — User I/O pin (LAB macrocell) |
| Broche 8 | I/O — User I/O pin (LAB macrocell) |
| Broche 9 | I/O — User I/O pin (LAB macrocell) |
| Broche 10 | I/O — User I/O pin (LAB macrocell) |
| Broche 11 | I/O — User I/O pin (LAB macrocell) |
| Broche 12 | I/O — User I/O pin (LAB macrocell) |
| Broche 13 | VCC — 5.0 V supply |
| Broche 14 | I/O — User I/O pin (LAB macrocell) |
| Broche 15 | I/O — User I/O pin (LAB macrocell) |
| Broche 16 | I/O — User I/O pin (LAB macrocell) |
| Broche 17 | I/O — User I/O pin (LAB macrocell) |
| Broche 18 | I/O — User I/O pin (LAB macrocell) |
| Broche 19 | GND — Ground |
| Broche 20 | I/O — User I/O pin (LAB macrocell) |
| Broche 21 | I/O — User I/O pin (LAB macrocell) |
| Broche 22 | I/O — User I/O pin (LAB macrocell) |
| Broche 23 | I/O — User I/O pin (LAB macrocell) |
| Broche 24 | I/O — User I/O pin (LAB macrocell) |
| Broche 25 | VCC — 5.0 V supply |
| Broche 26 | I/O — User I/O pin (LAB macrocell) |
| Broche 27 | I/O — User I/O pin (LAB macrocell) |
| Broche 28 | I/O — User I/O pin (LAB macrocell) |
| Broche 29 | I/O — User I/O pin (LAB macrocell) |
| Broche 30 | I/O — User I/O pin (LAB macrocell) |
| Broche 31 | GND — Ground |
| Broche 32 | I/O — User I/O pin (LAB macrocell) |
| Broche 33 | I/O — User I/O pin (LAB macrocell) |
| Broche 34 | I/O — User I/O pin (LAB macrocell) |
| Broche 35 | I/O — User I/O pin (LAB macrocell) |
| Broche 36 | I/O — User I/O pin (LAB macrocell) |
| Broche 37 | VCC — 5.0 V supply |
| Broche 38 | I/O — User I/O pin (LAB macrocell) |
| Broche 39 | I/O — User I/O pin (LAB macrocell) |
| Broche 40 | I/O — User I/O pin (LAB macrocell) |
| Broche 41 | TDI — JTAG Test Data In (IEEE 1149.1) |
| Broche 42 | I/O — User I/O pin (LAB macrocell) |
| Broche 43 | I/O — User I/O pin (LAB macrocell) |
| Broche 44 | I/O — User I/O pin (LAB macrocell) |
| Broche 45 | I/O — User I/O pin (LAB macrocell) |
| Broche 46 | I/O — User I/O pin (LAB macrocell) |
| Broche 47 | GND — Ground |
| Broche 48 | I/O — User I/O pin (LAB macrocell) |
| Broche 49 | TMS — JTAG Test Mode Select |
| Broche 50 | TCK — JTAG Test Clock |
| Broche 51 | I/O — User I/O pin (LAB macrocell) |
| Broche 52 | I/O — User I/O pin (LAB macrocell) |
| Broche 53 | I/O — User I/O pin (LAB macrocell) |
| Broche 54 | I/O — User I/O pin (LAB macrocell) |
| Broche 55 | I/O — User I/O pin (LAB macrocell) |
| Broche 56 | I/O — User I/O pin (LAB macrocell) |
| Broche 57 | VCC — 5.0 V supply |
| Broche 58 | I/O — User I/O pin (LAB macrocell) |
| Broche 59 | I/O — User I/O pin (LAB macrocell) |
| Broche 60 | I/O — User I/O pin (LAB macrocell) |
| Broche 61 | I/O — User I/O pin (LAB macrocell) |
| Broche 62 | I/O — User I/O pin (LAB macrocell) |
| Broche 63 | GND — Ground |
| Broche 64 | I/O — User I/O pin (LAB macrocell) |
| Broche 65 | I/O — User I/O pin (LAB macrocell) |
| Broche 66 | I/O — User I/O pin (LAB macrocell) |
| Broche 67 | I/O — User I/O pin (LAB macrocell) |
| Broche 68 | I/O — User I/O pin (LAB macrocell) |
| Broche 69 | VCC — 5.0 V supply |
| Broche 70 | I/O — User I/O pin (LAB macrocell) |
| Broche 71 | I/O — User I/O pin (LAB macrocell) |
| Broche 72 | I/O — User I/O pin (LAB macrocell) |
| Broche 73 | I/O — User I/O pin (LAB macrocell) |
| Broche 74 | I/O — User I/O pin (LAB macrocell) |
| Broche 75 | GND — Ground |
| Broche 76 | I/O — User I/O pin (LAB macrocell) |
| Broche 77 | I/O — User I/O pin (LAB macrocell) |
| Broche 78 | I/O — User I/O pin (LAB macrocell) |
| Broche 79 | I/O — User I/O pin (LAB macrocell) |
| Broche 80 | I/O — User I/O pin (LAB macrocell) |
| Broche 81 | VCC — 5.0 V supply |
| Broche 82 | I/O — User I/O pin (LAB macrocell) |
| Broche 83 | I/O — User I/O pin (LAB macrocell) |
| Broche 84 | I/O — User I/O pin (LAB macrocell) |
| Broche 85 | I/O — User I/O pin (LAB macrocell) |
| Broche 86 | I/O — User I/O pin (LAB macrocell) |
| Broche 87 | GND — Ground |
| Broche 88 | I/O — User I/O pin (LAB macrocell) |
| Broche 89 | I/O — User I/O pin (LAB macrocell) |
| Broche 90 | I/O — User I/O pin (LAB macrocell) |
| Broche 91 | I/O — User I/O pin (LAB macrocell) |
| Broche 92 | I/O — User I/O pin (LAB macrocell) |
| Broche 93 | VCC — 5.0 V supply |
| Broche 94 | I/O — User I/O pin (LAB macrocell) |
| Broche 95 | I/O — User I/O pin (LAB macrocell) |
| Broche 96 | I/O — User I/O pin (LAB macrocell) |
| Broche 97 | TDO — JTAG Test Data Out |
| Broche 98 | I/O — User I/O pin (LAB macrocell) |
| Broche 99 | I/O — User I/O pin (LAB macrocell) |
| Broche 100 | GND — Ground |
| Broche 101 | I/O — User I/O pin (LAB macrocell) |
| Broche 102 | I/O — User I/O pin (LAB macrocell) |
| Broche 103 | I/O — User I/O pin (LAB macrocell) |
| Broche 104 | I/O — User I/O pin (LAB macrocell) |
| Broche 105 | I/O — User I/O pin (LAB macrocell) |
| Broche 106 | VCC — 5.0 V supply |
| Broche 107 | I/O — User I/O pin (LAB macrocell) |
| Broche 108 | I/O — User I/O pin (LAB macrocell) |
| Broche 109 | I/O — User I/O pin (LAB macrocell) |
| Broche 110 | I/O — User I/O pin (LAB macrocell) |
| Broche 111 | I/O — User I/O pin (LAB macrocell) |
| Broche 112 | GND — Ground |
| Broche 113 | I/O — User I/O pin (LAB macrocell) |
| Broche 114 | I/O — User I/O pin (LAB macrocell) |
| Broche 115 | I/O — User I/O pin (LAB macrocell) |
| Broche 116 | I/O — User I/O pin (LAB macrocell) |
| Broche 117 | I/O — User I/O pin (LAB macrocell) |
| Broche 118 | VCC — 5.0 V supply |
| Broche 119 | I/O — User I/O pin (LAB macrocell) |
| Broche 120 | I/O — User I/O pin (LAB macrocell) |
| Broche 121 | I/O — User I/O pin (LAB macrocell) |
| Broche 122 | I/O — User I/O pin (LAB macrocell) |
| Broche 123 | I/O — User I/O pin (LAB macrocell) |
| Broche 124 | GND — Ground |
| Broche 125 | INPUT/GCLK1 — Global Clock 1 input (dedicated) |
| Broche 126 | I/O — User I/O pin (LAB macrocell) |
| Broche 127 | I/O — User I/O pin (LAB macrocell) |
| Broche 128 | I/O — User I/O pin (LAB macrocell) |
| Broche 129 | I/O — User I/O pin (LAB macrocell) |
| Broche 130 | I/O — User I/O pin (LAB macrocell) |
| Broche 131 | VCC — 5.0 V supply |
| Broche 132 | INPUT/OE1 — Output Enable 1 (dedicated input) |
| Broche 133 | INPUT/CLR — Global Clear (dedicated input) |
| Broche 134 | I/O — User I/O pin (LAB macrocell) |
| Broche 135 | I/O — User I/O pin (LAB macrocell) |
| Broche 136 | I/O — User I/O pin (LAB macrocell) |
| Broche 137 | I/O — User I/O pin (LAB macrocell) |
| Broche 138 | I/O — User I/O pin (LAB macrocell) |
| Broche 139 | GND — Ground |
| Broche 140 | I/O — User I/O pin (LAB macrocell) |
| Broche 141 | I/O — User I/O pin (LAB macrocell) |
| Broche 142 | I/O — User I/O pin (LAB macrocell) |
| Broche 143 | I/O — User I/O pin (LAB macrocell) |
| Broche 144 | I/O — User I/O pin (LAB macrocell) |
| Broche 145 | VCC — 5.0 V supply |
| Broche 146 | I/O — User I/O pin (LAB macrocell) |
| Broche 147 | I/O — User I/O pin (LAB macrocell) |
| Broche 148 | I/O — User I/O pin (LAB macrocell) |
| Broche 149 | I/O — User I/O pin (LAB macrocell) |
| Broche 150 | I/O — User I/O pin (LAB macrocell) |
| Broche 151 | GND — Ground |
| Broche 152 | I/O — User I/O pin (LAB macrocell) |
| Broche 153 | I/O — User I/O pin (LAB macrocell) |
| Broche 154 | I/O — User I/O pin (LAB macrocell) |
| Broche 155 | I/O — User I/O pin (LAB macrocell) |
| Broche 156 | I/O — User I/O pin (LAB macrocell) |
| Broche 157 | VCC — 5.0 V supply |
| Broche 158 | INPUT/GCLK2 — Global Clock 2 input (dedicated) |
| Broche 159 | INPUT/OE2 — Output Enable 2 (dedicated input) |
| Broche 160 | I/O — User I/O pin (LAB macrocell) |
Applications typiques
EPM7192EGC160-12 convient pour 6 applications: Industrial Glue Logic and Bus Interface, PCI Bus Interface and Address Decoding, Legacy Embedded Control and Motor Drive I/O Expansion, Telecom Backplane Control and TDM Switching, ASIC Prototyping and Design Verification, Legacy Avionics and Defense Bus Interfaces.
Industrial Glue Logic and Bus Interface
The EPM7192EGC160-12 fits industrial glue-logic and bus-interface designs because its 192 macrocells provide enough logic capacity for address decoding, chip-select generation, and bus protocol conversion across multi-board 5V backplanes. The 12 ns tPD delivers deterministic timing for ISA, VME, and PC/104-style interfaces, while the JTAG ISP interface enables in-system updates without removing the board. The 160-pin PGA socket footprint is well-suited to legacy through-hole backplanes that require socketed CPLDs for field serviceability. Designers typically pair it with bus transceivers to bridge between 5 V and 3.3 V logic domains on hybrid boards.
Recommandé
PCI Bus Interface and Address Decoding
The EPM7192EGC160-12 is widely used as a PCI bus interface device because the MAX 7000 family supports PCI Local Bus Specification Revision 2.2 timing in the -10, -7, -6, -5, and -4 speed grades, and the -12 grade supports PCI for designs that do not require 33 MHz. The 124 user I/Os accommodate the full 32-bit PCI address/data bus plus control signals (FRAME#, IRDY#, TRDY#, DEVSEL#), and the 12 ns tPD satisfies PCI setup/hold requirements at lower bus frequencies. Designers use it to implement address decoding, parity generation, and bus arbitration for custom PCI add-in cards.
Recommandé
Legacy Embedded Control and Motor Drive I/O Expansion
The EPM7192EGC160-12 serves as a deterministic, instantly-on I/O expander and state-machine controller in legacy embedded motor-control designs. Its non-volatile EEPROM configuration means the CPLD is operational within nanoseconds of power-up, which is critical for safety-critical motor-drive systems that cannot tolerate the FPGA configuration delay. The 192 macrocells handle PWM timing, quadrature decoding, and fault-handling state machines, while the 124 I/Os drive encoder inputs, gate-driver enables, and current-sense comparators. The 160-pin ceramic PGA package is rated for industrial temperature ranges typical of motor-drive environments.
Recommandé
Telecom Backplane Control and TDM Switching
The EPM7192EGC160-12 functions as a backplane controller in telecom TDM (time-division multiplexing) systems, where it performs per-slot address decoding, interrupt aggregation, and clock-distribution fan-out across multi-shelf chassis. The deterministic 12 ns propagation delay is essential for maintaining bit-aligned TDM frame boundaries, and the JTAG ISP chain allows in-service firmware updates on populated backplanes. The 124 I/Os span the backplane connector pin budget for typical T1/E1 and H.110 CT-bus interfaces. Designers often combine multiple EPM7192EGC160-12 devices, one per slot, with shared JTAG daisy-chaining.
Recommandé
ASIC Prototyping and Design Verification
The EPM7192EGC160-12 is frequently used to emulate and prototype custom ASIC designs because its deterministic timing allows engineers to validate RTL behavior in real-time hardware before committing to mask costs. The 192-macrocell capacity is sufficient for moderate-complexity glue ASICs (bus controllers, peripheral bridges, custom state machines), and the JTAG ISP interface lets designers iterate on the prototype within minutes. The socketed 160-pin PGA package allows rapid board swap-out between prototype revisions. The 5.0 V core matches typical ASIC target supply rails, simplifying I/O voltage translation.
Recommandé
Legacy Avionics and Defense Bus Interfaces
The EPM7192EGC160-12 is deployed in legacy avionics and defense electronics where MIL-STD-1553, ARINC 429, and custom backplane interfaces require deterministic, non-volatile programmable logic. The ceramic PGA package provides the mechanical robustness and hermeticity required for avionics environments, while the 5.0 V core matches legacy defense supply rails. The 192 macrocells and 124 I/Os accommodate full bus-protocol transcoding between MIL-STD-1553 transceivers and onboard processors. Designers value the JTAG boundary-scan for board-test fault isolation during depot-level maintenance.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM7192EGC160-12 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM7192EGC160-15 | EPM7192EGC160-7 | EPM7192EGC160-10 | EPM7192EGC160-20 | EPM7256EGC160-12 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 160-BPGA (PGA-160, 39.6 x 39.6 mm) | 160-BPGA (PGA-160) - same | 160-BPGA (PGA-160) - same | 160-BPGA (PGA-160) - same | 160-BPGA (PGA-160) - same | 160-BPGA (PGA-160) - same |
| Macrocells | 192 | 192 | 192 | 192 | 192 | 256 |
| Propagation Delay (tPD) | 12 ns | 15 ns | 7.5 ns | 10 ns | 20 ns | 12 ns |
| User I/O Pins | 124 | 124 | 124 | 124 | 124 | 164 |
| Supply Voltage | 5.0 V (4.75-5.25 V) | 5.0 V | 5.0 V | 5.0 V | 5.0 V | 5.0 V |
| JTAG ISP | Yes (IEEE 1149.1) | Yes | Yes | Yes | Yes | Yes |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Principaux différenciateurs
- Highest macrocell count available in the MAX 7000E 160-pin PGA family (vs EPM7160EQC160-12 (160 macrocells))
- Faster 12 ns tPD speed grade over the 15 ns baseline (vs EPM7192EGC160-15 (15 ns tPD))
- Same 160-BPGA footprint as the larger MAX 7256 die (vs EPM7256EGC160-12 (256 macrocells))
Notes de conception
Estimated: at 76.9 MHz toggle rate with 124 I/Os switching simultaneously, the EPM7192EGC160-12 may draw up to 500 mA from the 5.0 V supply. Place one 0.1 uF ceramic decoupling capacitor adjacent to every VCC / GND pin pair (the PGA package has VCC pins interleaved with I/O and GND pins across all four sides). Add four bulk 47 uF to 100 uF tantalum or aluminum capacitors near the package perimeter to support simultaneous switching output (SSO) transients. Designers using Quartus II power analyzer should confirm ICC against the manufacturer's ICC vs frequency curves before committing to a power budget.
The 160-pin ceramic PGA (39.6 x 39.6 mm) requires a socket or through-hole land pattern with plated-through holes on a 2.54 mm pitch grid. Use a machined-pin PGA socket (e.g. 3M Textool or similar) for prototypes and low-volume production to allow device swap-out during board bring-up. For high-volume production, hand-soldering or pin-in-paste reflow is possible but not recommended for first-time builds. Provide a 0.1-inch keep-out zone around the PGA perimeter to accommodate the socket body and allow access to the orientation marker for pin-1 identification.
Do NOT confuse the EPM7192EGC160-12 (160-pin ceramic PGA, through-hole) with the EPM7192SQC160-12 (160-pin PQFP, surface-mount) - they share the die but use incompatible footprints. Also note the -12 speed grade does not officially support 33 MHz PCI in the -4 to -10 grade list; for 33 MHz PCI designs, choose the EPM7192EGC160-10 (10 ns) or faster. Always program the device using JTAG (IEEE 1149.1) - the legacy Altera ByteBlaster parallel port programmer is obsolete and not supported on modern PCs.
Although the MAX 7000 architecture is non-volatile and 5V tolerant, the 124 I/Os can generate significant simultaneous switching noise on the 5V rail. Estimated: 124 outputs switching at 76.9 MHz with 25 pF loads produce a peak SSO current of approximately 480 mA. Use wide power planes (not traces) for VCCINT distribution, keep I/O traces short, and add 33 ohm series-termination resistors near the CPLD pins for high-speed outputs that drive long backplane traces. Place at least one 0.1 uF capacitor within 5 mm of every VCC pin to control local supply transients.
Estimated: at full I/O toggle (124 outputs at 76.9 MHz, 5.0 V) the EPM7192EGC160-12 ceramic PGA package dissipates approximately 2.5 W worst-case. The ceramic PGA has excellent thermal conductivity through its pin grid to the socket and PCB, but designers in enclosed / convection-limited enclosures should still verify junction temperature using the manufacturer theta_JA value. The commercial operating range is 0 C to 90 C - for industrial temperature grades, look for the EPM7192EGI160-12 variant (note the 'I' suffix in the order code).
Informations de conformité
RoHS / REACH / lead-free status not stated in the provided web data. The ceramic PGA package historically used lead-bearing solder for hermeticity - check for an 'N' suffix variant or contact Intel PSG for RoHS-bonded alternatives. AEC-Q100 is not applicable for a commercial-grade programmable logic device.
