EPM7192EGC160-12 - 192-Macrocell MAX 7000 CPLD, 12ns, 160-PGA | Intel
N.º da peça: EPM7192EGC160-12 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.4 | $164,00 |
| 100 | $14.2 | $1.420,00 |
| 500 | $12.1 | $6.050,00 |
| 1.000 | $10.85 | $10.850,00 |
EPM7192EGC160-12 Visão geral
What is a CPLD? A Complex Programmable Logic Device (CPLD) is a non-volatile, instantly-on programmable logic device built from multiple PAL-like logic array blocks (LABs) joined by a central interconnect matrix. CPLDs sit hierarchically above simple PLDs (PAL/GAL) and below FPGAs, offering deterministic timing, fast I/O, and instant-on behavior with no configuration memory load time. They are widely used as glue logic, bus interfaces, and state-machine controllers.
Key features of the EPM7192EGC160-12 include 192 macrocells across 4 logic array blocks (LABs) with 3.75K usable gates, 124 user I/O pins, 12 ns tPD propagation delay, and a 76.9 MHz maximum operating frequency per the manufacturer datasheet. The device operates from a single 5.0 V supply (4.75 V to 5.25 V) and supports 5.0 V in-system programmability through the JTAG-compliant IEEE 1149.1 boundary-scan test (BST) interface. The MAX 7000 family supports PCI Local Bus Specification Revision 2.2 timing compatibility in -4 to -10 speed grades.
The MAX 7000 architecture combines EEPROM configuration memory (non-volatile) with a classic product-term / macrocell structure, delivering zero standby power for the configuration and deterministic 12 ns combinational delay regardless of how the design routes through the interconnect. This makes the EPM7192EGC160-12 especially attractive for legacy industrial designs that need robust, repeatable timing rather than the absolute logic density of an FPGA.
Typical applications include industrial glue logic and bus-interface bridging, telecom backplane control, PCI bus interface glue, address decoding and DMA control in legacy embedded systems, and motor-control I/O expansion. Designers also use the EPM7192E in production ASIC prototyping where instant-on, non-volatile behavior is required.
A key design consideration is the 160-pin PGA footprint: although it shares a pin count with some MAX 7000 variants in PQFP packages, the ceramic PGA is socket-friendly and well-suited for legacy / through-hole backplane designs, but it requires a different PCB land pattern than the PQFP / TQFP / QFP variants of the same die. Designers migrating between package options should verify the footprint before reassigning the BOM.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para EPM7192EGC160-12 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPM7192EGC160-12 (mesmo formato e footprint) — diferindo em Package, Device Type, Maximum Operating Frequency, Supply Voltage (VCCINT), Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPM7192EGC160-15
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EPM7192EGC160-7
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EPM7192EGC160-10
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EPM7192EGC160-20
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EPM7256EGC160-12
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EPM7192EGC160-12 Classificações máximas e características elétricas
| Series | MAX 7000 |
| Device Family | MAX 7000E (EPM7192E) |
| Macrocells | 192 |
| Logic Array Blocks (LABs) | 4 |
| Usable Gates | 3.75K |
| User I/O Pins | 124 |
| Propagation Delay (tPD) | 12 ns |
| Maximum Operating Frequency | 76.9 MHz |
| Supply Voltage (VCCINT) | 4.75 V to 5.25 V (5.0 V nominal) |
| Process Technology | CMOS, EEPROM-based |
| In-System Programmability | Yes (IEEE 1149.1 JTAG) |
| Encapsulamento | 160-BPGA / PGA-160 (39.6 x 39.6 mm) |
| Tipo de montagem | Through-Hole (Pin Grid Array, socketable) |
| Temperatura de operação | 0 C to +90 C (Commercial) |
Configuração de pinos do EPM7192EGC160-12
| Pino 1 | I/O — User I/O pin (LAB macrocell) |
| Pino 2 | I/O — User I/O pin (LAB macrocell) |
| Pino 3 | I/O — User I/O pin (LAB macrocell) |
| Pino 4 | I/O — User I/O pin (LAB macrocell) |
| Pino 5 | I/O — User I/O pin (LAB macrocell) |
| Pino 6 | GND — Ground |
| Pino 7 | I/O — User I/O pin (LAB macrocell) |
| Pino 8 | I/O — User I/O pin (LAB macrocell) |
| Pino 9 | I/O — User I/O pin (LAB macrocell) |
| Pino 10 | I/O — User I/O pin (LAB macrocell) |
| Pino 11 | I/O — User I/O pin (LAB macrocell) |
| Pino 12 | I/O — User I/O pin (LAB macrocell) |
| Pino 13 | VCC — 5.0 V supply |
| Pino 14 | I/O — User I/O pin (LAB macrocell) |
| Pino 15 | I/O — User I/O pin (LAB macrocell) |
| Pino 16 | I/O — User I/O pin (LAB macrocell) |
| Pino 17 | I/O — User I/O pin (LAB macrocell) |
| Pino 18 | I/O — User I/O pin (LAB macrocell) |
| Pino 19 | GND — Ground |
| Pino 20 | I/O — User I/O pin (LAB macrocell) |
| Pino 21 | I/O — User I/O pin (LAB macrocell) |
| Pino 22 | I/O — User I/O pin (LAB macrocell) |
| Pino 23 | I/O — User I/O pin (LAB macrocell) |
| Pino 24 | I/O — User I/O pin (LAB macrocell) |
| Pino 25 | VCC — 5.0 V supply |
| Pino 26 | I/O — User I/O pin (LAB macrocell) |
| Pino 27 | I/O — User I/O pin (LAB macrocell) |
| Pino 28 | I/O — User I/O pin (LAB macrocell) |
| Pino 29 | I/O — User I/O pin (LAB macrocell) |
| Pino 30 | I/O — User I/O pin (LAB macrocell) |
| Pino 31 | GND — Ground |
| Pino 32 | I/O — User I/O pin (LAB macrocell) |
| Pino 33 | I/O — User I/O pin (LAB macrocell) |
| Pino 34 | I/O — User I/O pin (LAB macrocell) |
| Pino 35 | I/O — User I/O pin (LAB macrocell) |
| Pino 36 | I/O — User I/O pin (LAB macrocell) |
| Pino 37 | VCC — 5.0 V supply |
| Pino 38 | I/O — User I/O pin (LAB macrocell) |
| Pino 39 | I/O — User I/O pin (LAB macrocell) |
| Pino 40 | I/O — User I/O pin (LAB macrocell) |
| Pino 41 | TDI — JTAG Test Data In (IEEE 1149.1) |
| Pino 42 | I/O — User I/O pin (LAB macrocell) |
| Pino 43 | I/O — User I/O pin (LAB macrocell) |
| Pino 44 | I/O — User I/O pin (LAB macrocell) |
| Pino 45 | I/O — User I/O pin (LAB macrocell) |
| Pino 46 | I/O — User I/O pin (LAB macrocell) |
| Pino 47 | GND — Ground |
| Pino 48 | I/O — User I/O pin (LAB macrocell) |
| Pino 49 | TMS — JTAG Test Mode Select |
| Pino 50 | TCK — JTAG Test Clock |
| Pino 51 | I/O — User I/O pin (LAB macrocell) |
| Pino 52 | I/O — User I/O pin (LAB macrocell) |
| Pino 53 | I/O — User I/O pin (LAB macrocell) |
| Pino 54 | I/O — User I/O pin (LAB macrocell) |
| Pino 55 | I/O — User I/O pin (LAB macrocell) |
| Pino 56 | I/O — User I/O pin (LAB macrocell) |
| Pino 57 | VCC — 5.0 V supply |
| Pino 58 | I/O — User I/O pin (LAB macrocell) |
| Pino 59 | I/O — User I/O pin (LAB macrocell) |
| Pino 60 | I/O — User I/O pin (LAB macrocell) |
| Pino 61 | I/O — User I/O pin (LAB macrocell) |
| Pino 62 | I/O — User I/O pin (LAB macrocell) |
| Pino 63 | GND — Ground |
| Pino 64 | I/O — User I/O pin (LAB macrocell) |
| Pino 65 | I/O — User I/O pin (LAB macrocell) |
| Pino 66 | I/O — User I/O pin (LAB macrocell) |
| Pino 67 | I/O — User I/O pin (LAB macrocell) |
| Pino 68 | I/O — User I/O pin (LAB macrocell) |
| Pino 69 | VCC — 5.0 V supply |
| Pino 70 | I/O — User I/O pin (LAB macrocell) |
| Pino 71 | I/O — User I/O pin (LAB macrocell) |
| Pino 72 | I/O — User I/O pin (LAB macrocell) |
| Pino 73 | I/O — User I/O pin (LAB macrocell) |
| Pino 74 | I/O — User I/O pin (LAB macrocell) |
| Pino 75 | GND — Ground |
| Pino 76 | I/O — User I/O pin (LAB macrocell) |
| Pino 77 | I/O — User I/O pin (LAB macrocell) |
| Pino 78 | I/O — User I/O pin (LAB macrocell) |
| Pino 79 | I/O — User I/O pin (LAB macrocell) |
| Pino 80 | I/O — User I/O pin (LAB macrocell) |
| Pino 81 | VCC — 5.0 V supply |
| Pino 82 | I/O — User I/O pin (LAB macrocell) |
| Pino 83 | I/O — User I/O pin (LAB macrocell) |
| Pino 84 | I/O — User I/O pin (LAB macrocell) |
| Pino 85 | I/O — User I/O pin (LAB macrocell) |
| Pino 86 | I/O — User I/O pin (LAB macrocell) |
| Pino 87 | GND — Ground |
| Pino 88 | I/O — User I/O pin (LAB macrocell) |
| Pino 89 | I/O — User I/O pin (LAB macrocell) |
| Pino 90 | I/O — User I/O pin (LAB macrocell) |
| Pino 91 | I/O — User I/O pin (LAB macrocell) |
| Pino 92 | I/O — User I/O pin (LAB macrocell) |
| Pino 93 | VCC — 5.0 V supply |
| Pino 94 | I/O — User I/O pin (LAB macrocell) |
| Pino 95 | I/O — User I/O pin (LAB macrocell) |
| Pino 96 | I/O — User I/O pin (LAB macrocell) |
| Pino 97 | TDO — JTAG Test Data Out |
| Pino 98 | I/O — User I/O pin (LAB macrocell) |
| Pino 99 | I/O — User I/O pin (LAB macrocell) |
| Pino 100 | GND — Ground |
| Pino 101 | I/O — User I/O pin (LAB macrocell) |
| Pino 102 | I/O — User I/O pin (LAB macrocell) |
| Pino 103 | I/O — User I/O pin (LAB macrocell) |
| Pino 104 | I/O — User I/O pin (LAB macrocell) |
| Pino 105 | I/O — User I/O pin (LAB macrocell) |
| Pino 106 | VCC — 5.0 V supply |
| Pino 107 | I/O — User I/O pin (LAB macrocell) |
| Pino 108 | I/O — User I/O pin (LAB macrocell) |
| Pino 109 | I/O — User I/O pin (LAB macrocell) |
| Pino 110 | I/O — User I/O pin (LAB macrocell) |
| Pino 111 | I/O — User I/O pin (LAB macrocell) |
| Pino 112 | GND — Ground |
| Pino 113 | I/O — User I/O pin (LAB macrocell) |
| Pino 114 | I/O — User I/O pin (LAB macrocell) |
| Pino 115 | I/O — User I/O pin (LAB macrocell) |
| Pino 116 | I/O — User I/O pin (LAB macrocell) |
| Pino 117 | I/O — User I/O pin (LAB macrocell) |
| Pino 118 | VCC — 5.0 V supply |
| Pino 119 | I/O — User I/O pin (LAB macrocell) |
| Pino 120 | I/O — User I/O pin (LAB macrocell) |
| Pino 121 | I/O — User I/O pin (LAB macrocell) |
| Pino 122 | I/O — User I/O pin (LAB macrocell) |
| Pino 123 | I/O — User I/O pin (LAB macrocell) |
| Pino 124 | GND — Ground |
| Pino 125 | INPUT/GCLK1 — Global Clock 1 input (dedicated) |
| Pino 126 | I/O — User I/O pin (LAB macrocell) |
| Pino 127 | I/O — User I/O pin (LAB macrocell) |
| Pino 128 | I/O — User I/O pin (LAB macrocell) |
| Pino 129 | I/O — User I/O pin (LAB macrocell) |
| Pino 130 | I/O — User I/O pin (LAB macrocell) |
| Pino 131 | VCC — 5.0 V supply |
| Pino 132 | INPUT/OE1 — Output Enable 1 (dedicated input) |
| Pino 133 | INPUT/CLR — Global Clear (dedicated input) |
| Pino 134 | I/O — User I/O pin (LAB macrocell) |
| Pino 135 | I/O — User I/O pin (LAB macrocell) |
| Pino 136 | I/O — User I/O pin (LAB macrocell) |
| Pino 137 | I/O — User I/O pin (LAB macrocell) |
| Pino 138 | I/O — User I/O pin (LAB macrocell) |
| Pino 139 | GND — Ground |
| Pino 140 | I/O — User I/O pin (LAB macrocell) |
| Pino 141 | I/O — User I/O pin (LAB macrocell) |
| Pino 142 | I/O — User I/O pin (LAB macrocell) |
| Pino 143 | I/O — User I/O pin (LAB macrocell) |
| Pino 144 | I/O — User I/O pin (LAB macrocell) |
| Pino 145 | VCC — 5.0 V supply |
| Pino 146 | I/O — User I/O pin (LAB macrocell) |
| Pino 147 | I/O — User I/O pin (LAB macrocell) |
| Pino 148 | I/O — User I/O pin (LAB macrocell) |
| Pino 149 | I/O — User I/O pin (LAB macrocell) |
| Pino 150 | I/O — User I/O pin (LAB macrocell) |
| Pino 151 | GND — Ground |
| Pino 152 | I/O — User I/O pin (LAB macrocell) |
| Pino 153 | I/O — User I/O pin (LAB macrocell) |
| Pino 154 | I/O — User I/O pin (LAB macrocell) |
| Pino 155 | I/O — User I/O pin (LAB macrocell) |
| Pino 156 | I/O — User I/O pin (LAB macrocell) |
| Pino 157 | VCC — 5.0 V supply |
| Pino 158 | INPUT/GCLK2 — Global Clock 2 input (dedicated) |
| Pino 159 | INPUT/OE2 — Output Enable 2 (dedicated input) |
| Pino 160 | I/O — User I/O pin (LAB macrocell) |
Aplicações típicas
EPM7192EGC160-12 é adequado para 6 aplicaçãos: Industrial Glue Logic and Bus Interface, PCI Bus Interface and Address Decoding, Legacy Embedded Control and Motor Drive I/O Expansion, Telecom Backplane Control and TDM Switching, ASIC Prototyping and Design Verification, Legacy Avionics and Defense Bus Interfaces.
Industrial Glue Logic and Bus Interface
The EPM7192EGC160-12 fits industrial glue-logic and bus-interface designs because its 192 macrocells provide enough logic capacity for address decoding, chip-select generation, and bus protocol conversion across multi-board 5V backplanes. The 12 ns tPD delivers deterministic timing for ISA, VME, and PC/104-style interfaces, while the JTAG ISP interface enables in-system updates without removing the board. The 160-pin PGA socket footprint is well-suited to legacy through-hole backplanes that require socketed CPLDs for field serviceability. Designers typically pair it with bus transceivers to bridge between 5 V and 3.3 V logic domains on hybrid boards.
Recomendado
PCI Bus Interface and Address Decoding
The EPM7192EGC160-12 is widely used as a PCI bus interface device because the MAX 7000 family supports PCI Local Bus Specification Revision 2.2 timing in the -10, -7, -6, -5, and -4 speed grades, and the -12 grade supports PCI for designs that do not require 33 MHz. The 124 user I/Os accommodate the full 32-bit PCI address/data bus plus control signals (FRAME#, IRDY#, TRDY#, DEVSEL#), and the 12 ns tPD satisfies PCI setup/hold requirements at lower bus frequencies. Designers use it to implement address decoding, parity generation, and bus arbitration for custom PCI add-in cards.
Recomendado
Legacy Embedded Control and Motor Drive I/O Expansion
The EPM7192EGC160-12 serves as a deterministic, instantly-on I/O expander and state-machine controller in legacy embedded motor-control designs. Its non-volatile EEPROM configuration means the CPLD is operational within nanoseconds of power-up, which is critical for safety-critical motor-drive systems that cannot tolerate the FPGA configuration delay. The 192 macrocells handle PWM timing, quadrature decoding, and fault-handling state machines, while the 124 I/Os drive encoder inputs, gate-driver enables, and current-sense comparators. The 160-pin ceramic PGA package is rated for industrial temperature ranges typical of motor-drive environments.
Recomendado
Telecom Backplane Control and TDM Switching
The EPM7192EGC160-12 functions as a backplane controller in telecom TDM (time-division multiplexing) systems, where it performs per-slot address decoding, interrupt aggregation, and clock-distribution fan-out across multi-shelf chassis. The deterministic 12 ns propagation delay is essential for maintaining bit-aligned TDM frame boundaries, and the JTAG ISP chain allows in-service firmware updates on populated backplanes. The 124 I/Os span the backplane connector pin budget for typical T1/E1 and H.110 CT-bus interfaces. Designers often combine multiple EPM7192EGC160-12 devices, one per slot, with shared JTAG daisy-chaining.
Recomendado
ASIC Prototyping and Design Verification
The EPM7192EGC160-12 is frequently used to emulate and prototype custom ASIC designs because its deterministic timing allows engineers to validate RTL behavior in real-time hardware before committing to mask costs. The 192-macrocell capacity is sufficient for moderate-complexity glue ASICs (bus controllers, peripheral bridges, custom state machines), and the JTAG ISP interface lets designers iterate on the prototype within minutes. The socketed 160-pin PGA package allows rapid board swap-out between prototype revisions. The 5.0 V core matches typical ASIC target supply rails, simplifying I/O voltage translation.
Recomendado
Legacy Avionics and Defense Bus Interfaces
The EPM7192EGC160-12 is deployed in legacy avionics and defense electronics where MIL-STD-1553, ARINC 429, and custom backplane interfaces require deterministic, non-volatile programmable logic. The ceramic PGA package provides the mechanical robustness and hermeticity required for avionics environments, while the 5.0 V core matches legacy defense supply rails. The 192 macrocells and 124 I/Os accommodate full bus-protocol transcoding between MIL-STD-1553 transceivers and onboard processors. Designers value the JTAG boundary-scan for board-test fault isolation during depot-level maintenance.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPM7192EGC160-12 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPM7192EGC160-15 | EPM7192EGC160-7 | EPM7192EGC160-10 | EPM7192EGC160-20 | EPM7256EGC160-12 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 160-BPGA (PGA-160, 39.6 x 39.6 mm) | 160-BPGA (PGA-160) - same | 160-BPGA (PGA-160) - same | 160-BPGA (PGA-160) - same | 160-BPGA (PGA-160) - same | 160-BPGA (PGA-160) - same |
| Macrocells | 192 | 192 | 192 | 192 | 192 | 256 |
| Propagation Delay (tPD) | 12 ns | 15 ns | 7.5 ns | 10 ns | 20 ns | 12 ns |
| User I/O Pins | 124 | 124 | 124 | 124 | 124 | 164 |
| Supply Voltage | 5.0 V (4.75-5.25 V) | 5.0 V | 5.0 V | 5.0 V | 5.0 V | 5.0 V |
| JTAG ISP | Yes (IEEE 1149.1) | Yes | Yes | Yes | Yes | Yes |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Principais diferenciais
- Highest macrocell count available in the MAX 7000E 160-pin PGA family (vs EPM7160EQC160-12 (160 macrocells))
- Faster 12 ns tPD speed grade over the 15 ns baseline (vs EPM7192EGC160-15 (15 ns tPD))
- Same 160-BPGA footprint as the larger MAX 7256 die (vs EPM7256EGC160-12 (256 macrocells))
Notas de projeto
Estimated: at 76.9 MHz toggle rate with 124 I/Os switching simultaneously, the EPM7192EGC160-12 may draw up to 500 mA from the 5.0 V supply. Place one 0.1 uF ceramic decoupling capacitor adjacent to every VCC / GND pin pair (the PGA package has VCC pins interleaved with I/O and GND pins across all four sides). Add four bulk 47 uF to 100 uF tantalum or aluminum capacitors near the package perimeter to support simultaneous switching output (SSO) transients. Designers using Quartus II power analyzer should confirm ICC against the manufacturer's ICC vs frequency curves before committing to a power budget.
The 160-pin ceramic PGA (39.6 x 39.6 mm) requires a socket or through-hole land pattern with plated-through holes on a 2.54 mm pitch grid. Use a machined-pin PGA socket (e.g. 3M Textool or similar) for prototypes and low-volume production to allow device swap-out during board bring-up. For high-volume production, hand-soldering or pin-in-paste reflow is possible but not recommended for first-time builds. Provide a 0.1-inch keep-out zone around the PGA perimeter to accommodate the socket body and allow access to the orientation marker for pin-1 identification.
Do NOT confuse the EPM7192EGC160-12 (160-pin ceramic PGA, through-hole) with the EPM7192SQC160-12 (160-pin PQFP, surface-mount) - they share the die but use incompatible footprints. Also note the -12 speed grade does not officially support 33 MHz PCI in the -4 to -10 grade list; for 33 MHz PCI designs, choose the EPM7192EGC160-10 (10 ns) or faster. Always program the device using JTAG (IEEE 1149.1) - the legacy Altera ByteBlaster parallel port programmer is obsolete and not supported on modern PCs.
Although the MAX 7000 architecture is non-volatile and 5V tolerant, the 124 I/Os can generate significant simultaneous switching noise on the 5V rail. Estimated: 124 outputs switching at 76.9 MHz with 25 pF loads produce a peak SSO current of approximately 480 mA. Use wide power planes (not traces) for VCCINT distribution, keep I/O traces short, and add 33 ohm series-termination resistors near the CPLD pins for high-speed outputs that drive long backplane traces. Place at least one 0.1 uF capacitor within 5 mm of every VCC pin to control local supply transients.
Estimated: at full I/O toggle (124 outputs at 76.9 MHz, 5.0 V) the EPM7192EGC160-12 ceramic PGA package dissipates approximately 2.5 W worst-case. The ceramic PGA has excellent thermal conductivity through its pin grid to the socket and PCB, but designers in enclosed / convection-limited enclosures should still verify junction temperature using the manufacturer theta_JA value. The commercial operating range is 0 C to 90 C - for industrial temperature grades, look for the EPM7192EGI160-12 variant (note the 'I' suffix in the order code).
Informações de conformidade
RoHS / REACH / lead-free status not stated in the provided web data. The ceramic PGA package historically used lead-bearing solder for hermeticity - check for an 'N' suffix variant or contact Intel PSG for RoHS-bonded alternatives. AEC-Q100 is not applicable for a commercial-grade programmable logic device.
