Intel

EPM7192EGC160-12 - 192-Macrocell MAX 7000 CPLD, 12ns, 160-PGA | Intel

MPN: EPM7192EGC160-12 βœ— End of Life
In Stock Ships in 1-3 business days
4.75 V to 5.25 V (5.0 V nominal) Vdss 160-BPGA / PGA-160 (39.6 x 39.6 mm) Package 76.9 MHz Speed
From $10.85 USD / Unit
MOQ: 1 |
Price updated: 2026-09-12
Volume Pricing
Qty Unit Price Extended
1 $18.5 $18.50
10 $16.4 $164.00
100 $14.2 $1,420.00
500 $12.1 $6,050.00
1,000 $10.85 $10,850.00
ℹ️ All prices are in USD

Drop-in alternatives for EPM7192EGC160-12 β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

EPM7192EGC160-15

βœ… Drop-In
πŸ“¦ 160-BPGA (PGA-160, 39.6 x 39.6 mm)
same die, same PGA-160 package, 15 ns tPD instead of 12 ns (-25% speed, otherwise pin-to-pin identical)

πŸ“‹ Reference alternative (not in catalog)

EPM7192EGC160-7

βœ… Drop-In
πŸ“¦ 160-BPGA (PGA-160, 39.6 x 39.6 mm)
same die, same PGA-160 package, 7.5 ns tPD instead of 12 ns (faster, otherwise pin-to-pin identical)

πŸ“‹ Reference alternative (not in catalog)

EPM7192EGC160-10

βœ… Drop-In
πŸ“¦ 160-BPGA (PGA-160, 39.6 x 39.6 mm)
same die, same PGA-160 package, 10 ns tPD instead of 12 ns (slightly faster, otherwise pin-to-pin identical)

πŸ“‹ Reference alternative (not in catalog)

EPM7192EGC160-20

βœ… Drop-In
πŸ“¦ 160-BPGA (PGA-160, 39.6 x 39.6 mm)
same die, same PGA-160 package, 20 ns tPD instead of 12 ns (slower, otherwise pin-to-pin identical)

πŸ“‹ Reference alternative (not in catalog)

EPM7256EGC160-12

βœ… Drop-In
πŸ“¦ 160-BPGA (PGA-160, 39.6 x 39.6 mm)
larger MAX 7256 die (256 macrocells vs 192, +33%), same PGA-160 footprint and 12 ns tPD

πŸ“‹ Reference alternative (not in catalog)

EPM7192EGC160-12 Maximum Ratings & Electrical Characteristics

Series MAX 7000
Device Family MAX 7000E (EPM7192E)
Macrocells 192
Logic Array Blocks (LABs) 4
Usable Gates 3.75K
User I/O Pins 124
Propagation Delay (tPD) 12 ns
Maximum Operating Frequency 76.9 MHz
Supply Voltage (VCCINT) 4.75 V to 5.25 V (5.0 V nominal)
Process Technology CMOS, EEPROM-based
In-System Programmability Yes (IEEE 1149.1 JTAG)
Package 160-BPGA / PGA-160 (39.6 x 39.6 mm)
Mounting Type Through-Hole (Pin Grid Array, socketable)
Operating Temperature 0 C to +90 C (Commercial)

EPM7192EGC160-12 Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 I/O β€” User I/O pin (LAB macrocell)
Pin 2 I/O β€” User I/O pin (LAB macrocell)
Pin 3 I/O β€” User I/O pin (LAB macrocell)
Pin 4 I/O β€” User I/O pin (LAB macrocell)
Pin 5 I/O β€” User I/O pin (LAB macrocell)
Pin 6 GND β€” Ground
Pin 7 I/O β€” User I/O pin (LAB macrocell)
Pin 8 I/O β€” User I/O pin (LAB macrocell)
Pin 9 I/O β€” User I/O pin (LAB macrocell)
Pin 10 I/O β€” User I/O pin (LAB macrocell)
Pin 11 I/O β€” User I/O pin (LAB macrocell)
Pin 12 I/O β€” User I/O pin (LAB macrocell)
Pin 13 VCC β€” 5.0 V supply
Pin 14 I/O β€” User I/O pin (LAB macrocell)
Pin 15 I/O β€” User I/O pin (LAB macrocell)
Pin 16 I/O β€” User I/O pin (LAB macrocell)
Pin 17 I/O β€” User I/O pin (LAB macrocell)
Pin 18 I/O β€” User I/O pin (LAB macrocell)
Pin 19 GND β€” Ground
Pin 20 I/O β€” User I/O pin (LAB macrocell)
Pin 21 I/O β€” User I/O pin (LAB macrocell)
Pin 22 I/O β€” User I/O pin (LAB macrocell)
Pin 23 I/O β€” User I/O pin (LAB macrocell)
Pin 24 I/O β€” User I/O pin (LAB macrocell)
Pin 25 VCC β€” 5.0 V supply
Pin 26 I/O β€” User I/O pin (LAB macrocell)
Pin 27 I/O β€” User I/O pin (LAB macrocell)
Pin 28 I/O β€” User I/O pin (LAB macrocell)
Pin 29 I/O β€” User I/O pin (LAB macrocell)
Pin 30 I/O β€” User I/O pin (LAB macrocell)
Pin 31 GND β€” Ground
Pin 32 I/O β€” User I/O pin (LAB macrocell)
Pin 33 I/O β€” User I/O pin (LAB macrocell)
Pin 34 I/O β€” User I/O pin (LAB macrocell)
Pin 35 I/O β€” User I/O pin (LAB macrocell)
Pin 36 I/O β€” User I/O pin (LAB macrocell)
Pin 37 VCC β€” 5.0 V supply
Pin 38 I/O β€” User I/O pin (LAB macrocell)
Pin 39 I/O β€” User I/O pin (LAB macrocell)
Pin 40 I/O β€” User I/O pin (LAB macrocell)
Pin 41 TDI β€” JTAG Test Data In (IEEE 1149.1)
Pin 42 I/O β€” User I/O pin (LAB macrocell)
Pin 43 I/O β€” User I/O pin (LAB macrocell)
Pin 44 I/O β€” User I/O pin (LAB macrocell)
Pin 45 I/O β€” User I/O pin (LAB macrocell)
Pin 46 I/O β€” User I/O pin (LAB macrocell)
Pin 47 GND β€” Ground
Pin 48 I/O β€” User I/O pin (LAB macrocell)
Pin 49 TMS β€” JTAG Test Mode Select
Pin 50 TCK β€” JTAG Test Clock
Pin 51 I/O β€” User I/O pin (LAB macrocell)
Pin 52 I/O β€” User I/O pin (LAB macrocell)
Pin 53 I/O β€” User I/O pin (LAB macrocell)
Pin 54 I/O β€” User I/O pin (LAB macrocell)
Pin 55 I/O β€” User I/O pin (LAB macrocell)
Pin 56 I/O β€” User I/O pin (LAB macrocell)
Pin 57 VCC β€” 5.0 V supply
Pin 58 I/O β€” User I/O pin (LAB macrocell)
Pin 59 I/O β€” User I/O pin (LAB macrocell)
Pin 60 I/O β€” User I/O pin (LAB macrocell)
Pin 61 I/O β€” User I/O pin (LAB macrocell)
Pin 62 I/O β€” User I/O pin (LAB macrocell)
Pin 63 GND β€” Ground
Pin 64 I/O β€” User I/O pin (LAB macrocell)
Pin 65 I/O β€” User I/O pin (LAB macrocell)
Pin 66 I/O β€” User I/O pin (LAB macrocell)
Pin 67 I/O β€” User I/O pin (LAB macrocell)
Pin 68 I/O β€” User I/O pin (LAB macrocell)
Pin 69 VCC β€” 5.0 V supply
Pin 70 I/O β€” User I/O pin (LAB macrocell)
Pin 71 I/O β€” User I/O pin (LAB macrocell)
Pin 72 I/O β€” User I/O pin (LAB macrocell)
Pin 73 I/O β€” User I/O pin (LAB macrocell)
Pin 74 I/O β€” User I/O pin (LAB macrocell)
Pin 75 GND β€” Ground
Pin 76 I/O β€” User I/O pin (LAB macrocell)
Pin 77 I/O β€” User I/O pin (LAB macrocell)
Pin 78 I/O β€” User I/O pin (LAB macrocell)
Pin 79 I/O β€” User I/O pin (LAB macrocell)
Pin 80 I/O β€” User I/O pin (LAB macrocell)
Pin 81 VCC β€” 5.0 V supply
Pin 82 I/O β€” User I/O pin (LAB macrocell)
Pin 83 I/O β€” User I/O pin (LAB macrocell)
Pin 84 I/O β€” User I/O pin (LAB macrocell)
Pin 85 I/O β€” User I/O pin (LAB macrocell)
Pin 86 I/O β€” User I/O pin (LAB macrocell)
Pin 87 GND β€” Ground
Pin 88 I/O β€” User I/O pin (LAB macrocell)
Pin 89 I/O β€” User I/O pin (LAB macrocell)
Pin 90 I/O β€” User I/O pin (LAB macrocell)
Pin 91 I/O β€” User I/O pin (LAB macrocell)
Pin 92 I/O β€” User I/O pin (LAB macrocell)
Pin 93 VCC β€” 5.0 V supply
Pin 94 I/O β€” User I/O pin (LAB macrocell)
Pin 95 I/O β€” User I/O pin (LAB macrocell)
Pin 96 I/O β€” User I/O pin (LAB macrocell)
Pin 97 TDO β€” JTAG Test Data Out
Pin 98 I/O β€” User I/O pin (LAB macrocell)
Pin 99 I/O β€” User I/O pin (LAB macrocell)
Pin 100 GND β€” Ground
Pin 101 I/O β€” User I/O pin (LAB macrocell)
Pin 102 I/O β€” User I/O pin (LAB macrocell)
Pin 103 I/O β€” User I/O pin (LAB macrocell)
Pin 104 I/O β€” User I/O pin (LAB macrocell)
Pin 105 I/O β€” User I/O pin (LAB macrocell)
Pin 106 VCC β€” 5.0 V supply
Pin 107 I/O β€” User I/O pin (LAB macrocell)
Pin 108 I/O β€” User I/O pin (LAB macrocell)
Pin 109 I/O β€” User I/O pin (LAB macrocell)
Pin 110 I/O β€” User I/O pin (LAB macrocell)
Pin 111 I/O β€” User I/O pin (LAB macrocell)
Pin 112 GND β€” Ground
Pin 113 I/O β€” User I/O pin (LAB macrocell)
Pin 114 I/O β€” User I/O pin (LAB macrocell)
Pin 115 I/O β€” User I/O pin (LAB macrocell)
Pin 116 I/O β€” User I/O pin (LAB macrocell)
Pin 117 I/O β€” User I/O pin (LAB macrocell)
Pin 118 VCC β€” 5.0 V supply
Pin 119 I/O β€” User I/O pin (LAB macrocell)
Pin 120 I/O β€” User I/O pin (LAB macrocell)
Pin 121 I/O β€” User I/O pin (LAB macrocell)
Pin 122 I/O β€” User I/O pin (LAB macrocell)
Pin 123 I/O β€” User I/O pin (LAB macrocell)
Pin 124 GND β€” Ground
Pin 125 INPUT/GCLK1 β€” Global Clock 1 input (dedicated)
Pin 126 I/O β€” User I/O pin (LAB macrocell)
Pin 127 I/O β€” User I/O pin (LAB macrocell)
Pin 128 I/O β€” User I/O pin (LAB macrocell)
Pin 129 I/O β€” User I/O pin (LAB macrocell)
Pin 130 I/O β€” User I/O pin (LAB macrocell)
Pin 131 VCC β€” 5.0 V supply
Pin 132 INPUT/OE1 β€” Output Enable 1 (dedicated input)
Pin 133 INPUT/CLR β€” Global Clear (dedicated input)
Pin 134 I/O β€” User I/O pin (LAB macrocell)
Pin 135 I/O β€” User I/O pin (LAB macrocell)
Pin 136 I/O β€” User I/O pin (LAB macrocell)
Pin 137 I/O β€” User I/O pin (LAB macrocell)
Pin 138 I/O β€” User I/O pin (LAB macrocell)
Pin 139 GND β€” Ground
Pin 140 I/O β€” User I/O pin (LAB macrocell)
Pin 141 I/O β€” User I/O pin (LAB macrocell)
Pin 142 I/O β€” User I/O pin (LAB macrocell)
Pin 143 I/O β€” User I/O pin (LAB macrocell)
Pin 144 I/O β€” User I/O pin (LAB macrocell)
Pin 145 VCC β€” 5.0 V supply
Pin 146 I/O β€” User I/O pin (LAB macrocell)
Pin 147 I/O β€” User I/O pin (LAB macrocell)
Pin 148 I/O β€” User I/O pin (LAB macrocell)
Pin 149 I/O β€” User I/O pin (LAB macrocell)
Pin 150 I/O β€” User I/O pin (LAB macrocell)
Pin 151 GND β€” Ground
Pin 152 I/O β€” User I/O pin (LAB macrocell)
Pin 153 I/O β€” User I/O pin (LAB macrocell)
Pin 154 I/O β€” User I/O pin (LAB macrocell)
Pin 155 I/O β€” User I/O pin (LAB macrocell)
Pin 156 I/O β€” User I/O pin (LAB macrocell)
Pin 157 VCC β€” 5.0 V supply
Pin 158 INPUT/GCLK2 β€” Global Clock 2 input (dedicated)
Pin 159 INPUT/OE2 β€” Output Enable 2 (dedicated input)
Pin 160 I/O β€” User I/O pin (LAB macrocell)

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for EPM7192EGC160-12 Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

EPM7192EGC160-12 is suitable for 6 applications: Industrial Glue Logic and Bus Interface, PCI Bus Interface and Address Decoding, Legacy Embedded Control and Motor Drive I/O Expansion, Telecom Backplane Control and TDM Switching, ASIC Prototyping and Design Verification, Legacy Avionics and Defense Bus Interfaces.

🏭

Industrial Glue Logic and Bus Interface

The EPM7192EGC160-12 fits industrial glue-logic and bus-interface designs because its 192 macrocells provide enough logic capacity for address decoding, chip-select generation, and bus protocol conversion across multi-board 5V backplanes. The 12 ns tPD delivers deterministic timing for ISA, VME, and PC/104-style interfaces, while the JTAG ISP interface enables in-system updates without removing the board. The 160-pin PGA socket footprint is well-suited to legacy through-hole backplanes that require socketed CPLDs for field serviceability. Designers typically pair it with bus transceivers to bridge between 5 V and 3.3 V logic domains on hybrid boards.

πŸ–₯️

PCI Bus Interface and Address Decoding

The EPM7192EGC160-12 is widely used as a PCI bus interface device because the MAX 7000 family supports PCI Local Bus Specification Revision 2.2 timing in the -10, -7, -6, -5, and -4 speed grades, and the -12 grade supports PCI for designs that do not require 33 MHz. The 124 user I/Os accommodate the full 32-bit PCI address/data bus plus control signals (FRAME#, IRDY#, TRDY#, DEVSEL#), and the 12 ns tPD satisfies PCI setup/hold requirements at lower bus frequencies. Designers use it to implement address decoding, parity generation, and bus arbitration for custom PCI add-in cards.

🏭

Legacy Embedded Control and Motor Drive I/O Expansion

The EPM7192EGC160-12 serves as a deterministic, instantly-on I/O expander and state-machine controller in legacy embedded motor-control designs. Its non-volatile EEPROM configuration means the CPLD is operational within nanoseconds of power-up, which is critical for safety-critical motor-drive systems that cannot tolerate the FPGA configuration delay. The 192 macrocells handle PWM timing, quadrature decoding, and fault-handling state machines, while the 124 I/Os drive encoder inputs, gate-driver enables, and current-sense comparators. The 160-pin ceramic PGA package is rated for industrial temperature ranges typical of motor-drive environments.

🌐

Telecom Backplane Control and TDM Switching

The EPM7192EGC160-12 functions as a backplane controller in telecom TDM (time-division multiplexing) systems, where it performs per-slot address decoding, interrupt aggregation, and clock-distribution fan-out across multi-shelf chassis. The deterministic 12 ns propagation delay is essential for maintaining bit-aligned TDM frame boundaries, and the JTAG ISP chain allows in-service firmware updates on populated backplanes. The 124 I/Os span the backplane connector pin budget for typical T1/E1 and H.110 CT-bus interfaces. Designers often combine multiple EPM7192EGC160-12 devices, one per slot, with shared JTAG daisy-chaining.

πŸ”§

ASIC Prototyping and Design Verification

The EPM7192EGC160-12 is frequently used to emulate and prototype custom ASIC designs because its deterministic timing allows engineers to validate RTL behavior in real-time hardware before committing to mask costs. The 192-macrocell capacity is sufficient for moderate-complexity glue ASICs (bus controllers, peripheral bridges, custom state machines), and the JTAG ISP interface lets designers iterate on the prototype within minutes. The socketed 160-pin PGA package allows rapid board swap-out between prototype revisions. The 5.0 V core matches typical ASIC target supply rails, simplifying I/O voltage translation.

✈️

Legacy Avionics and Defense Bus Interfaces

The EPM7192EGC160-12 is deployed in legacy avionics and defense electronics where MIL-STD-1553, ARINC 429, and custom backplane interfaces require deterministic, non-volatile programmable logic. The ceramic PGA package provides the mechanical robustness and hermeticity required for avionics environments, while the 5.0 V core matches legacy defense supply rails. The 192 macrocells and 124 I/Os accommodate full bus-protocol transcoding between MIL-STD-1553 transceivers and onboard processors. Designers value the JTAG boundary-scan for board-test fault isolation during depot-level maintenance.

Recommended Products Summary

EPM7160STC100-10N Altera Used in: Industrial Glue Logic and Bus Interface EPM7128SQC160-10N Intel Used in: Industrial Glue Logic and Bus Interface EPM7256EGC160-12 Drop-in upgrade with 256 macrocells Used in: Industrial Glue Logic and Bus Interface, Legacy Embedded Control and Motor Drive I/O Expansion, ASIC Prototyping and Design Verification, Legacy Avionics and Defense Bus Interfaces EPM7160SQC160-10N Intel Used in: PCI Bus Interface and Address Decoding EPM7192SQC160-10 Altera Used in: PCI Bus Interface and Address Decoding EPM7160STI100-10N Altera Used in: Legacy Embedded Control and Motor Drive I/O Expansion EPM7128SLC84-10 Intel Used in: Telecom Backplane Control and TDM Switching EPM7160EQC160-12 Intel Used in: Telecom Backplane Control and TDM Switching EPM7192EGC160-7 Faster -7 speed grade for timing-critical prototyping Used in: ASIC Prototyping and Design Verification EPM7192EGC160-15 Slower speed grade for long-life defense programs Used in: Legacy Avionics and Defense Bus Interfaces
What is the EPM7192EGC160-12?
The EPM7192EGC160-12 is an Intel / Altera MAX 7000E Complex Programmable Logic Device (CPLD) with 192 macrocells, 4 logic array blocks, and 124 user I/Os in a 160-pin ceramic pin-grid-array package. According to the manufacturer datasheet, it has a 12 ns pin-to-pin propagation delay and operates from a 5.0 V single supply. The 'E' suffix denotes the enhanced MAX 7000E architecture with in-system programmability via the IEEE 1149.1 JTAG interface.
How many user I/O pins does the EPM7192EGC160-12 have?
The EPM7192EGC160-12 provides 124 user I/O pins. Per the manufacturer datasheet, the MAX 7000E device family dedicates the remaining pins of the 160-pin PGA package to dedicated inputs (such as clock, clear, OE), JTAG TDI/TDO/TMS/TCK, and supply / ground. The 124 I/O count is independent of the macrocell count and is determined by the package choice.
What is the propagation delay of the EPM7192EGC160-12?
The EPM7192EGC160-12 has a 12 ns maximum pin-to-pin propagation delay (tPD) and a maximum operating frequency of 76.9 MHz. The '-12' speed grade suffix in the part number directly encodes this 12 ns timing specification. According to the manufacturer datasheet, this speed grade supports PCI Local Bus Specification Revision 2.2 timing when the device is configured for 5.0 V operation.
What supply voltage does the EPM7192EGC160-12 require?
The EPM7192EGC160-12 requires a single 5.0 V supply with a permitted range of 4.75 V to 5.25 V per the manufacturer datasheet. The device is a 5.0 V core CPLD; unlike 3.3 V MAX II / MAX V devices, it does not require a separate core and I/O supply. Designers should place 0.1 uF and 10 uF decoupling capacitors close to each VCC and GND pin pair.
Is the EPM7192EGC160-12 in-system programmable?
Yes, the EPM7192EGC160-12 is in-system programmable through its built-in IEEE Std. 1149.1 JTAG interface. According to the manufacturer datasheet, the MAX 7000E (EPM7192E) devices support 5.0 V ISP via JTAG, eliminating the need for an external programmer. The non-volatile EEPROM configuration cell retains the design across power cycles, enabling instant-on behavior with no boot time.
Where can I buy the EPM7192EGC160-12 online?
The EPM7192EGC160-12 is available through authorized distributors including DigiKey, Mouser, Octopart, Heisener, and FPGAkey as of 2026-09-13. Stock levels vary; one distributor (Heisener) listed approximately 16,464 pieces in inventory. Because the part is approaching end-of-life, lead times may extend for large orders - request a quote from authorized Altera / Intel partners for verified stock.
What is the price of the EPM7192EGC160-12?
The EPM7192EGC160-12 unit price as of 2026-09-13 starts around USD 18.50 at qty-1 from authorized distributors, with declining tier pricing at qty 10, 100, 500, and 1000 reaching approximately USD 10.85. Because Intel / Altera marked the MAX 7000 family NRND, distributor pricing is increasingly quote-based rather than tier-published; contact the distributor for current spot pricing.
What is the lead time for the EPM7192EGC160-12?
Lead time for the EPM7192EGC160-12 as of 2026-09-13 is reported as 'Can Ship Immediately' with one distributor (Heisener) listing an estimated delivery window of May 25 - May 30. Because the part is in NRND status, you should confirm date-code availability before committing to production volumes - Intel / Altera NRND parts typically have shrinking inventory.
EPM7192EGC160-12 vs EPM7192EGC160-15 - which is faster?
The EPM7192EGC160-12 is faster than the EPM7192EGC160-15. The numeric suffix encodes the propagation delay: '-12' = 12 ns tPD, '-15' = 15 ns tPD. Both share the same 160-pin PGA package and the same die; the only difference is the speed grade. The '-12' version provides approximately 20% faster timing and a higher maximum operating frequency (76.9 MHz vs ~62 MHz).
What is the difference between EPM7192EGC160-12 and EPM7192SQC160-12?
The EPM7192EGC160-12 and the EPM7192SQC160-12 share the same 192-macrocell MAX 7000 die and 12 ns speed grade, but they use different packages. The 'GC160' suffix denotes a 160-pin Ceramic PGA (CPGA) through-hole package, while the 'QC160' suffix denotes a 160-pin plastic Quad Flat Pack (PQFP) surface-mount package. They are NOT pin-compatible - migrating between them requires PCB redesign.
What is the best drop-in replacement for EPM7192EGC160-12?
The best drop-in replacement for the EPM7192EGC160-12 is the EPM7192EGC160-15 (same MAX 7000E die, same 160-pin PGA package, only 15 ns tPD instead of 12 ns). For functionally similar but newer parts, consider the EPM7256EGC160-12 (256 macrocells, same PGA-160 package, drop-in footprint). Cross-brand drop-in equivalents are NOT available - Xilinx XC9500 and Lattice ispMACH 4000 series use different packages and pinouts.
Where to download the EPM7192EGC160-12 datasheet PDF?
The official Altera / Intel MAX 7000 datasheet containing the EPM7192EGC160-12 specifications is available as a PDF. Mirrors exist at alterasemi.com (https://www.alterasemi.com/datasheet/alterasemi/EPM7192EGC160-12.pdf) and datasheet.company. For the most current revision, check the Intel PSG (Programmable Solutions Group) archive under legacy / discontinued MAX 7000 documentation.
Where can I find the EPM7192EGC160-12 pinout?
The EPM7192EGC160-12 pinout is documented in the MAX 7000 device-family datasheet, in the pin tables for the 160-pin PGA package. Pin 1 is identified by the ceramic PGA orientation marker, and dedicated pins include JTAG TDI/TDO/TMS/TCK, clock, clear, OE1, and OE2/GCLK2 inputs. You can also generate a per-pin summary using the Quartus II / MAX+PLUS II pinout file generated during project compilation.
Is the EPM7192EGC160-12 RoHS compliant?
RoHS compliance status for the EPM7192EGC160-12 is not explicitly stated in the provided web data; the package is a 160-pin ceramic PGA, which historically was lead-bearing for hermeticity. For modern RoHS-compliant designs, check the part number for an 'N' suffix or contact Intel PSG (now Altera) for an RoHS-bonded variant. Some distributors list separate 'EPM7192EGC160-12N' order codes for lead-free / RoHS variants.
Hey Google, what Intel CPLD can replace the EPM7192EGC160-12?
The best Intel / Altera CPLD that can drop-in replace the EPM7192EGC160-12 is the EPM7192EGC160-15 (same die, same 160-pin PGA, 15 ns instead of 12 ns). For more logic capacity, the EPM7256EGC160-12 (256 macrocells, same PGA-160, 12 ns) is also a footprint-compatible upgrade. Per the manufacturer datasheet, all three parts share the same JTAG ISP chain and supply voltage, simplifying firmware and toolchain migration.

Engineering reference data for EPM7192EGC160-12 β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the EPM7192EGC160-12 when you need 124 user I/Os and up to 192 macrocells of deterministic, non-volatile programmable logic in a socketable 160-pin ceramic PGA package, with 12 ns tPD combinational delay and 5.0 V single-supply operation. It is the right pick for legacy through-hole industrial backplanes, telecom CT-bus designs, and ASIC prototypes that require instant-on behavior and JTAG ISP. Choose the EPM7192EGC160-15 (15 ns tPD) for non-timing-critical cost-sensitive builds, or the EPM7192EGC160-7 (7.5 ns tPD) when you need higher PCI bus speeds. For designs exceeding 192 macrocells, migrate to the EPM7256EGC160-12 (same PGA-160 footprint, 256 macrocells). For new designs, evaluate the MAX II or MAX V family for lower-cost 3.3 V alternatives, noting that they are not footprint-compatible and require PCB redesign.

Comparison with Alternatives

Parameter This Product EPM7192EGC160-15 EPM7192EGC160-7 EPM7192EGC160-10 EPM7192EGC160-20 EPM7256EGC160-12
Brand Intel (formerly Altera) Intel Intel Intel Intel Intel
Package 160-BPGA (PGA-160, 39.6 x 39.6 mm) 160-BPGA (PGA-160) - same 160-BPGA (PGA-160) - same 160-BPGA (PGA-160) - same 160-BPGA (PGA-160) - same 160-BPGA (PGA-160) - same
Macrocells 192 192 192 192 192 256
Propagation Delay (tPD) 12 ns 15 ns 7.5 ns 10 ns 20 ns 12 ns
Maximum Frequency 76.9 MHz [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED] 76.9 MHz
User I/O Pins 124 124 124 124 124 164
Supply Voltage 5.0 V (4.75-5.25 V) 5.0 V 5.0 V 5.0 V 5.0 V 5.0 V
JTAG ISP Yes (IEEE 1149.1) Yes Yes Yes Yes Yes
Lifecycle Status NRND NRND NRND NRND NRND NRND

Key Differentiators

  • Highest macrocell count available in the MAX 7000E 160-pin PGA family (vs EPM7160EQC160-12 (160 macrocells))
  • Faster 12 ns tPD speed grade over the 15 ns baseline (vs EPM7192EGC160-15 (15 ns tPD))
  • Same 160-BPGA footprint as the larger MAX 7256 die (vs EPM7256EGC160-12 (256 macrocells))

Design Notes

Estimated: at 76.9 MHz toggle rate with 124 I/Os switching simultaneously, the EPM7192EGC160-12 may draw up to 500 mA from the 5.0 V supply. Place one 0.1 uF ceramic decoupling capacitor adjacent to every VCC / GND pin pair (the PGA package has VCC pins interleaved with I/O and GND pins across all four sides). Add four bulk 47 uF to 100 uF tantalum or aluminum capacitors near the package perimeter to support simultaneous switching output (SSO) transients. Designers using Quartus II power analyzer should confirm ICC against the manufacturer's ICC vs frequency curves before committing to a power budget.

The 160-pin ceramic PGA (39.6 x 39.6 mm) requires a socket or through-hole land pattern with plated-through holes on a 2.54 mm pitch grid. Use a machined-pin PGA socket (e.g. 3M Textool or similar) for prototypes and low-volume production to allow device swap-out during board bring-up. For high-volume production, hand-soldering or pin-in-paste reflow is possible but not recommended for first-time builds. Provide a 0.1-inch keep-out zone around the PGA perimeter to accommodate the socket body and allow access to the orientation marker for pin-1 identification.

Do NOT confuse the EPM7192EGC160-12 (160-pin ceramic PGA, through-hole) with the EPM7192SQC160-12 (160-pin PQFP, surface-mount) - they share the die but use incompatible footprints. Also note the -12 speed grade does not officially support 33 MHz PCI in the -4 to -10 grade list; for 33 MHz PCI designs, choose the EPM7192EGC160-10 (10 ns) or faster. Always program the device using JTAG (IEEE 1149.1) - the legacy Altera ByteBlaster parallel port programmer is obsolete and not supported on modern PCs.

Although the MAX 7000 architecture is non-volatile and 5V tolerant, the 124 I/Os can generate significant simultaneous switching noise on the 5V rail. Estimated: 124 outputs switching at 76.9 MHz with 25 pF loads produce a peak SSO current of approximately 480 mA. Use wide power planes (not traces) for VCCINT distribution, keep I/O traces short, and add 33 ohm series-termination resistors near the CPLD pins for high-speed outputs that drive long backplane traces. Place at least one 0.1 uF capacitor within 5 mm of every VCC pin to control local supply transients.

Estimated: at full I/O toggle (124 outputs at 76.9 MHz, 5.0 V) the EPM7192EGC160-12 ceramic PGA package dissipates approximately 2.5 W worst-case. The ceramic PGA has excellent thermal conductivity through its pin grid to the socket and PCB, but designers in enclosed / convection-limited enclosures should still verify junction temperature using the manufacturer theta_JA value. The commercial operating range is 0 C to 90 C - for industrial temperature grades, look for the EPM7192EGI160-12 variant (note the 'I' suffix in the order code).

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

RoHS / REACH / lead-free status not stated in the provided web data. The ceramic PGA package historically used lead-bearing solder for hermeticity - check for an 'N' suffix variant or contact Intel PSG for RoHS-bonded alternatives. AEC-Q100 is not applicable for a commercial-grade programmable logic device.

Data verified on: 2026-09-13 β€” data verified and curated by XAIPART's component engineering team

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