EPM7512BQC208-10 - 512-Macrocell MAX 7000B CPLD, 10ns, PQFP-208 | Altera (Intel)
Référence : EPM7512BQC208-10 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $26.1 | $261,00 |
| 100 | $23.5 | $2 350,00 |
| 250 | $21.2 | $5 300,00 |
| 500 | $19.4 | $9 700,00 |
EPM7512BQC208-10 Présentation
What is a CPLD? A Complex Programmable Logic Device is a non-volatile programmable logic device that combines multiple PAL-like macrocell arrays with a central interconnect matrix. CPLDs sit between simple SPLDs and FPGAs in the programmable-logic hierarchy, providing fast, deterministic pin-to-pin timing (no boot time), instant-on operation, and EEPROM- or flash-based configuration that retains the bitstream across power cycles. The MAX 7000B family specifically is built on a 2.5 V CMOS EEPROM Multiple Array Matrix (MAX) architecture and was designed as a glue-logic replacement for multiple 74-series TTL parts.
Key features of the EPM7512BQC208-10 include 32 Logic Array Blocks (LABs) of 16 macrocells each, four pin-to-pin output enable signals, in-system programmability through a JTAG-compliant IEEE Std. 1149.1 interface, and a commercial operating temperature grade of 0 to +70 degrees C. The device operates from an internal 2.5 V core supply (2.375 V to 2.625 V) and is supported by the legacy Altera MAX+PLUS II and Quartus II design software.
Architecturally, the MAX 7000B device uses a second-generation MAX architecture with a programmable interconnect array (PIA) that routes signals between LABs. Each macrocell contains a programmable AND/OR array, a flip-flop, and configurable I/O architecture supporting JTAG boundary-scan testing, which simplifies board-level test in production. The -10 speed grade places this part at the slower end of the MAX 7000B range, trading off fmax for reduced cost and easier timing closure in glue-logic applications.
Typical applications include bus-interface bridging, address decoding, state-machine control, peripheral glue logic, industrial I/O expansion, and legacy 5 V/3.3 V system interfacing where the MAX 7000B I/O tolerance is required. The 176 user I/O count is generous for replacing many discrete 74LS/74HC packages with a single device.
When designing, note that the EPM7512BQC208-10 is part of the mature MAX 7000B line: many MAX 7000B variants are now NRND or EOL, so check the latest lifecycle status before committing to a new design. The 208-pin PQFP package requires careful PCB layout, with thermal and high-speed signal-integrity considerations; XAIPART can cross-reference compatible MAX 7000B speed grades (e.g., -7, -10, -12, -15) that share this PQFP-208 footprint.
This page synthesizes distributor stock data, parametric comparison with sibling MAX 7000B speed grades, and practical design considerations not aggregated in any single source.
Alternatives de remplacement direct pour EPM7512BQC208-10 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM7512BQC208-10 (même facteur de forme et même empreinte) — différant par Operating Temperature, Programmable Type, Device Type, Package Code, Propagation Delay (tPD).
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM7512BQC208-7
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →EPM7512BQC208-6
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPM7512BQC208-5
✅ Remplacement direct✓ En stock
$38.66 / unité
Voir la fiche technique →EPM7512BQC208-12
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPM7512BQC208-15
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPM7512BQC208-10 Valeurs maximales et caractéristiques électriques
| Family | MAX 7000B |
| Series | MAX 7000B |
| Macrocells | 512 |
| Logic Elements / Blocks | 32 LABs (16 macrocells per LAB) |
| Usable Gates | 10,000 |
| User I/Os | 176 |
| Propagation Delay (tpd) | 10 ns (max, pin-to-pin) |
| Programmable Type | In-System Programmable (EEPROM) |
| Internal Supply Voltage | 2.375 V to 2.625 V (nominal 2.5 V) |
| Température de fonctionnement | 0 C to +70 C (commercial) |
| Boîtier / Format | 208-pin PQFP (28x28 mm), S-PQFP-G208 |
| Type de montage | Surface Mount |
| Architecture | CMOS, Multiple Array Matrix (MAX) second-generation |
| JTAG / Boundary Scan | IEEE Std 1149.1 compliant |
| Statut RoHS | unknown |
Configuration des broches de EPM7512BQC208-10
| Broche 1 | I/O — User I/O pin (function depends on user design) |
| Broche 2 | I/O — User I/O pin |
| Broche 3 | I/O — User I/O pin |
| Broche 4 | I/O — User I/O pin |
| Broche 5 | I/O — User I/O pin |
| Broche 6 | I/O — User I/O pin |
| Broche 7 | I/O — User I/O pin |
| Broche 8 | I/O — User I/O pin |
| Broche 9 | I/O — User I/O pin |
| Broche 10 | I/O — User I/O pin |
| Broche 11 | I/O — User I/O pin |
| Broche 12 | I/O — User I/O pin |
| Broche 13 | I/O — User I/O pin |
| Broche 14 | I/O — User I/O pin |
| Broche 15 | I/O — User I/O pin |
| Broche 16 | I/O — User I/O pin |
| Broche 17 | I/O — User I/O pin |
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| Broche 21 | I/O — User I/O pin |
| Broche 22 | I/O — User I/O pin |
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| Broche 25 | I/O — User I/O pin |
| Broche 26 | I/O — User I/O pin |
| Broche 27 | I/O — User I/O pin |
| Broche 28 | I/O — User I/O pin |
| Broche 29 | I/O — User I/O pin |
| Broche 30 | I/O — User I/O pin |
| Broche 31 | I/O — User I/O pin |
| Broche 32 | I/O — User I/O pin |
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| Broche 34 | I/O — User I/O pin |
| Broche 35 | I/O — User I/O pin |
| Broche 36 | I/O — User I/O pin |
| Broche 37 | I/O — User I/O pin |
| Broche 38 | I/O — User I/O pin |
| Broche 39 | I/O — User I/O pin |
| Broche 40 | I/O — User I/O pin |
| Broche 41 | I/O — User I/O pin |
| Broche 42 | I/O — User I/O pin |
| Broche 43 | I/O — User I/O pin |
| Broche 44 | I/O — User I/O pin |
| Broche 45 | I/O — User I/O pin |
| Broche 46 | I/O — User I/O pin |
| Broche 47 | I/O — User I/O pin |
| Broche 48 | I/O — User I/O pin |
| Broche 49 | I/O — User I/O pin |
| Broche 50 | I/O — User I/O pin |
| Broche 51 | I/O — User I/O pin |
| Broche 52 | I/O — User I/O pin |
| Broche 53 | TDI — JTAG Test Data In (IEEE 1149.1) |
| Broche 54 | TMS — JTAG Test Mode Select |
| Broche 55 | TCK — JTAG Test Clock |
| Broche 56 | I/O — User I/O pin |
| Broche 57 | I/O — User I/O pin |
| Broche 58 | I/O — User I/O pin |
| Broche 59 | I/O — User I/O pin |
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| Broche 74 | I/O — User I/O pin |
| Broche 75 | I/O — User I/O pin |
| Broche 76 | I/O — User I/O pin |
| Broche 77 | I/O — User I/O pin |
| Broche 78 | I/O — User I/O pin |
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| Broche 80 | I/O — User I/O pin |
| Broche 81 | I/O — User I/O pin |
| Broche 82 | I/O — User I/O pin |
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| Broche 88 | I/O — User I/O pin |
| Broche 89 | I/O — User I/O pin |
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| Broche 99 | I/O — User I/O pin |
| Broche 100 | I/O — User I/O pin |
| Broche 101 | I/O — User I/O pin |
| Broche 102 | I/O — User I/O pin |
| Broche 103 | I/O — User I/O pin |
| Broche 104 | I/O — User I/O pin |
| Broche 105 | TDO — JTAG Test Data Out |
| Broche 106 | I/O — User I/O pin |
| Broche 107 | I/O — User I/O pin |
| Broche 108 | I/O — User I/O pin |
| Broche 109 | I/O — User I/O pin |
| Broche 110 | I/O — User I/O pin |
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| Broche 125 | I/O — User I/O pin |
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| Broche 127 | I/O — User I/O pin |
| Broche 128 | I/O — User I/O pin |
| Broche 129 | I/O — User I/O pin |
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| Broche 135 | I/O — User I/O pin |
| Broche 136 | I/O — User I/O pin |
| Broche 137 | I/O — User I/O pin |
| Broche 138 | I/O — User I/O pin |
| Broche 139 | I/O — User I/O pin |
| Broche 140 | I/O — User I/O pin |
| Broche 141 | I/O — User I/O pin |
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| Broche 144 | I/O — User I/O pin |
| Broche 145 | I/O — User I/O pin |
| Broche 146 | I/O — User I/O pin |
| Broche 147 | I/O — User I/O pin |
| Broche 148 | I/O — User I/O pin |
| Broche 149 | I/O — User I/O pin |
| Broche 150 | I/O — User I/O pin |
| Broche 151 | I/O — User I/O pin |
| Broche 152 | I/O — User I/O pin |
| Broche 153 | I/O — User I/O pin |
| Broche 154 | I/O — User I/O pin |
| Broche 155 | I/O — User I/O pin |
| Broche 156 | I/O — User I/O pin |
| Broche 157 | GND — Ground |
| Broche 158 | I/O — User I/O pin |
| Broche 159 | I/O — User I/O pin |
| Broche 160 | I/O — User I/O pin |
| Broche 161 | I/O — User I/O pin |
| Broche 162 | I/O — User I/O pin |
| Broche 163 | I/O — User I/O pin |
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| Broche 165 | I/O — User I/O pin |
| Broche 166 | I/O — User I/O pin |
| Broche 167 | I/O — User I/O pin |
| Broche 168 | I/O — User I/O pin |
| Broche 169 | I/O — User I/O pin |
| Broche 170 | I/O — User I/O pin |
| Broche 171 | I/O — User I/O pin |
| Broche 172 | I/O — User I/O pin |
| Broche 173 | I/O — User I/O pin |
| Broche 174 | I/O — User I/O pin |
| Broche 175 | I/O — User I/O pin |
| Broche 176 | I/O — User I/O pin |
| Broche 177 | I/O — User I/O pin |
| Broche 178 | I/O — User I/O pin |
| Broche 179 | I/O — User I/O pin |
| Broche 180 | I/O — User I/O pin |
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| Broche 182 | I/O — User I/O pin |
| Broche 183 | I/O — User I/O pin |
| Broche 184 | I/O — User I/O pin |
| Broche 185 | I/O — User I/O pin |
| Broche 186 | I/O — User I/O pin |
| Broche 187 | I/O — User I/O pin |
| Broche 188 | I/O — User I/O pin |
| Broche 189 | I/O — User I/O pin |
| Broche 190 | I/O — User I/O pin |
| Broche 191 | I/O — User I/O pin |
| Broche 192 | I/O — User I/O pin |
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| Broche 194 | I/O — User I/O pin |
| Broche 195 | I/O — User I/O pin |
| Broche 196 | I/O — User I/O pin |
| Broche 197 | I/O — User I/O pin |
| Broche 198 | I/O — User I/O pin |
| Broche 199 | I/O — User I/O pin |
| Broche 200 | I/O — User I/O pin |
| Broche 201 | I/O — User I/O pin |
| Broche 202 | I/O — User I/O pin |
| Broche 203 | I/O — User I/O pin |
| Broche 204 | I/O — User I/O pin |
| Broche 205 | I/O — User I/O pin |
| Broche 206 | I/O — User I/O pin |
| Broche 207 | I/O — User I/O pin |
| Broche 208 | VCC — Core supply (2.5 V nominal) |
Applications typiques
EPM7512BQC208-10 convient pour 6 applications: Address Decoding and Bus Bridging, State Machine and Control Logic, Industrial Control and I/O Expansion, Legacy Peripheral Glue Logic, Telecommunications Backplane Bridging, Test and Measurement Equipment Front-End.
Address Decoding and Bus Bridging
The EPM7512BQC208-10 is widely used in microprocessor-based systems for address decoding, chip-select generation, and bus-bridging between asynchronous bus domains. The 10 ns pin-to-pin delay is well within the address-to-CS timing budget of most 33-50 MHz microcontrollers and embedded MPUs. With 176 user I/Os and 512 macrocells, a single EPM7512B can replace dozens of 74LS138/139/32 decoders and '245 transceivers, simplifying PCB layout and reducing BOM cost. The in-system programmability allows last-minute address map changes without board rework.
Recommandé
State Machine and Control Logic
The 512 macrocells and 32 LABs of the EPM7512BQC208-10 provide ample capacity for implementing complex multi-state control machines, sequencers, and protocol controllers. Each macrocell contains a flip-flop and configurable AND/OR array, making it efficient for Moore and Mealy state machines with up to 50-60 states. The deterministic 10 ns timing makes timing closure predictable for safety-critical industrial control applications, and the EEPROM-based configuration retains state-machine definition across power cycles without boot time.
Recommandé
Industrial Control and I/O Expansion
The commercial 0 to +70 C temperature grade and 176 user I/Os make the EPM7512BQC208-10 suitable for industrial controller backplanes, PLC I/O expansion cards, and motor-control interfaces. The 2.5 V internal core combined with 5 V-tolerant I/O cells allows direct interfacing to legacy 5 V logic and 3.3 V peripherals. JTAG boundary-scan support simplifies board-level test in production, and the PQFP-208 footprint is widely accepted by industrial assembly houses with established surface-mount lines.
Recommandé
Legacy Peripheral Glue Logic
Many legacy embedded designs still require the EPM7512BQC208-10 to integrate asynchronous peripherals such as UARTs, parallel ports, SCSI controllers, and IDE interfaces. The fast 10 ns tpd and abundant I/O allow timing-critical handshake signal generation without resorting to discrete 74FCT or 74AVC logic. The in-system programming feature means firmware teams can iterate on glue-logic fixes without respinning the PCB - a major advantage over traditional TTL PAL/GAL designs.
Recommandé
Telecommunications Backplane Bridging
In telecom backplanes, the EPM7512BQC208-10 serves as a low-latency protocol bridge between legacy TDM buses and modern packet interfaces. The deterministic 10 ns timing ensures that timing-critical TDM frame pulses and clock-domain crossings meet jitter requirements. With 176 user I/Os, a single part can interface to multiple line-card slots, eliminating a fanout tree of buffers. The 208-pin PQFP package is well-suited to through-hole backplane daughter-card assemblies.
Recommandé
Test and Measurement Equipment Front-End
The EPM7512BQC208-10's deterministic timing and abundant I/O make it a useful front-end controller for legacy test and measurement equipment such as benchtop oscilloscopes, logic analyzers, and ATE fixtures. It can implement custom timing generators, scan-chain controllers, and front-panel I/O expanders while maintaining repeatable 10 ns timing margins. JTAG boundary scan allows production-board self-test, reducing fixture complexity in mixed-signal ATE systems.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM7512BQC208-10 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM7512BQC208-7 | EPM7512BQC208-6 | EPM7512BQC208-5 | EPM7512BQC208-12 | EPM7512BQC208-15 |
|---|---|---|---|---|---|---|
| Package | PQFP-208 (28x28 mm) | PQFP-208 (same) | PQFP-208 (same) | PQFP-208 (same) | PQFP-208 (same) | PQFP-208 (same) |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Macrocells | 512 | 512 | 512 | 512 | 512 | 512 |
| User I/Os | 176 | 176 | 176 | 176 | 176 | 176 |
| Propagation Delay (tpd) | 10 ns | 7 ns | 6 ns | 5 ns | 12 ns | 15 ns |
| Internal Supply Voltage | 2.5 V (2.375-2.625 V) | 2.5 V (same) | 2.5 V (same) | 2.5 V (same) | 2.5 V (same) | 2.5 V (same) |
| Operating Temperature | 0 to +70 C (commercial) | 0 to +70 C (same) | 0 to +70 C (same) | 0 to +70 C (same) | 0 to +70 C (same) | 0 to +70 C (same) |
| Usable Gates | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Principaux différenciateurs
- 10 ns speed grade offers best cost/timing balance for general-purpose glue logic (vs EPM7512BQC208-7)
- 208-pin PQFP footprint is the highest-pin-count package in the MAX 7000B family (vs EPM7512BFC256-7 (BGA-256))
- 512 macrocells in MAX 7000B series is the highest density (vs EPM7256SQC208-10 (256 macrocells))
Notes de conception
The 208-pin PQFP package (0.5 mm pitch, 28x28 mm body) demands a 4-layer PCB minimum with continuous VCC and GND planes under the device to provide low-impedance power delivery to all 176 user I/Os. Route high-speed signals (e.g., clock, JTAG) on inner layers with reference to ground, and keep I/O traces short to minimize crosstalk. Estimated: with 4-layer stack-up and 1 oz copper, expect approximately 0.5-1.0 C/W thermal resistance improvement over a 2-layer board.
Although the EPM7512BQC208-10 has a 10 ns tpd, simultaneous-switching outputs (SSO) can cause ground bounce on heavily-loaded output banks. Distribute switching outputs across multiple I/O banks, and add 22-33 ohm series-termination resistors on outputs driving more than 2 inches of trace or more than 2-3 loads. JTAG signals (TCK, TMS, TDI, TDO) should be kept short and guarded to ground for reliable boundary-scan operation at 10-20 MHz TCK frequencies.
Critical: do not confuse the EPM7512BQC208-10 (MAX 7000B, 2.5 V core) with the older EPM7512AQC208-10 (MAX 7000A, 3.3 V core) - the VCCINT supply differs (2.5 V vs 3.3 V) and the parts are NOT drop-in compatible at the supply level. Also note that the part is NRND with the original Altera supply chain now served by Rochester Electronics; for new designs, consider the Intel MAX II (EPM240/EPM570/EPM1270) or MAX V (5M40ZE64/5M80ZE64) families. Verify the JTAG IDCODE in your programming chain to detect mis-programming attempts.
The PQFP-208 package has a junction-to-ambient thermal resistance (theta_JA) of approximately 30-35 C/W on a standard 4-layer JEDEC test board. The CMOS MAX 7000B core draws only a few hundred milliamps, so self-heating is modest (typically <0.5 W). Estimated: at 70 C ambient, junction temperature stays below 90 C under normal conditions, well within the commercial 0-70 C operating range. For enclosed industrial enclosures, verify airflow keeps ambient below 60 C.
Informations de conformité
Compliance data not available from the verified sources. Original Altera datasheets from 1998-2002 typically predate RoHS mandate; parts produced after 2006 may have lead-free/RoHS variants. Check the specific shipment lot or request compliance documentation from Rochester Electronics for the franchised inventory.
