EPM7512BQC208-10 - 512-Macrocell MAX 7000B CPLD, 10ns, PQFP-208 | Altera (Intel)
MPN: EPM7512BQC208-10 β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $26.1 | $261.00 |
| 100 | $23.5 | $2,350.00 |
| 250 | $21.2 | $5,300.00 |
| 500 | $19.4 | $9,700.00 |
Drop-in alternatives for EPM7512BQC208-10 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EPM7512BQC208-7
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View Datasheet βEPM7512BQC208-6
β Drop-Inπ Reference alternative (not in catalog)
EPM7512BQC208-5
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$38.66 / Unit
View Datasheet βEPM7512BQC208-12
β Drop-Inπ Reference alternative (not in catalog)
EPM7512BQC208-15
β Drop-Inπ Reference alternative (not in catalog)
EPM7512BQC208-10 Maximum Ratings & Electrical Characteristics
| Family | MAX 7000B |
| Series | MAX 7000B |
| Macrocells | 512 |
| Logic Elements / Blocks | 32 LABs (16 macrocells per LAB) |
| Usable Gates | 10,000 |
| User I/Os | 176 |
| Propagation Delay (tpd) | 10 ns (max, pin-to-pin) |
| Programmable Type | In-System Programmable (EEPROM) |
| Internal Supply Voltage | 2.375 V to 2.625 V (nominal 2.5 V) |
| Operating Temperature | 0 C to +70 C (commercial) |
| Package / Case | 208-pin PQFP (28x28 mm), S-PQFP-G208 |
| Mounting Type | Surface Mount |
| Architecture | CMOS, Multiple Array Matrix (MAX) second-generation |
| JTAG / Boundary Scan | IEEE Std 1149.1 compliant |
| RoHS Status | unknown |
EPM7512BQC208-10 Pin Configuration
| Pin 1 | I/O β User I/O pin (function depends on user design) |
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| Pin 53 | TDI β JTAG Test Data In (IEEE 1149.1) |
| Pin 54 | TMS β JTAG Test Mode Select |
| Pin 55 | TCK β JTAG Test Clock |
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| Pin 105 | TDO β JTAG Test Data Out |
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| Pin 208 | VCC β Core supply (2.5 V nominal) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM7512BQC208-10 is suitable for 6 applications: Address Decoding and Bus Bridging, State Machine and Control Logic, Industrial Control and I/O Expansion, Legacy Peripheral Glue Logic, Telecommunications Backplane Bridging, Test and Measurement Equipment Front-End.
Address Decoding and Bus Bridging
The EPM7512BQC208-10 is widely used in microprocessor-based systems for address decoding, chip-select generation, and bus-bridging between asynchronous bus domains. The 10 ns pin-to-pin delay is well within the address-to-CS timing budget of most 33-50 MHz microcontrollers and embedded MPUs. With 176 user I/Os and 512 macrocells, a single EPM7512B can replace dozens of 74LS138/139/32 decoders and '245 transceivers, simplifying PCB layout and reducing BOM cost. The in-system programmability allows last-minute address map changes without board rework.
Recommended
State Machine and Control Logic
The 512 macrocells and 32 LABs of the EPM7512BQC208-10 provide ample capacity for implementing complex multi-state control machines, sequencers, and protocol controllers. Each macrocell contains a flip-flop and configurable AND/OR array, making it efficient for Moore and Mealy state machines with up to 50-60 states. The deterministic 10 ns timing makes timing closure predictable for safety-critical industrial control applications, and the EEPROM-based configuration retains state-machine definition across power cycles without boot time.
Recommended
Industrial Control and I/O Expansion
The commercial 0 to +70 C temperature grade and 176 user I/Os make the EPM7512BQC208-10 suitable for industrial controller backplanes, PLC I/O expansion cards, and motor-control interfaces. The 2.5 V internal core combined with 5 V-tolerant I/O cells allows direct interfacing to legacy 5 V logic and 3.3 V peripherals. JTAG boundary-scan support simplifies board-level test in production, and the PQFP-208 footprint is widely accepted by industrial assembly houses with established surface-mount lines.
Recommended
Legacy Peripheral Glue Logic
Many legacy embedded designs still require the EPM7512BQC208-10 to integrate asynchronous peripherals such as UARTs, parallel ports, SCSI controllers, and IDE interfaces. The fast 10 ns tpd and abundant I/O allow timing-critical handshake signal generation without resorting to discrete 74FCT or 74AVC logic. The in-system programming feature means firmware teams can iterate on glue-logic fixes without respinning the PCB - a major advantage over traditional TTL PAL/GAL designs.
Recommended
Telecommunications Backplane Bridging
In telecom backplanes, the EPM7512BQC208-10 serves as a low-latency protocol bridge between legacy TDM buses and modern packet interfaces. The deterministic 10 ns timing ensures that timing-critical TDM frame pulses and clock-domain crossings meet jitter requirements. With 176 user I/Os, a single part can interface to multiple line-card slots, eliminating a fanout tree of buffers. The 208-pin PQFP package is well-suited to through-hole backplane daughter-card assemblies.
Recommended
Test and Measurement Equipment Front-End
The EPM7512BQC208-10's deterministic timing and abundant I/O make it a useful front-end controller for legacy test and measurement equipment such as benchtop oscilloscopes, logic analyzers, and ATE fixtures. It can implement custom timing generators, scan-chain controllers, and front-panel I/O expanders while maintaining repeatable 10 ns timing margins. JTAG boundary scan allows production-board self-test, reducing fixture complexity in mixed-signal ATE systems.
Recommended
Recommended Products Summary
Engineering reference data for EPM7512BQC208-10 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM7512BQC208-7 | EPM7512BQC208-6 | EPM7512BQC208-5 | EPM7512BQC208-12 | EPM7512BQC208-15 |
|---|---|---|---|---|---|---|
| Package | PQFP-208 (28x28 mm) | PQFP-208 (same) | PQFP-208 (same) | PQFP-208 (same) | PQFP-208 (same) | PQFP-208 (same) |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Macrocells | 512 | 512 | 512 | 512 | 512 | 512 |
| User I/Os | 176 | 176 | 176 | 176 | 176 | 176 |
| Propagation Delay (tpd) | 10 ns | 7 ns | 6 ns | 5 ns | 12 ns | 15 ns |
| Internal Supply Voltage | 2.5 V (2.375-2.625 V) | 2.5 V (same) | 2.5 V (same) | 2.5 V (same) | 2.5 V (same) | 2.5 V (same) |
| Operating Temperature | 0 to +70 C (commercial) | 0 to +70 C (same) | 0 to +70 C (same) | 0 to +70 C (same) | 0 to +70 C (same) | 0 to +70 C (same) |
| Usable Gates | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- 10 ns speed grade offers best cost/timing balance for general-purpose glue logic (vs EPM7512BQC208-7)
- 208-pin PQFP footprint is the highest-pin-count package in the MAX 7000B family (vs EPM7512BFC256-7 (BGA-256))
- 512 macrocells in MAX 7000B series is the highest density (vs EPM7256SQC208-10 (256 macrocells))
Design Notes
The 208-pin PQFP package (0.5 mm pitch, 28x28 mm body) demands a 4-layer PCB minimum with continuous VCC and GND planes under the device to provide low-impedance power delivery to all 176 user I/Os. Route high-speed signals (e.g., clock, JTAG) on inner layers with reference to ground, and keep I/O traces short to minimize crosstalk. Estimated: with 4-layer stack-up and 1 oz copper, expect approximately 0.5-1.0 C/W thermal resistance improvement over a 2-layer board.
Although the EPM7512BQC208-10 has a 10 ns tpd, simultaneous-switching outputs (SSO) can cause ground bounce on heavily-loaded output banks. Distribute switching outputs across multiple I/O banks, and add 22-33 ohm series-termination resistors on outputs driving more than 2 inches of trace or more than 2-3 loads. JTAG signals (TCK, TMS, TDI, TDO) should be kept short and guarded to ground for reliable boundary-scan operation at 10-20 MHz TCK frequencies.
Critical: do not confuse the EPM7512BQC208-10 (MAX 7000B, 2.5 V core) with the older EPM7512AQC208-10 (MAX 7000A, 3.3 V core) - the VCCINT supply differs (2.5 V vs 3.3 V) and the parts are NOT drop-in compatible at the supply level. Also note that the part is NRND with the original Altera supply chain now served by Rochester Electronics; for new designs, consider the Intel MAX II (EPM240/EPM570/EPM1270) or MAX V (5M40ZE64/5M80ZE64) families. Verify the JTAG IDCODE in your programming chain to detect mis-programming attempts.
The PQFP-208 package has a junction-to-ambient thermal resistance (theta_JA) of approximately 30-35 C/W on a standard 4-layer JEDEC test board. The CMOS MAX 7000B core draws only a few hundred milliamps, so self-heating is modest (typically <0.5 W). Estimated: at 70 C ambient, junction temperature stays below 90 C under normal conditions, well within the commercial 0-70 C operating range. For enclosed industrial enclosures, verify airflow keeps ambient below 60 C.
Compliance Information
Compliance data not available from the verified sources. Original Altera datasheets from 1998-2002 typically predate RoHS mandate; parts produced after 2006 may have lead-free/RoHS variants. Check the specific shipment lot or request compliance documentation from Rochester Electronics for the franchised inventory.
