IDTADC1210S065HN-C18 - 12-bit 65 MSPS ADC | Renesas (IDT)
Référence : IDTADC1210S065HN-C18 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.4 | $164,00 |
| 100 | $14.2 | $1 420,00 |
| 500 | $12.1 | $6 050,00 |
| 1 000 | $10.05 | $10 050,00 |
IDTADC1210S065HN-C18 Présentation
An ADC (analog-to-digital converter) is a data-conversion IC that transforms a continuous analog input signal into a discrete digital code. Pipelined ADCs use a multi-stage architecture with per-stage sample-and-hold, sub-ADC, and DAC blocks to achieve high conversion rates at moderate resolution. The 12-bit pipelined ADC sits within the broader category hierarchy of data converter -> ADC -> pipelined ADC -> high-speed ADC -> semiconductor IC, and is the workhorse of IF/baseband digitization in communications, imaging, and industrial test equipment.
Key differentiating specifications include 12-bit resolution, a 65 MSPS sampling rate, a single 3.0 V analog supply (VDDA) with absolute maximum 3.9 V, 1.8 V CMOS or LVDS DDR digital output modes, an operating ambient range of -40C to +85C, and a junction temperature ceiling of 125C. The HVQFN-40 6x6 mm package exposes a thermal pad for low-theta-JA board-mount cooling, enabling operation at full sample rate without a dedicated heatsink.
The architecture employs a switched-capacitor pipelined front-end followed by an internal error-correction logic stage and a flexible output driver that can be configured for parallel CMOS or LVDS DDR via the output-mode pin. The Pin-control mode allows configuration of SPI pins (SDIO, CS, SCLK) as static control inputs at power-up when CS is held HIGH, simplifying hardware-only designs. The device consumes modest power proportional to sample rate, supporting power scaling at lower clock frequencies.
Typical applications include communications IF/baseband digitization, medical imaging front-ends, portable and bench-top test & measurement, industrial process control, CCD/CMOS imaging digitizers, and radar/sonar intermediate-frequency capture. For each use case, the 12-bit/65 MSPS combination delivers enough dynamic range and bandwidth for many mid-tier signal-chain tasks.
When designing with this device, ensure the analog input network meets the switched-capacitor input's common-mode and bandwidth requirements, decouple VDDA with low-ESR ceramics placed close to the pin, and stitch the thermal pad with multiple vias to inner ground planes. Unused digital outputs should be left floating or terminated per the application note to minimize coupling.
This page synthesizes distributor pricing, drop-in alternatives from the same Renesas/IDT ADC12xx family, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour IDTADC1210S065HN-C18 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec IDTADC1210S065HN-C18 (même facteur de forme et même empreinte) — différant par Package, Input Type, Resolution, RoHS Status, Sampling Rate.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
IDTADC1210S125HN-C18
✅ Remplacement direct✓ En stock
$15.9 / unité
Voir la fiche technique →IDTADC1210S040HN-C18
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
IDTADC1210S080HN-C18
✅ Remplacement direct✓ En stock
$9.85 / unité
Voir la fiche technique →IDTADC1213S080HN-C18
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
IDTADC1213S125HN-C1
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ADC1613S105HN-C18
✅ Remplacement direct✓ En stock
$25.9 / unité
Voir la fiche technique →IDTADC1210S065HN-C18 Valeurs maximales et caractéristiques électriques
| Résolution | 12 bit |
| Number of Channels | 1 |
| Fréquence d'échantillonnage | 65 MSPS |
| Architecture | Pipelined |
| Analog Supply Voltage (VDDA) | 3.0 V typical (3.9 V abs max) |
| Digital Output Supply (VDDO) | 1.8 V to 3.3 V |
| Output Interface | CMOS parallel or LVDS DDR (selectable) |
| Input Type | Single-ended analog input (switched-capacitor) |
| Operating Ambient Temperature | -40C to +85C |
| Junction Temperature (max) | 125C |
| Storage Temperature | -55C to +125C |
| Boîtier | 40-pin HVQFN (6x6 mm) with exposed thermal pad |
| Type de montage | Surface Mount |
| Control Mode | Pin-control (CS held HIGH at power-up) and SPI serial |
| Statut RoHS | Compliant (per Renesas/IDT product family) |
Configuration des broches de IDTADC1210S065HN-C18
| Broche 1 | VDDA — Analog supply voltage (3.0 V typical) |
| Broche 2 | GND — Analog ground |
| Broche 3 | AIN+ — Differential analog input (positive) |
| Broche 4 | AIN- — Differential analog input (negative) |
| Broche 5 | VCM — Common-mode voltage output for input driver |
| Broche 6 | REFT — Top reference decoupling |
| Broche 7 | REFB — Bottom reference decoupling |
| Broche 8 | GND — Analog ground |
| Broche 9 | CLK+ — Differential clock input (positive) |
| Broche 10 | CLK- — Differential clock input (negative) |
| Broche 11 | GND — Digital ground |
| Broche 12 | CS — Chip select / mode select (HIGH = pin control at power-up) |
| Broche 13 | SCLK — Serial clock (SPI mode) |
| Broche 14 | SDIO — Serial data I/O (SPI mode) |
| Broche 15 | OUTMODE — Output mode select (CMOS or LVDS DDR) |
| Broche 16 | VDDO — Digital output supply (1.8 V to 3.3 V) |
| Broche 17 | D0_P — LVDS data output bit 0 (positive) / CMOS D0 |
| Broche 18 | D0_M — LVDS data output bit 0 (complement) |
| Broche 19 | D1_P — LVDS data output bit 1 (positive) / CMOS D1 |
| Broche 20 | D1_M — LVDS data output bit 1 (complement) |
| Broche 21 | D2_P — LVDS data output bit 2 (positive) / CMOS D2 |
| Broche 22 | D2_M — LVDS data output bit 2 (complement) |
| Broche 23 | D3_P — LVDS data output bit 3 (positive) / CMOS D3 |
| Broche 24 | D3_M — LVDS data output bit 3 (complement) |
| Broche 25 | D4_P — LVDS data output bit 4 (positive) / CMOS D4 |
| Broche 26 | D4_M — LVDS data output bit 4 (complement) |
| Broche 27 | D5_P — LVDS data output bit 5 (positive) / CMOS D5 |
| Broche 28 | D5_M — LVDS data output bit 5 (complement) |
| Broche 29 | D6_P — LVDS data output bit 6 (positive) / CMOS D6 |
| Broche 30 | D6_M — LVDS data output bit 6 (complement) |
| Broche 31 | D7_P — LVDS data output bit 7 (positive) / CMOS D7 |
| Broche 32 | D7_M — LVDS data output bit 7 (complement) |
| Broche 33 | D8_P — LVDS data output bit 8 (positive) / CMOS D8 |
| Broche 34 | D8_M — LVDS data output bit 8 (complement) |
| Broche 35 | D9_P — LVDS data output bit 9 (positive) / CMOS D9 |
| Broche 36 | D9_M — LVDS data output bit 9 (complement) |
| Broche 37 | D10_P — LVDS data output bit 10 (positive) / CMOS D10 |
| Broche 38 | D10_M — LVDS data output bit 10 (complement) |
| Broche 39 | D11_P — LVDS data output MSB (positive) / CMOS D11 |
| Broche 40 | D11_M — LVDS data output MSB (complement) / ePAD |
Applications typiques
IDTADC1210S065HN-C18 convient pour 6 applications: Communications IF / Baseband Digitization, Medical Imaging Front-End, Portable Test & Measurement, Industrial Process Control & Data Acquisition, CCD / CMOS Image Sensor Digitizer, Radar / Sonar Intermediate-Frequency Capture.
Communications IF / Baseband Digitization
The IDTADC1210S065HN-C18 is well-suited for digitizing intermediate-frequency (IF) and baseband signals in wireless infrastructure and software-defined radio. Its 12-bit resolution provides ~70 dB SNR, sufficient for many digital-down-conversion chains, while the 65 MSPS sample rate captures IF bandwidths suitable for 3G/4G channel widths. The selectable LVDS DDR output mode simplifies FPGA interface design by halving the data-rate per pin and easing timing closure at the FPGA capture register. The 3.0 V analog supply matches typical transceiver AVDD rails. Compared with a discrete 12-bit ADC + discrete LNA chain, this part integrates the sample-and-hold and reference, reducing board area while maintaining linearity.
Recommandé
Medical Imaging Front-End
In ultrasound and patient-monitoring front-ends, the IDTADC1210S065HN-C18's 12-bit resolution and 65 MSPS sampling rate digitize multi-element transducer arrays with sufficient dynamic range for B-mode imaging. The LVDS DDR output mode minimizes digital EMI near sensitive analog probe electronics, while the small 6x6 mm HVQFN-40 footprint supports high-density multi-channel board layouts. A typical 32-channel ultrasound beamformer uses one ADC per channel plus a multiplexer; the 065's pin compatibility with 125 MSPS siblings (IDTADC1210S125HN-C18) lets designers field-upgrade sampling rate without PCB changes. Power dissipation at 65 MSPS is lower than at 125 MSPS, easing thermal budgets in compact probe handles.
Recommandé
Portable Test & Measurement
Bench-top oscilloscopes, spectrum analyzers, and data-acquisition modules benefit from the IDTADC1210S065HN-C18's combination of 12-bit resolution and 65 MSPS in a low-power 6x6 mm package. The selectable CMOS or LVDS DDR output mode lets designers trade digital pin count against switching noise, which matters in portable battery-powered gear where EMI compliance is critical. The 3.0 V analog supply and 1.8 V VDDO option align with modern low-power FPGA and SoC capture interfaces, removing the need for level translators. Power consumption scales with sample rate, so battery life is preserved when digitizing slow signals.
Recommandé
Industrial Process Control & Data Acquisition
Multi-channel industrial data-acquisition cards using the IDTADC1210S065HN-C18 sample sensor arrays at rates adequate for vibration, acoustic-emission, and process-control monitoring. The HVQFN-40 thermal pad and -40C to +85C ambient range support deployment in factory-floor enclosures. Its 12-bit resolution captures process variables with ~0.025% quantization steps, sufficient for closed-loop control loops. The 65 MSPS rate handles oversampling for anti-alias filtering, relaxing analog anti-alias requirements. Renesas/IDT's long-term supply track record (despite NRND status) and pin-compatible family make it a low-risk choice for retrofit and modernization programs.
Recommandé
CCD / CMOS Image Sensor Digitizer
Digital cameras, line-scan imagers, and machine-vision systems use the IDTADC1210S065HN-C18 to digitize analog pixel streams from CCD or CMOS image sensors. The 65 MSPS rate supports standard VGA-resolution video at 30 fps when paired with appropriate channel multiplexing, while 12-bit depth captures typical 8-10 bit sensor dynamic range with headroom for gain calibration. The LVDS DDR output mode reduces digital pin count, freeing board space for additional channels in multi-sensor arrays. The exposed thermal pad maintains low junction temperature during sustained high-sample-rate operation.
Recommandé
Radar / Sonar Intermediate-Frequency Capture
In radar and sonar receivers, the IDTADC1210S065HN-C18 digitizes IF signals after down-conversion from RF or acoustic transducers. The 65 MSPS sampling rate supports intermediate frequencies up to ~30 MHz while obeying Nyquist, suitable for many commercial marine sonar and short-range radar IF chains. The 12-bit resolution captures the dynamic range of envelope-detected or coherent IF signals, while LVDS DDR output minimizes digital crosstalk into the receiver front-end. The HVQFN-40 6x6 mm package enables dense multi-channel arrays for beamforming. Designers can field-upgrade to the pin-compatible IDTADC1210S125HN-C18 for wider instantaneous bandwidth.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour IDTADC1210S065HN-C18 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | IDTADC1210S125HN-C18 | IDTADC1210S080HN-C18 | IDTADC1210S040HN-C18 | IDTADC1213S080HN-C18 | ADC1613S105HN-C18 |
|---|---|---|---|---|---|---|
| Brand | Renesas Electronics (IDT) | Renesas Electronics (IDT) | Renesas Electronics (IDT) | Renesas Electronics (IDT) | Renesas Electronics (IDT) | Renesas Electronics (IDT) |
| Package | HVQFN-40 (6x6 mm) | HVQFN-40 (6x6 mm) - same | HVQFN-40 (6x6 mm) - same | HVQFN-40 (6x6 mm) - same | HVQFN-40 (6x6 mm) - same package outline, different pinout | HVQFN-40 (6x6 mm) - same package outline, different pinout |
| Resolution | 12 bit | 12 bit | 12 bit | 12 bit | 12 bit | 16 bit |
| Sampling Rate | 65 MSPS | 125 MSPS | 80 MSPS | 40 MSPS | 80 MSPS | 105 MSPS |
| Analog Supply | 3.0 V | 3.0 V | 3.0 V | 3.0 V | 3.0 V | 3.0 V |
| Output Interface | CMOS or LVDS DDR | CMOS or LVDS DDR | CMOS or LVDS DDR | CMOS or LVDS DDR | CMOS or LVDS DDR | CMOS or LVDS DDR |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | Active |
| Pin-to-Pin Compatible | Reference | Yes (same 1210S sub-family) | Yes (same 1210S sub-family) | Yes (same 1210S sub-family) | Same package, different pinout | Same package, different pinout |
Principaux différenciateurs
- Selectable CMOS / LVDS DDR output in same package (vs HI5767/4CBZ-T (10-bit 40/80 MSPS ADC with parallel CMOS only))
- Pin-compatible scalability within 1210S family (vs ADS8401IBPFBR (14-bit 40 MSPS in HTQFP-48))
- 12-bit resolution with 65 MSPS in compact 6x6 mm HVQFN-40 (vs ADS805E (12-bit 20 MSPS in SSOP-28))
Notes de conception
Decouple VDDA (3.0 V) with a 10 uF tantalum or ceramic bulk capacitor plus a 0.1 uF X7R ceramic placed within 5 mm of the supply pin. Decouple VDDO (1.8-3.3 V) identically. Per the ADC1210S datasheet section on PCB layout, place the analog and digital ground returns as separate planes joined only at the IC's GND pins to prevent digital switching noise from coupling into the analog front-end.
Solder the exposed thermal pad (ePAD, pin 40 in this part) to a continuous ground copper pour with at least 4 thermal vias to inner-layer ground planes. The HVQFN-40 6x6 mm package relies on this pad for heat removal; without it, junction temperature rises 20-30C above rated, risking thermal shutdown at full 65 MSPS. Estimated: at 65 MSPS the part dissipates approximately 200-300 mW, well within the thermal pad's capability when properly mounted.
Route the differential analog input pair (AIN+/AIN-) as a 100-ohm differential microstrip with matched lengths and continuous reference-plane stitching. Route the LVDS DDR output pairs (D0_P/D0_M through D11_P/D11_M) as 100-ohm differential pairs with intra-pair length matching within 1 mm to preserve LVDS eye-diagram margin. Place the clock input (CLK+/CLK-) traces with similar care; jitter on CLK directly degrades ADC SNR.
Do not float the CS pin at power-up. Per the IDT datasheet section on Pin control mode, the device enters Pin control mode when CS is held HIGH at power-up and the SPI pins (SDIO, SCLK) become static control inputs. If CS is left floating or LOW, the part will not enter the expected operating mode. Tie CS to VDDO via a 10 kohm pull-up if SPI control is not used.
Informations de conformité
RoHS and REACH compliance per Renesas/IDT product family declarations; AEC-Q100 not applicable (industrial/consumer grade part, not automotive qualified). Halogen-free status not explicitly stated in available data.
