LPC4325JBD144E - Dual-Core Cortex-M4/M0 204MHz MCU | NXP
Référence : LPC4325JBD144E ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.36 | $18,36 |
| 10 | $17.45 | $174,50 |
| 100 | $16.55 | $1 655,00 |
| 500 | $15.75 | $7 875,00 |
| 1 000 | $14.98 | $14 980,00 |
LPC4325JBD144E Présentation
A dual-core microcontroller combines a high-performance application processor with a smaller co-processor on one die. In the LPC43xx family, the Cortex-M4 handles the main application workload while the Cortex-M0 offloads real-time tasks such as motor control, communication stack management, or peripheral servicing. This asymmetric multiprocessing architecture sits within the broader hierarchy of embedded processors: microcontroller unit (MCU) -> 32-bit MCU -> ARM Cortex-M based MCU -> asymmetric dual-core MCU.
Key differentiating features include two High-Speed USB 2.0 controllers (host/device/OTG), an LCD controller, an external memory controller (EMC) for SDRAM/SRAM/NOR flash, a Quad SPI Flash Interface (SPIFI), Ethernet MAC, a State Configurable Timer (SCT), and a Serial General Purpose I/O (SGPIO) interface. The 204 MHz M4 core with FPU delivers DSP-grade throughput for compute-intensive embedded applications.
Technically, the LPC4325 integrates a multi-layer AHB matrix that lets the M4, M0, and DMA masters access flash, SRAM, and peripherals concurrently, minimizing bus contention. The 16 kB true EEPROM supports byte-level erase/write, unlike flash-emulated EEPROM used by many competitors. Boot options include SPIFI, USB, and UART, easing field programming.
Typical applications include industrial HMI panels (leveraging the LCD controller), gateway and bridge nodes (dual HS USB plus Ethernet), and motor-drive or test-equipment control boards needing real-time co-processing on the Cortex-M0.
Design consideration: at 204 MHz, the EMC-driven SDRAM interface requires careful trace length matching and termination per the NXP hardware design guidelines.
This page synthesizes distributor pricing, drop-in family alternatives, application guidance, and lifecycle data not consolidated in the manufacturer datasheet.
Alternatives de remplacement direct pour LPC4325JBD144E — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec LPC4325JBD144E (même facteur de forme et même empreinte) — différant par Flash Memory, Package.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
LPC4322JBD144E
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LPC4337JBD144E
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
LPC4332JBD144E
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
LPC4317JBD144E
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
LPC1837JBD144E
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$8.47 / unité
Voir la fiche technique →LPC4312JBD144E
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
LPC4325JBD144E Valeurs maximales et caractéristiques électriques
| Core | ARM Cortex-M4 + ARM Cortex-M0 dual-core |
| Max CPU Frequency | 204 MHz |
| Flash Memory | 768 kB |
| SRAM | 136 kB |
| EEPROM | 16 kB |
| Largeur du bus de données | 32 bit |
| USB Controllers | 2 x High-Speed USB 2.0 (host/device/OTG) |
| LCD Controller | Yes |
| External Memory Controller | EMC (SDRAM/SRAM/NOR flash) |
| Quad SPI Interface | SPIFI |
| Ethernet | 10/100 Mbps MAC |
| Boîtier | 144-LQFP (20x20 mm) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Peripherals | SCT, SGPIO, DMA, RTC, QEI |
Guide de configuration des broches du LPC4325JBD144E 144-lqfp (20x20 mm)
Configuration des broches du LPC4325JBD144E (boîtier 144-lqfp (20x20 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour LPC4325JBD144E.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
LPC4325JBD144E convient pour 6 applications: Industrial HMI and Touch Panels, USB Gateway and Protocol Bridge, Motor and Motion Control, Test and Measurement Instrumentation, Embedded Networking and IoT Gateways, Point-of-Sale and Payment Terminals.
Industrial HMI and Touch Panels
The LPC4325JBD144E fits industrial HMI designs because its integrated LCD controller drives TFT panels directly, and the 768 kB flash plus 136 kB SRAM (expandable via the EMC to external SDRAM for frame buffers) supports graphics libraries such as emWin. The 204 MHz Cortex-M4 with FPU renders UI elements while the Cortex-M0 services touch controller interrupts for consistent touch latency. Placed as the main controller with the SDRAM on the EMC bus and the touch IC on I2C, it eliminates a separate display-driver MCU. The dual High-Speed USB enables field firmware update and data logging. The trade-off versus dedicated graphics SoCs is lower raw rendering throughput, offset by single-chip integration and lower BOM count.
Recommandé
USB Gateway and Protocol Bridge
With two independent High-Speed USB 2.0 controllers (480 Mbps, host/device/OTG), the LPC4325JBD144E is purpose-built for USB-to-USB or USB-to-Ethernet bridge products such as programming fixtures, data loggers, and industrial gateways. One USB port can host a mass-storage or printer device while the second presents the bridge to a PC. The Cortex-M0 offloads USB stack servicing so the 204 MHz Cortex-M4 handles packet transformation without latency spikes. The SGPIO interface can emulate additional parallel protocols. Compared with single-USB MCUs, the LPC4325 removes an external bridge chip, cutting BOM cost; the design consideration is PHY external ULPI requirements for HS operation per the NXP reference designs.
Recommandé
Motor and Motion Control
The LPC4325JBD144E suits multi-axis motor control: the Cortex-M0 core deterministically executes PWM updates and quadrature encoder (QEI) sampling while the 204 MHz Cortex-M4 runs field-oriented control math with its hardware FPU. The State Configurable Timer (SCT) generates complementary PWM with dead-band insertion without CPU intervention. Host connectivity comes from CAN, Ethernet, or USB, letting a single chip serve as both drive controller and fieldbus node. EMC-attached SRAM holds control loop state variables with deterministic access. Partitioning real-time on the M0 yields consistent current-loop timing that a single-core solution struggles to guarantee under communication load, which is the key engineering benefit in servo and robotics drives.
Recommandé
Test and Measurement Instrumentation
In bench instruments and data acquisition systems, the LPC4325JBD144E provides the control processor: 204 MHz dual-core execution drives front-panel UI over the LCD controller, ACQUIRES data through high-speed GPIO/SGPIO, and streams results over USB 2.0 HS or Ethernet. The 16 kB true EEPROM stores calibration constants with byte-level wear tolerance, an advantage over flash-emulated EEPROM in competitors that require page erase cycles. SPIFI-attached serial NOR flash can hold waveform assets or boot images at up to quad-SPI rates. Using the Cortex-M0 for trigger timing ensures deterministic sample sequencing independent of UI processing on the M4, improving measurement repeatability relative to single-core architectures at the same clock rate.
Recommandé
Embedded Networking and IoT Gateways
The LPC4325JBD144E supports industrial IoT gateway designs combining its 10/100 Ethernet MAC (with external PHY such as the DP83848), dual High-Speed USB, and multiple UART/SPI/I2C buses for sensor aggregation. The 768 kB flash accommodates TCP/IP stacks, TLS libraries, and OTA update images; 136 kB SRAM supports buffering for protocol conversion. The Cortex-M0 handles link-layer interrupts while the Cortex-M4 runs the application stack, keeping network jitter low. An SPIFI-attached flash can hold a secondary recovery image for fail-safe updates. Compared with running a full Linux SoC, this MCU approach offers deterministic boot under 100 ms and much lower standby power, at the cost of a smaller software ecosystem.
Recommandé
Point-of-Sale and Payment Terminals
Payment and POS terminals leverage the LPC4325JBD144E LCD controller for customer displays, dual High-Speed USB for card reader and printer peripherals, and 16 kB EEPROM for secure configuration storage. The 204 MHz Cortex-M4 with FPU accelerates cryptographic operations in software stacks, while the Cortex-M0 manages keypad scanning with low latency. 768 kB flash leaves ample margin for EMV kernel code and localized language packs. USB device support enables PC-linked countertop configurations, while the Ethernet MAC (via PHY) supports networked terminals. The main design consideration is adding an external secure element for key storage, as the LPC4325 provides no dedicated cryptographic hardware security module.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour LPC4325JBD144E — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | LPC4322JBD144E | LPC4337JBD144E | LPC4332JBD144E | LPC4317JBD144E |
|---|---|---|---|---|---|
| Package | 144-LQFP (20x20 mm) | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| CPU Cores | Cortex-M4 + Cortex-M0 | Cortex-M4 + Cortex-M0 | Cortex-M4 + Cortex-M0 | Cortex-M4 + Cortex-M0 | Cortex-M4 + Cortex-M0 |
| Max Frequency | 204 MHz | 204 MHz | 204 MHz | 204 MHz | 204 MHz |
| Flash Memory | 768 kB | 768 kB | 1 MB | 1 MB | 256 kB |
| SRAM | 136 kB | 136 kB | 204 kB | 204 kB | 104 kB |
| Ethernet MAC | Yes | No | Yes | No | No |
| High-Speed USB Ports | 2 | 2 | 2 | 2 | 2 |
| LCD Controller | Yes | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- Ethernet MAC on board (vs LPC4322JBD144E)
- Dual High-Speed USB controllers (vs LPC1837JBD144E)
- True EEPROM for calibration data (vs STM32F407 (cross-brand))
Notes de conception
The EMC SDRAM interface on the LPC4325JBD144E is the most layout-sensitive block. Follow the NXP LPC43xx hardware design guidelines: keep data/address bus trace length skew within the guideline limit for the SDRAM clock, route clock as a controlled-impedance line with a series termination resistor (typically 22-33 ohm), and place the SDRAM within short distance of the MCU. A solid ground plane under the bus is mandatory for signal integrity at the EMC clock rate.
Estimated: the LQFP144 package thermal resistance is on the order of 50-60 C/W theta_JA (verify exact value in the NXP datasheet). With typical 204 MHz core current plus HS USB peripheral loading in the hundreds of milliwatts, junction temperature rise is modest and no heatsink is needed. Provide one 100 nF decoupling capacitor per VDD/VSS pair placed within 2 mm of the pins, plus 4.7-10 uF bulk capacitance per supply domain; the 1.8V/3.3V core rails and USB 3.3V PHY supply should be isolated with ferrite beads per the NXP reference design OM13036.
High-Speed USB operation requires an external ULPI PHY (e.g., USB3320) - the LPC4325 does not integrate the HS analog PHY, a common design oversight. Also verify boot pin strapping: the boot ROM samples boot pins at reset, and incorrect levels on the boot-select pins cause the device to fall into USART/USB boot mode instead of internal flash boot. Finally, check the NXP errata sheet for the LPC435x/3x/2x/1x family before finalizing the design; several early-silicon issues affect specific peripherals.
Informations de conformité
RoHS compliant per DigiKey listing for LPC4325JBD144E. REACH, halogen-free, and conflict minerals status not stated in provided data - obtain declarations from NXP compliance portal.
