M471A2G43AB2-CWE - 16GB DDR4-3200 SO-DIMM | Samsung
Référence : M471A2G43AB2-CWE ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $156 | $156,00 |
| 10 | $148.5 | $1 485,00 |
| 100 | $138 | $13 800,00 |
| 500 | $129 | $64 500,00 |
| 1 000 | $120.74 | $120 740,00 |
M471A2G43AB2-CWE Présentation
A SO-DIMM (Small Outline Dual In-Memory Module) is a compact JEDEC-standard memory module derived from the full-size DIMM but roughly half the height. DDR4 SDRAM is the fourth generation of double data rate synchronous DRAM; it operates at lower voltage (1.2 V) than DDR3 (1.5 V), reaches higher per-pin data rates up to 3200 MT/s at launch, and uses a 288/260-pin edge connector with point-to-point topology. The SO-DIMM variant mounts vertically in laptop sockets and supports up to 2 ranks per module (2DPC in some platforms).
Key features include 16 GB density in a 1Rx8 organisation (built from sixteen 1 Gx8 FBGA-78 die), 3200 MT/s transfer rate (PC4-25600), CAS Latency 22 (CL22), 1.2 V typical operating voltage (1.14-1.26 V per JEDEC DDR4 spec), and JEDEC-compliant 260-pin SO-DIMM edge finger geometry. The module is unbuffered, non-ECC, and supports standard SPD timings for plug-and-play compatibility with Intel and AMD mobile platforms.
Technically, the module follows the JEDEC DDR4 standard JESD79-4, supporting on-die termination (ODT), command/address parity on qualified platforms, and write CRC for signal-integrity robustness. The 1Rx8 organisation routes a single 64-bit data word through eight x8 DRAM devices per rank, balancing density and signal loading for mobile workloads.
Typical applications include laptop memory upgrades, ultrabook and thin-client RAM expansion, mini-PC and small-form-factor workstations, and embedded industrial PCs that require JEDEC-standard SO-DIMM compatibility. The 3200 MT/s rating aligns with mainstream 11th/12th-generation Intel Core and AMD Ryzen mobile platforms.
Design consideration: when populating two SO-DIMM sockets, mixing 1Rx8 and 2Rx8 modules downgrades the channel to the slower rank's timings on some chipsets - use matched modules for dual-channel performance.
This page synthesises distributor pricing, JEDEC-aligned specifications, drop-in alternatives, and practical upgrade notes not always shown on a single distributor listing.
Alternatives de remplacement direct pour M471A2G43AB2-CWE — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
M471A2G43AB2-CWE-Q
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
M471A2G43AB2-CTD
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
M471A2K43BB1-CWE
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
KVR32S22D8/16
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
CT16G4SFRA32A
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
AD4S320016G22-BGN
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
M471A2G43AB2-CWE Valeurs maximales et caractéristiques électriques
| Type de mémoire | DDR4 SDRAM SO-DIMM |
| Capacity | 16 GB |
| Module Configuration | 1 x 16 GB (1Rx8) |
| Débit de données | 3200 MT/s (PC4-25600) |
| Speed Grade | DDR4-3200AA |
| Latence CAS | CL22 |
| Operating Voltage | 1.2 V (typ, 1.14-1.26 V per JEDEC) |
| Form Factor | 260-pin SO-DIMM |
| Buffered / ECC | Unbuffered, Non-ECC |
| DRAM Organisation | 16 x 1 Gx8 FBGA-78 (2Gx64 total) |
| Rank Configuration | 1 Rank (1Rx8) |
| PCB Height | Standard SO-DIMM (approx. 30 mm) |
| Température de fonctionnement | 0C to +85C (commercial) |
| Compliance | JEDEC JESD79-4 (DDR4 SDRAM) |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
| Sans halogène | Yes |
| Compatibility | Dell, HP, Lenovo, ASUS and other laptop OEMs |
Guide de configuration des broches du M471A2G43AB2-CWE standard
Configuration des broches du M471A2G43AB2-CWE (boîtier standard). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour M471A2G43AB2-CWE.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
M471A2G43AB2-CWE convient pour 6 applications: Laptop Memory Upgrade, Ultrabook and Thin Client, Mini-PC and SFF Workstation, Industrial Embedded PC, Gaming Laptop Memory Expansion, Workstation Memory Upgrade.
Laptop Memory Upgrade
The M471A2G43AB2-CWE is purpose-built for laptop memory upgrades where the 260-pin SO-DIMM form factor is the only physical option. Its 16 GB density at 1Rx8 single-rank configuration maximises capacity per slot while keeping the channel loading light, which helps 11th/12th-gen Intel Core and AMD Ryzen 5000/6000 mobile controllers maintain their rated 3200 MT/s. Compared with dual-rank alternatives, this Samsung module draws slightly less power at idle and runs cooler, extending battery life by an estimated 5-8% during sustained workloads. Install one module per slot, or two for symmetric dual-channel with up to 51.2 GB/s aggregate bandwidth.
Recommandé
Ultrabook and Thin Client
Ultrabooks and thin-client systems frequently ship with soldered-down LPDDR4 but offer a single user-accessible SO-DIMM slot for expansion; the M471A2G43AB2-CWE fits this slot exactly. Its 1.2 V JEDEC DDR4-3200 operation matches the TDP envelope of these fanless or low-fan designs, while the 16 GB density doubles the typical 8 GB OEM configuration to enable heavier ChromeOS, VMware Horizon, or Citrix workloads. The 1Rx8 layout avoids the dual-rank signal-integrity penalties some chipsets apply to thin-client platforms, preserving full bandwidth at CL22.
Recommandé
Mini-PC and SFF Workstation
Mini-PCs such as Intel NUC, ASUS Mini PC, and Lenovo ThinkCentre Tiny typically expose two 260-pin SO-DIMM sockets and benefit from dual-channel memory configurations. Installing two M471A2G43AB2-CWE modules populates 32 GB symmetric across channels and reaches the full ~51.2 GB/s platform bandwidth, ideal for content creation, light video editing, and CAD workloads. The Samsung module's proven compatibility with the SO-DIMM sockets used in these chassis - validated by OEM listings - reduces the risk of POST failures that occasionally occur with off-brand modules.
Recommandé
Industrial Embedded PC
Industrial embedded PCs used in factory automation, kiosk displays, and digital signage often require reliable DDR4 SO-DIMM with documented longevity. The Samsung M471A2G43AB2-CWE draws on Samsung's tier-1 DRAM manufacturing and JEDEC JESD79-4 compliance to deliver predictable MTBF behaviour over multi-year deployments. With its 1Rx8 single-rank architecture and 1.2 V operating point, the module is well suited to passively-cooled or fan-cooled enclosures where thermal headroom is constrained, and the standard 260-pin footprint enables drop-in replacement over the system lifecycle.
Recommandé
Gaming Laptop Memory Expansion
Modern gaming laptops often ship with 8 GB or 16 GB of DDR4-3200, which becomes a bottleneck when pairing the discrete GPU with a high-refresh-rate QHD display. Upgrading to the M471A2G43AB2-CWE module - or a matched pair for dual-channel - lifts the frame buffer ceiling and improves 1% lows in CPU-bound titles by 8-15% according to user benchmarks. Samsung's reputation for low-defect DRAM helps reduce the small but real risk of XMP/EXPO training failures during POST, an issue occasionally reported with lesser-known brands on gaming motherboards.
Recommandé
Workstation Memory Upgrade
Mobile workstation laptops (Dell Precision, HP ZBook, Lenovo ThinkPad P-series) frequently accept 260-pin DDR4 SO-DIMMs and use ECC or non-ECC variants depending on the platform. The M471A2G43AB2-CWE - being non-ECC - fits the consumer-oriented mobile workstation tiers but should be verified against the specific platform's Qualified Vendor List (QVL). Upgrading from 8 GB to 16 GB or 32 GB (paired) significantly accelerates CAD assemblies, simulation pre-processing, and large spreadsheet recalculations where dataset size exceeds cache.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour M471A2G43AB2-CWE — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | M471A2G43AB2-CWE-Q | M471A2G43AB2-CTD | M471A2K43BB1-CWE | KVR32S22D8/16 | CT16G4SFRA32A | AD4S320016G22-BGN |
|---|---|---|---|---|---|---|---|
| Brand | Samsung | Samsung | Samsung | Samsung | Kingston | Crucial (Micron) | XPG |
| Package | 260-pin SO-DIMM | 260-pin SO-DIMM - same | 260-pin SO-DIMM - same | 260-pin SO-DIMM - same | 260-pin SO-DIMM - same | 260-pin SO-DIMM - same | 260-pin SO-DIMM - same |
| Capacity | 16 GB | 16 GB | 16 GB | 16 GB | 16 GB | 16 GB | 16 GB |
| Data Rate | 3200 MT/s | 3200 MT/s | 3200 MT/s | 3200 MT/s | 3200 MT/s | 3200 MT/s | 3200 MT/s |
| CAS Latency | CL22 | CL22 | CL22 | CL22 | CL22 | CL22 | CL22 |
| Operating Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Rank Configuration | 1Rx8 | 1Rx8 | 1Rx8 | 1Rx8 | 1Rx8 | 1Rx8 | 1Rx8 |
| ECC Support | Non-ECC | Non-ECC | Non-ECC | Non-ECC | Non-ECC | Non-ECC | Non-ECC |
| Approx. Price (1 pc) | USD 156.00 | USD 150-160 | USD 160-180 | USD 145-155 | USD 135-145 | USD 140-150 | USD 125-140 |
Principaux différenciateurs
- Samsung tier-1 OEM brand with broad OEM validation (vs KVR32S22D8/16)
- 1Rx8 single-rank layout for lower power and signal loading (vs NEMIX RAM 2Rx8 equivalent)
- Documented JEDEC JESD79-4 DDR4 compliance with standard SPD timings (vs AD4S320016G22-BGN (XPG gaming brand))
Notes de conception
Estimated: do NOT mix the M471A2G43AB2-CWE (1Rx8) with a 2Rx8 module of the same speed grade in dual-channel mode on older Intel 8th/9th-gen platforms - some chipsets will downclock to single-channel or reduce the bus speed by one bin. For modern 11th/12th-gen Intel and AMD Ryzen 5000/6000 platforms, mixed rank is more tolerant but still loses some symmetric dual-channel advantage. Match two identical M471A2G43AB2-CWE modules for guaranteed full 51.2 GB/s aggregate bandwidth.
DDR4 SO-DIMM modules such as the M471A2G43AB2-CWE generate 3-5 W of heat under sustained read/write workloads, and laptop SO-DIMM slots often have limited airflow due to the keyboard or bottom cover proximity. Estimated: in a passively cooled enclosure, prolonged thermal stress at 85C can accelerate DRAM refresh-rate degradation. If the laptop has bottom intake vents, avoid placing it on soft surfaces (bed, couch) during heavy workloads to maintain airflow across the SO-DIMM area.
When installing the M471A2G43AB2-CWE in a laptop, fully click both SO-DIMM socket latches to a vertical position before insertion, then press the module flat into the 260-pin edge finger connector at approximately a 25-30 degree angle before rotating it down until the latches lock. Forcing the module in upside-down (incorrect key notch orientation) can bend the gold fingers and damage the socket; always verify the notch offset matches the DDR4 keying (offset 5 from the centre of the pin 1 side).
Estimated: at 1.2 V, each 16 GB module draws approximately 1.5-2.5 W at idle and 4-5 W at full bandwidth. Two modules in dual-channel can add up to 10 W to system power consumption. This is within the DDR4 SO-DIMM JEDEC power envelope and is automatically managed by the memory controller's DLL power-down and CKE-based idle states. No additional power-rail design is required - the laptop's existing 1.2 V memory regulator (typically a buck converter with 3 A capability) is sufficient.
Informations de conformité
Compliant with JEDEC JESD79-4 DDR4 SDRAM specification. RoHS and REACH compliance per Samsung semiconductor product environmental documentation. AEC-Q100 not applicable - this is a commercial-grade memory module, not an automotive-grade component. Lead-free and halogen-free per Samsung M-Die product family disclosures.
