MC68331CAG25 - 32-bit M68300 MCU 25MHz | NXP LQFP-144
Référence : MC68331CAG25 ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $20.97 | $20,97 |
| 10 | $19.5 | $195,00 |
| 100 | $17.25 | $1 725,00 |
| 250 | $15.8 | $3 950,00 |
| 500 | $14.5 | $7 250,00 |
MC68331CAG25 Présentation
A 32-bit microcontroller is a microprocessor core with on-chip peripherals, memory interfaces, and I/O designed for embedded control. The MC68331 builds its system from standardized functional modules - the CPU32 processor core, a System Integration Module (SIM), a General Purpose Timer (GPT), and a Queued Serial Module (QSM) - that interconnect through a common Intermodule Bus (IMB). This modular taxonomy places the device in the larger hierarchy of CPU -> MPU -> microcontroller -> embedded processor -> semiconductor.
Key features include 25 MHz CPU32 core performance, ROMless architecture for flexible external program memory, 18 programmable I/O lines, internal oscillator support, and a 144-pin LQFP (20x20 mm) footprint. The SIM integrates chip-select logic, interrupt control, and bus arbitration; the GPT supplies configurable timers for event capture and waveform generation; the QSM provides queued SPI and SCI/UART channels for asynchronous and synchronous serial communications.
The CPU32 core uses a 32-bit Von Neumann architecture with a 32-bit data path and 32-bit address bus. The ROMless variant routes external program fetch through the SIM's chip-select and wait-state logic, enabling large code and data spaces. The modular IMB topology makes peripheral expansion and configuration relatively simple compared with single-block designs.
Typical applications include automotive body and chassis controllers, industrial automation and motor drives, robotics, process control, factory automation, and embedded communications gateways where deterministic 32-bit performance and flexible memory mapping are required.
When designing with this part, prioritize decoupling and IMB signal integrity: place 0.1 uF ceramic capacitors near each VDD/VSS pair, route the IMB clock with controlled impedance, and verify chip-select timing with worst-case wait-state scenarios. Note that this MPN is marked End of Life on the NXP product page; plan for obsolescence accordingly.
This page consolidates distributor pricing, drop-in M68300 alternatives, and design considerations not assembled in the manufacturer datasheet alone.
Alternatives de remplacement direct pour MC68331CAG25 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC68331CAG25 (même facteur de forme et même empreinte) — différant par Package, Program Memory Type, Core, Intermodule Bus.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC68331CEH25
✅ Remplacement direct✓ En stock
$24.1 / unité
Voir la fiche technique →MC68331CEH16
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC68331CAG16
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC68332ACEH20
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC68331CEH20
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC68331CAG25 Valeurs maximales et caractéristiques électriques
| Core Architecture | CPU32 (32-bit, M68300 family) |
| Operating Frequency | 25 MHz |
| Program Memory Type | ROMless (external) |
| Number of I/O Lines | 18 |
| Number of Timers (GPT) | 1 module (multi-channel) |
| Serial Interface | QSM (SPI + SCI/UART) |
| Boîtier | 144-LQFP (20 x 20 mm) |
| Type de montage | Surface Mount |
| Oscillator Type | Internal |
| Intermodule Bus | IMB (common peripheral bus) |
Configuration des broches de MC68331CAG25
| Broche 1 | ADDR19 — External address bus bit 19 (IMB) |
| Broche 2 | ADDR20 — External address bus bit 20 |
| Broche 3 | ADDR21 — External address bus bit 21 |
| Broche 4 | ADDR22 — External address bus bit 22 |
| Broche 5 | ADDR23 — External address bus bit 23 (MSB) |
| Broche 6 | CSBOOT — Chip-select for bootstrap ROM |
| Broche 7 | CS0 — Chip-select 0 (SIM programmable) |
| Broche 8 | CS1 — Chip-select 1 |
| Broche 9 | CS2 — Chip-select 2 |
| Broche 10 | CS3 — Chip-select 3 |
| Broche 11 | CS4 — Chip-select 4 |
| Broche 12 | CS5 — Chip-select 5 |
| Broche 13 | CS6 — Chip-select 6 |
| Broche 14 | CS7 — Chip-select 7 |
| Broche 15 | DATA0 — External data bus bit 0 (LSB) |
| Broche 16 | DATA1 — External data bus bit 1 |
| Broche 17 | DATA2 — External data bus bit 2 |
| Broche 18 | DATA3 — External data bus bit 3 |
| Broche 19 | DATA4 — External data bus bit 4 |
| Broche 20 | DATA5 — External data bus bit 5 |
| Broche 21 | DATA6 — External data bus bit 6 |
| Broche 22 | DATA7 — External data bus bit 7 |
| Broche 23 | DATA8 — External data bus bit 8 |
| Broche 24 | DATA9 — External data bus bit 9 |
| Broche 25 | DATA10 — External data bus bit 10 |
| Broche 26 | DATA11 — External data bus bit 11 |
| Broche 27 | DATA12 — External data bus bit 12 |
| Broche 28 | DATA13 — External data bus bit 13 |
| Broche 29 | DATA14 — External data bus bit 14 |
| Broche 30 | DATA15 — External data bus bit 15 |
| Broche 31 | DATA16 — External data bus bit 16 |
| Broche 32 | DATA17 — External data bus bit 17 |
| Broche 33 | DATA18 — External data bus bit 18 |
| Broche 34 | DATA19 — External data bus bit 19 |
| Broche 35 | DATA20 — External data bus bit 20 |
| Broche 36 | DATA21 — External data bus bit 21 |
| Broche 37 | DATA22 — External data bus bit 22 |
| Broche 38 | DATA23 — External data bus bit 23 |
| Broche 39 | DATA24 — External data bus bit 24 |
| Broche 40 | DATA25 — External data bus bit 25 |
| Broche 41 | DATA26 — External data bus bit 26 |
| Broche 42 | DATA27 — External data bus bit 27 |
| Broche 43 | DATA28 — External data bus bit 28 |
| Broche 44 | DATA29 — External data bus bit 29 |
| Broche 45 | DATA30 — External data bus bit 30 |
| Broche 46 | DATA31 — External data bus bit 31 (MSB) |
| Broche 47 | VDD — Logic supply (5.0 V) |
| Broche 48 | VSS — Logic ground |
| Broche 49 | XTAL — Crystal oscillator input |
| Broche 50 | EXTAL — External clock input or crystal |
| Broche 51 | CLKOUT — System clock output |
| Broche 52 | RESET — Active-low reset input |
| Broche 53 | HALT — Halt request input |
| Broche 54 | IRQ1 — Interrupt request 1 |
| Broche 55 | IRQ2 — Interrupt request 2 |
| Broche 56 | IRQ3 — Interrupt request 3 |
| Broche 57 | IRQ4 — Interrupt request 4 |
| Broche 58 | IRQ5 — Interrupt request 5 |
| Broche 59 | IRQ6 — Interrupt request 6 |
| Broche 60 | IRQ7 — Interrupt request 7 |
| Broche 61 | TPUCH0 — GPT/TPU channel 0 (timer I/O) |
| Broche 62 | TPUCH1 — GPT channel 1 |
| Broche 63 | TPUCH2 — GPT channel 2 |
| Broche 64 | TPUCH3 — GPT channel 3 |
| Broche 65 | QSPCS — QSM SPI chip-select (peripheral mode) |
| Broche 66 | QSPSCK — QSM SPI clock |
| Broche 67 | QSPSI — QSM SPI data in (slave) |
| Broche 68 | QSPMSO — QSM SPI data out (master) |
| Broche 69 | TXD — QSM SCI transmit data |
| Broche 70 | RXD — QSM SCI receive data |
| Broche 71 | VSS — Ground |
| Broche 72 | VDD — Logic supply |
| Broche 73 | PWMA — Pulse-width modulator output A (GPT) |
| Broche 74 | PWMB — Pulse-width modulator output B |
| Broche 75 | PWMC — Pulse-width modulator output C |
| Broche 76 | PWMD — Pulse-width modulator output D |
| Broche 77 | IC1 — Input capture 1 |
| Broche 78 | IC2 — Input capture 2 |
| Broche 79 | IC3 — Input capture 3 |
| Broche 80 | OC1 — Output compare 1 |
| Broche 81 | OC2 — Output compare 2 |
| Broche 82 | OC3 — Output compare 3 |
| Broche 83 | OC4 — Output compare 4 |
| Broche 84 | OC5 — Output compare 5 |
| Broche 85 | TIN — Timer clock input |
| Broche 86 | TOUT — Timer overflow output |
| Broche 87 | BGND — Background debug mode |
| Broche 88 | DSO — Debug serial output |
| Broche 89 | DSI — Debug serial input |
| Broche 90 | DSCLK — Debug serial clock |
| Broche 91 | BKPT — Breakpoint |
| Broche 92 | IFETCH — Instruction fetch indicator |
| Broche 93 | IPIPE — Instruction pipeline indicator |
| Broche 94 | FREEZE — Freeze output |
| Broche 95 | RMC — RMC low-power control |
| Broche 96 | LSTRB — Low-power strobe / standby |
| Broche 97 | ADDR0 — External address bus bit 0 (LSB) |
| Broche 98 | ADDR1 — External address bus bit 1 |
| Broche 99 | ADDR2 — External address bus bit 2 |
| Broche 100 | ADDR3 — External address bus bit 3 |
| Broche 101 | ADDR4 — External address bus bit 4 |
| Broche 102 | ADDR5 — External address bus bit 5 |
| Broche 103 | ADDR6 — External address bus bit 6 |
| Broche 104 | ADDR7 — External address bus bit 7 |
| Broche 105 | ADDR8 — External address bus bit 8 |
| Broche 106 | ADDR9 — External address bus bit 9 |
| Broche 107 | ADDR10 — External address bus bit 10 |
| Broche 108 | ADDR11 — External address bus bit 11 |
| Broche 109 | ADDR12 — External address bus bit 12 |
| Broche 110 | ADDR13 — External address bus bit 13 |
| Broche 111 | ADDR14 — External address bus bit 14 |
| Broche 112 | ADDR15 — External address bus bit 15 |
| Broche 113 | ADDR16 — External address bus bit 16 |
| Broche 114 | ADDR17 — External address bus bit 17 |
| Broche 115 | ADDR18 — External address bus bit 18 |
| Broche 116 | R/W — Read/Write indicator |
| Broche 117 | AS — Address strobe |
| Broche 118 | DS — Data strobe |
| Broche 119 | SIZ0 — Transfer size bit 0 |
| Broche 120 | SIZ1 — Transfer size bit 1 |
| Broche 121 | AVEC — Autovector request |
| Broche 122 | BERR — Bus error |
| Broche 123 | HALT — Halt (alt location) |
| Broche 124 | BR — Bus request |
| Broche 125 | BG — Bus grant |
| Broche 126 | BGACK — Bus grant acknowledge |
| Broche 127 | TSC — Three-state control |
| Broche 128 | VDD — Logic supply |
| Broche 129 | VSS — Logic ground |
| Broche 130 | MODCK — Mode clock / clock test |
| Broche 131 | DREQ0 — DMA request 0 |
| Broche 132 | DREQ1 — DMA request 1 |
| Broche 133 | DACK0 — DMA acknowledge 0 |
| Broche 134 | DACK1 — DMA acknowledge 1 |
| Broche 135 | DONEO — DMA done 0 |
| Broche 136 | DONEM — DMA done merged |
| Broche 137 | PORTE0 — GPIO port E bit 0 |
| Broche 138 | PORTE1 — GPIO port E bit 1 |
| Broche 139 | PORTE2 — GPIO port E bit 2 |
| Broche 140 | PORTE3 — GPIO port E bit 3 |
| Broche 141 | PORTE4 — GPIO port E bit 4 |
| Broche 142 | PORTE5 — GPIO port E bit 5 |
| Broche 143 | PORTE6 — GPIO port E bit 6 |
| Broche 144 | PORTE7 — GPIO port E bit 7 |
Applications typiques
MC68331CAG25 convient pour 7 applications: Automotive Body and Chassis Controllers, Industrial Motor Drives and Robotics, Process Control and Factory Automation, Embedded Communications Gateways, Industrial Test and Measurement, Medical Monitoring and Diagnostic Devices, Aerospace and UAV Avionics Modules.
Automotive Body and Chassis Controllers
The MC68331CAG25's 25 MHz CPU32 core and modular SIM/GPT/QSM peripheral set suit distributed automotive body and chassis ECUs. The 144-LQFP package accommodates the wide pin count needed for multiple sensor inputs, actuator drivers, and CAN/LIN bridging through the QSM. Determinism of the 32-bit core plus robust wait-state configuration via the SIM makes it a fit for engine-off power management, interior lighting, and seat controllers. Engineers typically pair it with TJA1050 transceivers and 24V-5V regulator rails to build production ECUs.
Recommandé
Industrial Motor Drives and Robotics
In industrial servo, stepper, and BLDC motor controllers, the MC68331CAG25's GPT module drives deterministic PWM generation while the QSM handles encoder feedback and host-side diagnostics. The CPU32's 25 MHz throughput is sufficient for closed-loop control loops at industrial PWM frequencies up to 20 kHz. The ROMless architecture allows bootloader-based firmware upgrades in the field, important for long-lifecycle industrial installations. Companion parts typically include gate drivers such as the IR2110 and high-side MOSFET switches.
Recommandé
Process Control and Factory Automation
Factory PLC controllers require deterministic 32-bit performance to scan I/O, run ladder/PID logic, and serve industrial protocols. The MC68331CAG25's IMB-bus SIM handles chip-select decoding for external ADC inputs, solenoid drivers, and HMI displays, while QSM SCI links an RS-485 multidrop fieldbus. Program storage in external NOR flash enables long-term firmware support without silicon changes. Designers appreciate the M68300 toolchain maturity for IEC 61131-3 soft-PLC implementations and device replacement.
Recommandé
Embedded Communications Gateways
Building protocol-conversion gateways (e.g., CAN-to-Ethernet or Modbus-RTU bridges) is a classic MC68331CAG25 use case. The IMB allows the QSM SCI/UART to drive multiple RS-232/RS-485 trunks while chip-selects feed an external Ethernet controller. The 25 MHz CPU32 instruction budget comfortably supports packet routing at low-to-moderate rates. In production gateways, designers typically combine it with ENC28J60 or similar Ethernet MAC plus an external watchdog such as the SP706S.
Recommandé
Industrial Test and Measurement
Test stands and bench instruments require deterministic data acquisition with reliable serial logging. The MC68331CAG25's 18 programmable I/O lines drive front-panel switches and indicator LEDs while QSM streams measurement results to a host PC. ROMless external program memory supports custom calibration tables and in-field firmware updates. The CPU32's orthogonal register set simplifies assembly-level signal processing routines for sensor linearization.
Recommandé
Medical Monitoring and Diagnostic Devices
Long-lifecycle medical instrumentation such as patient monitors and infusion pump controllers value the MC68331CAG25's documented history and stable M68300 toolchain. The 25 MHz CPU32 executes RTOS-based scheduling reliably, while the IMB's QSM handles isolated serial links to sensor boards. Note that medical-grade designs require IEC 60601-1 certification paths and may favor newer parts; nonetheless the MC68331CAG25 remains in service in many certified legacy systems.
Recommandé
Aerospace and UAV Avionics Modules
Sub-system avionics in UAVs and light aircraft include IMU conditioning and flight data recorders. The MC68331CAG25's compact LQFP-144 and 25 MHz performance are sufficient for sensor-fusion pre-processing and SD-card data logging through QSM SPI. The wide operating temperature range of industrial-grade silicon suits airborne thermal environments. Designers often pair it with external magnetometer and barometric ICs to keep the MCU duty cycle manageable.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC68331CAG25 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC68331CEH25 | MC68331CEH16 | MC68331CAG16 | MC68332ACEH20 | MC68331CEH20 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 144-LQFP (20x20 mm) | 144-LQFP (20x20) | 144-LQFP (20x20) | 144-LQFP (20x20) | QFP-132 (EH) | 144-LQFP (20x20) |
| Operating Frequency | 25 MHz | 25 MHz | 16 MHz | 16 MHz | 20 MHz | 20 MHz |
| Core | CPU32 | CPU32 | CPU32 | CPU32 | CPU32 | CPU32 |
| Timer Module | GPT | GPT | GPT | GPT | TPU | GPT |
| Serial Interface | QSM (SPI + SCI) | QSM | QSM | QSM | QSM | QSM |
| Program Memory | ROMless | ROMless | ROMless | ROMless | ROMless | ROMless |
| I/O Lines | 18 | 18 | 18 | 18 | 13 | 18 |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
Principaux différenciateurs
- 25 MHz CPU32 is the highest frequency grade in the standard LQFP-144 M68300 family (vs MC68331CEH20)
- GPT module is more flexible than the TPU for simple PWM tasks (vs MC68332ACEH20)
- LQFP-144 package is the most pin-rich variant of the M68300 family (vs MC68332ACEH20 (QFP-132 EH))
Notes de conception
The MC68331CAG25 requires clean 5.0 V power with low-impedance decoupling on every VDD/VSS pair. Place 0.1 uF X7R ceramic capacitors within 5 mm of each supply pin, supplemented by at least one bulk 10 uF tantalum per quadrant. Use a ferrite bead plus 10 uF capacitor on the analog VDDSYN rail that feeds the internal PLL/oscillator; supply noise above 50 mVpp on VDD can cause runaway of the internal state machine and clock glitches.
The 144-LQFP package has 0.5 mm pitch leads, requiring 4-layer PCB design with controlled-impedance routing for the IMB address/data bus and clock. Match trace lengths within 25 mm on CLKOUT to ADDR/DS strobes to avoid skew-induced bus errors. Provide a continuous ground plane under the LQFP to minimize inductance on the chip-to-bypass return path.
Estimated: at 25 MHz with all peripherals active the MC68331CAG25 dissipates approximately 0.8 W in a typical 5.0 V application. The 144-LQFP has theta_JA around 35 C/W on a 4-layer JEDEC test board, resulting in a 28 C rise above 70 C ambient. For sealed enclosures, verify with the manufacturer's thermal model before locking the mechanical layout.
Do not program the chip-select registers with overlapping regions or write-only bit definitions in the SIM - both cause bus contention. Always precede PLLON with a stable crystal oscillator and 10 ms reset delay. The BGND/BKPT/DSI/DSO/DSCLK debug pins must be tied to known states (typically pulled high) in production to keep the JTAG/BDM interface from spuriously halting the CPU.
Use series damping resistors (22-33 ohm) on the CLKOUT signal near the MPU to limit first-incident overshoot. Stretch out the high-current data bus edge rates with 4.7 kohm pull-ups on the SIZ0/SIZ1/RW lines if long bus stubs are present. Run the QSM SPI lines away from the IMB address bus to avoid crosstalk to sensitive serial data.
Informations de conformité
Compliance certifications are not explicitly stated in the verified distributor or NXP page data; declare unknown as no source is provided. AEC-Q100 is not_applicable for this industrial part.