MC68331CAG25 - 32-bit M68300 MCU 25MHz | NXP LQFP-144
Артикул: MC68331CAG25 ⚠ Последняя закупка| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $20.97 | $20,97 |
| 10 | $19.5 | $195,00 |
| 100 | $17.25 | $1.725,00 |
| 250 | $15.8 | $3.950,00 |
| 500 | $14.5 | $7.250,00 |
MC68331CAG25 Обзор
A 32-bit microcontroller is a microprocessor core with on-chip peripherals, memory interfaces, and I/O designed for embedded control. The MC68331 builds its system from standardized functional modules - the CPU32 processor core, a System Integration Module (SIM), a General Purpose Timer (GPT), and a Queued Serial Module (QSM) - that interconnect through a common Intermodule Bus (IMB). This modular taxonomy places the device in the larger hierarchy of CPU -> MPU -> microcontroller -> embedded processor -> semiconductor.
Key features include 25 MHz CPU32 core performance, ROMless architecture for flexible external program memory, 18 programmable I/O lines, internal oscillator support, and a 144-pin LQFP (20x20 mm) footprint. The SIM integrates chip-select logic, interrupt control, and bus arbitration; the GPT supplies configurable timers for event capture and waveform generation; the QSM provides queued SPI and SCI/UART channels for asynchronous and synchronous serial communications.
The CPU32 core uses a 32-bit Von Neumann architecture with a 32-bit data path and 32-bit address bus. The ROMless variant routes external program fetch through the SIM's chip-select and wait-state logic, enabling large code and data spaces. The modular IMB topology makes peripheral expansion and configuration relatively simple compared with single-block designs.
Typical applications include automotive body and chassis controllers, industrial automation and motor drives, robotics, process control, factory automation, and embedded communications gateways where deterministic 32-bit performance and flexible memory mapping are required.
When designing with this part, prioritize decoupling and IMB signal integrity: place 0.1 uF ceramic capacitors near each VDD/VSS pair, route the IMB clock with controlled impedance, and verify chip-select timing with worst-case wait-state scenarios. Note that this MPN is marked End of Life on the NXP product page; plan for obsolescence accordingly.
This page consolidates distributor pricing, drop-in M68300 alternatives, and design considerations not assembled in the manufacturer datasheet alone.
Аналоги без доработки для MC68331CAG25 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с MC68331CAG25 (тот же форм-фактор и посадочное место) — отличается по Package, Program Memory Type, Core.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
MC68331CEH25
✅ Прямая замена✓ В наличии
$24.1 / шт.
Открыть даташит →MC68331CEH16
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MC68331CAG16
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MC68332ACEH20
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MC68331CEH20
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MC68331CAG25 Максимальные параметры и электрические характеристики
| Core Architecture | CPU32 (32-bit, M68300 family) |
| Operating Frequency | 25 MHz |
| Program Memory Type | ROMless (external) |
| Number of I/O Lines | 18 |
| Number of Timers (GPT) | 1 module (multi-channel) |
| Serial Interface | QSM (SPI + SCI/UART) |
| Корпус | 144-LQFP (20 x 20 mm) |
| Тип монтажа | Surface Mount |
| Oscillator Type | Internal |
| Intermodule Bus | IMB (common peripheral bus) |
Конфигурация выводов MC68331CAG25
| Контакт 1 | ADDR19 — External address bus bit 19 (IMB) |
| Контакт 2 | ADDR20 — External address bus bit 20 |
| Контакт 3 | ADDR21 — External address bus bit 21 |
| Контакт 4 | ADDR22 — External address bus bit 22 |
| Контакт 5 | ADDR23 — External address bus bit 23 (MSB) |
| Контакт 6 | CSBOOT — Chip-select for bootstrap ROM |
| Контакт 7 | CS0 — Chip-select 0 (SIM programmable) |
| Контакт 8 | CS1 — Chip-select 1 |
| Контакт 9 | CS2 — Chip-select 2 |
| Контакт 10 | CS3 — Chip-select 3 |
| Контакт 11 | CS4 — Chip-select 4 |
| Контакт 12 | CS5 — Chip-select 5 |
| Контакт 13 | CS6 — Chip-select 6 |
| Контакт 14 | CS7 — Chip-select 7 |
| Контакт 15 | DATA0 — External data bus bit 0 (LSB) |
| Контакт 16 | DATA1 — External data bus bit 1 |
| Контакт 17 | DATA2 — External data bus bit 2 |
| Контакт 18 | DATA3 — External data bus bit 3 |
| Контакт 19 | DATA4 — External data bus bit 4 |
| Контакт 20 | DATA5 — External data bus bit 5 |
| Контакт 21 | DATA6 — External data bus bit 6 |
| Контакт 22 | DATA7 — External data bus bit 7 |
| Контакт 23 | DATA8 — External data bus bit 8 |
| Контакт 24 | DATA9 — External data bus bit 9 |
| Контакт 25 | DATA10 — External data bus bit 10 |
| Контакт 26 | DATA11 — External data bus bit 11 |
| Контакт 27 | DATA12 — External data bus bit 12 |
| Контакт 28 | DATA13 — External data bus bit 13 |
| Контакт 29 | DATA14 — External data bus bit 14 |
| Контакт 30 | DATA15 — External data bus bit 15 |
| Контакт 31 | DATA16 — External data bus bit 16 |
| Контакт 32 | DATA17 — External data bus bit 17 |
| Контакт 33 | DATA18 — External data bus bit 18 |
| Контакт 34 | DATA19 — External data bus bit 19 |
| Контакт 35 | DATA20 — External data bus bit 20 |
| Контакт 36 | DATA21 — External data bus bit 21 |
| Контакт 37 | DATA22 — External data bus bit 22 |
| Контакт 38 | DATA23 — External data bus bit 23 |
| Контакт 39 | DATA24 — External data bus bit 24 |
| Контакт 40 | DATA25 — External data bus bit 25 |
| Контакт 41 | DATA26 — External data bus bit 26 |
| Контакт 42 | DATA27 — External data bus bit 27 |
| Контакт 43 | DATA28 — External data bus bit 28 |
| Контакт 44 | DATA29 — External data bus bit 29 |
| Контакт 45 | DATA30 — External data bus bit 30 |
| Контакт 46 | DATA31 — External data bus bit 31 (MSB) |
| Контакт 47 | VDD — Logic supply (5.0 V) |
| Контакт 48 | VSS — Logic ground |
| Контакт 49 | XTAL — Crystal oscillator input |
| Контакт 50 | EXTAL — External clock input or crystal |
| Контакт 51 | CLKOUT — System clock output |
| Контакт 52 | RESET — Active-low reset input |
| Контакт 53 | HALT — Halt request input |
| Контакт 54 | IRQ1 — Interrupt request 1 |
| Контакт 55 | IRQ2 — Interrupt request 2 |
| Контакт 56 | IRQ3 — Interrupt request 3 |
| Контакт 57 | IRQ4 — Interrupt request 4 |
| Контакт 58 | IRQ5 — Interrupt request 5 |
| Контакт 59 | IRQ6 — Interrupt request 6 |
| Контакт 60 | IRQ7 — Interrupt request 7 |
| Контакт 61 | TPUCH0 — GPT/TPU channel 0 (timer I/O) |
| Контакт 62 | TPUCH1 — GPT channel 1 |
| Контакт 63 | TPUCH2 — GPT channel 2 |
| Контакт 64 | TPUCH3 — GPT channel 3 |
| Контакт 65 | QSPCS — QSM SPI chip-select (peripheral mode) |
| Контакт 66 | QSPSCK — QSM SPI clock |
| Контакт 67 | QSPSI — QSM SPI data in (slave) |
| Контакт 68 | QSPMSO — QSM SPI data out (master) |
| Контакт 69 | TXD — QSM SCI transmit data |
| Контакт 70 | RXD — QSM SCI receive data |
| Контакт 71 | VSS — Ground |
| Контакт 72 | VDD — Logic supply |
| Контакт 73 | PWMA — Pulse-width modulator output A (GPT) |
| Контакт 74 | PWMB — Pulse-width modulator output B |
| Контакт 75 | PWMC — Pulse-width modulator output C |
| Контакт 76 | PWMD — Pulse-width modulator output D |
| Контакт 77 | IC1 — Input capture 1 |
| Контакт 78 | IC2 — Input capture 2 |
| Контакт 79 | IC3 — Input capture 3 |
| Контакт 80 | OC1 — Output compare 1 |
| Контакт 81 | OC2 — Output compare 2 |
| Контакт 82 | OC3 — Output compare 3 |
| Контакт 83 | OC4 — Output compare 4 |
| Контакт 84 | OC5 — Output compare 5 |
| Контакт 85 | TIN — Timer clock input |
| Контакт 86 | TOUT — Timer overflow output |
| Контакт 87 | BGND — Background debug mode |
| Контакт 88 | DSO — Debug serial output |
| Контакт 89 | DSI — Debug serial input |
| Контакт 90 | DSCLK — Debug serial clock |
| Контакт 91 | BKPT — Breakpoint |
| Контакт 92 | IFETCH — Instruction fetch indicator |
| Контакт 93 | IPIPE — Instruction pipeline indicator |
| Контакт 94 | FREEZE — Freeze output |
| Контакт 95 | RMC — RMC low-power control |
| Контакт 96 | LSTRB — Low-power strobe / standby |
| Контакт 97 | ADDR0 — External address bus bit 0 (LSB) |
| Контакт 98 | ADDR1 — External address bus bit 1 |
| Контакт 99 | ADDR2 — External address bus bit 2 |
| Контакт 100 | ADDR3 — External address bus bit 3 |
| Контакт 101 | ADDR4 — External address bus bit 4 |
| Контакт 102 | ADDR5 — External address bus bit 5 |
| Контакт 103 | ADDR6 — External address bus bit 6 |
| Контакт 104 | ADDR7 — External address bus bit 7 |
| Контакт 105 | ADDR8 — External address bus bit 8 |
| Контакт 106 | ADDR9 — External address bus bit 9 |
| Контакт 107 | ADDR10 — External address bus bit 10 |
| Контакт 108 | ADDR11 — External address bus bit 11 |
| Контакт 109 | ADDR12 — External address bus bit 12 |
| Контакт 110 | ADDR13 — External address bus bit 13 |
| Контакт 111 | ADDR14 — External address bus bit 14 |
| Контакт 112 | ADDR15 — External address bus bit 15 |
| Контакт 113 | ADDR16 — External address bus bit 16 |
| Контакт 114 | ADDR17 — External address bus bit 17 |
| Контакт 115 | ADDR18 — External address bus bit 18 |
| Контакт 116 | R/W — Read/Write indicator |
| Контакт 117 | AS — Address strobe |
| Контакт 118 | DS — Data strobe |
| Контакт 119 | SIZ0 — Transfer size bit 0 |
| Контакт 120 | SIZ1 — Transfer size bit 1 |
| Контакт 121 | AVEC — Autovector request |
| Контакт 122 | BERR — Bus error |
| Контакт 123 | HALT — Halt (alt location) |
| Контакт 124 | BR — Bus request |
| Контакт 125 | BG — Bus grant |
| Контакт 126 | BGACK — Bus grant acknowledge |
| Контакт 127 | TSC — Three-state control |
| Контакт 128 | VDD — Logic supply |
| Контакт 129 | VSS — Logic ground |
| Контакт 130 | MODCK — Mode clock / clock test |
| Контакт 131 | DREQ0 — DMA request 0 |
| Контакт 132 | DREQ1 — DMA request 1 |
| Контакт 133 | DACK0 — DMA acknowledge 0 |
| Контакт 134 | DACK1 — DMA acknowledge 1 |
| Контакт 135 | DONEO — DMA done 0 |
| Контакт 136 | DONEM — DMA done merged |
| Контакт 137 | PORTE0 — GPIO port E bit 0 |
| Контакт 138 | PORTE1 — GPIO port E bit 1 |
| Контакт 139 | PORTE2 — GPIO port E bit 2 |
| Контакт 140 | PORTE3 — GPIO port E bit 3 |
| Контакт 141 | PORTE4 — GPIO port E bit 4 |
| Контакт 142 | PORTE5 — GPIO port E bit 5 |
| Контакт 143 | PORTE6 — GPIO port E bit 6 |
| Контакт 144 | PORTE7 — GPIO port E bit 7 |
Типичное применение
MC68331CAG25 подходит для 7 применениеs: Automotive Body and Chassis Controllers, Industrial Motor Drives and Robotics, Process Control and Factory Automation, Embedded Communications Gateways, Industrial Test and Measurement, Medical Monitoring and Diagnostic Devices, Aerospace and UAV Avionics Modules.
Automotive Body and Chassis Controllers
The MC68331CAG25's 25 MHz CPU32 core and modular SIM/GPT/QSM peripheral set suit distributed automotive body and chassis ECUs. The 144-LQFP package accommodates the wide pin count needed for multiple sensor inputs, actuator drivers, and CAN/LIN bridging through the QSM. Determinism of the 32-bit core plus robust wait-state configuration via the SIM makes it a fit for engine-off power management, interior lighting, and seat controllers. Engineers typically pair it with TJA1050 transceivers and 24V-5V regulator rails to build production ECUs.
Рекомендуется
Industrial Motor Drives and Robotics
In industrial servo, stepper, and BLDC motor controllers, the MC68331CAG25's GPT module drives deterministic PWM generation while the QSM handles encoder feedback and host-side diagnostics. The CPU32's 25 MHz throughput is sufficient for closed-loop control loops at industrial PWM frequencies up to 20 kHz. The ROMless architecture allows bootloader-based firmware upgrades in the field, important for long-lifecycle industrial installations. Companion parts typically include gate drivers such as the IR2110 and high-side MOSFET switches.
Рекомендуется
Process Control and Factory Automation
Factory PLC controllers require deterministic 32-bit performance to scan I/O, run ladder/PID logic, and serve industrial protocols. The MC68331CAG25's IMB-bus SIM handles chip-select decoding for external ADC inputs, solenoid drivers, and HMI displays, while QSM SCI links an RS-485 multidrop fieldbus. Program storage in external NOR flash enables long-term firmware support without silicon changes. Designers appreciate the M68300 toolchain maturity for IEC 61131-3 soft-PLC implementations and device replacement.
Рекомендуется
Embedded Communications Gateways
Building protocol-conversion gateways (e.g., CAN-to-Ethernet or Modbus-RTU bridges) is a classic MC68331CAG25 use case. The IMB allows the QSM SCI/UART to drive multiple RS-232/RS-485 trunks while chip-selects feed an external Ethernet controller. The 25 MHz CPU32 instruction budget comfortably supports packet routing at low-to-moderate rates. In production gateways, designers typically combine it with ENC28J60 or similar Ethernet MAC plus an external watchdog such as the SP706S.
Рекомендуется
Industrial Test and Measurement
Test stands and bench instruments require deterministic data acquisition with reliable serial logging. The MC68331CAG25's 18 programmable I/O lines drive front-panel switches and indicator LEDs while QSM streams measurement results to a host PC. ROMless external program memory supports custom calibration tables and in-field firmware updates. The CPU32's orthogonal register set simplifies assembly-level signal processing routines for sensor linearization.
Рекомендуется
Medical Monitoring and Diagnostic Devices
Long-lifecycle medical instrumentation such as patient monitors and infusion pump controllers value the MC68331CAG25's documented history and stable M68300 toolchain. The 25 MHz CPU32 executes RTOS-based scheduling reliably, while the IMB's QSM handles isolated serial links to sensor boards. Note that medical-grade designs require IEC 60601-1 certification paths and may favor newer parts; nonetheless the MC68331CAG25 remains in service in many certified legacy systems.
Рекомендуется
Aerospace and UAV Avionics Modules
Sub-system avionics in UAVs and light aircraft include IMU conditioning and flight data recorders. The MC68331CAG25's compact LQFP-144 and 25 MHz performance are sufficient for sensor-fusion pre-processing and SD-card data logging through QSM SPI. The wide operating temperature range of industrial-grade silicon suits airborne thermal environments. Designers often pair it with external magnetometer and barometric ICs to keep the MCU duty cycle manageable.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для MC68331CAG25 — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | MC68331CEH25 | MC68331CEH16 | MC68331CAG16 | MC68332ACEH20 | MC68331CEH20 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 144-LQFP (20x20 mm) | 144-LQFP (20x20) | 144-LQFP (20x20) | 144-LQFP (20x20) | QFP-132 (EH) | 144-LQFP (20x20) |
| Operating Frequency | 25 MHz | 25 MHz | 16 MHz | 16 MHz | 20 MHz | 20 MHz |
| Core | CPU32 | CPU32 | CPU32 | CPU32 | CPU32 | CPU32 |
| Timer Module | GPT | GPT | GPT | GPT | TPU | GPT |
| Serial Interface | QSM (SPI + SCI) | QSM | QSM | QSM | QSM | QSM |
| Program Memory | ROMless | ROMless | ROMless | ROMless | ROMless | ROMless |
| I/O Lines | 18 | 18 | 18 | 18 | 13 | 18 |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
Ключевые отличия
- 25 MHz CPU32 is the highest frequency grade in the standard LQFP-144 M68300 family (против MC68331CEH20)
- GPT module is more flexible than the TPU for simple PWM tasks (против MC68332ACEH20)
- LQFP-144 package is the most pin-rich variant of the M68300 family (против MC68332ACEH20 (QFP-132 EH))
Заметки по проектированию
The MC68331CAG25 requires clean 5.0 V power with low-impedance decoupling on every VDD/VSS pair. Place 0.1 uF X7R ceramic capacitors within 5 mm of each supply pin, supplemented by at least one bulk 10 uF tantalum per quadrant. Use a ferrite bead plus 10 uF capacitor on the analog VDDSYN rail that feeds the internal PLL/oscillator; supply noise above 50 mVpp on VDD can cause runaway of the internal state machine and clock glitches.
The 144-LQFP package has 0.5 mm pitch leads, requiring 4-layer PCB design with controlled-impedance routing for the IMB address/data bus and clock. Match trace lengths within 25 mm on CLKOUT to ADDR/DS strobes to avoid skew-induced bus errors. Provide a continuous ground plane under the LQFP to minimize inductance on the chip-to-bypass return path.
Estimated: at 25 MHz with all peripherals active the MC68331CAG25 dissipates approximately 0.8 W in a typical 5.0 V application. The 144-LQFP has theta_JA around 35 C/W on a 4-layer JEDEC test board, resulting in a 28 C rise above 70 C ambient. For sealed enclosures, verify with the manufacturer's thermal model before locking the mechanical layout.
Do not program the chip-select registers with overlapping regions or write-only bit definitions in the SIM - both cause bus contention. Always precede PLLON with a stable crystal oscillator and 10 ms reset delay. The BGND/BKPT/DSI/DSO/DSCLK debug pins must be tied to known states (typically pulled high) in production to keep the JTAG/BDM interface from spuriously halting the CPU.
Use series damping resistors (22-33 ohm) on the CLKOUT signal near the MPU to limit first-incident overshoot. Stretch out the high-current data bus edge rates with 4.7 kohm pull-ups on the SIZ0/SIZ1/RW lines if long bus stubs are present. Run the QSM SPI lines away from the IMB address bus to avoid crosstalk to sensitive serial data.
Информация о соответствии
Compliance certifications are not explicitly stated in the verified distributor or NXP page data; declare unknown as no source is provided. AEC-Q100 is not_applicable for this industrial part.