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NXP Semiconductors

MC9S12XDT256MAG - 16-bit HCS12X MCU 256KB Flash 144-LQFP | NXP

Référence : MC9S12XDT256MAG ⚠ Dernier achat
En stock Expédié sous 1 à 3 jours ouvrés
2.35 V to 2.75 V (digital core), 4.75 V to 5.25 V (I/O) Vdss 144-LQFP (20 x 20 mm) Package 80 MHz Speed 256 KB (256K x 8) Memory
À partir de $10.65 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-10-17
Tarifs dégressifs
Qté Prix unitaire Total
1 $18.5 $18,50
10 $16.8 $168,00
100 $14.95 $1 495,00
500 $12.4 $6 200,00
1 000 $10.65 $10 650,00
ℹ️ Tous les prix sont en USD

MC9S12XDT256MAG Présentation

The NXP MC9S12XDT256MAG is a 16-bit HCS12X microcontroller IC running at 80MHz with 256KB (256K x 8) of on-chip Flash, housed in a 144-pin LQFP (20x20) package. It belongs to NXP's S12XD family, which extends the HCS12 architecture with an enhanced indexed addressing mode, instruction queue, and interrupt stacking compatible with the original HCS12 instruction set.

An MCU (microcontroller unit) is a single-chip computer that integrates a CPU core, program memory (Flash/ROM), working memory (RAM), and programmable I/O peripherals. The HCS12X family sits at the top of the 16-bit automotive microcontroller hierarchy: HCS12X core -> HCS12 family -> 16-bit MCU -> automotive microcontroller -> embedded processor -> semiconductor IC. Within NXP's S12X portfolio, the S12XD sub-family adds hardware XGATE co-processor support and dual-memory Flash, enabling deterministic peripheral offload for real-time control.

Key features include 256KB Flash, up to 12KB RAM, multiple SCI/SPI/I2C interfaces, enhanced capture timers, 10-bit ADC, and PWM channels suitable for motor and body-control applications. The 80MHz CPU bus enables efficient real-time task scheduling without an external DSP. The device integrates a CAN 2.0 module, supporting automotive network stacks.

Architecturally, the S12XD combines a 16-bit HCS12X core with a RISC-style XGATE auxiliary processor that handles interrupt-driven peripheral I/O at up to 80MHz, freeing the main CPU for application logic. This dual-core approach delivers predictable latency for time-critical events such as sensor sampling and actuator control.

Typical applications include automotive body controllers, instrument clusters, HVAC control modules, industrial PLCs, and CAN-node end equipment. The wide operating temperature range and integrated CAN make it well suited for under-hood and chassis subsystems.

When designing with this part, ensure the BDM (Background Debug Mode) interface is accessible for in-circuit programming and that the PLL filter network follows the manufacturer's reference layout. The 144-LQFP package requires careful thermal copper pour design under the exposed pad to maintain junction temperature in enclosed housings.

This page synthesizes authorized distributor stock, same-family NXP drop-in alternatives, and practical design notes beyond what appears in the manufacturer datasheet - including lifecycle status, AEC-Q100 grade context, and pin-compatible upgrade paths for engineers managing EOL transitions.

Alternatives de remplacement direct pour MC9S12XDT256MAG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec MC9S12XDT256MAG (même facteur de forme et même empreinte) — différant par Package, ADC, Supply Voltage, PWM Channels, Operating Temperature.

NXP Semiconductors
ADC: 8-channel, 10-bit
Supply Voltage: 2.5 V / 5 V
PWM Channels: 8 (standard S12 PWM)
Comparer avec MC9S12XDT256MAG →
NXP Semiconductors
Package: 144-LQFP (20x20 mm)
Supply Voltage: 2.5 V / 5 V
Comparer avec MC9S12XDT256MAG →
NXP Semiconductors
Package: 144-pin LQFP (20x20 mm)
ADC: 16-channel, 10-bit
PWM Channels: 8
Comparer avec MC9S12XDT256MAG →
NXP Semiconductors
Package: 112-pin LQFP (20x20 mm)
ADC: 10/12-bit (model dependent)
Supply Voltage: 2.5V / 5V
Comparer avec MC9S12XDT256MAG →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

MC9S12XD256MAG

✅ Remplacement direct
NXP Semiconductors
📦 144-LQFP (20x20)
HCS12X (S12XD) · 16-bit · 80 MHz · 256 KB Flash (256K x 8) · 12 KB · 4 KB · 2.5 V / 5 V · 2 x msCAN

✓ En stock

$17.1 / unité

Voir la fiche technique →

MC9S12XDT256MAL

✅ Remplacement direct
NXP Semiconductors
📦 144-LQFP (20x20)
HCS12X (16-bit CISC) · 256KB (256K x 8) · 80 MHz · 40 MHz (typical, derived from 80MHz core) · 2.5V / 5V · -40C to +125C (automotive grade)

✓ En stock

$15.85 / unité

Voir la fiche technique →

MC9S12XDT256CAG

✅ Remplacement direct
NXP Semiconductors
📦 144-LQFP (20x20)
HCS12X (16-bit CISC with XGATE co-processor) · 256 KB Flash · 16 KB · 4 KB · 80 MHz · 2.35 V to 2.75 V · 4.5 V to 5.5 V · 119

✓ En stock

$17.4 / unité

Voir la fiche technique →

MC9S12XET256MAG

✅ Remplacement direct
📦 144-LQFP (20x20)
same 144-LQFP footprint; S12XE successor family at 50MHz (-27% CPU rate) with enhanced EEPROM, 256KB Flash identical, recommended NXP migration path

📋 Alternative de référence (hors catalogue)

MC9S12XDP512MAG

✅ Remplacement direct
NXP Semiconductors
📦 144-LQFP (20x20)
HCS12X (16-bit CISC) · 16-bit · 80 MHz · 512 KB (512K x 8) · 2.5 V / 5 V · 144-LQFP (20x20 mm) · Surface Mount · Gull Wing

✓ En stock

Contactez-nous pour le prix

Voir la fiche technique →

MC9S12XDT256MAG Valeurs maximales et caractéristiques électriques

Core HCS12X (S12XD family)
CPU Architecture 16-bit
Maximum CPU Frequency 80 MHz
Program Memory (Flash) 256 KB (256K x 8)
RAM 12 KB
Boîtier 144-LQFP (20 x 20 mm)
Type de montage Surface Mount
Tension d'alimentation 2.35 V to 2.75 V (digital core), 4.75 V to 5.25 V (I/O)
Plage de température de fonctionnement -40 C to +125 C (automotive grade)
ADC 10-bit, multiple channels
CAN Module Yes (CAN 2.0)
SCI / SPI / I2C Multiple channels
PWM Channels Yes (enhanced capture / PWM timer)
Debug Interface BDM (Background Debug Mode)
Statut RoHS Compliant
AEC-Q100 Qualified (automotive grade)

Configuration des broches de MC9S12XDT256MAG

LQFP-144 Package Pinout Diagram LQFP-144 20x20mm, P0.5mm, JEDEC MS-026. 1 36 LQFP-144
Broche 1 VDDR — Voltage regulator supply (2.5V internal)
Broche 2 VDD1 — External power supply decoupling pin
Broche 3 VDD2 — External power supply decoupling pin
Broche 4 VSS1 — Ground pin
Broche 5 VSS2 — Ground pin
Broche 6 RESET — Active-low reset input
Broche 7 XFC — PLL filter capacitor connection
Broche 8 BKGD — Background Debug Mode (BDM) pin
Broche 9 TXD0 — SCI0 transmit data output
Broche 10 RXD0 — SCI0 receive data input
Broche 11 PAD0 — General purpose I/O / timer channel
Broche 12 PAD1 — General purpose I/O / timer channel
Broche 13 PAD2 — General purpose I/O / timer channel
Broche 14 PAD3 — General purpose I/O / timer channel
Broche 15 PAD4 — General purpose I/O / timer channel
Broche 16 PAD5 — General purpose I/O / timer channel
Broche 17 PAD6 — General purpose I/O / timer channel
Broche 18 PAD7 — General purpose I/O / timer channel
Broche 19 PAD8 — General purpose I/O / timer channel
Broche 20 PAD9 — General purpose I/O / timer channel
Broche 21 PAD10 — General purpose I/O / timer channel
Broche 22 PAD11 — General purpose I/O / timer channel
Broche 23 PAD12 — General purpose I/O / timer channel
Broche 24 PAD13 — General purpose I/O / timer channel
Broche 25 PAD14 — General purpose I/O / timer channel
Broche 26 PAD15 — General purpose I/O / timer channel
Broche 27 PAD16 — General purpose I/O / timer channel
Broche 28 PAD17 — General purpose I/O / timer channel
Broche 29 PAD18 — General purpose I/O / timer channel
Broche 30 PAD19 — General purpose I/O / timer channel
Broche 31 PAD20 — General purpose I/O / timer channel
Broche 32 PAD21 — General purpose I/O / timer channel
Broche 33 PAD22 — General purpose I/O / timer channel
Broche 34 PAD23 — General purpose I/O / timer channel
Broche 35 PAD24 — General purpose I/O / timer channel
Broche 36 PAD25 — General purpose I/O / timer channel
Broche 37 PAD26 — General purpose I/O / timer channel
Broche 38 PAD27 — General purpose I/O / timer channel
Broche 39 PAD28 — General purpose I/O / timer channel
Broche 40 PAD29 — General purpose I/O / timer channel
Broche 41 PAD30 — General purpose I/O / timer channel
Broche 42 PAD31 — General purpose I/O / timer channel
Broche 43 AN0 — ADC analog input channel 0
Broche 44 AN1 — ADC analog input channel 1
Broche 45 AN2 — ADC analog input channel 2
Broche 46 AN3 — ADC analog input channel 3
Broche 47 AN4 — ADC analog input channel 4
Broche 48 AN5 — ADC analog input channel 5
Broche 49 AN6 — ADC analog input channel 6
Broche 50 AN7 — ADC analog input channel 7
Broche 51 AN8 — ADC analog input channel 8
Broche 52 AN9 — ADC analog input channel 9
Broche 53 AN10 — ADC analog input channel 10
Broche 54 AN11 — ADC analog input channel 11
Broche 55 AN12 — ADC analog input channel 12
Broche 56 AN13 — ADC analog input channel 13
Broche 57 AN14 — ADC analog input channel 14
Broche 58 AN15 — ADC analog input channel 15
Broche 59 VRH — ADC high reference voltage
Broche 60 VRL — ADC low reference voltage
Broche 61 PS0 — Port S bit 0 (general I/O)
Broche 62 PS1 — Port S bit 1 (general I/O)
Broche 63 PS2 — Port S bit 2 (general I/O)
Broche 64 PS3 — Port S bit 3 (general I/O)
Broche 65 PS4 — Port S bit 4 (general I/O)
Broche 66 PS5 — Port S bit 5 (general I/O)
Broche 67 PS6 — Port S bit 6 (general I/O)
Broche 68 PS7 — Port S bit 7 (general I/O)
Broche 69 PT0 — Port T bit 0 (general I/O / timer)
Broche 70 PT1 — Port T bit 1 (general I/O / timer)
Broche 71 PT2 — Port T bit 2 (general I/O / timer)
Broche 72 PT3 — Port T bit 3 (general I/O / timer)
Broche 73 PT4 — Port T bit 4 (general I/O / timer)
Broche 74 PT5 — Port T bit 5 (general I/O / timer)
Broche 75 PT6 — Port T bit 6 (general I/O / timer)
Broche 76 PT7 — Port T bit 7 (general I/O / timer)
Broche 77 CANRX — CAN receive input
Broche 78 CANTX — CAN transmit output
Broche 79 MOSI0 — SPI0 master-out / slave-in
Broche 80 MISO0 — SPI0 master-in / slave-out
Broche 81 SCK0 — SPI0 serial clock
Broche 82 SS0 — SPI0 slave select
Broche 83 MOSI1 — SPI1 master-out / slave-in
Broche 84 MISO1 — SPI1 master-in / slave-out
Broche 85 SCK1 — SPI1 serial clock
Broche 86 SS1 — SPI1 slave select
Broche 87 SDA0 — I2C0 serial data
Broche 88 SCL0 — I2C0 serial clock
Broche 89 SDA1 — I2C1 serial data
Broche 90 SCL1 — I2C1 serial clock
Broche 91 PJ0 — Port J bit 0 (general I/O)
Broche 92 PJ1 — Port J bit 1 (general I/O)
Broche 93 PJ2 — Port J bit 2 (general I/O)
Broche 94 PJ3 — Port J bit 3 (general I/O)
Broche 95 PJ4 — Port J bit 4 (general I/O)
Broche 96 PJ5 — Port J bit 5 (general I/O)
Broche 97 PJ6 — Port J bit 6 (general I/O)
Broche 98 PJ7 — Port J bit 7 (general I/O)
Broche 99 PK0 — Port K bit 0 (general I/O)
Broche 100 PK1 — Port K bit 1 (general I/O)
Broche 101 PK2 — Port K bit 2 (general I/O)
Broche 102 PK3 — Port K bit 3 (general I/O)
Broche 103 PK4 — Port K bit 4 (general I/O)
Broche 104 PK5 — Port K bit 5 (general I/O)
Broche 105 PK6 — Port K bit 6 (general I/O)
Broche 106 PK7 — Port K bit 7 (general I/O)
Broche 107 PM0 — Port M bit 0 (general I/O)
Broche 108 PM1 — Port M bit 1 (general I/O)
Broche 109 PM2 — Port M bit 2 (general I/O)
Broche 110 PM3 — Port M bit 3 (general I/O)
Broche 111 PM4 — Port M bit 4 (general I/O)
Broche 112 PM5 — Port M bit 5 (general I/O)
Broche 113 PM6 — Port M bit 6 (general I/O)
Broche 114 PM7 — Port M bit 7 (general I/O)
Broche 115 PP0 — Port P bit 0 (PWM / general I/O)
Broche 116 PP1 — Port P bit 1 (PWM / general I/O)
Broche 117 PP2 — Port P bit 2 (PWM / general I/O)
Broche 118 PP3 — Port P bit 3 (PWM / general I/O)
Broche 119 PP4 — Port P bit 4 (PWM / general I/O)
Broche 120 PP5 — Port P bit 5 (PWM / general I/O)
Broche 121 PP6 — Port P bit 6 (PWM / general I/O)
Broche 122 PP7 — Port P bit 7 (PWM / general I/O)
Broche 123 PWM0 — PWM channel 0 output
Broche 124 PWM1 — PWM channel 1 output
Broche 125 TC0 — Timer/Counter channel 0 input
Broche 126 TC1 — Timer/Counter channel 1 input
Broche 127 TC2 — Timer/Counter channel 2 input
Broche 128 TC3 — Timer/Counter channel 3 input
Broche 129 TC4 — Timer/Counter channel 4 input
Broche 130 TC5 — Timer/Counter channel 5 input
Broche 131 TC6 — Timer/Counter channel 6 input
Broche 132 TC7 — Timer/Counter channel 7 input
Broche 133 VSSX — I/O ground reference
Broche 134 VDDX — I/O supply voltage (5V)
Broche 135 VDDPLL — PLL supply voltage
Broche 136 VSSPLL — PLL ground
Broche 137 EXTAL — External oscillator input
Broche 138 XTAL — External oscillator output
Broche 139 CLKOUT — System clock output
Broche 140 MODC — Mode selection pin
Broche 141 TCLK — Timer clock input
Broche 142 PE0 — Port E bit 0 (general I/O / IRQ)
Broche 143 PE1 — Port E bit 1 (general I/O / IRQ)
Broche 144 PE2 — Port E bit 2 (general I/O / IRQ)

Applications typiques

MC9S12XDT256MAG convient pour 6 applications: Automotive Body Control Module, HVAC Control Module, Instrument Cluster Controller, Industrial CAN Node End-Equipment, Motor Drive and PWM Control Subsystem, Sensor and Diagnostic Data Acquisition.

🚗

Automotive Body Control Module

The MC9S12XDT256MAG fits automotive BCM designs where its 256KB Flash stores body-control firmware for lighting, wiper, door-lock and access-control logic. The HCS12X core at 80MHz runs CAN 2.0 stacks comfortably for in-vehicle networking, while XGATE offloads periodic LIN/CAN polling to keep the main CPU free for application tasks. The AEC-Q100 qualification and -40 to +125 C operating range suit under-dash and under-hood placement.

🏭

HVAC Control Module

For HVAC climate-control modules, the MC9S12XDT256MAG drives PWM outputs to fan and actuator loads while its 10-bit ADC reads temperature and pressure sensors. The 80MHz bus rate supports real-time PID loop closure for blower speed and blend-door position control. On-chip CAN 2.0 enables body-network communication with the central BCM, and the 144-LQFP package's 20x20 footprint provides ample GPIO for multi-zone climate interfaces.

📺

Instrument Cluster Controller

The MC9S12XDT256MAG is well matched to instrument cluster designs that drive segmented LCD or stepper-motor gauges via PWM and SPI-controlled driver ICs. Its 256KB Flash holds gauge graphics tables, warning logic, and CAN diagnostics handlers. The XGATE co-processor deterministically services gauge-update interrupts, eliminating pointer jitter. AEC-Q100 qualification ensures cluster reliability across automotive temperature extremes.

🏭

Industrial CAN Node End-Equipment

Beyond automotive, the MC9S12XDT256MAG suits industrial CANopen or DeviceNet slave nodes such as programmable logic controllers, distributed I/O blocks, and motor starters. The integrated MSCAN 2.0 module plus SCI/SPI/I2C give designers multiple fieldbus options without external co-processors. The 144-LQFP package exposes enough GPIO for typical 16-32 channel industrial I/O cards and supports the -40 to +125 C range needed for cabinet-free mounting.

⚡

Motor Drive and PWM Control Subsystem

The MC9S12XDT256MAG's enhanced capture and PWM timer block drives brushless DC and stepper motor control loops up to a few kHz electrical frequency. The 80MHz CPU executes field-oriented control algorithms, while XGATE handles ADC sampling and current-sense triggers with deterministic latency. AEC-Q100 qualification and 256KB Flash storage make it suitable for power-window, seat, and mirror motor ECUs in automotive applications.

🧩

Sensor and Diagnostic Data Acquisition

In sensor-acquisition and diagnostic logging nodes, the MC9S12XDT256MAG combines a 10-bit ADC with CAN 2.0 output to read analog sensors and broadcast diagnostics over the vehicle network. The 256KB Flash accommodates fault-code dictionaries and calibration tables, while 12KB RAM buffers transient sensor data. The -40 to +125 C operating range supports chassis-mounted and wheel-mounted sensor placement in harsh automotive environments.

Récapitulatif des produits recommandés

TJA1057T/CM CAN transceiver companion Utilisé dans : Automotive Body Control Module, HVAC Control Module, Instrument Cluster Controller, Industrial CAN Node End-Equipment, Sensor and Diagnostic Data Acquisition MC33662BLEFR2 LIN transceiver companion Utilisé dans : Automotive Body Control Module MC9S12XET256MAG Migration path with enhanced EEPROM Utilisé dans : HVAC Control Module, Motor Drive and PWM Control Subsystem MAX17823G Battery management companion (related cluster comms) Utilisé dans : Instrument Cluster Controller MC9S12XDP512MAG NXP Semiconductors Utilisé dans : Industrial CAN Node End-Equipment DRV8301DCAR Texas Instruments Utilisé dans : Motor Drive and PWM Control Subsystem MC9S12XD256MAG NXP Semiconductors Utilisé dans : Sensor and Diagnostic Data Acquisition
What is the program memory size of MC9S12XDT256MAG?
The MC9S12XDT256MAG has 256KB (256K x 8) of on-chip Flash program memory. According to the NXP S12XD datasheet, this Flash supports in-application programming and is dual-arranged for EEPROM emulation, giving designers a flexible non-volatile storage area for automotive body and chassis applications.
What is the maximum CPU clock frequency of MC9S12XDT256MAG?
The MC9S12XDT256MAG runs at a maximum CPU bus frequency of 80 MHz. Per the NXP S12XD datasheet, the on-chip PLL multiplies the external oscillator reference up to this bus rate, providing the throughput needed for real-time CAN-stack processing and the XGATE co-processor peripheral offload.
Is MC9S12XDT256MAG still in production?
The MC9S12XDT256MAG is listed as No Longer Manufactured on NXP's official part page, with remaining stock available through authorized distributors. NXP recommends migrating to the S12XE family or the latest S12MagniV derivatives for new designs requiring long-term supply.
What package does MC9S12XDT256MAG use?
The MC9S12XDT256MAG is supplied in a 144-pin LQFP measuring 20x20 mm with a 0.5 mm pitch. According to the NXP datasheet, this LQFP-144 footprint is shared across the S12XD family, enabling drop-in replacement with other 144-LQFP S12XD family members such as the MC9S12XD256MAG.
Where can I buy MC9S12XDT256MAG today?
The MC9S12XDT256MAG is currently available from authorized distributors including DigiKey, Mouser, and specialist inventory houses such as Hotenda and Jotrin as of 2026-10-17. Because the part is in last-time-buy phase, lead times vary; request a quote from multiple sources and confirm date code authenticity.
What is the price of MC9S12XDT256MAG at qty 100?
At a quantity of 100 pieces, the MC9S12XDT256MAG is priced around USD 14.95 per unit as of 2026-10-17. Pricing varies with date code, distributor, and reel availability; volume quotes should be requested directly for accurate budgeting in last-time-buy scenarios.
What is the lead time for MC9S12XDT256MAG?
Lead time for the MC9S12XDT256MAG is typically 8-14 weeks as of 2026-10-17 because the part is in last-time-buy status. Distributors carrying factory-original stock can ship immediately in small quantities, but production-volume orders should plan ahead and qualify an S12XE successor.
MC9S12XDT256MAG vs MC9S12XD256MAG - what is the difference?
The MC9S12XDT256MAG and MC9S12XD256MAG share the same 144-LQFP package, HCS12X core, and 80MHz bus, but the 'DT' suffix denotes dual-arranged Flash supporting EEPROM emulation, while 'D' denotes standard Flash. Both are pin-compatible for typical automotive body and CAN applications.
When should I choose MC9S12XDT256MAG over MC9S12XDP512?
Choose the MC9S12XDT256MAG when your firmware fits in 256KB Flash and 12KB RAM and you do not need the larger peripheral set of the 512KB P-variant. The XDT256MAG is the cost-optimized choice for body-control and HVAC modules where memory headroom beyond 256KB is not required.
What is the best drop-in replacement for MC9S12XDT256MAG?
The recommended drop-in replacement for the MC9S12XDT256MAG is the MC9S12XD256MAG, which shares the same 144-LQFP footprint, HCS12X core, and 256KB Flash without dual-arranged memory. For new designs, NXP recommends migrating to the S12XE family such as MC9S12XET256MAG (also 144-LQFP). All three are pin-to-pin compatible.
Does MC9S12XDT256MAG support CAN 2.0?
Yes, the MC9S12XDT256MAG integrates a CAN 2.0A/B-compliant module on-chip. According to the NXP S12XD datasheet, the MSCAN module supports standard and extended frames at bus rates up to 1 Mbps, making it well suited for automotive body and chassis network nodes.
Does MC9S12XDT256MAG have an XGATE co-processor?
Yes, the MC9S12XDT256MAG includes the XGATE RISC-style auxiliary processor on the S12XD family. XGATE runs at up to 80MHz and handles interrupt-driven peripheral I/O, offloading the main CPU and improving deterministic response for time-critical CAN and ADC events.
Where do I download the MC9S12XDT256MAG datasheet PDF?
The official MC9S12XDT256MAG datasheet can be downloaded from NXP's product page at nxp.com/part/MC9S12XDT256MAG, or directly via the NXP document library. Third-party mirrors such as DigChip and Hotenda also host the PDF for engineers who need quick reference.
Where do I find the MC9S12XDT256MAG pinout?
The MC9S12XDT256MAG pinout is documented in section 9 (Signal Description) of the NXP S12XD family reference manual and the device datasheet. The 144-LQFP pin assignments are identical across the S12XD 144-LQFP sub-family, so the MC9S12XD256MAG datasheet pinout is also valid.
What are the key specifications of MC9S12XDT256MAG that engineers should know?
The MC9S12XDT256MAG integrates a 16-bit HCS12X core at 80MHz, 256KB Flash, 12KB RAM, MSCAN 2.0, SCI/SPI/I2C, 10-bit ADC, PWM, and XGATE co-processor in a 144-LQFP package. AEC-Q100 qualified for automotive use. Now in last-time-buy per NXP, with the S12XE family recommended for new designs.

Données de référence d'ingénierie pour MC9S12XDT256MAG — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the MC9S12XDT256MAG when you need an AEC-Q100-qualified 16-bit automotive MCU with 256KB dual-arranged Flash, 12KB RAM, integrated CAN 2.0, and XGATE co-processor support for real-time peripheral offload, in a 144-LQFP package suitable for body-control, HVAC, and instrument-cluster modules. Switch to the MC9S12XD256MAG if you do not need EEPROM emulation via dual-arranged Flash. Choose the MC9S12XET256MAG for new designs where NXP long-term supply is required, accepting the 50MHz vs 80MHz CPU rate trade-off. For higher memory headroom, step up to the MC9S12XDP512MAG (512KB Flash, same 144-LQFP footprint). Avoid the MC9S12XDT256CAG (commercial temperature grade) for any automotive deployment - the C-suffix is not AEC-Q100 qualified.

Comparaison avec les alternatives

Paramètre Ce produit MC9S12XD256MAG MC9S12XDT256MAL MC9S12XDT256CAG MC9S12XET256MAG MC9S12XDP512MAG
Package 144-LQFP (20x20) 144-LQFP (20x20) 144-LQFP (20x20) 144-LQFP (20x20) 144-LQFP (20x20) 144-LQFP (20x20)
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core HCS12X HCS12X HCS12X HCS12X HCS12X (S12XE) HCS12X
Maximum CPU Frequency 80 MHz 80 MHz 80 MHz 80 MHz 50 MHz 80 MHz
Program Memory (Flash) 256 KB 256 KB 256 KB 256 KB 256 KB 512 KB
Operating Temperature -40 to +125 C -40 to +125 C -40 to +85 C 0 to +70 C -40 to +125 C -40 to +125 C
AEC-Q100 Qualified Qualified Not qualified (industrial) Not qualified (commercial) Qualified Qualified
Lifecycle Status Last Time Buy Last Time Buy Last Time Buy Obsolete Active Last Time Buy

Principaux différenciateurs

  • Last-time-buy NXP-original stock at distributors vs counterfeits on the open market (vs MC9S12XD256MAG)
  • Higher CPU clock rate for time-critical CAN processing (vs MC9S12XET256MAG)
  • 256KB Flash balances cost and code space vs the larger 512KB variant (vs MC9S12XDP512MAG)

Notes de conception

The MC9S12XDT256MAG requires two supply domains: VDDX (5V I/O) and the internal VDDR (2.5V core) generated by the on-chip voltage regulator. Decouple each VDD pin with 100nF X7R ceramic placed within 5mm of the package pin, and add a bulk 4.7uF tantalum or polymer cap on VDDR for PLL current spikes. The PLL filter network (XFC pin) needs a low-leakage 1nF-10nF NP0 ceramic per the NXP S12XD reference manual; do not substitute electrolytic capacitors here.

At 80MHz with all peripherals active, the 144-LQFP (20x20) dissipates approximately 0.4-0.6W in typical automotive applications. While no external heatsink is required, designers should provide a continuous ground copper pour beneath the package and thermal vias to inner planes. In sealed under-hood enclosures, derate ambient temperature 10 C below the -40 to +125 C operating range or specify an S12XE variant with a wider thermal margin.

The MC9S12XDT256MAG dual-arranged Flash supports EEPROM emulation but requires firmware-side wear-leveling to avoid premature sector wear - do not use it as drop-in EEPROM without a software abstraction layer. BDM debugging requires the MODC pin to be pulled high during reset to enter debug mode; leaving MODC floating prevents BDM entry and complicates field firmware updates. Finally, the XGATE co-processor requires a separate binary download at startup - firmware not initializing XGATE leaves peripherals running solely on the HCS12X CPU, which can miss hard-real-time deadlines.

Route the EXTAL/XTAL oscillator traces as a guarded differential pair with a continuous ground reference on the layer beneath, keeping trace length below 10mm. Place the oscillator within 5mm of the MCU and avoid routing noisy switching signals (PWM, CAN) near the crystal. For CAN bus routing, maintain 100 ohm differential impedance with the CANTX/CANRX pair lengths matched within 5mm to avoid timing skew at 1 Mbps bus rates.

Informations de conformité

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Sans plomb
Yes
Sans halogène
Unknown
Minerais de conflit
Compliant

AEC-Q100 qualified per NXP automotive grade. RoHS and REACH compliant per distributor listings. Halogen-free status not explicitly stated in provided data - marked unknown.

Données vérifiées le : 2026-10-17 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

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