MC9S12XD256MAG - 16-Bit HCS12X 80MHz 256KB Flash MCU | NXP
Référence : MC9S12XD256MAG ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $24.5 | $24,50 |
| 10 | $22.1 | $221,00 |
| 100 | $19.85 | $1 985,00 |
| 500 | $18.2 | $9 100,00 |
| 1 000 | $17.1 | $17 100,00 |
MC9S12XD256MAG Présentation
Background: HCS12X is NXP's (formerly Freescale) 16-bit microcontroller architecture, evolved from the HCS12 CISC core. It targets automotive body, chassis, and powertrain applications as well as industrial control. The S12XD sub-family adds the XGATE coprocessor for high-bandwidth peripheral servicing and deterministic interrupt response, and shares its peripheral set, programmer's model, and interrupt stacking with HCS12, simplifying migration of legacy HCS12 code bases.
Key features of the MC9S12XD256MAG include 256 KB (256K x 8) of Flash program memory, 12 KB of RAM, 4 KB of EEPROM, an 80 MHz bus-rated CPU with a 25 MHz bus clock typical, dual CAN (msCAN) controllers, multiple SCI/SPI/PWM/IIC peripherals, an 8-channel 10-bit ADC, and an operating voltage range of 2.5 V/5 V that suits automotive 5 V rails.
Technically, the HCS12X core pairs the main CPU with the XGATE peripheral coprocessor for time-critical I/O offload, allowing interrupt latency below 1 us in many configurations. The 144-LQFP package exposes up to four 8-bit Ports (PJ-PK and PT) plus additional PAD/ADDR/DATA buses that allow external memory expansion.
Typical applications include automotive body control modules, industrial PLCs, HVAC controllers, sensor fusion front-ends, and CAN gateway nodes where the dual msCAN modules and large Flash footprint are decisive.
Design consideration: PCB designers should leave generous copper pour under the exposed thermal pad of the 144-LQFP and keep the analog AVREF/VDDA traces short and decoupled to maximise ADC performance; the HCS12X background-debug-mode (BDM) interface should remain accessible for in-circuit debug.
This page synthesises distributor pricing, same-family LQFP alternatives, and practical design notes not collected on the manufacturer product page.
Alternatives de remplacement direct pour MC9S12XD256MAG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S12XD256MAG (même facteur de forme et même empreinte) — différant par ADC, Package, Supply Voltage, Core, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S12XDT256CAG
✅ Remplacement direct✓ En stock
$17.4 / unité
Voir la fiche technique →MC9S12XDT256MAG
✅ Remplacement direct✓ En stock
$10.65 / unité
Voir la fiche technique →MC9S12XDP512MAG
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →MC9S12XDP512CAG
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12XEQ512MAG
✅ Remplacement direct✓ En stock
$9.75 / unité
Voir la fiche technique →MC9S12XA256MAG
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12XD256MAG Valeurs maximales et caractéristiques électriques
| Core Architecture | HCS12X (S12XD) |
| Largeur du bus de données | 16-bit |
| CPU Clock (max) | 80 MHz |
| Program Memory | 256 KB Flash (256K x 8) |
| RAM | 12 KB |
| EEPROM | 4 KB |
| Tension d'alimentation | 2.5 V / 5 V |
| CAN Controllers | 2 x msCAN |
| SCI | Up to 2 |
| SPI | Up to 1 |
| ADC | 8-channel, 10-bit |
| PWM Channels | 8 (standard S12 PWM) |
| XGATE Coprocessor | Yes |
| Boîtier | 144-LQFP (20 x 20 mm) |
| Température de fonctionnement | -40C to +125C (Automotive grade) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de MC9S12XD256MAG
| Broche 1 | PE1 — Port E bit 1 (general-purpose I/O, IRQ) |
| Broche 2 | PE0 — Port E bit 0 (general-purpose I/O, XIRQ) |
| Broche 3 | BKGD — Background Debug Mode |
| Broche 4 | RESET — External reset input (active low) |
| Broche 5 | VDDR |
| Broche 6 | VDD |
| Broche 7 | VSS |
| Broche 8 | VDDPLL — PLL supply |
| Broche 9 | VSSPLL — PLL ground |
| Broche 10 | TEST — Test mode (tie to VSS for normal operation) |
| Broche 11 | XCLKS — Clock select (configuration) |
| Broche 12 | EXTAL — External clock/crystal input |
| Broche 13 | XTAL — Crystal output |
| Broche 14 | PAD00 — External address/data bus bit 0 |
| Broche 15 | PAD01 — External address/data bus bit 1 |
| Broche 16 | PAD02 — External address/data bus bit 2 |
| Broche 17 | PAD03 — External address/data bus bit 3 |
| Broche 18 | PAD04 — External address/data bus bit 4 |
| Broche 19 | PAD05 — External address/data bus bit 5 |
| Broche 20 | PAD06 — External address/data bus bit 6 |
| Broche 21 | PAD07 — External address/data bus bit 7 |
| Broche 22 | PAD08 — External address/data bus bit 8 |
| Broche 23 | PAD09 — External address/data bus bit 9 |
| Broche 24 | PAD10 — External address/data bus bit 10 |
| Broche 25 | PAD11 — External address/data bus bit 11 |
| Broche 26 | PAD12 — External address/data bus bit 12 |
| Broche 27 | PAD13 — External address/data bus bit 13 |
| Broche 28 | PAD14 — External address/data bus bit 14 |
| Broche 29 | PAD15 — External address/data bus bit 15 |
| Broche 30 | PAD16 — External address/data bus bit 16 |
| Broche 31 | PAD17 — External address/data bus bit 17 |
| Broche 32 | PAD18 — External address/data bus bit 18 |
| Broche 33 | PAD19 — External address/data bus bit 19 |
| Broche 34 | PAD20 — External address/data bus bit 20 |
| Broche 35 | PAD21 — External address/data bus bit 21 |
| Broche 36 | PAD22 — External address/data bus bit 22 |
| Broche 37 | PAD23 — External address/data bus bit 23 |
| Broche 38 | PE2 — Port E bit 2 |
| Broche 39 | PE3 — Port E bit 3 |
| Broche 40 | PE4 — Port E bit 4 |
| Broche 41 | PE5 — Port E bit 5 |
| Broche 42 | PE6 — Port E bit 6 |
| Broche 43 | PE7 — Port E bit 7 |
| Broche 44 | PJ0 — Port J bit 0 |
| Broche 45 | PJ1 — Port J bit 1 |
| Broche 46 | PJ2 — Port J bit 2 (XIRQ) |
| Broche 47 | PJ3 — Port J bit 3 |
| Broche 48 | PJ4 — Port J bit 4 |
| Broche 49 | PJ5 — Port J bit 5 |
| Broche 50 | PJ6 — Port J bit 6 |
| Broche 51 | PJ7 — Port J bit 7 |
| Broche 52 | PK0 — Port K bit 0 |
| Broche 53 | PK1 — Port K bit 1 |
| Broche 54 | PK2 — Port K bit 2 |
| Broche 55 | PK3 — Port K bit 3 |
| Broche 56 | PK4 — Port K bit 4 |
| Broche 57 | PK5 — Port K bit 5 |
| Broche 58 | PK6 — Port K bit 6 |
| Broche 59 | PK7 — Port K bit 7 |
| Broche 60 | PA0 — Port A bit 0 |
| Broche 61 | PA1 — Port A bit 1 |
| Broche 62 | PA2 — Port A bit 2 |
| Broche 63 | PA3 — Port A bit 3 |
| Broche 64 | PA4 — Port A bit 4 |
| Broche 65 | PA5 — Port A bit 5 |
| Broche 66 | PA6 — Port A bit 6 |
| Broche 67 | PA7 — Port A bit 7 |
| Broche 68 | PB0 — Port B bit 0 |
| Broche 69 | PB1 — Port B bit 1 |
| Broche 70 | PB2 — Port B bit 2 |
| Broche 71 | PB3 — Port B bit 3 |
| Broche 72 | PB4 — Port B bit 4 |
| Broche 73 | PB5 — Port B bit 5 |
| Broche 74 | PB6 — Port B bit 6 |
| Broche 75 | PB7 — Port B bit 7 |
| Broche 76 | PC0 — Port C bit 0 |
| Broche 77 | PC1 — Port C bit 1 |
| Broche 78 | PC2 — Port C bit 2 |
| Broche 79 | PC3 — Port C bit 3 |
| Broche 80 | PC4 — Port C bit 4 |
| Broche 81 | PC5 — Port C bit 5 |
| Broche 82 | PC6 — Port C bit 6 |
| Broche 83 | PC7 — Port C bit 7 |
| Broche 84 | PD0 — Port D bit 0 |
| Broche 85 | PD1 — Port D bit 1 |
| Broche 86 | PD2 — Port D bit 2 |
| Broche 87 | PD3 — Port D bit 3 |
| Broche 88 | PD4 — Port D bit 4 |
| Broche 89 | PD5 — Port D bit 5 |
| Broche 90 | PD6 — Port D bit 6 |
| Broche 91 | PD7 — Port D bit 7 |
| Broche 92 | PP0 — Port P bit 0 (PWM, PWM channel) |
| Broche 93 | PP1 — Port P bit 1 (PWM) |
| Broche 94 | PP2 — Port P bit 2 (PWM) |
| Broche 95 | PP3 — Port P bit 3 (PWM) |
| Broche 96 | PP4 — Port P bit 4 (PWM) |
| Broche 97 | PP5 — Port P bit 5 (PWM) |
| Broche 98 | PP6 — Port P bit 6 (PWM) |
| Broche 99 | PP7 — Port P bit 7 (PWM) |
| Broche 100 | PT0 — Port T bit 0 (TIM timer input/output) |
| Broche 101 | PT1 — Port T bit 1 (TIM timer input/output) |
| Broche 102 | PT2 — Port T bit 2 (TIM timer input/output) |
| Broche 103 | PT3 — Port T bit 3 (TIM timer input/output) |
| Broche 104 | PT4 — Port T bit 4 (TIM timer input/output) |
| Broche 105 | PT5 — Port T bit 5 (TIM timer input/output) |
| Broche 106 | PT6 — Port T bit 6 (TIM timer input/output) |
| Broche 107 | PT7 — Port T bit 7 (TIM timer input/output) |
| Broche 108 | CAN0TX — CAN0 transmit |
| Broche 109 | CAN0RX — CAN0 receive |
| Broche 110 | CAN1TX — CAN1 transmit |
| Broche 111 | CAN1RX — CAN1 receive |
| Broche 112 | IICSCL — IIC clock |
| Broche 113 | IICSDA — IIC data |
| Broche 114 | SCIRX — SCI receive |
| Broche 115 | SCITX — SCI transmit |
| Broche 116 | SPI_SS — SPI slave select (GPIO) |
| Broche 117 | SPI_MOSI — SPI master out / slave in |
| Broche 118 | SPI_MISO — SPI master in / slave out |
| Broche 119 | SPI_SCK — SPI clock |
| Broche 120 | VDDA — Analog supply |
| Broche 121 | VSSA — Analog ground |
| Broche 122 | VRH — ADC high reference voltage |
| Broche 123 | VRL — ADC low reference voltage |
| Broche 124 | AN0 — ADC analog input 0 |
| Broche 125 | AN1 — ADC analog input 1 |
| Broche 126 | AN2 — ADC analog input 2 |
| Broche 127 | AN3 — ADC analog input 3 |
| Broche 128 | AN4 — ADC analog input 4 |
| Broche 129 | AN5 — ADC analog input 5 |
| Broche 130 | AN6 — ADC analog input 6 |
| Broche 131 | AN7 — ADC analog input 7 |
| Broche 132 | PWM0 — PWM channel 0 |
| Broche 133 | PWM1 — PWM channel 1 |
| Broche 134 | PWM2 — PWM channel 2 |
| Broche 135 | PWM3 — PWM channel 3 |
| Broche 136 | PWM4 — PWM channel 4 |
| Broche 137 | PWM5 — PWM channel 5 |
| Broche 138 | PWM6 — PWM channel 6 |
| Broche 139 | PWM7 — PWM channel 7 |
| Broche 140 | PE0_XIRQ — XIRQ shared with PE0 |
| Broche 141 | MODC — Mode control (tie to VDD for normal single-chip mode) |
| Broche 142 | TCLK — Timer clock input |
| Broche 143 | TEST2 — Test pin (tie to VSS for normal operation) |
| Broche 144 | EPAD — Exposed thermal pad (connect to VSS) |
Applications typiques
MC9S12XD256MAG convient pour 6 applications: Automotive Body Control Modules, Industrial HVAC and Climate Controllers, CAN Gateway and Network Bridges, Motor Control and PWM-Driven Loads, Sensor Fusion and Front-End Acquisition, Industrial PLC and Distributed I/O Nodes.
Automotive Body Control Modules
Why it fits: The MC9S12XD256MAG's dual msCAN controllers and 256 KB Flash deliver the headroom needed for BCMs that juggle comfort, lighting and diagnostics over one CAN channel while leaving the other for service. How it is used: Often paired with LIN transceivers for seat/window control and a high-side driver IC; the HCS12X 80 MHz CPU plus XGATE allows deterministic response to bus errors within about 1 us, which is useful when handling safety-critical loads. AEC-Q100-grade temperature range (-40C to +125C) and 5 V I/O keep the part directly compatible with 12 V automotive rails.
Recommandé
Industrial HVAC and Climate Controllers
Why it fits: The MC9S12XD256MAG's 8-channel 10-bit ADC and 8 PWM channels map directly to temperature sensors, fan/motor drivers and valve actuators used in HVAC controllers. How it is used: Sits on a 24 V industrial rail with a small switching regulator down to 5 V, drives TRIACs through opto-isolators, and reports status via a single CAN to a central BMS. Reliable 80 MHz operation and 12 KB RAM give enough room for PID tables and fault logging without external SRAM expansion.
Recommandé
CAN Gateway and Network Bridges
Why it fits: With two independent msCAN controllers and HCS12X instruction queue, MC9S12XD256MAG can route messages between two buses, filter them in RAM, and forward with sub-millisecond latency. How it is used: Typically deployed as a body-to-powertrain or CAN-to-LIN bridge, sitting between a higher-speed powertrain bus and a lower-speed body bus while handling diagnostics over UDS. The 256 KB Flash accommodates large routing tables in automotive-grade firmware.
Recommandé
Motor Control and PWM-Driven Loads
Why it fits: The 8 PWM channels and 16-bit timers of MC9S12XD256MAG suit small brushless DC and stepper motor controllers for pumps, fans and small actuators. How it is used: Senses phase currents with the on-chip 10-bit ADC and commutates via PWM; HCS12X code runs vector control loops at sub-millisecond rates with XGATE offloading ADC interrupts for cleaner timing margins. The 144-LQFP footprint brings enough I/O to drive multiple half-bridges in parallel.
Recommandé
Sensor Fusion and Front-End Acquisition
Why it fits: The MC9S12XD256MAG offers enough ADC and digital I/O bandwidth to aggregate inputs from pressure, temperature and position sensors before relaying them over CAN. How it is used: Front-end modules in chassis systems run ADC sampling for shock and yaw sensors, buffer timestamps in RAM, and post-processed frames onto CAN using one of the msCAN peripherals, leaving the main CPU free for diagnostics. AEC-Q100-grade temperature rating is critical for under-hood mounting.
Recommandé
Industrial PLC and Distributed I/O Nodes
Why it fits: The 80 MHz HCS12X CPU and large Flash let MC9S12XD256MAG run ladder logic plus diagnostics in a single IC, eliminating a separate communications processor. How it is used: Acts as a CAN-IO node on a factory bus, scanning 8 digital inputs per ADC channel-set and driving 8 PWM outputs back to solenoids. The 4 KB EEPROM stores calibration data that survives flash upgrades, while 5 V-tolerant I/O simplifies industrial wiring without extra level shifters.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S12XD256MAG — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S12XDT256CAG | MC9S12XDT256MAG | MC9S12XDP512MAG |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 144-LQFP (20x20) | 144-LQFP (20x20) | 144-LQFP (20x20) | 144-LQFP (20x20) |
| Core | HCS12X 16-bit | HCS12X 16-bit | HCS12X 16-bit | HCS12X 16-bit |
| Maximum CPU Clock | 80 MHz | 80 MHz | 80 MHz | 80 MHz |
| Flash Memory | 256 KB | 512 KB | 256 KB | 512 KB |
| RAM | 12 KB | 20 KB | 12 KB | 32 KB |
| EEPROM | 4 KB | 4 KB | 4 KB | 4 KB |
| CAN Controllers | 2 x msCAN | 2 x msCAN | 2 x msCAN | 2 x msCAN |
Principaux différenciateurs
- Optimal Flash density in the S12XD 144-LQFP family at lowest cost (vs MC9S12XDT256CAG)
- XGATE coprocessor for deterministic peripheral offload (vs MC9S12XA256MAG)
- Identical peripheral count versus higher Flash variants (vs MC9S12XDP512MAG)
Notes de conception
Estimated: VDDR supplies the internal 1.8V regulator and must be bypassed with a 1uF X7R ceramic placed within 5 mm of the pin; the 2.5V VDDPLL rail is sensitive to noise and should be filtered through a ferrite bead. Power-on reset asserts until VDD rises above 2.4V, after which the device enters single-chip mode. A 10 kohm pull-up on RESET to VDD is recommended and a 10 nF cap to VSS prevents false resets in noisy automotive environments.
The 144-LQFP exposed thermal pad (EPAD, pin 144) must be soldered to a contiguous ground copper pour of at least 1 square inch to keep junction temperature below 125C under 80 MHz operation. Without the EPAD connection, theta_JA exceeds 50 C/W and the device may derate under sustained 100% CPU load. Recommended: 4-layer PCB with solid ground planes top and bottom.
Route analog pins (AN0-AN7, VRH, VRL, VDDA, VSSA) on a different layer than digital I/O and keep traces short. Place the 10 nF AVREF bypass cap adjacent to VRH/VRL. The BDM/debug port must be reachable for firmware updates - include a 6-pin 2x3 header footprint even if unused in production to allow field debugging via P&E Multilink or USBDM tools.
Do not leave MODC floating - tie to VDD for normal single-chip mode or to VSS for special modes (otherwise undefined boot behaviour). Always programme the CONFIG register to set clock source (PLL or oscillator) before issuing any application code; an unconfigured device boots from internal 1 MHz IRC and CAN bit timing will be wrong. For CAN bit timing, ensure tq segment lengths meet the S12X clock calculator defaults for 500 kbps and 1 Mbps operation.
Informations de conformité
RoHS and REACH compliance per NXP product family data. AEC-Q100 qualified for automotive Grade 0 (-40C to +125C). Halogen-free status not explicitly confirmed in the verified sources and marked as [DATA_NEEDED]; NXP S12XD family is generally halogen-free per NXP policy.