MC8641DHX1333JE - Dual-Core PowerPC e600 SoC 1.333GHz | NXP
Référence : MC8641DHX1333JE ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $215 | $215,00 |
| 10 | $198 | $1 980,00 |
| 100 | $178 | $17 800,00 |
| 500 | $162 | $81 000,00 |
| 1 000 | $149 | $149 000,00 |
MC8641DHX1333JE Présentation
A Power Architecture SoC is a single integrated circuit that combines one or more processor cores, memory controllers, peripheral I/O, and interconnect fabric into a single silicon die. In the broader taxonomy this places the MPC8641D in the family of embedded multiprocessors, a category that includes communications processors, network SoCs, and high-performance industrial MPUs. The e600 core line itself evolved from the PowerPC 74xx series and is the basis for Freescale/NXP's QorIQ and PowerQUICC III families, which remain widely deployed in long-life-cycle infrastructure equipment.
Key features of the MC8641DHX1333JE include the dual e600 cores running at 1.333 GHz with hardware-managed coherency, dual-channel DDR/DDR2 memory controllers with ECC, two Enhanced Three-Speed Ethernet (eTSEC) MACs supporting 10/100/1000 Mbps, integrated PCI Express and Serial RapidIO (SRIO) interfaces, and AltiVec vector processing for compute-intensive DSP-style workloads. The device operates from a 1.05 V core supply, supports 32-bit Power Architecture instruction set, and is rated for the extended 0 to 105 °C industrial temperature range.
Typical applications for this SoC include multi-gigabit networking line cards, industrial control routers, software-defined radio baseband processing, telecom switching fabrics, and defense/aerospace embedded compute modules. The combination of AltiVec, dual GbE, and high-speed serial interfaces makes the part particularly attractive for legacy infrastructure that still requires deterministic PowerPC behavior and long-term component availability through NXP's product longevity commitments.
When designing with this part, pay close attention to PCB layout for the FC-CBGA-1023 package; the 33 x 33 mm substrate requires multilayer BGA escape routing, controlled-impedance SERDES traces, and matched-length clocks. Thermal management is critical at 1.333 GHz - a heatsink is mandatory, and the board should provide 2 oz copper on outer layers under the BGA for spreading. The DDR2 memory interface must be length-matched within tight skew tolerances per NXP application notes.
This page aggregates distributor pricing, drop-in alternatives within the MPC8641D/MPC8640D family, and design notes that go beyond the manufacturer datasheet summary - useful for engineers qualifying the part into long-life programs.
Alternatives de remplacement direct pour MC8641DHX1333JE — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC8641DHX1333JE (même facteur de forme et même empreinte) — différant par Ethernet, Package, Operating Temperature, PCI Express, Core Architecture.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC8641DHX1500JE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC8641VU1333JE
✓ En stock
$333.06 / unité
Voir la fiche technique →MC8641DVU1000GE
✅ Remplacement direct✓ En stock
$295.5 / unité
Voir la fiche technique →MC8641DVJ1333JE
✅ Remplacement direct✓ En stock
$660 / unité
Voir la fiche technique →MC8640DTVJ1250HE
✅ Remplacement direct✓ En stock
$439.13 / unité
Voir la fiche technique →MC8641DHX1333JE Valeurs maximales et caractéristiques électriques
| Core Architecture | PowerPC e600 (dual-core) |
| Number of Cores | 2 |
| Largeur du bus de données | 32-bit |
| Maximum Core Frequency | 1.333 GHz |
| Instruction Set Architecture | Power Architecture (Book-E) |
| SIMD / Vector Unit | AltiVec |
| RAM Controllers | DDR1, DDR2 (with ECC) |
| Ethernet | 10/100/1000 Mbps (eTSEC, multiple MACs) |
| High-Speed Serial I/O | PCI Express, Serial RapidIO (SRIO) |
| Graphics Acceleration | No |
| Core Supply Voltage | 1.05 V |
| Température de fonctionnement | 0 °C to +105 °C |
| Boîtier | 1023-ball FC-CBGA, 33 x 33 mm |
| Type de montage | Surface Mount (BGA) |
| Statut RoHS | Compliant |
| Part Status | Obsolete (per distributor listings) |
Guide de configuration des broches du MC8641DHX1333JE 1023-ball fc-cbga, 33 x 33 mm
Configuration des broches du MC8641DHX1333JE (boîtier 1023-ball fc-cbga, 33 x 33 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MC8641DHX1333JE.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MC8641DHX1333JE convient pour 6 applications: Multi-Gigabit Telecom Line Card, Software Defined Radio Baseband, Industrial Control Router, Defense / Aerospace Embedded Compute, Network Attached Storage Controller, Test & Measurement Instrumentation.
Multi-Gigabit Telecom Line Card
The MC8641DHX1333JE's dual e600 cores at 1.333 GHz, dual eTSEC GbE MACs, and on-chip PCI Express / Serial RapidIO make it a natural fit for multi-gigabit telecom line cards. Its AltiVec SIMD unit accelerates packet-header parsing and traffic-management workloads, while the DDR2 controller with ECC supports line-rate deep packet inspection buffers. Designers typically place the part on a 12+ layer board with matched-length SERDES traces to PHYs and switch fabrics, leveraging NXP's PowerPC tool chain for deterministic forwarding performance.
Recommandé
Software Defined Radio Baseband
For software-defined radio (SDR) baseband processing, the MC8641DHX1333JE delivers two e600 superscalar cores plus AltiVec, giving developers the vector throughput needed for FFTs, channelization, and modulation/coding chains at baseband sample rates. The SRIO fabric streams IQ data to/from RF front-end FPGAs, and the DDR2 controller buffers wide-bandwidth capture streams. Industrial 0-105 °C rating and long-term supply via NXP/Rochester are critical for defense and aerospace SDR programs.
Recommandé
Industrial Control Router
Industrial control routers benefit from the MC8641DHX1333JE's three Ethernet MACs (10/100/1000), hardware ECC memory, and extended 0-105 °C temperature range. The dual e600 cores handle routing-table lookup and firewall filtering in parallel, while the PCI Express port links to additional switching ASICs. NXP's mature VxWorks and Linux BSP support makes the part drop-in for industrial networking equipment that must operate for 10+ years in the field.
Recommandé
Defense / Aerospace Embedded Compute
Defense and aerospace programs value the MC8641DHX1333JE for its deterministic PowerPC architecture, AltiVec acceleration for signal-processing workloads, and legacy tooling that has been flight-qualified over decades. The FC-CBGA-1023 package supports ruggedized board builds with underfills and lid options. Long-life-cycle procurement via Rochester Electronics makes the part suitable for platforms requiring 15-20 year support windows.
Recommandé
Network Attached Storage Controller
The MC8641DHX1333JE's dual e600 cores, hardware-accelerated RAID-class I/O via PCI Express, and GbE MACs support enterprise and rugged NAS controller boards. AltiVec accelerates XOR and encryption primitives, while the DDR2 ECC controller protects file-system metadata. Industrial temperature rating enables deployment in non-datacenter environments such as shipboard or tactical edge storage.
Recommandé
Test & Measurement Instrumentation
Test-and-measurement instruments such as protocol analyzers and high-speed digitizers benefit from the MC8641DHX1333JE's combination of AltiVec for DSP-style processing, multi-gigabit Ethernet for streaming captured data, and PCI Express for host-side offload. The PowerPC execution model allows deterministic, real-time response for protocol-aware triggering, and NXP's long-term supply chain suits instruments with decade-long production runs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC8641DHX1333JE — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC8641DHX1500JE | MC8641VU1333JE | MC8641DVU1000GE | MC8641DVJ1333JE | MC8640DTVJ1250HE |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 1023-FCCBGA (33x33 mm) | 1023-FCCBGA (33x33 mm) - same | 1023-FCCBGA (33x33 mm) - same | 1023-FCCBGA (33x33 mm) - same | 1023-FCCBGA (33x33 mm) - same | 1023-FCCBGA (33x33 mm) - same |
| Core Frequency | 1.333 GHz | 1.5 GHz | 1.333 GHz | 1.0 GHz | 1.333 GHz | 1.25 GHz |
| Number of Cores | 2 (e600) | 2 (e600) | 2 (e600) | 2 (e600) | 2 (e600) | 2 (e600) |
| Core Supply Voltage | 1.05 V | 1.05 V | 1.05 V | 1.05 V | 1.05 V | 1.05 V |
| Operating Temperature | 0 °C to +105 °C | 0 °C to +105 °C | 0 °C to +105 °C | 0 °C to +105 °C | 0 °C to +105 °C | 0 °C to +105 °C |
| RAM Controllers | DDR1 / DDR2 with ECC | DDR1 / DDR2 with ECC | DDR1 / DDR2 with ECC | DDR1 / DDR2 with ECC | DDR1 / DDR2 with ECC | DDR1 / DDR2 with ECC |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Higher stock probability via multi-suffix variants (vs MC8641DHX1500JE)
- Same silicon, alternative option codes open more distributors (vs MC8641VU1333JE / MC8641DVJ1333JE)
- Lower-cost 1.0 GHz variant within drop-in window (vs MC8641DVU1000GE)
Notes de conception
The 1023-ball FC-CBGA at 1.333 GHz dissipates substantial power and requires a heatsink plus at least 2 oz copper on outer PCB layers under the BGA. Estimate: ~12-15 W typical SoC power at full dual-core + SERDES load - a low-profile heatsink with thermal interface material is mandatory for the 0-105 °C industrial envelope. Validate junction temperature with the NXP thermal model under worst-case ambient.
The 33 x 33 mm FC-CBGA-1023 requires 12+ PCB layers for escape routing. Match-length the DDR2 address/command/clock traces within 25 mil and within-byte data within 50 mil per NXP application notes. Use controlled-impedance (100 ohm differential) routing for PCI Express and Serial RapidIO SERDES, and place AC coupling capacitors within 250 mil of the SoC balls.
Do not confuse the MC8641DHX1333JE option code with other MC8641D variants - the suffix encodes SERDES lane count, PCIe/SRIO configuration, and feature gating. Always cross-reference the exact MPN against the NXP part-number decoder in the datasheet before PCB bring-up. Because the part is obsolete, qualify the chosen variant's supply before committing to a board spin.
Use a sequencing controller (e.g., NXP-compatible supervisor) to enforce proper 1.05 V core rail ramp relative to DDR2 I/O and PLL supplies. Power sequencing violations can latch-up the SoC or cause non-deterministic boot. Add bulk decoupling (220 uF polymer + 22 uF ceramic) within 1 inch of the BGA power balls, plus 0.1 uF + 1 nF ceramic per power pin pair.
Informations de conformité
RoHS compliance per DigiKey listing. AEC-Q100 not applicable (industrial/embedded MPU, not automotive-grade). REACH, halogen-free, and conflict-minerals status not stated in distributor listings - mark unknown and request latest material declaration from supplier for new programs.
