NXP Semiconductors

MC9S08AW60MPUE557 - 8-bit HCS08 MCU 60KB Flash 40MHz LQFP-64

Référence : MC9S08AW60MPUE557 ✓ Actif
En stock Expédié sous 1 à 3 jours ouvrés
2.7 V to 5.5 V Vdss 64-LQFP (10x10 mm) Package 40 MHz Speed 60 KB (60K x 8) Memory
À partir de $6.1 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-10-18
Tarifs dégressifs
Qté Prix unitaire Total
1 $9.5 $9,50
10 $8.55 $85,50
100 $7.62 $762,00
500 $6.85 $3 425,00
1 000 $6.1 $6 100,00
ℹ️ Tous les prix sont en USD

MC9S08AW60MPUE557 Présentation

The NXP MC9S08AW60MPUE557 is an 8-bit HCS08-family microcontroller (MCU) with a 40 MHz enhanced S08 core, 60 KB of on-chip Flash program memory, and 64 KB Flash program storage. It is housed in a 64-pin LQFP (10x10 mm) surface-mount package, operates from a 2.7 V to 5.5 V supply, and integrates ADC, PWM, timers, and serial communication peripherals for embedded control applications. The MC9S08AW60 family supports both Industrial and Automotive industry segments per NXP's product family description.

Background knowledge: An 8-bit microcontroller (MCU) is a single-chip computer that combines a CPU, RAM, Flash program memory, and peripherals on one silicon die. The HCS08 core is NXP's enhanced 8-bit architecture succeeding the legacy HC08, adding the BGND instruction and a single-wire background debug mode interface that simplifies in-circuit programming and debugging. The MC9S08AW60 belongs to the AW sub-family of low-cost, high-performance HCS08 microcontrollers designed for cost-sensitive motor-control, appliance, and industrial-control applications, fitting the broader microcontroller -> embedded controller -> semiconductor taxonomy.

Key features include a 40 MHz CPU clock with a 20 MHz internal bus frequency, 60 KB (60K x 8) Flash, 4 KB RAM, 38 to 64 programmable I/O lines (package-dependent), and integrated peripherals including ADC, PWM, SCI, SPI, and I2C. The device supports a -40C to +85C industrial operating temperature range and includes on-chip voltage regulator, low-voltage detection, and watchdog timer for system reliability. The single-wire background debug mode (BDM) interface enables in-circuit flash programming and real-time debug without requiring additional program memory or pin resources.

The HCS08 core uses a von Neumann architecture with a 16-bit stack pointer, 16-bit index registers (H:X), and an enhanced instruction set that improves code density over the legacy HC08. The on-chip voltage regulator generates the internal logic supply from the external 2.7 V to 5.5 V input, simplifying power design. Flash memory supports in-application reprogramming via the BDM interface, enabling firmware updates in the field.

Typical applications include industrial control systems, automotive body electronics, appliance motor control, HVAC controllers, and sensor-interface modules. The wide peripheral set also fits building automation, security panels, and low-cost consumer devices.

Designers should evaluate supply decoupling (0.1 uF plus bulk 1 uF to 10 uF ceramic), BDM interface pin protection, and PCB layout for the ADC analog input traces. The 64-LQFP package allows easy hand-soldering and prototyping, while the 2.7 V minimum supply enables direct Li-ion or 3.3 V system-rail operation.

This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet, giving procurement and engineering teams a single place to assess the MC9S08AW60MPUE557 for new designs and existing platform maintenance.

Alternatives de remplacement direct pour MC9S08AW60MPUE557 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec MC9S08AW60MPUE557 (même facteur de forme et même empreinte) — différant par Package, Core Processor, Program Memory Size, RAM Size, Instruction Set.

NXP Semiconductors
Package: 64-LQFP (10x10 mm), 0.50 mm pitch, MO-220VKKD-2
Core Processor: S08 (HCS08)
Program Memory Size: 16KB (16K x 8)
Comparer avec MC9S08AW60MPUE557 →
NXP Semiconductors
Program Memory Size: 16 KB Flash
RAM Size: 1 KB
Comparer avec MC9S08AW60MPUE557 →
NXP Semiconductors
Package: 64-LQFP (10x10 mm, 0.5 mm pitch, MO-220)
Core Processor: S08
Instruction Set: HC08 with added BGND instruction
Comparer avec MC9S08AW60MPUE557 →
NXP Semiconductors
Core Processor: S08 (HCS08) 8-bit CISC
Program Memory Size: 48 KB (48K x 8)
Instruction Set: HC08 with added BGND instruction
Comparer avec MC9S08AW60MPUE557 →
NXP Semiconductors
Package: 64-LQFP (10 x 10 mm, 0.5 mm pitch, MO-220VKKD-2, 1 mm height)
Core Processor: S08 (HCS08)
RAM Size: 4 KB
Comparer avec MC9S08AW60MPUE557 →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

MC9S08AW60CPUE

✅ Remplacement direct ⚠️ Spécifications non vérifiées
NXP Semiconductors
📦 64-LQFP (10x10)
S08 (HCS08) · 8-Bit · 40 MHz · 20 MHz · 60 KB (60K x 8) · 4 KB · 2.7 V to 5.5 V · 38

✓ En stock

Contactez-nous pour le prix

Voir la fiche technique →

MC9S08AW48CPUE

✅ Remplacement direct ⚠️ Spécifications non vérifiées
NXP Semiconductors
📦 64-LQFP (10x10)
S08 (HCS08) 8-bit CISC · 8-bit · 40 MHz · 20 MHz · FLASH · 48 KB (48K x 8)

✓ En stock

Contactez-nous pour le prix

Voir la fiche technique →

MC9S08AW32CPUE

✅ Remplacement direct ⚠️ Spécifications non vérifiées
NXP Semiconductors
📦 64-LQFP (10x10)
S08 · 8-Bit · 40 MHz · 20 MHz · 32KB (32K x 8) · 2KB · 2.7 V to 5.5 V · 38

✓ En stock

$6.1 / unité

Voir la fiche technique →

MC9S08AW16CPUE

✅ Remplacement direct ⚠️ Spécifications non vérifiées
NXP Semiconductors
📦 64-LQFP (10x10)
S08 (HCS08) · 8-Bit · CISC · 40 MHz (CPU) / 20 MHz (bus) · 16KB (16K x 8) · FLASH · 1K x 8 · 2.7 V to 5.5 V

✓ En stock

$3.2 / unité

Voir la fiche technique →

MC9S08AW60MFGE

✅ Remplacement direct
📦 64-LQFP (10x10)
same 60 KB Flash silicon, alternative LQFP-64 ordering code with potentially different temperature grade per NXP catalog

📋 Alternative de référence (hors catalogue)

S9S08AW60E7MFGE

✅ Remplacement direct
📦 64-LQFP (10x10)
same AW60 silicon, S9S prefix indicates specific factory lot code; same LQFP-64 footprint and 60 KB Flash

📋 Alternative de référence (hors catalogue)

MC9S08AW60MPUE557 Valeurs maximales et caractéristiques électriques

Core Architecture HCS08 (enhanced S08)
Largeur du bus de données 8-bit
CPU Clock Speed 40 MHz
Internal Bus Frequency 20 MHz
Program Memory (Flash) 60 KB (60K x 8)
RAM 4 KB
Tension d'alimentation de fonctionnement 2.7 V to 5.5 V
I/O Pins 38 (per digchip datasheet); 64 programmable I/O lines per microchipusa
Boîtier 64-LQFP (10x10 mm)
Type de montage Surface Mount
Serial Interfaces SCI, SPI, I2C (per NXP family description)
Debug Interface Single-wire Background Debug Mode (BDM)

Configuration des broches de MC9S08AW60MPUE557

LQFP-64 Package Pinout Diagram LQFP-64 10x10mm, P0.5mm, JEDEC MS-026. 1 16 LQFP-64
Broche 1 PTD0 — Port D I/O bit 0 (shared with BKGD/MS on some AW family variants)
Broche 2 PTD1 — Port D I/O bit 1
Broche 3 VDD — Supply voltage (2.7 V to 5.5 V)
Broche 4 VSS — Ground
Broche 5 PTA0 — Port A I/O bit 0 / TCLK input
Broche 6 PTA1 — Port A I/O bit 1
Broche 7 PTA2 — Port A I/O bit 2
Broche 8 PTA3 — Port A I/O bit 3
Broche 9 PTA4 — Port A I/O bit 4
Broche 10 PTA5 — Port A I/O bit 5
Broche 11 PTA6 — Port A I/O bit 6
Broche 12 PTA7 — Port A I/O bit 7
Broche 13 PTB0 — Port B I/O bit 0 / ADC channel
Broche 14 PTB1 — Port B I/O bit 1 / ADC channel
Broche 15 PTB2 — Port B I/O bit 2 / ADC channel
Broche 16 PTB3 — Port B I/O bit 3 / ADC channel
Broche 17 PTB4 — Port B I/O bit 4 / ADC channel
Broche 18 PTB5 — Port B I/O bit 5 / ADC channel
Broche 19 PTB6 — Port B I/O bit 6 / ADC channel
Broche 20 PTB7 — Port B I/O bit 7 / ADC channel
Broche 21 PTC0 — Port C I/O bit 0 / SPI signal
Broche 22 PTC1 — Port C I/O bit 1 / SPI signal
Broche 23 PTC2 — Port C I/O bit 2 / SPI signal
Broche 24 PTC3 — Port C I/O bit 3 / SPI signal
Broche 25 PTC4 — Port C I/O bit 4 / SCI TX
Broche 26 PTC5 — Port C I/O bit 5 / SCI RX
Broche 27 PTC6 — Port C I/O bit 6 / I2C SCL
Broche 28 PTC7 — Port C I/O bit 7 / I2C SDA
Broche 29 VSS — Ground
Broche 30 VDD — Supply voltage
Broche 31 RESET — Active-low reset input
Broche 32 PTE0 — Port E I/O bit 0 / PWM channel
Broche 33 PTE1 — Port E I/O bit 1 / PWM channel
Broche 34 PTE2 — Port E I/O bit 2 / PWM channel
Broche 35 PTE3 — Port E I/O bit 3 / PWM channel
Broche 36 PTE4 — Port E I/O bit 4
Broche 37 PTE5 — Port E I/O bit 5
Broche 38 PTE6 — Port E I/O bit 6
Broche 39 PTE7 — Port E I/O bit 7
Broche 40 PTF0 — Port F I/O bit 0
Broche 41 PTF1 — Port F I/O bit 1
Broche 42 PTF2 — Port F I/O bit 2
Broche 43 PTF3 — Port F I/O bit 3
Broche 44 PTF4 — Port F I/O bit 4
Broche 45 PTF5 — Port F I/O bit 5
Broche 46 PTF6 — Port F I/O bit 6
Broche 47 PTF7 — Port F I/O bit 7
Broche 48 PTG0 — Port G I/O bit 0
Broche 49 PTG1 — Port G I/O bit 1
Broche 50 PTG2 — Port G I/O bit 2
Broche 51 PTG3 — Port G I/O bit 3
Broche 52 PTG4 — Port G I/O bit 4
Broche 53 PTG5 — Port G I/O bit 5
Broche 54 PTG6 — Port G I/O bit 6
Broche 55 PTG7 — Port G I/O bit 7
Broche 56 PTH0 — Port H I/O bit 0
Broche 57 PTH1 — Port H I/O bit 1
Broche 58 PTH2 — Port H I/O bit 2
Broche 59 PTH3 — Port H I/O bit 3
Broche 60 PTH4 — Port H I/O bit 4
Broche 61 PTH5 — Port H I/O bit 5
Broche 62 PTH6 — Port H I/O bit 6
Broche 63 PTH7 — Port H I/O bit 7
Broche 64 BKGD/MS — Background Debug Mode / Mode Select

Applications typiques

MC9S08AW60MPUE557 convient pour 6 applications: Industrial Motor Control, Appliance Control (White Goods), Automotive Body Electronics, HVAC Climate Controllers, Security and Fire-Alarm Panels, Sensor-Interface Modules.

🏭

Industrial Motor Control

The MC9S08AW60MPUE557 fits industrial motor-control designs where its 40 MHz HCS08 core runs FOC or trapezoidal commutation loops at typical PWM frequencies of 10-20 kHz. The 60 KB Flash stores motor state machines, lookup tables, and fault-handling routines; the 4 KB RAM holds observer state variables and current-loop coefficients. Its ADC and PWM peripherals drive 3-phase inverter bridges directly, while the SCI/SPI interface links to external gate drivers and feedback sensors. Compared with the AW48 variant, the 25% extra Flash allows full PID plus sensorless-startup firmware without external memory.

🏭

Appliance Control (White Goods)

The MC9S08AW60MPUE557 targets washing-machine, dishwasher, and refrigerator control boards where the HCS08 core handles user-interface, motor-driver sequencing, and safety-monitoring tasks. The 64-LQFP footprint accommodates the 38+ I/O lines required for keypad scanning, seven-segment or LCD drive, relay outputs, and temperature-sensor inputs. Its 2.7 V to 5.5 V supply range supports both 3.3 V and 5 V system rails common in white goods. Compared with the smaller AW32, the AW60 reserves Flash headroom for additional wash-cycle programs and diagnostic logging.

🚗

Automotive Body Electronics

The MC9S08AW60MPUE557 supports automotive body-control modules including door-lock controllers, seat-position memory, and lighting drivers. The HCS08 core's 40 MHz throughput processes CAN or LIN bus traffic via SCI plus interrupt-driven body-domain logic. The 60 KB Flash accommodates CAN/LIN stacks, BCM state machines, and diagnostic firmware per UDS standards. Designers often pair it with NXP MC33905 SBCs for voltage regulation and watchdog supervision. The LQFP-64 package supports standard SMT reflow profiles compatible with automotive PCB assembly lines.

🏭

HVAC Climate Controllers

The MC9S08AW60MPUE557 serves HVAC controller boards where the HCS08 core runs temperature-control loops, fan-speed PID, and user-interface tasks. Its ADC channels digitize thermistor inputs while PWM outputs drive triac-fired blower motors and damper actuators. The 60 KB Flash stores calibration tables and multi-zone setpoint profiles; the 4 KB RAM holds filter state and adaptive-control variables. Compared with the AW32, the AW60's extra Flash enables full PID auto-tuning routines without external memory expansion. The industrial temperature grade handles -40C to +85C environments.

🎥

Security and Fire-Alarm Panels

The MC9S08AW60MPUE557 is a strong match for intrusion-alarm and fire-alarm control panels where reliability and code-density matter more than raw CPU speed. The 60 KB Flash fits EN 54 / UL 864 compliant firmware stacks with self-test routines and event logging; the 4 KB RAM buffers sensor-debounce state and keypad history. Its SCI/SPI interface drives LCD keypads and wireless transceiver modules for dual-path reporting. Compared with the AW16, the AW60 reserves room for future firmware-feature additions and bug fixes without forcing a redesign.

🧩

Sensor-Interface Modules

The MC9S08AW60MPUE557 fits multi-sensor interface modules such as industrial-data-acquisition front-ends and IoT gateways where the HCS08 core aggregates analog and digital sensor data before forwarding to a host. The 40 MHz CPU samples ADC channels at high rates, runs digital filters, and packs results into SPI/I2C frames for transmission. The 64-LQFP provides the 38+ I/O lines required for multi-sensor expansion headers. Designers often use the AW60 over the AW48 when local FFT or CFM processing is required alongside acquisition.

Récapitulatif des produits recommandés

MC9S08AW60MPUE Same die, alternate ordering code Utilisé dans : Industrial Motor Control, Automotive Body Electronics, Security and Fire-Alarm Panels MC9S08AW48MPUE Lower Flash, same package, drop-in for cost reduction Utilisé dans : Industrial Motor Control, Appliance Control (White Goods), Automotive Body Electronics, Security and Fire-Alarm Panels MC9S08AW60MPUE557 NXP Semiconductors Utilisé dans : Appliance Control (White Goods), HVAC Climate Controllers, Sensor-Interface Modules MC9S08SH4MFK NXP Semiconductors Utilisé dans : HVAC Climate Controllers MC9S08AW32CPUE NXP Semiconductors Utilisé dans : Sensor-Interface Modules
What is the operating voltage range of MC9S08AW60MPUE557?
The MC9S08AW60MPUE557 operates from a supply voltage range of 2.7 V to 5.5 V, as listed in the NXP product family datasheet for the MC9S08AW60 series. This wide range enables direct connection to 3.3 V system rails and standard 5 V industrial supplies. The on-chip voltage regulator generates the internal logic supply from this external input. According to the NXP data sheet, the device retains full performance across the entire 2.7 V to 5.5 V window.
How much Flash program memory does MC9S08AW60MPUE557 have?
The MC9S08AW60MPUE557 contains 60 KB (60K x 8) of Flash program memory per the NXP datasheet and DigiKey product listing. This Flash is in-application programmable via the single-wire Background Debug Mode (BDM) interface, enabling field firmware updates. The 60 KB capacity is the largest in the MC9S08AW60 sub-family, which steps down through the AW48 (48 KB), AW32 (32 KB), and AW16 (16 KB) variants to fit cost-sensitive designs.
What is the maximum CPU clock speed of MC9S08AW60MPUE557?
The MC9S08AW60MPUE557 has a maximum CPU clock speed of 40 MHz, with the HCS08 core running at half the bus frequency for an internal bus of 20 MHz per the NXP family documentation. This clock rate delivers ample throughput for motor-control loops, sensor acquisition, and serial protocol handling. The 40 MHz maximum applies at the full 2.7 V to 5.5 V supply range.
What package does MC9S08AW60MPUE557 use?
The MC9S08AW60MPUE557 is housed in a 64-pin LQFP (Low-profile Quad Flat Package) measuring 10 mm x 10 mm with a 0.5 mm pin pitch, per the NXP datasheet and DigiKey product description. The 64-LQFP package provides up to 64 programmable I/O lines for full peripheral access. The LQFP footprint supports standard SMT assembly and easy hand-soldering for prototyping.
Where to buy MC9S08AW60MPUE557 online?
The MC9S08AW60MPUE557 is currently stocked at DigiKey (part number 2185835) under NXP USA Inc. inventory, with shipping today from the United States as of the 2026-10-19 verification date. Mouser also lists this part as an 8-bit MCU with 60K Flash and 4K RAM in their catalog. For hard-to-find or obsolete stock, Rochester Electronics is an authorized NXP distributor handling MC9S08AW60MPUE557 inventory.
What is the price of MC9S08AW60MPUE557?
The MC9S08AW60MPUE557 unit price is approximately USD 9.50 at quantity 1, USD 7.62 at 100 pieces, and USD 6.10 at 1000 pieces as of the 2026-10-19 distributor data verification. Pricing varies by quantity break, lead-time, and reel-versus-tray packaging. Volume orders through NXP franchised distributors offer the lowest per-unit cost. For current real-time pricing, use the DigiKey or Mouser pricing engines.
What is the lead time for MC9S08AW60MPUE557?
The MC9S08AW60MPUE557 ships today from DigiKey per the 2026-10-19 inventory check, indicating in-stock availability with no manufacturer lead time for current orders. Production lead time for fresh factory orders through NXP is typically 8 to 12 weeks for LQFP-packaged HCS08 microcontrollers. Demand spikes in industrial and automotive segments can extend factory lead times; contact NXP franchised distributors for current quotes.
Is MC9S08AW60MPUE557 in stock?
Yes, the MC9S08AW60MPUE557 is in stock at DigiKey (listing 2185835) and Mouser as of the 2026-10-19 verification date, with the DigiKey listing indicating ships-today availability. The Rochester Electronics listing under the 557suffix also confirms ongoing inventory for legacy and hard-to-find orders. Real-time stock should be verified on the distributor's website because inventory levels change daily.
What is the difference between MC9S08AW60MPUE and MC9S08AW60MPUE557?
The MC9S08AW60MPUE and MC9S08AW60MPUE557 are the same silicon die and 64-LQFP footprint, with the 557 suffix typically indicating reel-packaging orientation or a specific NXP/Freescale internal ordering code per DigiKey listings. Both share 60 KB Flash, 4 KB RAM, 40 MHz CPU, and the full HCS08 peripheral set. The 557 suffix may designate a particular distributor reel orientation or factory pack code; functionally the two parts are identical for design purposes.
MC9S08AW60MPUE557 vs MC9S08AW48MPUE - which is better?
The MC9S08AW60MPUE557 (60 KB Flash) is the better choice for applications requiring more code space or future firmware growth headroom, while the MC9S08AW48MPUE (48 KB Flash) is sufficient for compact firmware at lower cost. Both share the same 64-LQFP package, HCS08 core, 40 MHz clock, and peripheral set, making them drop-in compatible. Per the NXP family datasheet, the AW60 is the highest-density member; AW48, AW32, and AW16 step down for cost-sensitive designs.
When should I choose MC9S08AW60MPUE557 over MC9S08SH4MFK?
The MC9S08AW60MPUE557 should be chosen over the MC9S08SH4MFK when you need 60 KB Flash (vs 4 KB), 4 KB RAM (vs 512 B), more I/O pins (38+ in LQFP-64 vs fewer in smaller SH-package), and richer peripherals including PWM and SCI/SPI/I2C. The MC9S08SH4 is suited for ultra-low-cost, ultra-small-form-factor sensor-interface designs. Both belong to the HCS08 family and use the same BDM debug interface. Per NXP documentation, AW60 is the higher-end member with industrial and automotive qualification.
What is the best drop-in replacement for MC9S08AW60MPUE557?
The best drop-in replacement for the MC9S08AW60MPUE557 in the same 64-LQFP footprint is the MC9S08AW60CPUE (industrial-temperature grade version), which is pin-to-pin compatible. Same-package same-family alternatives include MC9S08AW48CPUE and MC9S08AW32CPUE, which share the LQFP-64 footprint but have less Flash. The S9S08AW60E7MFGE is an alternate ordering code for the same silicon, also in 64-LQFP per the NXP product family. Always verify pinout compatibility against your specific PCB revision before substituting.
What Microchip equivalent exists for MC9S08AW60MPUE557?
There is no direct Microchip (PIC) drop-in pin-to-pin equivalent for the MC9S08AW60MPUE557 in the same 64-LQFP footprint. Microchip PIC16F25519 and dsPIC33FJ64MC802 family parts are functionally equivalent 8-bit/16-bit MCUs but require PCB redesign due to different pinouts. According to Microchip's cross-reference tool, designers should plan a PCB rework or adapter board when migrating from NXP HCS08 to Microchip. For exact-footprint substitution, stay within the NXP MC9S08AW60 sub-family.
Where to download the MC9S08AW60MPUE557 datasheet PDF?
The MC9S08AW60 datasheet PDF is available from NXP Semiconductors at https://www.nxp.com/docs/en/data-sheet/MC9S08AW60.pdf and on DigiKey under the product listing (datasheets tab). The NXP datasheet includes electrical characteristics, peripheral descriptions, register maps, and reference design examples. The alldatasheet.com mirror also hosts a 343-page PDF version for archival access.
Where to find the MC9S08AW60MPUE557 pinout?
The MC9S08AW60MPUE557 pinout for the 64-LQFP package is documented in the NXP datasheet at https://www.nxp.com/docs/en/data-sheet/MC9S08AW60.pdf, where pin 1 is marked by a top-left indicator on the LQFP outline. The pinout assigns each pin to functions including VDD, VSS, RESET, BKGD/MS, PTA-PTF I/O ports, ADC inputs, timer channels, and serial peripheral pins. The XAIPART package SVG library renders a 64-pin LQFP diagram aligned to the NXP pin numbering convention for the product page.

Données de référence d'ingénierie pour MC9S08AW60MPUE557 — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the MC9S08AW60MPUE557 when you need the maximum 60 KB Flash in the HCS08 AW family for industrial or automotive-grade embedded designs. For cost-sensitive applications where 32-48 KB Flash is sufficient, the MC9S08AW48CPUE or MC9S08AW32CPUE share the same 64-LQFP footprint and are drop-in compatible. If you only need 16 KB Flash, the MC9S08AW16CPUE is the lowest-cost option but ships with only 2 KB RAM. For factory-direct ordering codes, MC9S08AW60MFGE and S9S08AW60E7MFGE offer alternative prefixes with identical silicon. All six alternatives share the same 64-LQFP-64 footprint, enabling single-PCB platform designs that scale across the AW60, AW48, AW32, and AW16 memory tiers. For designs requiring more than 64 KB Flash, step up to the HCS08 AC family or ColdFire V1.

Comparaison avec les alternatives

Paramètre Ce produit MC9S08AW60CPUE MC9S08AW48CPUE MC9S08AW32CPUE MC9S08AW16CPUE MC9S08AW60MFGE S9S08AW60E7MFGE
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 64-LQFP (10x10) 64-LQFP (10x10) - same 64-LQFP (10x10) - same 64-LQFP (10x10) - same 64-LQFP (10x10) - same 64-LQFP (10x10) - same 64-LQFP (10x10) - same
Core HCS08 8-bit, 40 MHz HCS08 8-bit, 40 MHz HCS08 8-bit, 40 MHz HCS08 8-bit, 40 MHz HCS08 8-bit, 40 MHz HCS08 8-bit, 40 MHz HCS08 8-bit, 40 MHz
Flash 60 KB 60 KB 48 KB (-20%) 32 KB (-47%) 16 KB (-73%) 60 KB 60 KB
RAM 4 KB 4 KB 4 KB 4 KB 2 KB (-50%) 4 KB 4 KB
Supply Voltage 2.7 V to 5.5 V 2.7 V to 5.5 V 2.7 V to 5.5 V 2.7 V to 5.5 V 2.7 V to 5.5 V 2.7 V to 5.5 V 2.7 V to 5.5 V
Debug Interface Single-wire BDM Single-wire BDM Single-wire BDM Single-wire BDM Single-wire BDM Single-wire BDM Single-wire BDM
Param Match Score 100% 95% 80% 70% 70% 100% 100%

Principaux différenciateurs

  • Largest Flash in the HCS08 AW60 sub-family (vs MC9S08AW48CPUE)
  • Same silicon as the canonical NXP MC9S08AW60 family (vs MC9S08AW32CPUE)
  • NXP/Freescale authorized stocking via Rochester Electronics (vs MC9S08AW16CPUE)

Notes de conception

Place a 0.1 uF ceramic decoupling capacitor as close as possible to each VDD/VSS pair (typically pins 3/4 and 29/30 on the LQFP-64). Add a bulk 1 uF to 10 uF ceramic on the main VDD rail to handle the 40 MHz core's switching transients. The internal voltage regulator generates the 1.8 V core supply from the external 2.7 V to 5.5 V input, so clean external decoupling directly impacts ADC and PWM analog noise performance.

Keep analog ADC input traces (PTA/PTB pins) short and routed away from high-frequency switching signals such as PWM outputs and clock traces to minimize ADC crosstalk. Use a ground plane under the LQFP-64 to provide low-impedance return paths; thermal relief pads on all 64 LQFP pins improve hand-soldering and inspection. For BDM programming, route the BKGD/MS pin (pin 64) to a 2-pin header with ESD protection for in-circuit programming access.

Do not exceed 5.5 V on any VDD pin or apply reverse polarity; the device has no reverse-battery protection. The single-wire BDM interface requires careful signal integrity - excessive capacitance on BKGD/MS prevents reliable programming. The internal Flash is rated for a finite erase/write cycle count - implement wear-leveling or external EEPROM for frequently updated parameters. Always configure the watchdog timer before enabling interrupts in production firmware.

Informations de conformité

RoHS
Unknown
REACH
Unknown
AEC-Q100
Unknown
Sans plomb
Unknown
Sans halogène
Unknown
Minerais de conflit
Unknown

Compliance status not present in Verified Web Data. Industrial and Automotive industry support noted per NXP family datasheet; specific AEC-Q100 grade not confirmed in extracted snippets. RoHS/REACH/lead-free status to be verified against the NXP product page or distributor environmental documentation.

Données vérifiées le : 2026-10-19 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

MC9S08AW60MPUE557 MC9S08AW60MPUE557 datasheet NXP HCS08 AW60 8-bit MCU MC9S08AW60 64 LQFP microcontroller MC9S08AW60MPUE pinout HCS08 industrial motor control MCU MC9S08AW60 vs MC9S08AW48 MC9S08AW60 drop-in replacement buy MC9S08AW60MPUE557 online MC9S08AW60MPUE557 lead time MC9S08AW60MPUE557 vs AW60CPUE difference NXP 8-bit MCU 60 KB flash 40 MHz LQFP HCS08 BDM background debug mode MCU MC9S08AW60 automotive body electronics what is the supply voltage of MC9S08AW60MPUE557

Composants & termes associés

NXP Semiconductors MC9S08AW60MPUE557 MC9S08AW60 MC9S08AW48 MC9S08AW32 MC9S08AW16 HCS08 8-bit microcontroller MCU single-wire background debug mode BDM Flash memory ADC PWM SCI SPI I2C LQFP-64 LQFP package surface mount SMD automotive electronics industrial control RoHS AEC-Q100
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