MC9S08DN32CLF - 8-Bit S08 MCU 32KB Flash 48-LQFP | NXP
Référence : MC9S08DN32CLF ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $5.92 | $5,92 |
| 10 | $5.3 | $53,00 |
| 100 | $4.62 | $462,00 |
| 500 | $4.05 | $2 025,00 |
| 1 000 | $3.55 | $3 550,00 |
MC9S08DN32CLF Présentation
An S08 microcontroller is a member of the broader 8-bit MCU category (8-bit MCU -> microcontroller -> embedded processor -> semiconductor). The HCS08 core is a second-generation evolution of the original HC08 instruction set, retaining object-code compatibility while adding the BGND instruction, a hardware breakpoint, and improved low-power modes. Within NXP's portfolio, the MC9S08DN32 sits in the S08DN sub-family, which adds USB and CAN peripherals specifically for industrial and consumer networked-embedded designs.
Key on-chip resources include a 16-channel, 12-bit analog-to-digital converter with 2.5 us conversion time, multiple timers (TPM and a real-time counter), a USB 2.0 full-speed device/host/OTG controller with on-chip transceiver, an MSCAN (CAN 2.0B) module, two SCI (UART) ports, and an SPI. The device supports up to 32 interrupt/reset sources and provides a low-power run, wait, and stop mode set typical of the S08 family. Operating voltage is 2.7V-5.5V with an industrial temperature range of -40C to +85C.
The architecture pairs a von-Neumann-style unified address space with banked Flash and a small page-erased Flash controller, allowing byte-level EEPROM emulation and online field updates. The 12-bit ADC is sequenced by a dedicated channel list RAM, freeing the CPU from polling. The on-chip CAN module is Bosch CAN 2.0A/B compliant with 5 message buffers and a programmable bit timing engine that can be clocked from the bus or the IRC.
Typical applications include USB peripherals, CAN node endpoints in industrial networks, HVAC and appliance controllers, low-cost sensor hubs, and battery-powered metering. The wide 2.7V-5.5V supply range supports direct Li-ion or 3.3V regulated rails, while the LQFP-48 footprint simplifies hand-prototyping and rework. Design tip: place a 4.7 uF bulk plus a 100 nF decoupling capacitor within 5 mm of each VDD/VSS pair, and route the USB D+/D- pair as a 90-ohm differential with length matching better than 2 mm to keep the eye diagram compliant.
Alternatives de remplacement direct pour MC9S08DN32CLF — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S08DN32CLF (même facteur de forme et même empreinte) — différant par Package, Core Processor, RAM Size, Number of I/O, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
Aucune alternative de remplacement direct disponible pour ce produit.
Demander des alternativesMC9S08DN32CLF Valeurs maximales et caractéristiques électriques
| Core | HCS08 (8-bit) |
| Core Frequency | 40 MHz (20 MHz bus) |
| Program Memory | 32 KB Flash |
| RAM | 1.5 KB |
| Number of I/O | 39 |
| ADC | 16-channel, 12-bit, 2.5 us conversion |
| CAN | 1x MSCAN (CAN 2.0A/B), 5 message buffers |
| USB | USB 2.0 FS device/host/OTG, on-chip transceiver |
| Serial Interfaces | 2x SCI (UART), 1x SPI |
| Timers | TPM + real-time counter |
| Interrupts | Up to 32 interrupt/reset sources |
| Tension d'alimentation | 2.7 V to 5.5 V |
| Température de fonctionnement | -40 C to +85 C (industrial) |
| Boîtier | 48-LQFP (7x7 mm) |
| Type de montage | Surface Mount |
| Niveau MSL | 2 (per JEDEC J-STD-020, 1 year) |
| Statut RoHS | Compliant |
Guide de configuration des broches du MC9S08DN32CLF 48-lqfp (7x7 mm)
Configuration des broches du MC9S08DN32CLF (boîtier 48-lqfp (7x7 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MC9S08DN32CLF.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MC9S08DN32CLF convient pour 7 applications: USB Human-Interface Device (HID), CAN Node for Industrial Networks, HVAC and Appliance Controllers, Low-Cost Sensor Hub, Battery-Powered Metering, USB-to-UART/CAN Bridge, Automotive Body and Comfort Modules.
USB Human-Interface Device (HID)
The MC9S08DN32CLF is well-suited to USB HID peripherals such as keyboards, mice, game controllers, and custom input devices. Its on-chip USB 2.0 full-speed transceiver with device/host/OTG capability eliminates the need for an external PHY, reducing BOM cost by approximately USD 0.80 per board. The 40 MHz HCS08 core provides ample processing bandwidth for HID report parsing, debouncing, and LED matrix driving, while the 1.5 KB SRAM comfortably accommodates USB endpoint buffers plus application state. Designers can use the integrated USB SIE to enumerate as a low-speed or full-speed device without an external crystal, and the BGND instruction simplifies in-circuit debug of USB interrupt handlers. Place a 1.5 kohm pull-up on D+ for full-speed, and add ESD protection diodes rated at 15 kV HBM on the bus pins.
Recommandé
CAN Node for Industrial Networks
In industrial CAN-based networks such as CANopen, DeviceNet, or NMEA 2000, the MC9S08DN32CLF serves as a low-cost sensor or actuator node endpoint. The on-chip MSCAN module is Bosch CAN 2.0A/B compliant with 5 message buffers and a programmable bit timing engine capable of 125 kbps to 1 Mbps operation. With 32 KB of Flash the MCU holds a CANopen stack plus application logic, while the 12-bit ADC acquires analog sensor signals with 2.5 us conversion time. The industrial -40C to +85C temperature range and 2.7V-5.5V supply tolerance allow direct connection to 24V industrial rails via a simple LDO. Pair this MCU with an isolated CAN transceiver such as the TJA1051 for galvanically-isolated nodes.
Recommandé
HVAC and Appliance Controllers
White-goods and HVAC control boards benefit from the MC9S08DN32CLF's mix of on-chip analog, communication, and control resources. The 12-bit ADC with 16 channels reads thermistor temperature sensors and pressure transducers, while the TPM module generates PWM outputs to drive triac-based motor controllers and valve actuators. The 39 GPIO lines provide ample headroom for keypad scan, LCD segment driving, and relay control. The 2.7V-5.5V supply tolerance allows direct operation from rectified mains-derived rails after a simple capacitive dropper. Low-power stop modes below 5 uA extend battery life in wireless thermostat remotes, and the HCS08 interrupt-driven architecture is well-matched to deterministic temperature-loop response.
Recommandé
Low-Cost Sensor Hub
The MC9S08DN32CLF is an excellent aggregator for distributed sensor nodes in industrial IoT pilots and smart-building deployments. Its 12-bit ADC reads up to 16 analog channels with 2.5 us conversion, and its two SCI (UART) ports plus one SPI allow connection to digital sensors (temperature, humidity, gas) while the CAN module uplinks aggregated data to a master controller. The 32 KB Flash stores a lightweight sensor-fusion or averaging algorithm, while the 1.5 KB SRAM buffers samples before burst transmission. Industrial-grade temperature and a robust MSCAN peripheral combine to give reliable operation in factory environments where ESD and EMI are concerns.
Recommandé
Battery-Powered Metering
Battery-powered utility meters (water, gas, electricity) leverage the MC9S08DN32CLF's low-power modes and CAN/USB connectivity for AMI (Advanced Metering Infrastructure) endpoints. The S08 stop-mode current below 5 uA and run-mode current below 10 mA at 20 MHz bus extend battery life beyond 10 years on a typical lithium pack. The 12-bit ADC accurately measures pulse-output meter heads with 2.5 us conversion, while the CAN module reports usage to the neighborhood aggregator. The industrial -40C to +85C rating handles outdoor enclosure environments; pair with a lithium SOCl2 primary cell for 20+ year deployments.
Recommandé
USB-to-UART/CAN Bridge
The MC9S08DN32CLF can implement a USB-to-UART or USB-to-CAN bridge dongle for legacy equipment modernization. The on-chip USB device controller enumerates as a CDC/ECM or vendor-class device while the SCI or MSCAN peripheral exposes the legacy serial interface. With 32 KB Flash, the MCU holds the USB stack plus protocol translation logic, and the 12-bit ADC provides optional line-voltage monitoring on the legacy side. Industrial temperature rating and the 48-LQFP footprint make the bridge suitable for factory-floor deployment. Add a high-ESR-tolerant LDO for hot-plug operation.
Recommandé
Automotive Body and Comfort Modules
The MC9S08DN32CLF (or its automotive-grade V-suffix variant) handles low-speed body and comfort electronics such as seat controllers, mirror adjusters, and interior lighting. The MSCAN module connects to the vehicle CAN bus for diagnostic and command traffic, while the 12-bit ADC reads potentiometer positions and the TPM generates PWM outputs for mirror motors and dimming LEDs. The 39 GPIO lines drive relay coils, status LEDs, and H-bridge direction logic. With 32 KB Flash, the MCU holds CAN-based diagnostic stacks plus the comfort application logic. For -40C to +125C AEC-Q100 requirements, choose the V-suffix variant.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S08DN32CLF — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S08DN32ACLF | MC9S08DN32CLH | MC9S08DN32CLC | MC9S08DN32VLF | MC9S08DN32MLF | MC9S08DN16CLF |
|---|---|---|---|---|---|---|---|
| Package | 48-LQFP (7x7 mm) | 48-LQFP - same | 48-LQFP - same | 48-LQFP - same | 48-LQFP - same | 48-LQFP - same | 48-LQFP - same |
| Brand | NXP Semiconductors | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same |
| Core | HCS08, 40 MHz (20 MHz bus) | HCS08, 40 MHz | HCS08, 40 MHz | HCS08, 40 MHz | HCS08, 40 MHz | HCS08, 40 MHz | HCS08, 40 MHz |
| Program Memory | 32 KB Flash | 32 KB Flash | 32 KB Flash | 32 KB Flash | 32 KB Flash | 32 KB Flash | 16 KB Flash (-50%) |
| RAM | 1.5 KB | 1.5 KB | 1.5 KB | 1.5 KB | 1.5 KB | 1.5 KB | 1 KB (-33%) |
| Number of I/O | 39 | 39 | 39 | 39 | 39 | 39 | 39 |
| Supply Voltage | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| Operating Temperature | -40 C to +85 C (industrial) | Industrial / variant grade | Industrial / variant grade | Industrial / variant grade | -40 C to +105 C (extended) | Industrial / variant grade | Industrial |
| Lifecycle | NRND | NRND / Active variant | NRND / Active variant | NRND / Active variant | Active (auto grade) | NRND / Active variant | NRND |
| RoHS | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- On-chip USB 2.0 FS transceiver with device/host/OTG (vs MC9S08AC60CFU)
- Bosch MSCAN 2.0A/B controller with 5 message buffers (vs MC9S08AC60CFU)
- 32 KB Flash in same 48-LQFP footprint (vs MC9S08DN16CLF)
Notes de conception
Place a 4.7 uF bulk plus a 100 nF decoupling capacitor within 5 mm of each VDD/VSS pair; the S08DN has multiple VDD pins (one per I/O bank plus core). For USB applications add a 1 uF X5R capacitor on the VUSB pin to stabilize the internal 3.3 V USB regulator. If the MCU is supplied from a switching regulator, keep the regulator switching node >10 mm away from VDD and route an L-C pi filter on the VDD trace.
The 48-LQFP at 0.5 mm pitch requires 0.25 mm-wide traces and 0.20 mm-wide spaces per the manufacturer's PCB design guidelines. Route the USB D+/D- pair as a 90-ohm differential with length matching better than 2 mm to keep the eye diagram compliant with USB 2.0 full-speed templates. Place the 12 MHz crystal within 5 mm of the XTAL pins and guard the traces with a grounded via fence.
Do not assume the C-suffix industrial temperature variant is the only choice; NXP also offers V-suffix automotive-grade versions on the same 48-LQFP footprint. Verifying the full part suffix against the latest datasheet prevents ordering a temperature grade unsuitable for the deployment environment. Also remember that on S08DN the BGND instruction requires the BKGD pin to be accessible; do not gate it behind an unpopulated jumper on the production board.
Informations de conformité
RoHS compliant per NXP product page. Not AEC-Q100 qualified in the standard C-suffix variant - choose MC9S08DN32VLF (AEC-Q100) for automotive applications. Lead-free matte-tin plating per JEDEC J-STD-020.