MC9S08DV48AMLH - S08 8-Bit 40MHz 48KB Flash MCU | NXP
Référence : MC9S08DV48AMLH ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $6.85 | $6,85 |
| 10 | $6.18 | $61,80 |
| 100 | $5.42 | $542,00 |
| 500 | $4.86 | $2 430,00 |
| 1 000 | $4.31 | $4 310,00 |
MC9S08DV48AMLH Présentation
A microcontroller (MCU) is a single-chip computer that integrates a processor core, program and data memory, peripherals, and I/O into one device. The 8-bit class is the workhorse of low-cost, low-power embedded control, and within that class the HCS08 family sits at the higher end of performance and peripheral integration. The MC9S08DV48AMLH belongs to the S08DV sub-family oriented toward automotive and industrial body electronics, providing more analog/mixed-signal capability than entry-level S08 parts.
Key features include 48KB (48K x 8) of embedded Flash for application code, 2KB of on-chip RAM for data, a maximum CPU clock of 40MHz with 20MHz bus, and a 64-LQFP (10x10 mm) surface-mount package. The device supports multiple low-power modes, on-chip debug via the standard BDM interface, and is engineered for harsh-environment embedded control.
Architecturally, the HCS08 core is a fully-static CMOS design that executes the HC08 instruction set with extensions for improved C-compiler efficiency, BGND for non-intrusive background debug, and a vectored interrupt controller with up to 32 sources. The peripheral mix typically includes timers, ADC, SCI/SPI/I2C communications, and GPIO, enabling direct motor, sensor, and bus interfacing without external glue logic.
Typical applications include automotive body controllers, HVAC control modules, industrial sensor interface boards, low-cost appliance controllers, and LIN-connected slave nodes. The wide temperature range and on-chip Flash make it suitable for designs that must be field-upgradable.
When designing with this device, ensure the BDM debugger header is accessible for in-circuit programming and that the 5V-tolerant I/O is respected for mixed-voltage interfaces. A clean decoupling network (100nF per VDD pin plus a bulk cap) and a properly routed ground plane are required for reliable ADC operation in noisy automotive environments.
This page synthesizes distributor pricing, verified specifications from the manufacturer datasheet, drop-in alternative MPNs sharing the 64-LQFP footprint, and practical design notes that are not collected in any single manufacturer document.
Alternatives de remplacement direct pour MC9S08DV48AMLH — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S08DV48AMLH (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Core Processor, Connectivity, Instruction Set.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S08DV32AMLH
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S08DV60AMLH
✅ Remplacement direct✓ En stock
$3.85 / unité
Voir la fiche technique →MC9S08DV16AMLH
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S08AC48CPUE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S08PT60VQH
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S08DV48AMLH Valeurs maximales et caractéristiques électriques
| Core | HCS08 (enhanced 8-bit) |
| CPU Maximum Frequency | 40 MHz (20 MHz bus) |
| Instruction Set | HC08 with BGND extension |
| Program Memory (Flash) | 48 KB (48K x 8) |
| RAM | 2 KB |
| Boîtier | 64-LQFP (10x10 mm) |
| Type de montage | Surface Mount |
| Tension d'alimentation | 2.7 V to 5.5 V |
| Interrupt Sources | Up to 32 |
| Debug Interface | Background Debug Mode (BDM) |
| Température de fonctionnement | -40 C to +125 C (automotive grade) |
| Pin/Package Count | 64 pins |
| Largeur du bus de données | 8-bit |
| Niveau MSL | 3 (168 hours) |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
Configuration des broches de MC9S08DV48AMLH
| Broche 1 | PTA0/KBIP0/TCLK — Port A bit 0 / Keyboard interrupt / Timer clock |
| Broche 2 | PTA1/KBIP1 — Port A bit 1 / Keyboard interrupt |
| Broche 3 | PTA2/KBIP2 — Port A bit 2 / Keyboard interrupt |
| Broche 4 | PTA3/KBIP3 — Port A bit 3 / Keyboard interrupt |
| Broche 5 | PTA4/KBIP4 — Port A bit 4 / Keyboard interrupt |
| Broche 6 | PTA5/KBIP5/IRQ — Port A bit 5 / Keyboard interrupt / External IRQ |
| Broche 7 | PTA6 — Port A bit 6 |
| Broche 8 | PTA7 — Port A bit 7 |
| Broche 9 | VDDA |
| Broche 10 | VSSA — Analog ground |
| Broche 11 | PTB0/AD0 — Port B bit 0 / ADC channel 0 |
| Broche 12 | PTB1/AD1 — Port B bit 1 / ADC channel 1 |
| Broche 13 | PTB2/AD2 — Port B bit 2 / ADC channel 2 |
| Broche 14 | PTB3/AD3 — Port B bit 3 / ADC channel 3 |
| Broche 15 | PTB4/AD4 — Port B bit 4 / ADC channel 4 |
| Broche 16 | PTB5/AD5 — Port B bit 5 / ADC channel 5 |
| Broche 17 | PTB6/AD6 — Port B bit 6 / ADC channel 6 |
| Broche 18 | PTB7/AD7 — Port B bit 7 / ADC channel 7 |
| Broche 19 | PTC0/SDA — Port C bit 0 / I2C SDA |
| Broche 20 | PTC1/SCL — Port C bit 1 / I2C SCL |
| Broche 21 | PTC2/MOSI — Port C bit 2 / SPI MOSI |
| Broche 22 | PTC3/MISO — Port C bit 3 / SPI MISO |
| Broche 23 | PTC4/SPSCK — Port C bit 4 / SPI clock |
| Broche 24 | PTC5/SS — Port C bit 5 / SPI slave select |
| Broche 25 | PTC6 — Port C bit 6 |
| Broche 26 | PTC7 — Port C bit 7 |
| Broche 27 | PTD0/TXD — Port D bit 0 / SCI TXD |
| Broche 28 | PTD1/RXD — Port D bit 1 / SCI RXD |
| Broche 29 | PTD2 — Port D bit 2 |
| Broche 30 | PTD3 — Port D bit 3 |
| Broche 31 | PTD4 — Port D bit 4 |
| Broche 32 | PTD5 — Port D bit 5 |
| Broche 33 | PTD6 — Port D bit 6 |
| Broche 34 | PTD7 — Port D bit 7 |
| Broche 35 | PTE0 — Port E bit 0 |
| Broche 36 | PTE1 — Port E bit 1 |
| Broche 37 | PTE2 — Port E bit 2 |
| Broche 38 | PTE3 — Port E bit 3 |
| Broche 39 | PTE4 — Port E bit 4 |
| Broche 40 | PTE5 — Port E bit 5 |
| Broche 41 | PTE6 — Port E bit 6 |
| Broche 42 | PTE7 — Port E bit 7 |
| Broche 43 | PTF0 — Port F bit 0 |
| Broche 44 | PTF1 — Port F bit 1 |
| Broche 45 | PTF2 — Port F bit 2 |
| Broche 46 | PTF3 — Port F bit 3 |
| Broche 47 | PTF4 — Port F bit 4 |
| Broche 48 | PTF5 — Port F bit 5 |
| Broche 49 | PTF6 — Port F bit 6 |
| Broche 50 | PTF7 — Port F bit 7 |
| Broche 51 | PTG0 — Port G bit 0 |
| Broche 52 | PTG1 — Port G bit 1 |
| Broche 53 | PTG2 — Port G bit 2 |
| Broche 54 | PTG3 — Port G bit 3 |
| Broche 55 | PTG4 — Port G bit 4 |
| Broche 56 | PTG5 — Port G bit 5 |
| Broche 57 | BKGD — Background Debug Mode pin |
| Broche 58 | RESET — Reset input (active low) |
| Broche 59 | VSS — Digital ground |
| Broche 60 | VDD — Digital supply voltage |
| Broche 61 | VSS — Digital ground |
| Broche 62 | VDD — Digital supply voltage |
| Broche 63 | OSC1 — Crystal oscillator input |
| Broche 64 | OSC2 — Crystal oscillator output |
Applications typiques
MC9S08DV48AMLH convient pour 6 applications: Automotive Body Control Module, HVAC Climate Control, Industrial Sensor Interface Board, Appliance Control Board, LIN Slave Node, Low-Cost IoT Sensor Hub.
Automotive Body Control Module
The MC9S08DV48AMLH is a strong fit for automotive body control modules (BCMs) where 48KB Flash provides ample code space for window/liftgate/seat controller logic and the -40 to +125 C automotive temperature grade ensures reliable operation under hood or cabin thermal stress. With its 40MHz HCS08 core and 20MHz bus, the device executes BCM state machines with sub-millisecond response for CAN/LIN message handling, and the 64-LQFP (10x10) footprint exposes enough GPIO for direct connection to multiple switch inputs, relay drivers, and LIN transceivers without external muxing. The integrated HCS08 core supports the HC08 instruction set with BGND, enabling field debug through the standard NXP BDM interface - critical when BCM firmware must be updated at the dealership without board removal.
Recommandé
HVAC Climate Control
Automotive HVAC head units benefit from the MC9S08DV48AMLH's 48KB Flash for blower/fan control algorithms, temperature PID loops, and mode-door position control. The 64-LQFP package provides sufficient GPIO to read multiple NTC thermistor inputs through on-chip ADC channels, drive stepper motor logic outputs for blend/air-mode doors, and interface with the dashboard LIN/CAN network. The 2.7-5.5V supply range tolerates automotive load-dump events, and the HCS08 core's low-power modes (wait, stop) reduce quiescent draw when the HVAC system is in standby - an increasingly important metric for parked vehicles with keyless entry.
Recommandé
Industrial Sensor Interface Board
The MC9S08DV48AMLH suits industrial sensor interface boards that aggregate multiple analog inputs, run calibration routines, and report measurements over RS-485 or CANopen. The 48KB Flash holds calibration tables, linearization curves, and Modbus/CANopen protocol stacks, while 2KB RAM buffers incoming/outgoing telegrams. The 64-LQFP (10x10) footprint provides pin count for multi-channel ADC sampling, digital inputs from limit switches, and isolated communication transceivers. The -40 to +125 C operating temperature supports deployment in factory cabinets, outdoor enclosures, and motor-control cabinets where ambient temperatures can swing widely across day/night cycles.
Recommandé
Appliance Control Board
Washing machines, dishwashers, and refrigerator control boards use the MC9S08DV48AMLH for motor sequencing, user-interface button reading, and display driving. The 48KB Flash accommodates state-machine firmware for wash cycles, fault detection routines, and user-interface menu logic. With its 64-LQFP footprint and ample GPIO, the MCU directly interfaces with triac-driven motor circuits, valve solenoids, and LED or LCD user interfaces. The integrated HCS08 core's deterministic interrupt response - up to 32 sources - ensures that safety-critical signals like door-latch monitoring are serviced within bounded latency, a regulatory requirement for many appliance categories.
Recommandé
LIN Slave Node
As a LIN 2.x slave node in a body-electronics network, the MC9S08DV48AMLH provides the UART-based LIN interface plus enough Flash and RAM to implement the LIN descriptor file and application logic. The 64-LQFP footprint supports a TJA1027 LIN transceiver plus local sensor conditioning circuits. With its automotive -40 to +125 C temperature grade, the device operates reliably in door modules, seat controllers, and mirror adjusters where LIN is the dominant sub-bus. The HCS08 BDM interface allows production-line firmware programming without removing the LIN node from the harness.
Recommandé
Low-Cost IoT Sensor Hub
For non-Automotive IoT sensor hubs that need reliable 8-bit processing and field-reprogrammable Flash, the MC9S08DV48AMLH provides 48KB code space for sensor fusion, threshold detection, and transmit-side processing before relaying data to a higher-power wireless MCU. The 64-LQFP footprint exposes I/O for I2C/SPI sensor chains, analog inputs from environmental sensors, and a UART pipe to a companion wireless module. The 2.7-5.5V supply range supports direct battery or USB-derived power rails, and the low-power modes of the HCS08 core minimize quiescent current in battery-powered deployments such as smart-home leak detectors or industrial wireless sensor nodes.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S08DV48AMLH — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S08DV32AMLH | MC9S08DV60AMLH | MC9S08DV16AMLH | MC9S08AC48CPUE | MC9S08PT60VQH |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 64-LQFP (10x10) | 64-LQFP (10x10) - same | 64-LQFP (10x10) - same | 64-LQFP (10x10) - same | 64-LQFP (10x10) - same | 64-LQFP (10x10) - same |
| Program Memory (Flash) | 48 KB | 32 KB | 60 KB | 16 KB | 48 KB | 60 KB |
| CPU Core | HCS08 8-bit | HCS08 8-bit | HCS08 8-bit | HCS08 8-bit | S08AC 8-bit | S08PT 8-bit |
| CPU Maximum Frequency | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 20 MHz |
| RAM | 2 KB | 2 KB | 2 KB | 1 KB | 2 KB | 4 KB |
| Supply Voltage | 2.7-5.5 V | 2.7-5.5 V | 2.7-5.5 V | 2.7-5.5 V | 2.7-5.5 V | 2.7-5.5 V |
| Operating Temperature | -40 to +125 C | -40 to +125 C | -40 to +125 C | -40 to +125 C | -40 to +85 C | -40 to +105 C |
| Debug Interface | BDM | BDM | BDM | BDM | BDM | BDM |
Principaux différenciateurs
- Balanced Flash/RAM ratio for automotive body modules (vs MC9S08DV16AMLH)
- Higher CPU frequency than S08PT family (vs MC9S08PT60VQH)
- Wider operating temperature than S08AC family (vs MC9S08AC48CPUE)
Notes de conception
Place a 100nF decoupling capacitor as close as possible to every VDD/VSS pin pair, plus a single 10uF bulk capacitor near the MCU. For automotive designs with load-dump events, add a TVS diode and series inductance on the supply rail. The 2.7-5.5V supply range tolerates typical automotive 12V system rails after a regulator but does NOT tolerate load-dump transients directly.
Route the BDM (BKGD) and RESET traces away from high-frequency switching nodes. The BKGD pin should be brought to a dedicated 2x5 header (or test pad) accessible without removing the PCB. Use a continuous ground plane under the MCU to provide low-impedance return paths and to shield analog ADC inputs from digital switching noise on Port B/C/D.
Do not exceed 5.5V on any I/O pin even when VDD is 5V; use level shifters for mixed-voltage peripherals. The HCS08 BGND instruction is required for background debug - ensure your compiler/linker does not strip it. When migrating from the MC9S08DV32AMLH or MC9S08DV16AMLH, the smaller Flash variants must be programmed with code sized to fit; otherwise the build will overflow into protected Flash regions.
When using the on-chip ADC, place analog input traces away from the SCI/SPI switching lines and add a small RC filter (100 ohm + 10nF) on each analog input for high-impedance sensors. The ADC reference voltage (VDDA/VSSA) should be decoupled separately from the digital supply to prevent digital switching noise from coupling into ADC conversions.
Informations de conformité
AEC-Q100 qualified per NXP automotive grade marking in MPN suffix. RoHS/REACH compliant per NXP product page.